Packaging structure of LED and light-emitting assembly

Abstract

The application relates to the field of semiconductor packaging, and discloses an LED packaging structure, which comprises a substrate, a first surface and a second surface arranged on two sides of the substrate along a first direction, a driving chip arranged on the first surface, a light-emitting unit provided with two or more light-emitting units arranged around the driving chip, and a pad assembly comprising a plurality of pads, the pad assembly being arranged on the second surface and connected with the light-emitting unit and the driving chip. The LED packaging structure and the light-emitting assembly can improve the layout density of the light-emitting unit and reduce the manufacturing cost.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging, and in particular to the packaging structure and light-emitting components of LEDs. Background Technology

[0002] In the LED display field, Micro-in-Package (MIP) is a novel LED packaging technology with significant advantages over traditional SMD single-lamp and COB technologies. However, existing MIP packaging technologies suffer from limitations in forming ultra-small pitch modules due to the layout of the light-emitting units, resulting in low light-emitting unit density. Furthermore, current MIP packaging technologies employ double-sided mounting, attaching the light-emitting units to one surface of the substrate and the driver chip to the other, further increasing the number of circuit layers in the substrate and thus raising manufacturing costs. Utility Model Content

[0003] This application primarily addresses the technical problems of low light-emitting unit layout density and high substrate manufacturing costs in existing technologies. It provides an LED packaging structure and light-emitting component that improves light-emitting unit layout density and reduces manufacturing costs.

[0004] To address the aforementioned technical problems, this application provides an LED packaging structure, characterized in that the LED packaging structure includes, A substrate, wherein a first surface and a second surface are respectively provided on both sides along a first direction; A driver chip, wherein the driver chip is disposed on the first surface; The light-emitting unit is provided in two or more forms, and the two or more light-emitting units are arranged around the driving chip. A pad assembly, comprising multiple pads, is disposed on the second surface and is connected to the light-emitting unit and the driving chip respectively.

[0005] In one embodiment, four light-emitting units are provided, and the driving chip is located at the center of the first surface.

[0006] In one embodiment, the light-emitting unit is composed of multiple LED beads, each LED bead having a P-terminal and an N-terminal, with the N-terminal of the LED bead connected to the driving chip.

[0007] In one embodiment, the light-emitting unit consists of red LED beads, green LED beads, and blue LED beads.

[0008] In one possible implementation, the pad assembly includes, The first pad is used to connect to the power supply, and the first pad is connected to the P-terminal of the driver chip and the lamp bead respectively.

[0009] In one possible implementation, the pad assembly includes, The second pad is used to connect to the ground line and is connected to the driver chip. The third pad is used to connect to the clock module and is connected to the driver chip; The fourth pad is used to connect to the data module and is connected to the driver chip.

[0010] In one embodiment, the substrate has a size of 0.4 mm. 0.4mm.

[0011] This application also provides a light-emitting component, characterized in that the light-emitting component includes the LED encapsulation structure described in Embodiment 1. In one embodiment, the light-emitting component includes a package structure of two or more LEDs, and the spacing between the package structures of two adjacent LEDs is 0.3 mm to 0.4 mm.

[0012] Compared to existing technologies, the substrate of this application includes a first surface and a second surface respectively disposed along a first direction, with the first and second surfaces used to assemble different structures. The driver chip and light-emitting units of this application are both disposed on the first surface, wherein there are two or more light-emitting units arranged around the driver chip. The welding assembly of this application is disposed on the second surface and is connected to both the light-emitting units and the driver chip. This increases the number of light-emitting units and reduces the spacing between them, thereby reducing the LED area while maintaining the same luminous intensity. Furthermore, the driver chip and light-emitting units are jointly disposed on the first surface, optimizing the connection between them and reducing the number of circuit layers in the substrate, thus lowering the LED manufacturing cost. Attached Figure Description

[0013] Appendix Figure 1 This is a schematic diagram of one type of LED packaging structure in the existing technology; Appendix Figure 2 This is a schematic diagram of another LED packaging structure in the existing technology; Appendix Figure 3 This is a schematic diagram of one possible LED packaging structure according to this application; Appendix Figure 4 This is another schematic diagram of the LED packaging structure of this application; Appendix Figure 5This is another schematic diagram of the LED packaging structure of this application; Appendix Figure 6 This is a schematic diagram of one structure of the light-emitting component of this application.

[0014] Explanation of the labels in the diagram: 10. LED packaging structure; 100, Substrate; 110, First surface; 120, Second surface; 200. Driver chip; 300, Light-emitting unit; 310, LED bead; 311, P-terminal; 312, N-terminal; 410, First pad; 420, Second pad; 430, Third pad; 440, Fourth pad; 20. Light-emitting components. Detailed Implementation

[0015] To make the objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0016] Existing technologies suffer from low light-emitting unit density and high substrate manufacturing costs.

[0017] Therefore, this application provides an LED packaging structure, characterized in that the LED packaging structure includes, A substrate, wherein a first surface and a second surface are respectively provided on both sides along a first direction; A driver chip, wherein the driver chip is disposed on the first surface; The light-emitting unit is provided in two or more forms, and the two or more light-emitting units are arranged around the driving chip. A pad assembly, comprising multiple pads, is disposed on the second surface and is connected to the light-emitting unit and the driving chip respectively.

[0018] This application provides a light-emitting component, characterized in that the light-emitting component includes the LED encapsulation structure described in Embodiment 1.

[0019] Example 1: Appendix Figure 1 This is a schematic diagram of one type of LED packaging structure 10 in the prior art. (Attached) Figure 2This is a schematic diagram of another LED packaging structure 10 in the prior art. Please refer to the attached diagram. Figure 1 and appendix Figure 2 The diagram shows a schematic of an LED packaging structure 10 in the prior art. (The diagram includes...) Figure 1 The front structure of the LED package structure 10 is shown, with attached... Figure 2 The reverse side of the LED packaging structure 10 is shown.

[0020] Please refer to the attached document. Figure 1 and appendix Figure 2 As shown, the LED packaging structure 10 of this application is formed using a MIP (Multi-In-Package) method. This method uses a single set of light-emitting units 300, with the light-emitting units positioned at the center of the first surface 110 of the substrate 100. Because the light-emitting units 300 and the driver chip 200 are located on different surfaces, it further limits the number of light-emitting units 300 that can be placed, reducing the density of the light-emitting units 300 and preventing the formation of ultra-small pitch modules. Existing MIP packaging technology uses double-sided bonding to complete the packaging, i.e., attaching the light-emitting units 300 to the first surface 110 of the substrate 100 and the driver chip 200 to the second surface 120 of the substrate 100. This further increases the number of circuit layers in the substrate 100, thereby increasing manufacturing costs.

[0021] In this application, the first direction refers to the height direction of the LED packaging structure 10, that is, the direction of the LED packaging structure 10 from top to bottom or the direction of the LED packaging structure 10 from bottom to top. In this application, the first surface 110 is disposed above the second surface 120, and the second surface 120 is disposed below the first surface 110.

[0022] Appendix Figure 3 This is a schematic diagram of one possible LED packaging structure 10 of this application. Please refer to the attached diagram. Figure 3 As shown, the LED packaging structure 10 of this application includes a substrate 100, which is used to support other components in the LED packaging structure 10.

[0023] In one embodiment, the substrate 100 has a rectangular structure. Further, the substrate 100 has a size of 0.4 mm. 0.4mm.

[0024] Please refer to the attached document. Figure 3 As shown, the LED packaging structure 10 of this application also includes a driver chip 200. The driver chip 200 provides a stable and controllable current or voltage to the light-emitting unit 300, ensuring that the LED works normally and realizes various functions. The driver chip 200 of this application is disposed on the first surface 110.

[0025] In one embodiment, the driving chip 200 is disposed at the center of the first surface 110, that is, there is a certain distance between the driving chip 200 and the edge of the substrate 100, so that the light-emitting unit 300 can be arranged between the driving chip 200 and the edge of the substrate 100.

[0026] Please refer to the attached document. Figure 3 As shown, the LED packaging structure 10 of this application also includes light-emitting units 300. There are two or more light-emitting units 300. The light-emitting units 300 are arranged around the driver chip 200, thereby optimizing the layout of the light-emitting units 300. This allows more light-emitting units 300 to be arranged on the first surface 110 and reduces the layout between adjacent light-emitting units 300. As a result, the size of the substrate 100 can be further reduced while maintaining the same light emission.

[0027] In one embodiment, four light-emitting units 300 are provided. Further, the light-emitting units 300 are disposed at the four corners of the rectangular substrate 100.

[0028] In one embodiment, the light-emitting unit 300 is composed of multiple LED beads 310. Further, the light-emitting unit 300 is composed of red LED beads 310, green LED beads 310 and blue LED beads 310 to achieve multi-color light emission of LEDs.

[0029] Appendix Figure 4 This is another schematic diagram of the LED packaging structure 10 of this application. Please refer to the attached diagram. Figure 4 As shown, the LED packaging structure 10 of this application also includes a pad assembly 400, which consists of multiple pads and is disposed on the second surface 120. The pad assembly 400 is connected to the light-emitting unit 300 and the driver chip 200, respectively. Furthermore, the connection between the pad assembly 400 and the driver chip 200 has been modified from the original complex connection structure to be achieved with only 4 wires.

[0030] In one embodiment, the pad assembly 400 includes a first pad 410 for power connection, which is connected to the P-terminal 311 of both the driver chip 200 and the LED bead 310. The pad assembly 400 also includes a second pad 420 for connection to a ground line and is connected to the driver chip 200. The pad assembly 400 further includes a third pad 430 for connection to a clock module and is connected to the driver chip 200. The pad assembly 400 also includes a fourth pad 440 for connection to a data module and is connected to the driver chip 200.

[0031] Appendix Figure 5 This is another schematic diagram of the LED packaging structure 10 of this application. Please refer to the attached diagram. Figure 5As shown, the light-emitting unit 300 of this application is composed of multiple LED beads 310. Each LED bead 310 includes a P-terminal 311 and an N-terminal 312. The N-terminal 312 of the LED bead 310 is connected to the driver chip 200, and the P-terminal 311 of the LED bead 310 is connected to the first pad 410.

[0032] Example 2: Appendix Figure 6 This is a schematic diagram of one structure of the light-emitting component 20 of this application. Please refer to the attached diagram. Figure 6 As shown, the light-emitting component 20 of this application is composed of the LED encapsulation structure 10 in Embodiment 1. Further, the light-emitting component 20 is composed of two or more LED encapsulation structures 10, and the spacing between adjacent LED encapsulation structures 10 is 0.3 mm to 0.4 mm.

[0033] In one embodiment, the light-emitting component 20 of this application consists of a package structure 10 of four LEDs.

[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0036] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A packaging structure for an LED, characterized in that, The LED packaging structure includes, A substrate, wherein a first surface and a second surface are respectively provided on both sides along a first direction; A driver chip, wherein the driver chip is disposed on the first surface; The light-emitting unit is provided in two or more forms, and the two or more light-emitting units are arranged around the driving chip. A pad assembly, comprising multiple pads, is disposed on the second surface and is connected to the light-emitting unit and the driving chip respectively.

2. The LED packaging structure according to claim 1, characterized in that, The light-emitting unit is provided in four parts, and the driving chip is located at the center of the first surface.

3. The LED packaging structure according to claim 1, characterized in that, The light-emitting unit is composed of multiple LED beads, each LED bead having a P-terminal and an N-terminal, with the N-terminal of the LED bead connected to the driver chip.

4. The LED packaging structure according to claim 3, characterized in that, The light-emitting unit consists of red LED beads, green LED beads and blue LED beads.

5. The LED packaging structure according to claim 3, characterized in that, The pad assembly includes, The first pad is used to connect to the power supply, and the first pad is connected to the P-terminal of the driver chip and the lamp bead respectively.

6. The LED packaging structure according to claim 1, characterized in that, The pad assembly includes, The second pad is used to connect to the ground line and is connected to the driver chip. The third pad is used to connect to the clock module and is connected to the driver chip; The fourth pad is used to connect to the data module and is connected to the driver chip.

7. The LED packaging structure according to claim 1, characterized in that, The substrate has dimensions of 0.4mm*0.4mm.

8. A light-emitting component, characterized in that, The light-emitting component includes the LED encapsulation structure described in any one of claims 1 to 7.

9. The light-emitting component according to claim 8, characterized in that, The light-emitting component includes a package structure of two or more LEDs, and the spacing between the package structures of two adjacent LEDs is 0.3 mm to 0.4 mm.

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