Chip pick-and-place device and die bonder

Abstract

The utility model belongs to chip package fixed crystal equipment technical field, concretely relates to a kind of chip pickup mounting device and fixed crystal machine, the device includes frame;Z-axis mechanism, is installed on the frame;Rotary mechanism, is connected in the Z-axis mechanism;Suction nozzle mechanism, is connected in the rotary mechanism, the suction nozzle mechanism includes seat, spring force control mechanism, suction needle and suction nozzle head, the seat is connected with the rotary mechanism, the spring force control mechanism is installed in the seat, the spring force control mechanism is connected with the suction needle, the suction needle is connected with the suction nozzle head, the real-time pressure when pickup and mounting chip is fed back by the spring force control mechanism;The utility model is designed by unique spring force control mechanism, can real-time feedback the pressure value when pickup and mounting chip, to realize the accurate control to the force exerted on chip, significantly improve the precision and quality of chip packaging.

Description

Technical Field

[0001] This utility model belongs to the technical field of chip packaging and die bonding equipment, specifically relating to a chip pick-up and placement device and a die bonding machine. Background Technology

[0002] In chip manufacturing, packaging is a crucial step. It not only protects the chip from physical and chemical damage but also ensures an effective electrical connection between the chip and external circuits. The chip mounting and dismounting process is a vital component of the entire packaging process, and its precision directly impacts the chip's performance and reliability.

[0003] In practical applications, the inventors discovered that the force control method for chip picking and placing in the prior art has limitations, and at least the following technical problems exist:

[0004] On the one hand, as chip sizes continue to shrink, the requirements for pick-and-place accuracy are becoming increasingly stringent. During the pick-and-place process, the force applied to the chip needs precise control. Excessive force may damage the chip; insufficient force may prevent accurate chip placement. Existing equipment has limitations in force control, failing to achieve high-precision force control in lightweight and miniaturized designs, thus affecting packaging quality. On the other hand, different types of chips vary in size, shape, and material. Existing pick-and-place equipment often struggles to adapt to multiple chip types, requiring complex adjustments for different chips, thereby increasing the equipment's operating costs and maintenance complexity.

[0005] Therefore, it is necessary to improve upon the shortcomings of existing technologies in order to overcome their deficiencies in practical applications. Utility Model Content

[0006] Based on the aforementioned shortcomings and deficiencies in the prior art, one of the objectives of this utility model is to at least solve one or more of the aforementioned problems in the prior art. In other words, one of the objectives of this utility model is to provide a chip pick-up and placement device and a die bonder that meet one or more of the aforementioned requirements.

[0007] To achieve the above-mentioned objectives, this utility model adopts the following technical solution:

[0008] This utility model provides a chip pickup and mounting device, comprising:

[0009] frame;

[0010] The Z-axis mechanism is mounted on the frame;

[0011] A rotating mechanism connected to the Z-axis mechanism;

[0012] A suction nozzle mechanism is connected to the rotating mechanism. The suction nozzle mechanism includes a base, a spring force control mechanism, a suction needle, and a suction nozzle head. The base is connected to the rotating mechanism, the spring force control mechanism is mounted on the base, the spring force control mechanism is connected to the suction needle, and the suction needle is connected to the suction nozzle head. The spring force control mechanism is used to provide feedback on the real-time pressure during chip picking and placement.

[0013] As a preferred embodiment, the suction nozzle mechanism further includes a fixing block and a guide structure. The guide structure adopts an air bearing, which is sleeved between the axially moving part of the suction needle and the fixing block.

[0014] As a preferred embodiment, the spring force control mechanism includes a crossbar, a spring, a Hall sensor, and a magnet. The crossbar is arranged perpendicularly to the suction needle. The two ends of the spring are respectively connected to the crossbar and the rotating mechanism. The magnet is installed on the crossbar, and the Hall sensor is installed on the fixing block. The Hall sensor is arranged facing the magnet.

[0015] As a preferred embodiment, the crossbar passes through the suction needle, and a limiting component is provided at one end of the crossbar to limit the vertical movement limit position of the crossbar.

[0016] As a preferred embodiment, the Z-axis mechanism includes a motor, a ball screw, and a mounting plate. The motor is connected to the ball screw, and the ball screw is connected to the mounting plate to drive the mounting plate to move up and down along the frame.

[0017] As a preferred embodiment, the suction nozzle mechanism is provided with a first negative pressure channel and a second negative pressure channel. The first negative pressure channel is configured to adsorb the chip onto the suction nozzle head, and the second negative pressure channel is configured to fix the suction nozzle head.

[0018] As a preferred embodiment, the rotating mechanism is configured as a DDR motor.

[0019] As a preferred embodiment, the base is equipped with an overvoltage alarm contact.

[0020] This utility model also provides a die bonder, including a frame and a mounting device as described in any of the above embodiments, wherein the frame is connected to the frame.

[0021] Compared with the prior art, the advantages of this utility model are:

[0022] This invention provides a chip pick-and-place device. Through a unique spring force control mechanism design, it can provide real-time feedback on the pressure value when picking up and placing the chip, thereby achieving precise control of the force applied to the chip. This not only avoids damage to the chip due to excessive force, but also prevents the problem of inaccurate chip placement due to insufficient force, significantly improving the accuracy and quality of chip packaging.

[0023] This invention provides a chip pick-up and placement device. The nozzle mechanism of the device is flexibly designed to adapt to the size, shape and material differences of different types of chips, eliminating the need for complex adjustments for different chips, thus reducing the operating cost and maintenance difficulty of the equipment. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a chip pickup and mounting device according to an embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of the suction nozzle mechanism according to an embodiment of the present invention;

[0027] Figure 3 This is a side view of the suction nozzle mechanism according to an embodiment of the present utility model;

[0028] Figure 4 This is a cross-sectional view of the suction nozzle mechanism according to an embodiment of the present utility model;

[0029] In the diagram: 1 Frame, 2 Z-axis mechanism, 21 Motor, 22 Ball screw, 23 Mounting plate, 3 Rotation mechanism, 4 Suction nozzle mechanism, 41 Base, 411 Overpressure alarm contact, 42 Spring force control mechanism, 421 Crossbar, 422 Spring, 423 Hall sensor, 424 Magnet, 43 Suction needle, 44 Suction nozzle head, 441 First negative pressure channel, 442 Second negative pressure channel, 45 Fixing block, 46 Guide structure, 47 Limiting component, 5 Air bearing. Detailed Implementation

[0030] To more clearly illustrate the embodiments of this application, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0031] In the description of the embodiments of this application, the terms "upper," "lower," "front," "rear," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," etc., are only used for distinction in description and have no special meaning.

[0032] According to some embodiments of this application, please refer to Figures 1 to 4 As shown, a chip pick-and-place device is provided, including a frame 1, a Z-axis mechanism 2, a rotation mechanism 3, and a nozzle mechanism 4. The Z-axis mechanism 2 is mounted on the frame 1, the rotation mechanism 3 is connected to the Z-axis mechanism 2, and the nozzle mechanism 4 is connected to the rotation mechanism 3. The nozzle mechanism 4 includes a base 41, a spring force control mechanism 42, a suction pin 43, and a nozzle head 44. The base 41 is connected to the rotation mechanism 3, the spring force control mechanism 42 is mounted on the base 41, and the spring force control mechanism 42 is connected to the suction pin 43. The suction pin 43 is connected to the nozzle head 44. The spring force control mechanism 42 is used to provide feedback on the real-time pressure during chip pick-up and placement.

[0033] In some embodiments of this application, the nozzle mechanism 4 further includes a fixing block 45 and a guide structure 46. The guide structure 46 employs an air bearing, which is sleeved between the axially moving portion of the suction pin 43 and the fixing block 45. The air film formed by compressed gas reduces motion friction while ensuring the axial alignment of the nozzle mechanism, preventing chip picking and placement deviations caused by nozzle head offset, and improving the accuracy of picking and placing.

[0034] In some embodiments of this application, the spring force control mechanism 42 includes a crossbar 421, a spring 422, a Hall sensor 423, and a magnet 424. The crossbar 421 is arranged perpendicularly to the suction needle 43. The two ends of the spring 422 are respectively connected to the crossbar 421 and the rotating mechanism 3. The magnet 424 is installed on the crossbar 421, and the Hall sensor 423 is installed on the fixing block 45. The Hall sensor 423 and the magnet 424 are arranged facing each other to monitor and provide feedback on the pressure changes on the suction needle 43 in real time.

[0035] Furthermore, the crossbar 421 passes through the suction needle 43, and a limiting component 47 is configured at one end of the crossbar 421. The limiting component 47 is used to limit the vertical movement limit position of the crossbar to prevent equipment damage caused by excessive movement.

[0036] In some embodiments of this application, the Z-axis mechanism 2 includes a motor 21, a ball screw 22, and a mounting plate 23. The motor 21 is connected to the ball screw 22, and the ball screw 22 is connected to the mounting plate 23, so as to drive the mounting plate 23 to move up and down along the frame 1, thereby achieving precise positioning of the nozzle mechanism 4 in the Z-axis direction.

[0037] In some embodiments of this application, the suction nozzle mechanism 4 is provided with a first negative pressure channel 441 and a second negative pressure channel 442. The first negative pressure channel 441 is configured to adsorb the chip onto the suction nozzle head 44 to ensure the stability of the picking process; the second negative pressure channel 442 is configured to fix the suction nozzle head 44 to prevent it from shifting during movement.

[0038] In some embodiments of this application, the rotating mechanism 3 is configured as a DDR motor. The DDR motor has the characteristics of high speed and high precision, which can meet the strict requirements for rotation angle and speed during chip pick-up and placement.

[0039] In some embodiments of this application, an overpressure alarm contact 411 is configured on the base 41. When the pressure on the nozzle head 44 exceeds the set value, an alarm will be triggered to promptly remind the operator to handle the situation, effectively avoiding chip damage caused by excessive pressure.

[0040] According to some embodiments of this application, a die bonder is also provided, including a frame and a mounting device as described above. The frame 1 is connected to the frame to form a complete chip packaging die bonder, providing an efficient and reliable solution for the chip manufacturing process.

[0041] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0042] The above description is only a detailed explanation of the preferred embodiments and principles of this application. For those skilled in the art, there may be changes in the specific implementation based on the ideas provided by this utility model, and these changes should also be considered within the scope of protection of this application.

Claims

1. A chip pickup and mounting device, characterized in that, include: frame; The Z-axis mechanism is mounted on the frame; A rotating mechanism connected to the Z-axis mechanism; A suction nozzle mechanism is connected to the rotating mechanism. The suction nozzle mechanism includes a base, a spring force control mechanism, a suction needle, and a suction nozzle head. The base is connected to the rotating mechanism, the spring force control mechanism is mounted on the base, the spring force control mechanism is connected to the suction needle, and the suction needle is connected to the suction nozzle head. The spring force control mechanism is used to provide feedback on the real-time pressure during chip picking and placement.

2. The chip pickup and mounting device according to claim 1, characterized in that, The suction nozzle mechanism also includes a fixed block and a guide structure. The guide structure adopts an air bearing, which is sleeved between the axial moving part of the suction needle and the fixed block.

3. The chip pick-and-place device according to claim 2, characterized in that, The spring force control mechanism includes a crossbar, a spring, a Hall sensor, and a magnet. The crossbar is arranged perpendicularly to the suction needle. The two ends of the spring are respectively connected to the crossbar and the rotating mechanism. The magnet is installed on the crossbar, and the Hall sensor is installed on the fixing block. The Hall sensor is arranged facing the magnet.

4. The chip pickup and mounting device according to claim 3, characterized in that, The crossbar passes through the suction needle, and a limiting component is provided at one end of the crossbar to limit the vertical movement limit position of the crossbar.

5. A chip pick-up and placement device according to claim 1, characterized in that, The Z-axis mechanism includes a motor, a ball screw, and a mounting plate. The motor is connected to the ball screw, and the ball screw is connected to the mounting plate to drive the mounting plate to move up and down along the frame.

6. The chip pick-and-place device according to claim 1, characterized in that, The suction nozzle mechanism is provided with a first negative pressure channel and a second negative pressure channel. The first negative pressure channel is configured to adsorb the chip onto the suction nozzle head, and the second negative pressure channel is configured to fix the suction nozzle head.

7. A chip pick-up and placement device according to claim 1, characterized in that, The rotating mechanism is configured as a DDR motor.

8. A chip pickup and mounting device according to claim 1, characterized in that, The base is equipped with an overvoltage alarm contact.

9. A die bonder, characterized in that, It includes a frame and a mounting device as described in any one of claims 1 to 8, wherein the frame is connected to the frame.

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