Wafer probe card auxiliary alignment device

Abstract

The utility model relates to wafer processing technical field discloses a kind of wafer probe card auxiliary alignment device, including bottom plate, support leg, the bottom plate upper portion is provided with auxiliary alignment structure, the auxiliary alignment structure includes alignment mechanism and auxiliary mechanism, the alignment mechanism includes drive motor, rotating rod, guide plate, reversible motor, threaded rod, the drive motor output end is connected with the rotating rod bottom each other, this wafer probe card auxiliary alignment device realizes drive motor, rotating rod can drive guide plate and drive wafer chuck accurate rotation, realize the millimeter level fine adjustment of wafer circumferential angle, reversible motor, threaded rod cooperate with the movement groove of guide plate, can drive moving plate to translate steadily, complete the fine calibration of wafer radial position, the light emitter on positioning strip and the light receiver of bearing plate bottom form real-time signal feedback, only when beam stable transmission judges alignment accurate, avoid artificial observation or subjective / wear error of mechanical scale.

Description

Technical Field

[0001] This utility model belongs to the field of wafer processing technology, specifically, it relates to a wafer probe card-assisted alignment device. Background Technology

[0002] Wafers are the core substrate for semiconductor manufacturing. Essentially, they are highly purified semiconductor wafers with specific crystal structures. The vast majority of wafers use silicon (Si) as the main material, while in a few special scenarios, compound semiconductor materials such as gallium arsenide (GaAs), gallium nitride (GaN), and silicon carbide (SiC) are used. The number of chip cells (dies) integrated on a wafer has increased significantly, which places stringent requirements on the accuracy and efficiency of the wafer testing process. As a core tool for wafer testing, probe cards need to make precise contact with the pads or bumps of the chips on the wafer through precise probe tips. Therefore, auxiliary alignment devices are needed to align the probe cards with the wafer.

[0003] Existing auxiliary alignment devices typically involve placing the wafer directly into the device for testing. However, in practical use, they lack a bidirectional fine adjustment structure for both circumferential and radial directions. Relying solely on simple mechanical limits or manual pushing to adjust the wafer position fails to achieve precise circumferential rotation of the wafer and makes millimeter-level fine-tuning of the wafer's radial position difficult. This leads to a misalignment between the wafer's geometric center and the preset probe card alignment reference, resulting in the probe card tip failing to accurately contact the wafer pads or bumps, causing invalid test data, and even scratching the wafer surface. Utility Model Content

[0004] The purpose of this invention is to provide a wafer probe card-assisted alignment device to solve the problems mentioned in the background art.

[0005] A wafer probe card auxiliary alignment device includes a base plate and support legs, and an auxiliary alignment structure is provided on the top of the base plate;

[0006] The auxiliary alignment structure includes an alignment mechanism and an auxiliary mechanism;

[0007] The alignment mechanism includes a drive motor, a rotating rod, a guide plate, a forward and reverse motor, and a threaded rod. The output end of the drive motor is connected to the bottom of the rotating rod, the top of the rotating rod is connected to the bottom of the guide plate, one end of the guide plate is connected to one end of the forward and reverse motor, and the output end of the forward and reverse motor is connected to one end of the threaded rod. A movable plate is threadedly connected to the outer wall of the threaded rod, a fixed plate is fixedly installed on the top of the movable plate, a wafer chuck is fixedly installed on the top of the fixed plate, a connecting plate is fixedly installed on the top of the fixed plate, a positioning strip is fixedly installed on one side of the connecting plate, a light emitter is fixedly installed on the top of the positioning strip, a limit plate is fixedly installed on one side of the connecting plate, and a fixing bolt is threadedly connected to the inner wall of the limit plate.

[0008] In a preferred embodiment of this utility model, the top of the guide plate is provided with a movable groove, the bottom of the movable plate is slidably connected to the inner wall of the movable groove, and there are two movable plates, which are symmetrically distributed on the bottom of the fixed plate, so that the position of the wafer chuck can be adjusted quickly and conveniently, thereby enabling better alignment work.

[0009] In a preferred embodiment of this utility model, there are two connecting plates, which are symmetrically distributed on the top of the fixing plate, and two positioning strips, which are symmetrically distributed on the top of the wafer chuck, thereby enabling quick and convenient clamping of wafers of different sizes, and thus enabling better testing.

[0010] In a preferred embodiment of this utility model, there are two limiting plates, which are symmetrically distributed on both sides of the connecting plate. The top of the fixing plate has a fixing hole, and the bottom of the fixing bolt is threaded to the inner wall of the fixing hole. This allows for quick and convenient assembly and disassembly of the connecting plate, the positioning strip, and the light emitter, thus enabling better use.

[0011] In a preferred embodiment of this utility model, the auxiliary mechanism includes a mounting frame, an electric telescopic rod, a support plate, a probe station, and a sliding plate. The inner wall of the mounting frame is connected to the outer wall of the electric telescopic rod. The bottom of the electric telescopic rod is connected to the top of the support plate. The bottom of the support plate is connected to the top of the probe station. One side of the support plate is connected to one end of the sliding plate. A light receiver is fixedly installed at the bottom of the support plate.

[0012] In a preferred embodiment of this utility model, the mounting bracket is U-shaped, with a sliding groove on one side. One end of the sliding plate is slidably connected to the inner wall of the sliding groove, and a probe clip is provided at the bottom of the probe station. This allows for quick and convenient adjustment of the height of the probe station and the light receiver, thereby enabling better detection work.

[0013] In a preferred embodiment of this utility model, the bottom of the base plate is connected to the top of the support leg, the bottom of the base plate is connected to the top of the drive motor, and the top of the base plate is connected to the bottom of the mounting frame.

[0014] Compared with the prior art, the present invention has the following advantages:

[0015] 1. This wafer probe card-assisted alignment device, through the alignment mechanism, enables the drive motor and rotating rod 302 to drive the guide plate to precisely rotate the wafer chuck, achieving millimeter-level fine adjustment of the wafer's circumferential angle. The forward and reverse motors and threaded rods, in conjunction with the moving slot of the guide plate, can drive the moving plate to smoothly translate, completing the fine calibration of the wafer's radial position. The light emitter on the positioning strip and the light receiver at the bottom of the carrier plate form real-time signal feedback, and the alignment is determined to be accurate only when the light beam is transmitted stably, avoiding subjective / wear errors from manual observation or mechanical calibration.

[0016] 2. This wafer probe card auxiliary alignment device enables quick and convenient adjustment of the height of the probe station and the photodetector through an auxiliary mechanism, thereby enabling better detection work. Furthermore, the probe station is rigidly connected to the carrier plate and remains horizontal throughout the height adjustment process, ensuring that the probe card tip makes parallel contact with the wafer surface, thus facilitating better use.

[0017] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0018] In the attached diagram:

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a partial structural schematic diagram of the present invention;

[0021] Figure 3 This is a schematic diagram of the alignment mechanism of this utility model. Figure 1 ;

[0022] Figure 4 This is a schematic diagram of the alignment mechanism of this utility model. Figure 2 ;

[0023] Figure 5 This is a schematic diagram of the auxiliary mechanism of this utility model;

[0024] In the diagram: 1. Base plate; 2. Support leg; 3. Alignment mechanism; 301. Drive motor; 302. Rotating rod; 303. Guide plate; 304. Forward and reverse motor; 305. Threaded rod; 306. Moving plate; 307. Fixing plate; 308. Wafer chuck; 309. Connecting plate; 310. Positioning strip; 311. Light emitter; 312. Limiting plate; 313. Fixing bolt; 4. Auxiliary mechanism; 401. Mounting bracket; 402. Electric telescopic rod; 403. Bearing plate; 404. Probe station; 405. Sliding plate; 406. Light receiver. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate this utility model.

[0026] Example 1:

[0027] like Figures 1 to 5 As shown, a wafer probe card auxiliary alignment device includes a base plate 1, a support leg 2, and an auxiliary alignment structure is provided on the top of the base plate 1;

[0028] The auxiliary alignment structure includes alignment mechanism 3 and auxiliary mechanism 4;

[0029] The alignment mechanism 3 includes a drive motor 301, a rotating rod 302, a guide plate 303, a forward and reverse motor 304, and a threaded rod 305. The output end of the drive motor 301 is connected to the bottom of the rotating rod 302, the top of the rotating rod 302 is connected to the bottom of the guide plate 303, one end of the guide plate 303 is connected to one end of the forward and reverse motor 304, the output end of the forward and reverse motor 304 is connected to one end of the threaded rod 305, a moving plate 306 is threadedly connected to the outer wall of the threaded rod 305, a fixed plate 307 is fixedly installed on the top of the moving plate 306, a wafer chuck 308 is fixedly installed on the top of the fixed plate 307, a connecting plate 309 is fixedly installed on the top of the fixed plate 307, a positioning strip 310 is fixedly installed on one side of the connecting plate 309, a light emitter 311 is fixedly installed on the top of the positioning strip 310, a limiting plate 312 is fixedly installed on one side of the connecting plate 309, and a fixing bolt 313 is threadedly connected to the inner wall of the limiting plate 312.

[0030] In this embodiment, the top of the guide plate 303 is provided with a movable groove, and the bottom of the movable plate 306 is slidably connected to the inner wall of the movable groove. There are two movable plates 306, which are symmetrically distributed on the bottom of the fixed plate 307, so that the position of the wafer chuck 308 can be adjusted quickly and conveniently, thereby enabling better alignment work.

[0031] Furthermore, there are two connecting plates 309, which are symmetrically distributed on the top of the fixing plate 307. There are also two positioning strips 310, which are symmetrically distributed on the top of the wafer chuck 308. This allows for quick and convenient clamping of wafers of different sizes, thereby enabling better testing.

[0032] Furthermore, there are two limiting plates 312, which are symmetrically distributed on both sides of the connecting plate 309. The top of the fixing plate 307 has a fixing hole, and the bottom of the fixing bolt 313 is threaded to the inner wall of the fixing hole, so that the connecting plate 309, the positioning strip 310 and the light emitter 311 can be quickly and conveniently disassembled and assembled, thus enabling better use.

[0033] Alignment reference calibration steps:

[0034] Calibration procedure before first use:

[0035] Take a standard calibration piece, an 8-inch / 12-inch calibration wafer with a cross center mark and a center mark accuracy of ±0.001mm, place it on the wafer chuck 308, and initially limit its position using the positioning bar 310;

[0036] Attach the dial indicator to the guide plate 303, with the indicator head contacting the edge of the calibration wafer. Manually rotate the guide plate 303 to adjust the dial indicator reading fluctuation to ≤0.005mm. At this point, the center of the calibration wafer coincides with the reference center of the wafer chuck 308.

[0037] Start the light emitter 311, use a JC100 laser collimator to measure the line connecting the light emitter's emission center and the calibration wafer's center, and record the horizontal angle and distance of this line as the "alignment reference line";

[0038] The initial angle of the drive motor 301 is marked on the guide plate 303, and the initial position of the forward and reverse motors 304 is marked on the end of the threaded rod 305. Before each subsequent alignment, the drive motor is reset to the initial mark to ensure that the reference is consistent.

[0039] Optical signal threshold and feedback logic:

[0040] The light receiver 406, model PT334-6C photoelectric sensor, has a received light intensity threshold set to 500 lux.

[0041] When the intensity of the laser beam received by the optical receiver is ≥500 lux, the signal is determined to be stable, and a high-level signal is sent to the external controller, model S7-1200PLC, indicating that the radial / circumferential position of the wafer is accurate.

[0042] When the light intensity is less than 500 lux, a low-level signal is sent, and the controller triggers an adjustment command: if the light intensity on one side is insufficient, drive the drive motor 301 to fine-tune the circumferential angle; if the light intensity on both sides is insufficient, drive the forward and reverse motors 304 to fine-tune the radial position until the light intensity on both sides is ≥500 lux.

[0043] The drive motor 301 is fixed to the motor mounting bracket at the bottom of the base plate 1 by four M8×20 socket head cap screws, and the mounting bracket is welded to the base plate 1.

[0044] The rotating rod 302 is connected to the guide plate 303 by a 6×10mm flat key with a keyway clearance of 0.01-0.03mm. The top of the rotating rod is locked with an M4 set screw to prevent axial movement.

[0045] The limiting plates 312 on both sides of the connecting plate 309 are welded and fixed to the connecting plate. The fixing hole at the top of the fixing plate 307 is an M5 threaded hole with a depth of 10mm. After the fixing bolt 313 is screwed in, 2-3 threads need to be exposed to ensure a tight connection.

[0046] The 307 mounting plate has four sets of mounting holes along the circumference on its top, suitable for 8-inch / 12-inch wafers.

[0047] When adapting to an 8-inch wafer, use a 30mm long positioning strip 310 to fix the connecting plate 309 in the first set of fixing holes near the wafer chuck 308, with the inner side of the positioning strip in contact with the edge of the 8-inch wafer.

[0048] When adapting to a 12-inch wafer, replace it with a positioning strip 310 with a length of 45mm, fix the connecting plate 309 in the third set of fixing holes away from the wafer chuck 308, and make the inner side of the positioning strip fit against the edge of the 12-inch wafer.

[0049] When replacing the positioning strip, the installation position of the optical transmitter 311 needs to be adjusted simultaneously. Three M3 mounting holes are reserved at the top of the positioning strip, with a hole spacing of 10mm, to ensure that the distance between the emission center and the wafer center is always 160mm.

[0050] The drive motor 301 is equipped with a TB6600 microstepping driver, with a circumferential adjustment accuracy of up to 0.1125°, and the motor output shaft is equipped with a mechanical limit block to prevent the rotation angle from exceeding ±180°;

[0051] The forward and reverse motors 304 are controlled by a driver to achieve micro-step control. For every one revolution of the threaded rod 305, the moving plate 306 moves 2mm. After subdivision, the minimum movement is 0.01mm. Polyurethane buffer blocks are provided at both ends of the guide plate 303 to prevent the moving plate from hitting the limit position.

[0052] When wafer testing is required, the operator places the wafer onto the wafer chuck 308 and uses the positioning strip 310 for assisted installation, ensuring that the geometric center of the wafer is aligned with the reference center of the wafer chuck 308. The probe card to be docked is then installed at the bottom of the probe station 404, completing the initial placement of the core testing components. At this point, the drive motor 301, fixed to the bottom of the base plate 1, is activated, and its output drives the rotating rod 302 to rotate. Since the top of the rotating rod 302 is connected to the bottom of the guide plate 303, the guide plate 303 rotates synchronously with the rotating rod 302. The rotation of the guide plate 303 indirectly drives the fixing plate 307 and the wafer chuck 308 to rotate together with the guide plate 303, thereby adjusting the circumferential angle of the wafer so that the orientation of the light emitters 311 on both sides is initially aligned with the direction of the probe station 404, thus enabling circumferential angle adjustment. At this point, the forward and reverse motor 304, fixed to one end of the guide plate 303, is activated, and its output drives the... The threaded rod 305 rotates forward or backward, driving the moving plate 306 to move. The moving plate 306 then moves the top fixed plate 307, wafer chuck 308, and wafer horizontally until the wafer's geometric center is nearly aligned with the preset alignment reference line. This completes the fine adjustment of the wafer's planar position. The light emitters 311 on the positioning strips 310 on both sides are then activated, emitting a stable beam of light. If the wafer and probe station are aligned, the beam will be horizontally transmitted to the corresponding light receiver 406 at the bottom of the support plate 403. If the light receiver 406 does not receive the beam, or the received signal strength is below the threshold, it indicates a deviation in the wafer's position or the probe station's height. In this case, the drive motor 301, the forward / reverse motor 304, or the electric telescopic rod 40 must be restarted until the light receiver 406 receives a stable signal, completing the final alignment and adjustment. This allows for better alignment and testing.

[0053] Example 2:

[0054] Based on Embodiment 1, the auxiliary mechanism 4 includes a mounting frame 401, an electric telescopic rod 402, a support plate 403, a probe station 404, and a sliding plate 405. The inner wall of the mounting frame 401 is connected to the outer wall of the electric telescopic rod 402. The bottom of the electric telescopic rod 402 is connected to the top of the support plate 403. The bottom of the support plate 403 is connected to the top of the probe station 404. One side of the support plate 403 is connected to one end of the sliding plate 405. A light receiver 406 is fixedly installed at the bottom of the support plate 403.

[0055] In this embodiment, the mounting bracket 401 is U-shaped, and a sliding groove is provided on one side of the mounting bracket 401. One end of the sliding plate 405 is slidably connected to the inner wall of the sliding groove. A probe card is provided at the bottom of the probe station 404, so that the height of the probe station 404 and the light receiver 406 can be quickly and conveniently adjusted, thereby enabling better detection work.

[0056] Furthermore, the bottom of the base plate 1 is connected to the top of the support leg 2, the bottom of the base plate 1 is connected to the top of the drive motor 301, and the top of the base plate 1 is connected to the bottom of the mounting bracket 401.

[0057] Probe station height calibration and optical signal alignment:

[0058] Altitude calibration steps:

[0059] Place the standard calibration wafer on the wafer chuck 308, start the light emitter 311, adjust the electric telescopic rod 402 to raise and lower, and use a height gauge to measure the height of the light emitter's emission center.

[0060] Adjust the mounting bracket of the optical receiver 406 (with M4 fine-tuning knob) so that the height of the optical receiver center is also 80mm. Use a level to calibrate the carrier plate 403 to ensure that the beam is transmitted horizontally with an error ≤0.01mm.

[0061] After calibration, tighten the M5 locking bolts on the locking bracket, mark the alignment height of the electric telescopic rod on the mounting bracket 401, and ensure that the bottom of the bearing plate is 50mm from the top of the fixing plate. This height parameter will be used directly for subsequent alignment.

[0062] Optical signal alignment verification: After starting the optical transmitter 311, use an oscilloscope of model DS1102E to detect the output signal of the optical receiver 406. When the peak value of the signal waveform is ≥3.3V and the fluctuation is ≤0.1V, it is determined that the beam is accurately aligned; if the peak value of the waveform is <3.3V, finely adjust the height of the electric telescopic rod or the position of the optical receiver until the signal is stable.

[0063] The probe station 404 has an adjustable probe card clamp at the bottom. The clamp body is made of aluminum alloy and has a silicone pad on the inner ring to prevent damage to the edge of the probe card. There is an M6 hand-tightening bolt on each side of the clamp. The probe card is tightened by rotating the bolt. It is suitable for probe cards with a size range of 50mm×50mm-150mm×150mm.

[0064] If a probe card of a special size needs to be adapted, the bushing inside the fixture can be replaced. The bushing is connected to the fixture by a snap-fit, and the replacement time is ≤5 minutes.

[0065] The clearance between the sliding plate 405 and the sliding groove of the mounting bracket 401 is 0.02-0.05mm. The inner wall of the sliding groove is coated with No. 3 lithium-based grease to ensure smooth lifting and lowering. A dust cover is installed on the top of the sliding plate to prevent dust from entering and affecting the fitting accuracy.

[0066] The 402 electric telescopic pole is equipped with dual limit protection:

[0067] Hardware limit: A metal limit ring is installed at the bottom of the telescopic rod. When the telescopic rod is raised to the maximum stroke of 100mm or the minimum stroke of 0mm, the limit ring triggers a mechanical switch to cut off the motor power.

[0068] Software limit: The controller presets a safe descent height, with the bottom of the probe station 1mm away from the wafer surface. When the limit sensor of model E3Z-LS63 detects a distance ≤1mm, it sends a command to decelerate the electric telescopic rod to 2mm / s to avoid rapidly damaging the wafer.

[0069] Component connection and reset process

[0070] The electric telescopic rod 402 is connected to the inner wall of the mounting bracket 401 via a flange. Four M6×15 bolts are evenly distributed on the flange. The bolt tightening torque is 8 N·m to ensure that the telescopic rod does not tilt.

[0071] The support plate 403 is fixed to the bottom of the electric telescopic rod by M8 bolts, and one side of the support plate is welded to the sliding plate 405 to ensure that the two move synchronously.

[0072] Post-test reset procedure:

[0073] After the wafer testing is completed, the controller sends a reset command, and the electric telescopic rod drives the probe station to rise to the initial height, with the bottom of the support plate 100mm away from the top of the fixed plate;

[0074] When the light emitter 311 is powered off, the drive motor 301 and the forward and reverse motor 304 are reset to their initial marked positions.

[0075] If a wafer needs to be replaced, the electric telescopic rod maintains its initial height, the operator removes the tested wafer, places the new wafer, and restarts the alignment process.

[0076] The electric telescopic rod 402, fixed to the inner wall of the mounting bracket 401, is activated, causing its telescopic end to move the bottom support plate 403 up and down. Since the bottom of the support plate 403 is connected to the probe station 404 and one side is connected to the sliding plate 405, the probe station 404 and the sliding plate 405 rise and fall synchronously with the support plate 403. The sliding plate 405 increases the stability of the support plate 403 during movement, thus enabling better adjustment. Meanwhile, the optical receiver 406 (corresponding one-to-one with the optical transmitter 311), fixed to the bottom of the support plate 403, rises and falls with the support plate 403 until the optical receiver 406... The "receiving center" of probe station 406 and the "emitting center" of optical transmitter 311 are at the same level, ensuring that the beam emitted by optical transmitter 311 can be accurately pointed to optical receiver 406. This allows for quick and convenient adjustment of the height of probe station 404 and optical receiver 406. When optical receiver 406 sends a "correct alignment" signal, electric telescopic rod 402 is activated again, causing the carrier plate 403 and probe station 404 to slowly descend, so that the probe tip of the probe card at the bottom of probe station 404 accurately contacts the test point (pad / bump) on the wafer. Then the wafer electrical performance testing process can be started.

Claims

1. A wafer probe card-assisted alignment device, comprising a base plate (1) and support legs (2), characterized in that: An auxiliary alignment structure is provided above the base plate (1); The auxiliary alignment structure includes an alignment mechanism (3) and an auxiliary mechanism (4). The alignment mechanism (3) includes a drive motor (301), a rotating rod (302), a guide plate (303), a forward and reverse motor (304), and a threaded rod (305). The output end of the drive motor (301) is connected to the bottom of the rotating rod (302), the top of the rotating rod (302) is connected to the bottom of the guide plate (303), one end of the guide plate (303) is connected to one end of the forward and reverse motor (304), the output end of the forward and reverse motor (304) is connected to one end of the threaded rod (305), and the outer wall of the threaded rod (305) is threaded with... A movable plate (306) is fixedly mounted on the top of the movable plate (306), a fixed plate (307) is fixedly mounted on the top of the fixed plate (307), a connecting plate (309) is fixedly mounted on the top of the fixed plate (307), a positioning strip (310) is fixedly mounted on one side of the connecting plate (309), a light emitter (311) is fixedly mounted on the top of the positioning strip (310), a limiting plate (312) is fixedly mounted on one side of the connecting plate (309), and a fixing bolt (313) is threadedly connected to the inner wall of the limiting plate (312).

2. The wafer probe card-assisted alignment device according to claim 1, characterized in that: The guide plate (303) has a moving groove at the top, and the bottom of the moving plate (306) is slidably connected to the inner wall of the moving groove. There are two moving plates (306), which are symmetrically distributed at the bottom of the fixed plate (307).

3. The wafer probe card-assisted alignment device according to claim 1, characterized in that: There are two connecting plates (309), which are symmetrically distributed on the top of the fixing plate (307). There are two positioning strips (310), which are symmetrically distributed on the top of the wafer chuck (308).

4. The wafer probe card-assisted alignment device according to claim 1, characterized in that: There are two limiting plates (312), which are symmetrically distributed on both sides of the connecting plate (309). The top of the fixing plate (307) has a fixing hole, and the bottom of the fixing bolt (313) is threaded to the inner wall of the fixing hole.

5. The wafer probe card-assisted alignment device according to claim 1, characterized in that: The auxiliary mechanism (4) includes a mounting frame (401), an electric telescopic rod (402), a support plate (403), a probe station (404), and a sliding plate (405). The inner wall of the mounting frame (401) is connected to the outer wall of the electric telescopic rod (402). The bottom of the electric telescopic rod (402) is connected to the top of the support plate (403). The bottom of the support plate (403) is connected to the top of the probe station (404). One side of the support plate (403) is connected to one end of the sliding plate (405). A light receiver (406) is fixedly installed at the bottom of the support plate (403).

6. The wafer probe card-assisted alignment device according to claim 5, characterized in that: The mounting bracket (401) is U-shaped, and a sliding groove is provided on one side of the mounting bracket (401). One end of the sliding plate (405) is slidably connected to the inner wall of the sliding groove, and a probe card is provided at the bottom of the probe station (404).

7. The wafer probe card-assisted alignment device according to claim 1, characterized in that: The bottom of the base plate (1) is connected to the top of the support leg (2), the bottom of the base plate (1) is connected to the top of the drive motor (301), and the top of the base plate (1) is connected to the bottom of the mounting bracket (401).

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