Wafer double-side cleaning device

Abstract

The utility model relates to a kind of wafer double-sided cleaning device, including base, and wafer stripping station, manipulator and double-sided cleaning assembly are equipped on base. Manipulator is located between wafer stripping station and cleaning assembly, for grabbing wafer and executing overturning, lifting and handling operation. Double-sided cleaning assembly includes the first lifting mechanism and the second lifting mechanism oppositely arranged, respectively with adsorption assembly, first cleaning device and second cleaning device;Second lifting mechanism side is equipped with support, first guide rail and third cleaning device, and third cleaning device can reciprocate along guide rail. Three groups of cleaning devices can release liquid, gas or two fluid medium, for realizing the sequential cleaning and blow-drying of wafer smooth surface and rough surface. Through the above setting, cleaning device can reduce the number of turning, reduce the risk of handling pollution, realize the automation and efficient connection of wafer double-sided cleaning, suitable for the higher cleanliness and stability requirement semiconductor processing process.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a wafer double-sided cleaning device. Background Technology

[0002] As a key intermediate product in semiconductor chip manufacturing, wafers typically need to be detached from the carrier using a laser lift-off process during processing. During the lift-off process, adhesives, water stains, particulate impurities, and other contaminants can easily remain on the front and back sides of the wafer. If not cleaned effectively and promptly, this will severely affect the cleanliness and flatness of the wafer surface, thereby impacting the stability of subsequent processes such as coating, photolithography, and electroplating, as well as the chip yield.

[0003] Current wafer cleaning processes mostly employ a single-sided processing method, meaning that one side of the wafer is cleaned first, then manually flipped or handled by a separate mechanism to clean the other side. This method not only increases the time cost of the cleaning process, but also reduces the overall cleaning effect and equipment stability because the wafer is susceptible to particulate contamination or mechanical damage during flipping and multiple handling. Furthermore, the cleaning, drying, and handling structures of existing cleaning devices are often separate, lacking unified coordination and control, making it difficult to achieve precise and efficient process integration.

[0004] To address the aforementioned issues, there is an urgent need for a device with high structural integration, well-coordinated actions, and the ability to sequentially clean and dry the front and back sides of wafers. This device should possess efficient wafer handling capabilities, automatic flipping control, and precisely coordinated cleaning and drying units to meet the comprehensive requirements for cleanliness, efficiency, and safety during the wafer cleaning process. Utility Model Content

[0005] In order to overcome the shortcomings of the existing technology, the purpose of this utility model is to provide a wafer double-sided cleaning device with high structural integration, reasonable action coordination, and the ability to sequentially clean and dry the front and back sides of the wafer.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A wafer double-sided cleaning apparatus includes a base with a wafer stripping station on the base. A four-axis robot and a double-sided cleaning assembly are also mounted on the base. The four-axis robot is located between the wafer stripping station and the double-sided cleaning assembly. The four-axis robot is used to grip the wafer and transport it above the double-sided cleaning assembly, and to perform wafer flipping and lifting operations. The double-sided cleaning assembly includes a first lifting mechanism and a second lifting mechanism arranged opposite each other. The top of the first lifting mechanism is equipped with an adsorption component and a first cleaning device, and the top of the second lifting mechanism is equipped with a second cleaning device. A bracket and a first guide rail mounted on the bracket are located near the second lifting mechanism. The first guide rail has a... The third cleaning device reciprocates along the same path; the first, second, and third cleaning devices are all capable of releasing liquid, gas, or two fluids; during operation, the four-axis robot moves the wafer above the double-sided cleaning assembly and flips it so that the smooth side faces down. The first and second cleaning devices perform two-fluid cleaning on the smooth side of the wafer and then blow it dry; after cleaning, the second lifting mechanism descends, and the first lifting mechanism rises below the wafer. The four-axis robot places the wafer on the wafer adsorption assembly, and then the first lifting mechanism descends, moving the wafer below the third cleaning device. The third cleaning device reciprocates to perform two-fluid cleaning on the rough side of the wafer and then blows it dry.

[0007] Furthermore, the four-axis robot includes an A-axis rotation assembly, a Z-axis lifting assembly, a Y-axis movement assembly, and a B-axis tilting assembly connected in sequence. The A-axis rotation assembly includes an A-axis servo motor mounted on a base, with its output shaft vertically arranged and connected to a rotating column. A mounting plate is fixed on the rotating column. The Z-axis lifting assembly includes multiple vertical guide columns arranged on the mounting plate, a lifting platform sleeved on the guide columns, and a Z-axis servo motor mounted on the mounting plate. The Z-axis servo motor drives the lifting platform to move up and down along the guide columns. The Y-axis movement assembly is mounted on the upper surface of the lifting platform and includes a second guide rail arranged radially along the rotating column and a slider that slides in cooperation with the second guide rail. A B-axis tilting assembly is mounted on the slider. The B-axis tilting assembly includes a horizontally arranged tilting axis and a B-axis servo motor connected to the tilting axis. The B-axis servo motor is mounted on the slider.

[0008] Furthermore, a suction cup device is connected to the end of the flip axis away from the B-axis servo motor. The suction cup device uses vacuum adsorption, with its adsorption surface facing downwards.

[0009] Furthermore, the first lifting mechanism includes a first lifting component, a first support plate, and a second lifting component; the first support plate is disposed on the top of the first lifting component, and the second lifting component and a first cleaning device are disposed on the first support plate; the output end of the second lifting component is connected to an extension plate extending toward the second lifting mechanism, and an adsorption component is disposed on the extension plate.

[0010] Furthermore, the second lifting mechanism is a two-stage lifting mechanism, which includes a third lifting component, a fourth lifting component, and a second support plate; the third lifting component is mounted on the base, and its output end is connected to the fourth lifting component; the second support plate is mounted on the top of the fourth lifting component, and a second cleaning device is installed on the second support plate.

[0011] Furthermore, the first cleaning device includes a first cleaning component and a first two-fluid valve block disposed at the bottom of the first cleaning component, the first two-fluid valve block being mounted on the first lifting mechanism; the second cleaning device includes a second cleaning component and a second two-fluid valve block disposed at the bottom of the second cleaning component, the second two-fluid valve block being mounted on the second lifting mechanism.

[0012] Furthermore, both the first and second cleaning components include multiple bamboo-joint omnidirectional nozzles.

[0013] Furthermore, the third cleaning component includes a support shaft perpendicular to the first guide rail, and a plurality of nozzles arranged at intervals along the axial direction below the support shaft. The nozzles are used to clean or dry the rough surface of the wafer. A single-fluid valve block is provided on the top of the support shaft, and a third two-fluid valve block is provided on the back. The single-fluid valve block and the third two-fluid valve block are respectively connected to the nozzles.

[0014] Furthermore, the bottom of the double-sided cleaning assembly is provided with a water outlet for discharging waste liquid generated during the cleaning process, and a protective cover is provided on the outside of the double-sided cleaning assembly to cover the cleaning area.

[0015] The aforementioned double-sided wafer cleaning device uses a four-axis robotic arm to automatically transport, flip, and position wafers after stripping. Combined with an integrated double-sided cleaning component, it sequentially performs two-fluid cleaning and drying operations on the smooth and rough surfaces of the wafers. This solves the problems of transport contamination, low cleaning efficiency, and unstable cleanliness caused by the step-by-step cleaning and flipping process in existing technologies. It achieves efficient and continuous cleaning of both sides of the wafers, improves the integration, automation level, and stability of the cleaning process, and effectively ensures the yield and consistency of subsequent processes. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the wafer double-sided cleaning device provided by this utility model; Figure 2 This is a structural schematic diagram of the four-axis robot provided by this utility model; Figure 3 This is a schematic diagram of the overall structure of the double-sided cleaning assembly provided by this utility model; Figure 4 This is a schematic diagram of the internal structure of the double-sided cleaning assembly provided by this utility model. Detailed Implementation

[0017] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0018] like Figures 1 to 4 As shown, this application provides a wafer double-sided cleaning device including a base 1, a wafer stripping station 2 on the base 1, and a robot arm 3 and a double-sided cleaning assembly 4 on the base 1.

[0019] Specifically, the robotic arm 3 is located between the wafer stripping station 2 and the double-sided cleaning assembly 4, used to grasp wafers and transport them above the double-sided cleaning assembly 4, and has wafer flipping and lifting functions. The double-sided cleaning assembly 4 includes a first lifting mechanism 41 and a second lifting mechanism 42 arranged opposite to each other. The first lifting mechanism 41 is equipped with an adsorption assembly 43 and a first cleaning device 44 at its top, and the second lifting mechanism 42 is equipped with a second cleaning device 45 at its top. A bracket 46 and a first guide rail 47 mounted on the bracket 46 are provided on the side near the second lifting mechanism 42. A third cleaning device 48 that can reciprocate is provided on the first guide rail 47. The first cleaning device 44, the second cleaning device 45 and the third cleaning device 48 all support the release of liquid, gas or two-fluid media to achieve cleaning and drying functions.

[0020] In actual operation, the robotic arm 3 picks up the wafer from the wafer stripping station 2, transports it above the double-sided cleaning assembly 4, and flips it so that the smooth side of the wafer faces down. Then, the first lifting mechanism 41 moves the first cleaning device 44 above the wafer, while the second lifting mechanism 42 positions the second cleaning device 45 below the wafer. The first and second cleaning devices 44 and 45 simultaneously perform two-fluid cleaning and drying operations on the smooth side of the wafer. After cleaning, the second lifting mechanism 42 descends, and the first lifting mechanism 41 rises below the wafer. The robotic arm 3 places the wafer on the adsorption assembly 43. Then, the first lifting mechanism 41 descends to the position of the third cleaning device 48, moving the wafer below it. The third cleaning device 48 then reciprocates on the first guide rail 47, performing two-fluid cleaning on the rough side of the wafer and completing the drying process.

[0021] This implementation method uses a robotic arm 3 that integrates flipping, handling, positioning and cleaning functions, as well as multiple modularly arranged cleaning devices, to enable the wafer to complete double-sided processing in a continuous operation process, which greatly simplifies the process chain and improves cleaning efficiency and surface cleanliness.

[0022] In this structure, the first lifting mechanism 41 and the second lifting mechanism 42 are responsible for the dynamic adjustment of the cleaning position, working together with the adsorption component 43 to achieve stable wafer bearing and position transfer, significantly reducing the risk of surface particle contamination and mechanical damage caused by repeated handling. The movable structure design of the third cleaning device 48 ensures the uniformity and integrity of the rough surface cleaning coverage. Each cleaning device supports liquid cleaning, gas drying, or two-fluid combined cleaning, adapting to the requirements of different process stages for liquid spray intensity, airflow velocity, and drying efficiency.

[0023] Compared to traditional single-sided cleaning and manual flipping methods, this device has the following advantages: First, it integrates and automates the cleaning process on both sides, significantly improving cleaning efficiency; second, it reduces manual intervention and the number of flipping operations, lowering the risk of cross-contamination and misoperation; third, the device has a compact structure and high modularity, facilitating maintenance and integration; fourth, through the coordinated control of the robotic arm 3 and the cleaning unit, it can achieve high-repeatability automatic positioning and operation, improving the stability of equipment operation.

[0024] like Figure 2 As shown, the robotic arm 3 includes an A-axis rotation assembly 31, a Z-axis lifting assembly 32, a Y-axis movement assembly 33, and a B-axis tilting assembly 34 connected in sequence. The A-axis rotation assembly 31 includes an A-axis servo motor 311 mounted on a base 1, whose output shaft is vertically arranged and connected to a rotating column 312, and a mounting plate 313 is fixed on the rotating column 312. Z-axis lifting assembly 32 includes multiple vertical guide columns 321 mounted on mounting plate 313, lifting platform 322 sleeved on guide columns 321, and Z-axis servo motor 323 mounted on mounting plate 313. Z-axis servo motor 323 drives lifting platform 322 to move up and down along guide columns 321. Y-axis moving assembly 33 is installed on the upper surface of lifting platform 322, including a second guide rail 331 arranged radially along rotating column 312 and a slider 332 that slides in cooperation with the second guide rail 331. B-axis flipping assembly 34 is installed on slider 332. The B-axis flip assembly 34 includes a horizontally arranged flip axis 341 and a B-axis servo motor 342 connected to the flip axis 341. The B-axis servo motor 342 is mounted on the slider 332.

[0025] This multi-degree-of-freedom mechanical structure ensures the accuracy and stability of wafers during handling, flipping, and positioning. Multi-axis servo linkage control enables rapid response and high-precision operation, significantly improving the automation level and production efficiency of the entire cleaning process. The servo motor drive, combined with the guide rail and slider structure, provides high repeatability and operational stability. The overall structure is compact, making it suitable for integration between cleaning stations and optimizing equipment space utilization.

[0026] The end of the flip axis 341 furthest from the B-axis servo motor 342 is connected to a suction cup device 35. The suction cup device 35 uses vacuum adsorption, with its adsorption surface facing downwards. Vacuum adsorption offers advantages such as rapid response, gentle contact, and minimal damage to the wafer surface, making it particularly suitable for handling thin, low-strength semiconductor wafers. During wafer surface cleaning, the flip axis 341, in conjunction with the suction cup device 35, slightly tilts the surface relative to the horizontal plane, allowing the cleaning liquid to fall below the double-sided cleaning assembly 4 and preventing splashing.

[0027] like Figure 4 As shown, the first lifting mechanism 41 includes a first lifting component 411, a first support plate 412, and a second lifting component 413. The first support plate 412 is disposed on top of the first lifting component 411, and the second lifting component 413 and a first cleaning device 44 are disposed on the first support plate 412. The output end of the second lifting component 413 is connected to an extension plate 414 extending toward the second lifting mechanism 42, and an adsorption component 43 is disposed on the extension plate 414. In this embodiment, the first lifting mechanism 41 has a dual lifting structure, wherein the first lifting component 411 is responsible for the overall lifting action, realizing the movement of the first support plate 412 and all its components (including the second lifting component 413, the first cleaning device 44, and the adsorption component 43) within a large stroke range, for docking the wafer height position during the cleaning or handling process; the second lifting component 413 serves as a fine displacement mechanism, used for precise adjustment of the adsorption component 43 during the cleaning process, to achieve optimal spacing control between the wafer and the cleaning nozzle. By mounting the adsorption component 43 onto the extension plate 414 and driving its independent lifting by the second lifting component 413, higher stability and position control accuracy can be provided during wafer drying or transfer. Simultaneously, this structure avoids interference caused by the cleaning device and adsorption device sharing a lifting mechanism, ensuring that each subunit operates independently and coordinates effectively.

[0028] The second lifting mechanism 42 is a two-stage lifting mechanism, comprising a third lifting component 421, a fourth lifting component 422, and a second support plate 423. The third lifting component 421 is mounted on the base 1, and its output end is connected to the fourth lifting component 422. The second support plate 423 is positioned on top of the fourth lifting component 422, and a second cleaning device 45 is mounted on the second support plate 423. This configuration achieves functional separation between large-range coarse adjustment and small-range fine adjustment, improving dynamic response efficiency and control precision during the cleaning process. Simultaneously, the modular design facilitates maintenance and replacement, reduces equipment downtime, and enhances the adaptability of the second cleaning device 45 during wafer cleaning, allowing for flexible position adjustment according to process requirements and ensuring consistent cleaning results.

[0029] The first cleaning device 44 includes a first cleaning component 441 and a first two-fluid valve block 442 disposed at the bottom of the first cleaning component 441, the first two-fluid valve block 442 being mounted on the first lifting mechanism 41; the second cleaning device 45 includes a second cleaning component 451 and a second two-fluid valve block 452 disposed at the bottom of the second cleaning component 451, the second two-fluid valve block 452 being mounted on the second lifting mechanism 42. In the above configuration, the use of two-fluid mixed spraying can increase the cleaning energy density and enhance the removal capacity of contaminants, making it suitable for wafer processing processes with high cleanliness requirements; simultaneously, the modular arrangement of the cleaning component and valve block facilitates later replacement of nozzles or adjustment of spraying parameters, improving equipment maintenance convenience.

[0030] Both the first cleaning component 441 and the second cleaning component 451 include multiple bamboo-joint tube universal nozzles to support flexible multi-angle adjustment, which can quickly adapt to the cleaning needs of wafers with different diameters and different process requirements; at the same time, in conjunction with the lifting structure, the spray angle can be dynamically adjusted to improve the equipment's adaptability and cleaning quality.

[0031] The third cleaning device 48 includes a support shaft 481 perpendicularly arranged to the first guide rail 47. Multiple nozzles 482 are spaced apart along the axial direction below the support shaft 481, used for cleaning or drying the rough surface of the wafer. A single-fluid valve block 483 is located at the top of the support shaft 481, and a third two-fluid valve block 484 is located at the back. The single-fluid valve block 483 and the third two-fluid valve block 484 are respectively connected to the nozzles 482. In operation, after the wafer is moved and positioned below the third cleaning device 48 by the adsorption assembly 43, the support shaft 481, along with the nozzle assembly, moves reciprocally along the guide rail to complete the comprehensive cleaning and drying of the entire rough surface area of ​​the wafer. According to the process settings, a mixed flow cleaning controlled by the third two-fluid valve block 484 can be used first, followed by drying using the high-pressure airflow output by the single-fluid valve block 483, achieving thorough decontamination and rapid drying. The nozzle assembly can be moved as a whole, avoiding the cleaning dead zones or uneven coverage that may be caused by fixed nozzles; by controlling the opening sequence of the nozzles in segments, fine area spraying can be achieved, saving resources and reducing the spread of pollution.

[0032] like Figure 3 As shown, the double-sided cleaning assembly 4 has a water outlet at its bottom for discharging waste liquid generated during the cleaning process. A protective cover 49 surrounds the outer side of the double-sided cleaning assembly 4, covering the cleaning area. The protective cover 49 is made of transparent or semi-transparent material, providing good physical isolation, splash protection, and visual observation. Its structure covers the cleaning area and is fixedly connected to the base 1, effectively isolating the high-pressure cleaning spray from external influences and preventing operators from accidentally touching internal moving parts or inhaling fine mist particles.

[0033] The above description of embodiments of the present invention, through which those skilled in the art are able to implement or use the present invention, will be readily apparent to those skilled in the art. Various modifications to these embodiments will be readily apparent to those skilled in the art. The general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novelty disclosed herein.

Claims

1. A wafer double-sided cleaning device, comprising a base (1), wherein a wafer stripping station (2) is provided on the base (1), characterized in that: The base (1) is provided with a robotic arm (3) and a double-sided cleaning assembly (4). The robotic arm (3) is located between the wafer stripping station (2) and the double-sided cleaning assembly (4). The robotic arm (3) is used to grab the wafer and transport it above the double-sided cleaning assembly (4), and to perform wafer flipping and lifting operations. The double-sided cleaning assembly (4) includes a first lifting mechanism (41) and a second lifting mechanism (42) arranged opposite to each other. The first lifting mechanism (41) is provided with an adsorption assembly (43) and a first cleaning device (44) at its top, and the second lifting mechanism (42) is provided with a second cleaning device (45) at its top. A bracket (46) and a first guide rail (47) mounted on the bracket (46) are provided on the side near the second lifting mechanism (42). A third cleaning device (48) that can reciprocate along the first guide rail (47) is provided on the first guide rail (47). The first cleaning device (44), the second cleaning device (45) and the third cleaning device (48) are all capable of releasing liquid, gas or two fluids; During the operation, the robotic arm (3) transports the wafer to the top of the double-sided cleaning assembly (4) and flips it so that the shiny side faces down. The first cleaning device (44) and the second cleaning device (45) perform two-fluid cleaning on the shiny side of the wafer and blow it dry. After cleaning, the second lifting mechanism (42) descends, and the first lifting mechanism (41) rises below the wafer. The robotic arm (3) places the wafer on the wafer adsorption assembly (43). Then the first lifting mechanism (41) descends, moving the wafer below the third cleaning device (48). The third cleaning device (48) reciprocates to perform two-fluid cleaning on the rough surface of the wafer and blows it dry.

2. The wafer double-sided cleaning apparatus as described in claim 1, characterized in that, The robotic arm (3) includes an A-axis rotation assembly (31), a Z-axis lifting assembly (32), a Y-axis movement assembly (33), and a B-axis flipping assembly (34) connected in sequence. The A-axis rotation assembly (31) includes an A-axis servo motor (311) mounted on the base (1), whose output shaft is vertically arranged and connected to a rotating column (312), and a mounting plate (313) is fixed on the rotating column (312). The Z-axis lifting assembly (32) includes a plurality of vertical guide columns (321) disposed on the mounting plate (313), a lifting platform (322) sleeved on the guide columns (321), and a Z-axis servo motor (323) mounted on the mounting plate (313). The Z-axis servo motor (323) drives the lifting platform (322) to move up and down along the guide columns (321). The Y-axis moving assembly (33) is installed on the upper surface of the lifting platform (322), including a second guide rail (331) arranged radially along the rotating column (312) and a slider (332) that slides in cooperation with the second guide rail (331). A B-axis flipping assembly (34) is installed on the slider (332). The B-axis flip assembly (34) includes a horizontally arranged flip axis (341) and a B-axis servo motor (342) connected to the flip axis (341), and the B-axis servo motor (342) is mounted on the slider (332).

3. The wafer double-sided cleaning apparatus as described in claim 2, characterized in that, The end of the flip axis (341) away from the B-axis servo motor (342) is connected to a suction cup device (35), which uses vacuum adsorption and has its adsorption surface facing down.

4. The wafer double-sided cleaning apparatus as described in claim 1, characterized in that, The first lifting mechanism (41) includes a first lifting component (411), a first support plate (412), and a second lifting component (413). The first support plate (412) is disposed on the top of the first lifting assembly (411), and the first support plate (412) is provided with the second lifting assembly (413) and the first cleaning device (44). The output end of the second lifting component (413) is connected to an extension plate (414) extending toward the second lifting mechanism (42), and the adsorption component (43) is provided on the extension plate (414).

5. The wafer double-sided cleaning apparatus as described in claim 1, characterized in that, The second lifting mechanism (42) is a secondary lifting mechanism, which includes a third lifting component (421), a fourth lifting component (422), and a second support plate (423). The third lifting component (421) is mounted on the base (1), and its output end is connected to the fourth lifting component (422); The second support plate (423) is disposed on the top of the fourth lifting assembly (422), and the second cleaning device (45) is installed on the second support plate (423).

6. The wafer double-sided cleaning apparatus as described in claim 1, characterized in that, The first cleaning device (44) includes a first cleaning component (441) and a first two-fluid valve block (442) disposed at the bottom of the first cleaning component (441), the first two-fluid valve block (442) being mounted on the first lifting mechanism (41); the second cleaning device (45) includes a second cleaning component (451) and a second two-fluid valve block (452) disposed at the bottom of the second cleaning component (451), the second two-fluid valve block (452) being mounted on the second lifting mechanism (42).

7. The wafer double-sided cleaning apparatus as described in claim 6, characterized in that, Both the first cleaning component (441) and the second cleaning component (451) include multiple bamboo-joint tube universal nozzles.

8. The wafer double-sided cleaning apparatus as described in claim 1, characterized in that, The third cleaning device (48) includes a support shaft (481) perpendicular to the first guide rail (47), and a plurality of nozzles (482) arranged at intervals are provided below the support shaft (481) along the axial direction. The nozzles (482) are used to clean or dry the rough surface of the wafer. The support shaft (481) has a single-fluid valve block (483) on its top and a third two-fluid valve block (484) on its back. The single-fluid valve block (483) and the third two-fluid valve block (484) are respectively connected to the nozzle (482).

9. The wafer double-sided cleaning apparatus as described in claim 1, characterized in that, The bottom of the double-sided cleaning assembly (4) is provided with a water outlet for discharging waste liquid generated during the cleaning process. The outer side of the double-sided cleaning assembly (4) is provided with a protective cover (49) for covering the cleaning area.

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