LED lamp bead and PCBA board with improved antistatic capability

Abstract

The utility model is suitable for lamp pearl technical field provides a kind of LED lamp pearl and PCBA board of improving antistatic ability.The LED lamp pearl of improving antistatic ability includes support, pad, IC chip, several luminous wafer and several zener diode;The support top is provided with mounting groove, the pad in the mounting groove is provided with the IC chip, the luminous wafer and the zener diode;The pad, the IC chip and the luminous wafer are realized by wire, and the zener diode is connected with the pad by wire, for protecting the IC chip and the luminous wafer.The utility model integrates the zener diode of antistatic ability in the inside of LED lamp pearl, and the LED lamp pearl integrated with zener diode does not need additional electronic component of antistatic ability in application circuit, reduces the space of PCB circuit wiring, reduces processing cost.

Description

Technical Field

[0001] This utility model belongs to the field of LED bead technology, and in particular relates to an LED bead and PCBA board with improved antistatic capability. Background Technology

[0002] Currently, all existing iridescent LED beads consist of a bracket, an iridescent IC, and a light-emitting chip. Through a die bonding process, the light-emitting chip and the iridescent IC are fixed on the bracket. Then, wire bonding is performed using bonding alloy wires to define specific functional signals for the bracket pins. Finally, through encapsulation processes such as potting or molding, the iridescent IC and the light-emitting chip are protected with adhesive. Finally, through subsequent peeling or cutting, a complete iridescent LED bead is produced.

[0003] However, in some special application areas, such as automotive-grade and high-end consumer products, the existing colorful LED beads do not meet the requirements of ±8KV air discharge in terms of ESD immunity, referring to GB / T 17626.2 and IEC61000-4-2 electrostatic discharge immunity test standards. Figure 1 The graph shows the characteristics of electrostatic discharge: instantaneous high voltage and high current, and short duration.

[0004] Considering the characteristics of electrostatic discharge, the current solution is to add anti-static electronic components to the application circuit. This can overcome the damage of static electricity to LED chips. However, this solution has some problems: a) the circuit design is relatively complex and difficult to implement under limited wiring space; b) PCBA processing is complex and expensive. Summary of the Invention

[0005] The purpose of this utility model embodiment is to provide an LED lamp bead with improved antistatic capability, aiming to solve the problems of relatively complex circuit design and high processing cost.

[0006] This utility model embodiment is implemented as follows: an LED lamp bead with improved antistatic capability, the LED lamp bead with improved antistatic capability includes a bracket, a pad, an IC chip, a plurality of light-emitting wafers and a plurality of Zener diodes; the top of the bracket is provided with a mounting groove, and the pad, the IC chip, the light-emitting wafers and the Zener diodes are disposed in the mounting groove; The pads, the IC chip, and the light-emitting wafer are connected by wires, and the Zener diode is connected to the pads by wires to protect the IC chip and the light-emitting wafer.

[0007] Furthermore, the pads include a first pad connected to the positive electrode of the light-emitting chip, a second pad connected to the power supply pin, a third pad connected to the signal input pin, a fourth pad connected to the signal output pin, and a fifth pad connected to the ground pin. The first pad and the second pad are connected by a wire. Several of the light-emitting chips are disposed on the first pad.

[0008] Furthermore, the IC chip is provided with a first interface, a second interface, a third interface, a fourth interface, a fifth interface, a sixth interface, and a seventh interface; the light-emitting wafer includes an R wafer, a B wafer, and a G wafer; The first interface, the second interface, and the third interface are respectively connected to the R chip, the B chip, and the G chip; the fourth interface is connected to the second pad; the fifth interface is connected to the third pad; the sixth interface is connected to the fourth pad; and the seventh interface is connected to the fifth pad.

[0009] Furthermore, three Zener diodes are provided; The first Zener diode is connected to the second pad and the third pad, respectively; The second Zener diode is connected to the first pad and the fifth pad, respectively; The third Zener diode is connected to the fourth pad and the fifth pad, respectively.

[0010] Furthermore, the IC chip is disposed on the third pad, and the Zener diode is disposed on both the third pad and the fifth pad.

[0011] Furthermore, the first pad and the third pad are arranged opposite each other, and both are elongated in shape; two Zener diodes are disposed on the third pad, and another Zener diode is disposed on the fifth pad.

[0012] Furthermore, the mounting slot is rectangular, and the second pad, the fourth pad, and the fifth pad are all located at the corners of the rectangle.

[0013] Furthermore, the R chip connects to the first pad and the first interface, the B chip connects to the first pad and the second interface, and the G chip connects to the first pad and the third interface.

[0014] Another objective of this utility model embodiment is a PCBA board, wherein the PCBA board is equipped with the aforementioned LED beads that improve antistatic capability.

[0015] This utility model provides an LED bead with improved antistatic capability by integrating an antistatic Zener diode inside the LED bead. LED beads with integrated Zener diodes do not require additional electronic components to enhance antistatic capability in application circuits, thus reducing the space required for PCB circuit wiring and lowering processing costs. Attached Figure Description

[0016] Figure 1 This is a graph showing the electrostatic discharge curve. Figure 2 A structural diagram of an LED bead with improved antistatic capability is provided for an embodiment of this utility model; Figure 3 A structural diagram of the IC chip provided in an embodiment of this utility model; 100. Bracket; 110. Mounting slot; 210, First pad; 220, Second pad; 230, Third pad; 240, Fourth pad; 250, Fifth pad; 300. IC chip; 310. First interface; 320. Second interface; 330. Third interface; 340. Fourth interface; 350. Fifth interface; 360. Sixth interface; 370. Seventh interface; 410, R chip; 420, B chip; 430, G chip; 510, First Zener diode; 520, Second Zener diode; 530, Third Zener diode. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0018] It is understood that the terms "first," "second," etc., used in this application may be used herein to describe various elements, but unless otherwise specified, these elements are not limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first xx mechanism may be referred to as a second xx mechanism, and similarly, a second xx mechanism may be referred to as a first xx mechanism.

[0019] In the first embodiment, such as Figure 2As shown, an LED bead with improved antistatic capability is proposed. The LED bead with improved antistatic capability includes a bracket 100, pads, an IC chip 300, a plurality of light-emitting wafers and a plurality of Zener diodes. The top of the bracket 100 is provided with a mounting groove 110, and the pads, the IC chip 300, the light-emitting wafers and the Zener diodes are disposed in the mounting groove 110. The pads, the IC chip 300, and the light-emitting wafer are connected by wires. The Zener diode is connected to the pads by wires to protect the IC chip 300 and the light-emitting wafer.

[0020] In this embodiment, an anti-static diode is integrated inside the LED chip. LED chips with integrated Zener diodes do not require additional electronic components to enhance anti-static capabilities in the application circuit, thus reducing the space required for PCB circuit wiring and lowering processing costs.

[0021] In this embodiment, based on the characteristics of electrostatic discharge, the Zener diode selection requires an extremely fast response time, generally at the picosecond level; the voltage selection should be slightly higher than the operating voltage of the LED chip, currently generally around 5V and 12V; the Zener diode needs bidirectional protection; and the wafer size of the Zener diode cannot be too small.

[0022] Existing circuit applications suffer from electrostatic discharge (ESD) problems. Adding ESD-resistant electronic components can lead to the following four issues: a. The circuit design is relatively complex and difficult to implement under conditions of limited wiring space; b. PCBA manufacturing is complex and costly; c. The anti-static electronic components are too far away from the protected IC, resulting in poor protection. d. Poor solder joints may pose a risk of sparks from the electric arc.

[0023] Problems a and b are solved by the aforementioned technical features of this embodiment. Problems c and d need to be addressed in specific circuits.

[0024] In this embodiment, as Figure 2As shown, the pads include a first pad 210 connected to the positive electrode of the light-emitting chip, a second pad 220 connected to the power supply pin VDD, a third pad 230 connected to the signal input pin DI, a fourth pad 240 connected to the signal output pin DO, and a fifth pad 250 connected to the ground pin GND. The first pad 210 and the second pad 220 are connected by wires. A plurality of light-emitting chips are disposed on the first pad 210. The first pad 210, second pad 220, third pad 230, fourth pad 240, and fifth pad 250 are arranged clockwise within the mounting groove 110. Three Zener diodes are provided. The IC chip 300 is disposed on the third pad 230, and the Zener diodes are disposed on the third pad 230 and the fifth pad 250. The mounting groove 110 is rectangular, and the second pad 220, the fourth pad 240, and the fifth pad 250 are all located at the corners of the rectangle.

[0025] In this embodiment, as Figure 2 As shown, three Zener diodes are provided; the first Zener diode 510 is connected to the second pad 220 and the third pad 230 respectively; the second Zener diode 520 is connected to the first pad 210 and the fifth pad 250 respectively; and the third Zener diode 530 is connected to the fourth pad 240 and the fifth pad 250 respectively. The first pad 210 and the third pad 230 are arranged opposite each other and are both elongated in shape; two Zener diodes are disposed on the third pad 230 and the other Zener diode is disposed on the fifth pad 250. In this embodiment, in the LED lamp bead with integrated Zener diodes, the Zener diodes are relatively close to the IC chip 300, resulting in good protection and solving the above-mentioned problem c.

[0026] In this embodiment, as Figure 2 and 3As shown, the IC chip 300 is provided with a first interface 310, a second interface 320, a third interface 330, a fourth interface 340, a fifth interface 350, a sixth interface 360, and a seventh interface 370; the light-emitting wafers include an R wafer 410, a B wafer 420, and a G wafer 430, where the R wafer 410 emits red light, the B wafer 420 emits blue light, and the G wafer 430 emits green light; the first interface 310, the second interface 320, and the third interface 330 are respectively connected to the R wafer 410, the B wafer 420, and the G wafer 430, the fourth interface 340 is connected to the second pad 220, the fifth interface 350 is connected to the third pad 230, the sixth interface 360 ​​is connected to the fourth pad 240, and the seventh interface 370 is connected to the fifth pad 250. The R chip 410 connects to the first pad 210 and the first interface 310, the B chip 420 connects to the first pad 210 and the second interface 320, and the G chip 430 connects to the first pad 210 and the third interface 330. This embodiment optimizes the pads and solder joints by concentrating the light-emitting chips on the first pad 210 and placing the Zener diode and IC chip 300 on the third pad 230, reducing the possibility of arc sparks and solving the aforementioned problem d.

[0027] In the second embodiment, a PCBA board is proposed, which is an application of the first embodiment described above, and is equipped with LED beads with improved antistatic capability as described in the above embodiment.

[0028] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0029] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

[0030] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An LED lamp bead with improved antistatic capability, characterized in that, The LED bead with improved antistatic capability includes a bracket, pads, an IC chip, several light-emitting wafers, and several Zener diodes; the top of the bracket is provided with a mounting groove, and the pads, the IC chip, the light-emitting wafers, and the Zener diodes are disposed in the mounting groove; The pads, the IC chip, and the light-emitting wafer are connected by wires, and the Zener diode is connected to the pads by wires to protect the IC chip and the light-emitting wafer.

2. The LED lamp bead with improved antistatic capability according to claim 1, characterized in that, The pads include a first pad connected to the positive electrode of the light-emitting chip, a second pad connected to the power supply pin, a third pad connected to the signal input pin, a fourth pad connected to the signal output pin, and a fifth pad connected to the ground pin. The first pad and the second pad are connected by a wire. Several of the light-emitting chips are disposed on the first pad.

3. The LED lamp bead with improved antistatic capability according to claim 2, characterized in that, The IC chip is provided with a first interface, a second interface, a third interface, a fourth interface, a fifth interface, a sixth interface, and a seventh interface; the light-emitting wafer includes an R wafer, a B wafer, and a G wafer; The first interface, the second interface, and the third interface are respectively connected to the R chip, the B chip, and the G chip; the fourth interface is connected to the second pad; the fifth interface is connected to the third pad; the sixth interface is connected to the fourth pad; and the seventh interface is connected to the fifth pad.

4. The LED lamp bead with improved antistatic capability according to claim 3, characterized in that, Three Zener diodes are provided; The first Zener diode is connected to the second pad and the third pad, respectively; The second Zener diode is connected to the first pad and the fifth pad, respectively; The third Zener diode is connected to the fourth pad and the fifth pad, respectively.

5. The LED lamp bead with improved antistatic capability according to claim 4, characterized in that, The IC chip is disposed on the third pad, and the Zener diode is disposed on the third pad and the fifth pad.

6. The LED lamp bead with improved antistatic capability according to claim 5, characterized in that, The first and third pads are arranged opposite each other and are both elongated strips in shape; two Zener diodes are disposed on the third pad and another Zener diode is disposed on the fifth pad.

7. The LED lamp bead with improved antistatic capability according to claim 6, characterized in that, The mounting slot is rectangular, and the second pad, the fourth pad, and the fifth pad are all located at the corners of the rectangle.

8. The LED lamp bead with improved antistatic capability according to claim 3, characterized in that, The R chip connects to the first pad and the first interface, the B chip connects to the first pad and the second interface, and the G chip connects to the first pad and the third interface.

9. A PCBA board, characterized in that, The PCBA board is equipped with LED beads that improve antistatic capability as described in any one of claims 1-8.

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