Anti-swinging glue solidification device

Abstract

A kind of anti-slinging glue die bonding device, including die bonding pedestal, anti-slinging glue fixture and glue dispensing assembly, die bonding pedestal one side is concave and forms containing groove, containing groove is arranged transmission and placing plate, transmission is connected placing plate, placing plate one side is concave and forms placing groove, and placing groove is used to place LED support, anti-slinging glue fixture includes fixed plate and anti-slinging glue plate, fixed plate is detachably linked with placing plate, anti-slinging glue plate one end is rotatably connected die bonding pedestal by hinge, anti-slinging glue plate other end is connected fixed plate, anti-slinging glue plate is provided with glue dispensing groove, fixed plate is provided with several fixed slots passing through fixed plate, LED support is provided with several support slots matched with fixed slot, and several chip slots connected with each other are arranged in support slot.The anti-slinging glue die bonding device provided by the utility model solves the technical problems in the prior art, still has the risk of glue dripping, leads to multiple glue of chip, further causes abnormal dead lamp of lamp bead, or affects subsequent welding operation.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead packaging technology, specifically to an anti-jet bonding device. Background Technology

[0002] LED packaging is a core link in the semiconductor lighting industry chain. As LED chips develop better and better, the requirements for processes and quality are also getting higher and higher. The dispensing step in LED chip packaging is a key step to ensure chip protection and optical performance. LED chip packaging generally uses die bonding equipment. The dispensing step is generally done by a robotic arm's dispensing head picking up die bonding adhesive and applying it to the LED bracket. Then, another robotic arm's nozzle picks up the chip and places it on the adhesive. Finally, the chip, adhesive, and bracket are bonded by baking in an oven. When the dispensing head is driven by the robotic arm, adhesive can easily be splattered.

[0003] In existing technologies, the risk of glue spillage is usually addressed by improving the dispensing head and die-bonding adhesive. However, this requires high precision in the dispensing head or high-quality materials in the die-bonding adhesive. Furthermore, there is still a risk of glue spillage and dripping, which can lead to excessive glue on the chip, causing abnormal LED failure, or affecting subsequent soldering operations. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an anti-adhesive die bonding device, which aims to solve the technical problem that there is still a risk of adhesive spillage and dripping in the existing technology, resulting in excessive adhesive on the chip, which may further cause abnormal failure of the LED or affect subsequent soldering operations.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0006] A die-bonding device for preventing adhesive spillage includes a die-bonding base, an anti-splashing fixture, and a dispensing assembly. One side of the die-bonding base is recessed to form a receiving groove. A transmission device and a placement plate are disposed within the receiving groove. The transmission device is connected to the placement plate and is used to drive the placement plate to reciprocate along an X-axis or Y-axis. One side of the placement plate is recessed to form a placement slot for placing an LED bracket. The anti-splashing fixture includes a fixing plate and an anti-splashing plate. The fixing plate is detachably connected to the placement plate. One end of the anti-splashing plate is rotatably connected to the die-bonding base via a hinge, and the other end of the anti-splashing plate is connected to... The side of the fixing plate facing away from the placement plate has a dispensing groove that runs through it at the end of the anti-swing adhesive plate away from the fixing base. The fixing plate has several fixing grooves that run through it. The LED bracket has several bracket grooves that match the fixing grooves. Several interconnected chip slots are arranged in the bracket grooves. The size of the dispensing groove is at least larger than the size of one chip slot. The dispensing assembly is connected to the top of the die-bonding base. The dispensing assembly is used to dispense adhesive into the chip slots. The area of ​​the anti-swing adhesive plate is not less than the area formed by the movement trajectory of the dispensing assembly.

[0007] Furthermore, the dispensing assembly includes a dispensing head, a first robotic arm, and a second robotic arm. One end of the first robotic arm is rotatably connected to the die bond substrate, and the other end of the first robotic arm is rotatably connected to the second robotic arm. The second robotic arm is rotatably connected to the dispensing head.

[0008] Furthermore, the dispensing assembly also includes a die bond adhesive tray, which is located on one side of the die bond base, and the die bond adhesive is disposed in the die bond adhesive tray.

[0009] Furthermore, the die-bonding adhesive is an organosilicon fluorescent adhesive.

[0010] Furthermore, the die-bonding substrate is provided with a first slide rail and two second slide rails. The transmission device includes an X-axis transmission assembly and a Y-axis transmission assembly. The X-axis transmission assembly includes an X-axis baffle and an X-axis slide rod. One end of the X-axis slide rod is connected to the X-axis baffle, and the other end of the X-axis slide rod is slidably connected to the first slide rail. The Y-axis transmission assembly includes two Y-axis baffles and two Y-axis slide rods. One end of each of the two Y-axis slide rods is connected to the two Y-axis baffles, and the other end of each of the two Y-axis slide rods is slidably connected to the two second slide rails. One end of the placement plate along the X-axis is connected to the X-axis baffle, and the two opposite ends of the placement plate along the Y-axis are connected to the two Y-axis baffles.

[0011] Furthermore, both the X-axis slide rod and the two Y-axis slide rods are telescopic rods. A first motor is installed on the X-axis slide rod, and a second motor is installed on the Y-axis slide rod. The first motor is used to drive the X-axis slide rod to reciprocate along the first slide rail, and the second motor is used to drive the Y-axis slide rod to reciprocate along the second slide rail.

[0012] Furthermore, the fixing plate is provided with a fixing plate through hole.

[0013] Furthermore, the hinge includes a fixed blade, a movable blade, a fixed sleeve, a movable sleeve, and a connecting rod. One end of the fixed blade is detachably connected to the die-bonding base, and the other end of the fixed blade is connected to the fixed sleeve. The fixed sleeve is rotatably connected to the connecting rod. One end of the movable blade is detachably connected to the anti-slip rubber plate, and the other end of the movable blade is connected to the movable sleeve. The movable sleeve is rotatably connected to the connecting rod.

[0014] Furthermore, both the fixing plate and the anti-spinning rubber plate are made of stainless steel.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: The LED bracket is fixed in the storage slot of the storage plate by the fixing plate set on the storage plate. The fixing slot set on the fixing plate matches the bracket slot on the LED bracket, so that the part of the LED bracket that needs to be glued is fixed and will not shift significantly with the movement of the storage plate, thus ensuring the accuracy of glue dispensing. At the same time, the anti-glue plate is connected to the die bond base by a hinge. When glue dispensing is required, the anti-glue plate is flipped and placed above the fixing plate. Since there is a glue dispensing groove on the anti-glue plate, the glue dispensing operation is carried out through the glue dispensing groove. During this process, the movement path of the glue dispensing component from absorbing glue to dripping glue coincides with the surface covered by the anti-glue plate. Even if glue falls, it will fall onto the anti-glue plate first, which can promptly avoid the situation of extra glue in other chip slots on the LED bracket, and also reduce the situation of abnormal lamp failure or affecting subsequent soldering operations. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic diagram of the anti-spinning adhesive crystal bonding device according to an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the structure of the anti-spinning adhesive crystal bonding device under another state according to an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of the placement plate in the anti-spinning adhesive bonding device according to an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of the structure of the fixing plate in the anti-spinning adhesive bonding device of this utility model embodiment;

[0021] Figure 5 This is a schematic diagram of the LED bracket in the anti-spinning adhesive die bonding device according to an embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of the anti-spinning adhesive plate in the anti-spinning adhesive bonding device of this utility model embodiment;

[0023] Figure 7 This is a side view of the connection structure between the anti-spinning adhesive plate and the die-bonding base in the anti-spinning adhesive die-bonding device of this utility model embodiment;

[0024] Figure 8 This is a schematic diagram of the hinge structure in the anti-spinning adhesive bonding device of this utility model embodiment.

[0025] Explanation of key component symbols:

[0026] 1. Die-bonding base; 10. Receiving slot; 11. Shelf; 12. Storage groove; 13. LED bracket; 131. Bracket groove; 132. Chip groove; 2. Anti-slinging adhesive fixture; 20. Fixing plate; 201. Fixing groove; 202. Fixing plate through hole; 21. Anti-slinging adhesive plate; 211. Dispensing groove; 22. Hinge; 221. Fixed blade; 222. Movable blade; 223. Fixed sleeve; 224. Movable sleeve; 225. 3. Connecting rod; 4. Transmission device; 5. X-axis transmission assembly; 6. X-axis baffle; 7. X-axis slide bar; 8. First slide rail; 9. Y-axis transmission assembly; 10. Y-axis baffle; 11. Y-axis slide bar; 12. Second slide rail; 13. First motor; 24. Second motor; 15. Dispensing assembly; 16. Dispensing head; 17. First robotic arm; 18. Second robotic arm; 19. Die-bonding adhesive tray; 20. Die-bonding adhesive.

[0027] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0028] To make the objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described in detail below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of this utility model more thorough and complete.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," "upper," "lower," and similar expressions used herein are for illustrative purposes only and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

[0030] In this utility model, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0031] Please see Figures 1 to 8 A die-bonding device for preventing adhesive spillage includes a die-bonding base 1, an anti-splashing adhesive fixture 2, and an adhesive dispensing assembly 4. One side of the die-bonding base 1 is recessed to form a receiving groove 10. A transmission device 3 and a placement plate 11 are disposed within the receiving groove 10. The transmission device 3 is connected to the placement plate 11 and is used to reciprocate the placement plate 11 along the X-axis or Y-axis. One side of the placement plate 11 is recessed to form a placement slot 12 for placing an LED bracket 13. The anti-splashing adhesive fixture 2 includes a fixing plate 20 and an anti-splashing adhesive plate 21. The fixing plate 20 is detachably connected to the placement plate 11. One end of the anti-splashing adhesive plate 21 is rotatably connected to the die-bonding base 1 via a hinge 22. The other end of the 21 is connected to the side of the fixing plate 20 facing away from the placement plate 11. The end of the anti-swing rubber plate 21 away from the fixing base 1 is provided with a dispensing groove 211 that passes through the anti-swing rubber plate 21. The fixing plate 20 is provided with a plurality of fixing grooves 201 that pass through the fixing plate 20. The LED bracket 13 is provided with a plurality of bracket grooves 131 that match the fixing grooves 201. A plurality of chip grooves 132 that are connected to each other are provided in the bracket grooves 131. The size of the dispensing groove 211 is at least larger than the size of one chip groove 132. The dispensing assembly 4 is used to dispense glue to the chip grooves. The area of ​​the anti-swing rubber plate 21 is not less than the area formed by the movement trajectory of the dispensing assembly 4.

[0032] The dispensing assembly 4 includes a dispensing head 40, a first robotic arm 41, and a second robotic arm 42. One end of the first robotic arm 41 is rotatably connected to the die bond base 1, and the other end of the first robotic arm 41 is rotatably connected to the second robotic arm 42. The second robotic arm 42 is rotatably connected to the dispensing head 40.

[0033] The dispensing assembly 4 also includes a die bond pad 43, which is located on one side of the die bond base 1, and die bond adhesive 44 is disposed inside the die bond pad 43.

[0034] The die-bonding adhesive 44 is an organosilicon fluorescent adhesive.

[0035] The die-bonding substrate 1 is provided with a first slide rail 302 and two second slide rails 312. The transmission device 3 includes an X-axis transmission assembly 30 and a Y-axis transmission assembly 31. The X-axis transmission assembly 30 includes an X-axis baffle 300 and an X-axis slide rod 301. One end of the X-axis slide rod 301 is connected to the X-axis baffle 300, and the other end of the X-axis slide rod 301 is slidably connected to the first slide rail 302. The Y-axis transmission assembly 31 includes two Y-axis baffles 310 and two Y-axis slide rods 311. One end of the two Y-axis slide rods 311 is respectively connected to the two Y-axis baffles 310, and the other end of the two Y-axis slide rods 311 is slidably connected to the two second slide rails 312. One end of the placement plate 11 along the X-axis is connected to the X-axis baffle 300, and the two opposite ends of the placement plate 11 along the Y-axis are connected to the two Y-axis baffles 310.

[0036] The X-axis slide bar 301 and the two Y-axis slide bars 311 are all telescopic rods. A first motor 32 is provided on the X-axis slide bar 301; a second motor 33 is provided on the Y-axis slide bar 311. The first motor 32 is used to drive the X-axis slide bar 311 to reciprocate along the first slide rail 302, and the second motor 33 is used to drive the Y-axis slide bar 311 to reciprocate along the second slide rail 312.

[0037] The fixing plate 20 is provided with a fixing plate through hole 202, which facilitates fixing to the placement plate 11 and reduces the shaking of the LED bracket 13 during the dispensing process.

[0038] The hinge 22 includes a fixed blade 221, a movable blade 222, a fixed sleeve 223, a movable sleeve 224, and a connecting rod 225. One end of the fixed blade 221 is detachably connected to the die-bonding base 1, and the other end of the fixed blade 221 is connected to the fixed sleeve 223. The fixed sleeve 223 is rotatably connected to the connecting rod 225. One end of the movable blade 222 is detachably connected to the anti-slip rubber plate 21, and the other end of the movable blade 222 is connected to the movable sleeve 224. The movable sleeve 224 is rotatably connected to the connecting rod 225, making the anti-slip rubber plate 21 more flexible. It can be folded for use when needed and easily disassembled when not in use.

[0039] Both the fixing plate 20 and the anti-spinning rubber plate 21 are made of stainless steel, which is heat-resistant, corrosion-resistant and easy to clean.

[0040] Specifically, when dispensing is required, first place the LED bracket 13 into the storage slot 12 in the storage plate 11, and use fixing bolts to insert into the fixing plate through hole 202 on the fixing plate 20 to fix the LED bracket 13. It should be noted that during the fixing process, the bracket slot 131 on the LED bracket 13 should be aligned with the fixing slot 201 on the fixing plate 20 to ensure that the chip slot 132 in the bracket slot 131 is not blocked.

[0041] Secondly, the anti-spinning adhesive plate 21, which is fixed on the die bond base 1, is flipped by the hinge 22 so that the anti-spinning adhesive plate 21 is located above the fixing plate 20. Since the anti-spinning adhesive plate 21 is provided with a dispensing groove 211, and the size of the dispensing groove 211 is at least larger than the size of a chip slot 132, when the dispensing head 40 in the dispensing assembly 4 extracts the die bond adhesive 44 from the die bond adhesive tray 43, the first robotic arm 41 rotates to adjust the horizontal position, and the second robotic arm 42 adjusts the vertical position. The dispensing head 40 directly dispenses adhesive into the chip slot 132 in the bracket slot 131 through the dispensing groove 211 and the fixing groove 201.

[0042] Finally, during the dispensing and dispensing process of the dispensing head 40, the first robotic arm 41 will reciprocate in a horizontal position. Due to gravity and inertia, there is a risk that the die-bonding adhesive 44 may fall off. Since the area of ​​the anti-slip plate 21 is not less than the area formed by the movement trajectory of the dispensing component 4, the dripping adhesive will fall onto the anti-slip plate 21, which can promptly prevent additional adhesive from appearing in other chip slots 132 on the LED bracket 13. After stopping work, the LED bracket 13 can be removed by flipping the anti-slip plate 21 through the hinge 22 to start the next work. Alternatively, when cleaning is required, the anti-slip plate 21 can be directly disassembled for cleaning. The above settings achieve anti-slip of adhesive in an economical and efficient manner, and also reduce the possibility of abnormal LED die-offs or affecting subsequent welding operations.

[0043] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0044] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A device for preventing adhesive residue from sticking to crystal, characterized in that... The device includes a die-bonding substrate, an anti-splashing adhesive fixture, and an adhesive dispensing assembly. One side of the die-bonding substrate is recessed to form a receiving groove. A transmission device and a placement plate are disposed within the receiving groove. The transmission device is connected to the placement plate and is used to drive the placement plate to reciprocate along the X-axis or Y-axis. One side of the placement plate is recessed to form a placement slot for placing LED brackets. The anti-splashing adhesive fixture includes a fixing plate and an anti-splashing adhesive plate. The fixing plate is detachably connected to the placement plate. One end of the anti-splashing adhesive plate is rotatably connected to the die-bonding substrate via a hinge, and the other end of the anti-splashing adhesive plate is connected to the fixing plate. On the side of the plate facing away from the placement plate, the anti-swing adhesive plate has a dispensing groove penetrating through it at the end away from the fixing base. The fixing plate has several fixing grooves penetrating through it. The LED bracket has several bracket grooves matching the fixing grooves. Several interconnected chip slots are arranged in the bracket grooves. The size of the dispensing groove is at least larger than the size of one chip slot. The dispensing assembly is connected to the top of the die-bonding base. The dispensing assembly is used to dispense adhesive to the chip slots. The area of ​​the anti-swing adhesive plate is not less than the area formed by the movement trajectory of the dispensing assembly.

2. The anti-spinning adhesive crystal bonding device according to claim 1, characterized in that, The dispensing assembly includes a dispensing head, a first robotic arm, and a second robotic arm. One end of the first robotic arm is rotatably connected to the die bond substrate, and the other end of the first robotic arm is rotatably connected to the second robotic arm. The second robotic arm is rotatably connected to the dispensing head.

3. The anti-spinning adhesive crystal bonding device according to claim 2, characterized in that, The dispensing assembly also includes a die bond pad, which is located on one side of the die bond base, and the die bond pad contains die bond adhesive.

4. The anti-spinning adhesive crystal bonding device according to claim 3, characterized in that, The die-bonding adhesive is an organosilicon fluorescent adhesive.

5. The anti-spinning adhesive crystal bonding device according to claim 1, characterized in that, The die-bonding substrate is provided with a first slide rail and two second slide rails. The transmission device includes an X-axis transmission assembly and a Y-axis transmission assembly. The X-axis transmission assembly includes an X-axis baffle and an X-axis slide rod. One end of the X-axis slide rod is connected to the X-axis baffle, and the other end of the X-axis slide rod is slidably connected to the first slide rail. The Y-axis transmission assembly includes two Y-axis baffles and two Y-axis slide rods. One end of each of the two Y-axis slide rods is connected to the two Y-axis baffles, and the other end of each of the two Y-axis slide rods is slidably connected to the two second slide rails. One end of the shelf along the X-axis is connected to the X-axis baffle, and the two opposite ends of the shelf along the Y-axis are connected to the two Y-axis baffles.

6. The anti-spinning adhesive crystal bonding device according to claim 5, characterized in that, The X-axis slide rod and the two Y-axis slide rods are all telescopic rods. A first motor is installed on the X-axis slide rod; a second motor is installed on the Y-axis slide rod. The first motor is used to drive the X-axis slide rod to reciprocate along the first slide rail, and the second motor is used to drive the Y-axis slide rod to reciprocate along the second slide rail.

7. The anti-spinning adhesive crystal bonding device according to claim 1, characterized in that, The fixing plate is provided with a fixing plate through hole.

8. The anti-spinning adhesive crystal bonding device according to claim 1, characterized in that, The hinge includes a fixed blade, a movable blade, a fixed sleeve, a movable sleeve, and a connecting rod. One end of the fixed blade is detachably connected to the die-bonding base, and the other end of the fixed blade is connected to the fixed sleeve. The fixed sleeve is rotatably connected to the connecting rod. One end of the movable blade is detachably connected to the anti-slip rubber plate, and the other end of the movable blade is connected to the movable sleeve. The movable sleeve is rotatably connected to the connecting rod.

9. The anti-spinning adhesive crystal bonding device according to claim 1, characterized in that, Both the fixing plate and the anti-spinning rubber plate are made of stainless steel.

Images