A cleaning device for wafer processing

Abstract

The utility model discloses a kind of cleaning devices for wafer processing, including box, the side door is rotatably connected with the box one side by hinge, the box interior is provided with rack, the fixed component for fixing rack is provided in the box inner bottom wall both sides, the box interior is provided with flushing component, pump body is installed on the box upper surface, and pump body is connected with flushing component;In the utility model, box, rack, fixed component, flushing component, pump body, rubber roll, speed reducer and hot air component are set, after wafer is placed on rack, wafer can be horizontally rotated on rack, then entire rack is fixed in the box interior by fixed component, wafer side edge is contacted with rubber roll at this time, rubber roll is driven to rotate using speed reducer, wafer is driven to rotate again under the action of friction force, flushing component is used to flush wafer at this time, and there is no cleaning dead angle, to improve the cleaning effect of wafer.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, and in particular to a cleaning device for wafer processing. Background Technology

[0002] After wafer fabrication, cleaning is required to remove residual particles, metal ions, organic contaminants, and oxide layers from the manufacturing process. These contaminants can cause short circuits, leakage, or decreased reliability, affecting chip performance and yield. Cleaning processes are integral to the entire semiconductor manufacturing process, including front-end processes such as post-lithography and post-etching cleaning, and final cleaning before packaging. Traditional cleaning equipment mainly includes wet cleaning equipment, such as rotary spray systems and tank cleaning machines.

[0003] A search revealed that patent CN222851395U discloses a cleaning device for wafer processing. The device uses a feeding assembly to feed a wafer rack into a housing, where the wafer body and the rotating tube are staggered. Cleaning fluid can then be introduced into the rotating tube through a comprehensive piping assembly and sprayed out from through holes on both sides of the rotating tube, facilitating the simultaneous rinsing of multiple wafer bodies. During the rinsing process, the rotating tube can be rotated 360° by a drive assembly to improve the rinsing effect.

[0004] However, the aforementioned device has the following drawbacks: Although it solves the problem that existing technologies can only clean one wafer at a time, the device blocks the contact area between the wafer and the wafer holder by fixing the wafer to the wafer holder, resulting in blind spots that cannot be cleaned. After each cleaning cycle, the wafer angle must be adjusted for a second cleaning. Therefore, further improvements are needed. To this end, we propose a cleaning device for wafer processing. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a cleaning device for wafer processing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a cleaning device for wafer processing, comprising a housing, a side door rotatably connected to one side of the housing via a hinge, a placement rack inside the housing, fixing components for fixing the placement rack on both sides of the bottom wall inside the housing, a rinsing component inside the housing, a pump body installed on the upper surface of the housing and connected to the rinsing component, a rubber roller vertically arranged inside the housing and on the side facing the side door, a reduction motor for driving the rubber roller to rotate installed on the upper surface of the housing, a hot air component installed outside the housing, an air outlet opened on the top of the housing on the side facing the hot air component, a drain pipe fixed to the bottom of the side wall of the housing, and a controller installed on the outer side wall of the housing.

[0007] Furthermore, the placement rack includes a base plate, on the upper surface of which three vertical plates are fixed, and the three vertical plates have the same structure. Several first grooves are equally spaced on the side of the vertical plates near the center of the base plate. Two symmetrical first rollers are horizontally rotatably connected inside the first grooves. A second groove is formed on the inner wall of the first grooves, and a second roller is vertically rotatably connected inside the second grooves.

[0008] Furthermore, a handle is fixed to the top surface of the vertical plate.

[0009] Furthermore, the fixing component includes a support base fixed to the bottom wall of the box, the support base having a side groove on the side near the placement frame, the bottom plate being slidably connected to the side groove, and a compression bolt being threadedly connected to the top of the side groove.

[0010] Furthermore, the flushing assembly includes a vertically arranged main pipe, a plurality of horizontal pipes are fixed at equal intervals on the surface of the main pipe, a plurality of nozzles are fixed at equal intervals on the surface of the horizontal pipes, and the pump body outlet is fixedly connected to the top of the main pipe.

[0011] Furthermore, the bottom output shaft of the geared motor passes through the top wall of the housing and is fixedly connected to the rubber roller.

[0012] Furthermore, the hot air assembly includes a fan fixed to the upper surface of the housing and a fan hood fixed to the side wall of the housing. The fan hood and the fan exhaust port are fixedly connected to a duct. A heating tube is fixed in the middle of the duct, and an electric heating wire is installed inside the heating tube.

[0013] The beneficial effects of this utility model are:

[0014] In use, this invention comprises a housing, a placement rack, a fixing component, a rinsing component, a pump, a rubber roller, a geared motor, and a hot air component. After the wafer is placed on the placement rack, it can rotate horizontally on the rack. Then, the entire placement rack is fixed inside the housing by the fixing component. At this time, the side of the wafer contacts the rubber roller, and the geared motor drives the rubber roller to rotate. Under the action of friction, the rubber roller then drives the wafer to rotate. The rinsing component then rinses the wafer, eliminating cleaning dead corners and improving the cleaning effect of the wafer. Attached Figure Description

[0015] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is an overall sectional view of the present invention;

[0017] Figure 2 This is a perspective view of the placement rack of this utility model;

[0018] Figure 3 For the present utility model Figure 1 Enlarged view of point A in the middle;

[0019] Figure 4 For the present utility model Figure 1 Enlarged view at point B in the middle;

[0020] Figure 5 For the present utility model Figure 1 Enlarged view of point C in the middle.

[0021] The attached figures are labeled as follows:

[0022] 1. Housing; 2. Placement rack; 21. Base plate; 22. Vertical plate; 23. First groove; 24. First roller; 25. Second groove; 26. Second roller; 3. Fixing assembly; 31. Support base; 32. Side groove; 33. Extrusion bolt; 4. Flushing assembly; 41. Main pipe; 42. Horizontal pipe; 43. Nozzle; 5. Pump body; 6. Rubber roller; 7. Gear motor; 8. Hot air assembly; 81. Fan; 82. Air duct; 83. Air cover; 84. Heating element; 9. Air outlet; 10. Drain pipe; 11. Wafer. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0024] like Figures 1-5 As shown, a cleaning device for wafer processing is disclosed, comprising a housing 1, a side door rotatably connected to one side of the housing 1 via a hinge, a placement rack 2 disposed inside the housing 1, fixing components 3 for fixing the placement rack 2 disposed on both sides of the bottom wall of the housing 1, a rinsing component 4 disposed inside the housing 1, a pump body 5 mounted on the upper surface of the housing 1 and connected to the rinsing component 4, a rubber roller 6 vertically disposed inside the housing 1 and on the side facing the side door, a geared motor 7 for driving the rubber roller 6 to rotate disposed on the upper surface of the housing 1, a hot air component 8 disposed outside the housing 1, an air outlet 9 opened on the top of the side of the housing 1 facing the hot air component 8, a drain pipe 10 fixed to the bottom of the side wall of the housing 1, and a controller disposed on the outer side wall of the housing 1.

[0025] The placement rack 2 includes a base plate 21. Three vertical plates 22 are fixed on the upper surface of the base plate 21, and the three vertical plates 22 have the same structure. Several first grooves 23 are equally spaced on the side of the vertical plates 22 near the center of the base plate 21. Two symmetrical first rollers 24 are horizontally rotatably connected inside the first grooves 23. A second groove 25 is opened on the inner wall of the first grooves 23. A second roller 26 is vertically rotatably connected inside the second grooves 25.

[0026] In this embodiment, the three vertical plates 22 are located at the three ends of the circle. An opening is formed on the side where the vertical plates 22 are not provided. When in use, the wafer 11 can be inserted from the opening side into the first groove 23 and the second groove 25 at the same height as the three vertical plates 22. At this time, the upper and lower surfaces of the wafer 11 are in contact with the first roller 24, and the side of the wafer 11 is in contact with the second roller 26.

[0027] A handle is fixed to the top surface of the vertical plate 22. The handle makes it easy to pick up the entire shelf 2.

[0028] The fixing component 3 includes a support base 31 fixed to the bottom wall of the box 1. The support base 31 has a side groove 32 on the side near the placement rack 2. The bottom plate 21 is slidably connected to the side groove 32. The top of the side groove 32 is connected to a compression bolt 33 by threaded rotation.

[0029] When the placement rack 2 containing the wafer 11 is placed inside the housing 1, the base plate 21 is inserted into the side groove 32 between the two support seats 31 until the wafer 11 contacts the surface of the rubber roller 6. The rubber roller 6 has a certain elasticity, thereby ensuring that each wafer 11 can be in close contact with the rubber roller 6.

[0030] The flushing assembly 4 includes a vertically arranged main pipe 41, a number of horizontal pipes 42 are fixed at equal intervals on the surface of the main pipe 41, a number of nozzles 43 are fixed at equal intervals on the surface of the horizontal pipes 42, and the outlet of the pump body 5 is fixedly connected to the top of the main pipe 41.

[0031] Water can be injected into the rinsing assembly 4 by activating the pump body 5, and then sprayed out through several nozzles 43 to rinse the surface of the wafer 11.

[0032] The bottom output shaft of the geared motor 7 passes through the top wall of the housing 1 and is fixedly connected to the rubber roller 6.

[0033] The geared motor 7 can drive the rubber roller 6 to rotate slowly. Under the drive of friction, the rubber roller 6 will drive the wafer 11 in contact with it to rotate horizontally, so that different parts of the wafer 11 can rotate to one side of the rinsing component 4, avoiding cleaning dead corners.

[0034] The hot air assembly 8 includes a fan 81 fixed to the upper surface of the housing 1 and a fan hood 83 fixed to the side wall of the housing 1. The fan hood 83 and the exhaust port of the fan 81 are fixedly connected to a duct 82. A heating tube 84 is fixed in the middle of the duct 82, and an electric heating wire is installed inside the heating tube 84.

[0035] The heating wire is a heating resistance wire. When the fan 81 is turned on, the air passes through the heating tube 84 and is heated by the internal heating wire. The hot air enters the housing 1 from the fan cover 83, thereby drying the wafer 11 on the rack 2. Then the air is discharged from the air outlet 9. Its working principle is similar to that of a hair dryer.

[0036] Working principle: First, place the wafer 11 on the placement rack 2 outside the housing 1 as described above. Then, place the entire placement rack 2 inside the housing 1, with the side of the placement rack 2 without the vertical plate 22 facing the rubber roller 6. The bottom plate 21 slides in along the side groove 32. Once the side of the wafer 11 is in close contact with the rubber roller 6, tighten the compression bolt 33 at the top of the side groove 32. Use the compression bolt 33 to press and fix the bottom plate 21. Then, close the side door of the housing 1, start the reduction motor 7 and the pump body 5. The reduction motor 7 drives the rubber roller 6 to rotate. Under the action of friction, the rubber roller 6 drives the wafer 11 to rotate inside the placement rack 2. The water inlet of the pump body 5 is connected to a water source, thereby using the nozzle 43 to rinse the upper and lower surfaces of the rotating wafer 11. After rinsing, start the hot air assembly 8 to dry the wafer 11. After drying, open the side door and remove the placement rack 2 from inside the housing 1.

[0037] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A cleaning apparatus for wafer processing, comprising a housing (1), characterized in that: The box (1) has a side door connected to it by a hinge on one side. The box (1) has a shelf (2) inside. The box (1) has fixing components (3) for fixing the shelf (2) on both sides of the bottom wall of the box (1). The box (1) has a rinsing component (4) inside. The box (1) has a pump (5) installed on the upper surface of the box (1) and the pump (5) is connected to the rinsing component (4). The box (1) has a rubber roller (6) vertically installed on the side facing the side door inside. The box (1) has a geared motor (7) installed on the upper surface of the box (1) to drive the rubber roller (6) to rotate. The box (1) has a hot air component (8) installed on the outside. The box (1) has an air outlet (9) on the top of the side facing the hot air component (8). The box (1) has a drain pipe (10) fixed at the bottom of the side wall of the box (1). The box (1) has a controller installed on the outer side wall of the box (1).

2. The cleaning apparatus for wafer processing according to claim 1, characterized in that: The placement rack (2) includes a base plate (21). Three vertical plates (22) are fixed on the upper surface of the base plate (21), and the three vertical plates (22) have the same structure. Several first grooves (23) are equally spaced on the side of the vertical plate (22) near the center of the base plate (21). Two symmetrical first rollers (24) are horizontally rotatably connected inside the first groove (23). A second groove (25) is opened on the inner wall of the first groove (23). A second roller (26) is vertically rotatably connected inside the second groove (25).

3. The cleaning apparatus for wafer processing according to claim 2, characterized in that: A handle is fixed to the top surface of the vertical plate (22).

4. The cleaning apparatus for wafer processing according to claim 2, characterized in that: The fixing component (3) includes a support base (31) fixed to the bottom wall of the box (1). The support base (31) has a side groove (32) on the side near the placement rack (2). The bottom plate (21) is slidably connected to the side groove (32). The top of the side groove (32) is connected to a compression bolt (33) by threaded rotation.

5. A cleaning apparatus for wafer processing according to claim 1, characterized in that: The flushing assembly (4) includes a vertically arranged main pipe (41), a plurality of horizontal pipes (42) are fixed at equal intervals on the surface of the main pipe (41), a plurality of nozzles (43) are fixed at equal intervals on the surface of the horizontal pipes (42), and the outlet of the pump body (5) is fixedly connected to the top of the main pipe (41).

6. The cleaning apparatus for wafer processing according to claim 1, characterized in that: The bottom output shaft of the geared motor (7) passes through the top wall of the housing (1) and is fixedly connected to the rubber roller (6).

7. A cleaning apparatus for wafer processing according to claim 1, characterized in that: The hot air assembly (8) includes a fan (81) fixed to the upper surface of the housing (1) and a fan hood (83) fixed to the side wall of the housing (1). The fan hood (83) and the exhaust port of the fan (81) are fixedly connected to a duct (82). A heating tube (84) is fixed in the middle of the duct (82), and an electric heating wire is installed inside the heating tube (84).

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