Tooling and bonding apparatus for securing semiconductor structures

Abstract

The application provides a tool for fixing a semiconductor structure and a bonding device. The tool for fixing a semiconductor structure comprises a base, a compression structure, a first driving part and at least one second driving part. The base is provided with a supporting surface. The compression structure comprises two compression parts arranged on the same side of the supporting surface and oppositely arranged. The first driving part is connected with each compression part for driving each compression part to move, so that each compression part approaches and moves away from the supporting surface. Each second driving part is connected with one compression part for driving the compression part connected therewith to approach and move away from the other compression part. The bonding device comprises the tool for fixing a semiconductor structure.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a tooling and bonding apparatus for fixing semiconductor structures. Background Technology

[0002] In common semiconductor packaging technologies, such as chip packaging, the chip is first mounted on the base island of a leadframe, and then wires are used to electrically connect the chip's pads to the leadframe pins. Specifically, one end of the wire is bonded to the pad, and the other end is bonded to the pin.

[0003] Wire bonding devices are typically used to bond wires to chips and pins. These devices include a pressure plate used to secure the semiconductor structure, including the chip and lead frame. The pressure plate has a fixed size and cannot be adapted to semiconductor structures of different sizes. Utility Model Content

[0004] This application provides a tooling and bonding apparatus for fixing semiconductor structures.

[0005] According to a first aspect of the embodiments of this application, a tooling for fixing a semiconductor structure is provided, comprising: The base has a supporting surface; The crimping structure includes two crimping parts disposed on the same side of the support surface, and the two crimping parts are disposed opposite to each other; A first driving unit is connected to each of the pressing parts and is used to drive each of the pressing parts to move, so that each of the pressing parts moves closer to and away from the support surface; At least one second driving part, each second driving part being connected to one of the crimping parts, for driving the crimping part connected thereto to move closer to and away from another crimping part.

[0006] In one embodiment, the tooling for fixing the semiconductor structure further includes two support bases mounted on the base; the first driving part includes two driving members, each driving member being connected to one of the pressing parts, and each driving member being disposed on one of the support bases; The driving component includes a first motor, a gear, and a moving part. The first motor is fixed to the support base and is drivenly connected to the gear. The gear has a plurality of first meshing teeth, and the moving part has a plurality of second meshing teeth arranged along a first direction perpendicular to the support surface. The second meshing teeth mesh with the first meshing teeth. The moving part is slidably connected to the support base and can slide relative to the support base along the first direction. The moving part is connected to the pressing part. The first motor drives the gear to rotate, and the gear drives the moving part to slide relative to the support base along the first direction.

[0007] In one embodiment, the support base is provided with a fixed rod extending in a first direction, and the movable part is sleeved on the fixed rod and can slide relative to the fixed rod in the first direction.

[0008] In one embodiment, the second drive unit includes a screw and a connecting part; the screw is rotatable relative to the base; the axis of the screw is parallel to the support surface; the connecting part is threadedly connected to the screw and is circumferentially limited around the central axis of the screw; the connecting part is connected to the crimping part.

[0009] In one embodiment, the tooling for fixing the semiconductor structure includes two second driving units; at least one of the second driving units includes a second motor, which is fixed to the base and driven to the screw to drive the screw to rotate.

[0010] In one embodiment, the base is provided with a slide groove, and the screw is located in the slide groove; the connecting part is at least partially located in the slide groove and is movable along the slide groove; one of the side of the connecting part and the side of the slide groove is provided with a limiting block, and the other is provided with a limiting groove, the limiting block is limited in the limiting groove and is movable relative to the limiting groove along the axial direction of the screw.

[0011] In one embodiment, the tooling for fixing the semiconductor structure includes two second driving units; the axes of the screws of the two second driving units are in the same straight line or parallel to each other.

[0012] In one embodiment, the crimping portion includes a first crimping plate and two second crimping plates connected to the first crimping plate. The direction in which one crimping portion points to the other crimping portion is a second direction. The two second crimping plates of the same crimping portion are arranged in a direction perpendicular to the second direction and parallel to the support surface, and the opposite ends of the first crimping plate are respectively connected to one of the second crimping plates.

[0013] In one embodiment, the crimping portion is detachably connected to the first driving portion; and / or, The crimping portion includes a main body and a flexible pad located on the side of the main body facing the support surface.

[0014] According to a second aspect of the present application, a bonding apparatus is provided, the bonding apparatus including a bonding device and the above-described tooling for fixing a semiconductor structure, wherein the base is mounted on the bonding device.

[0015] The main technical effects achieved by the embodiments of this application are: The tooling and bonding apparatus for fixing semiconductor structures provided in this application embodiment has a first driving unit that can adjust the distance between each pressing part and the support surface of the base, thereby facilitating the placement and removal of the semiconductor structure from the support surface, and can fix semiconductor structures of different thicknesses; the second driving unit can adjust the distance between the two pressing parts, so that the tooling can be used to fix semiconductor structures of different widths. It can be seen that the tooling for fixing semiconductor structures provided in this application embodiment can be used to fix semiconductor structures of various sizes, thus having better applicability. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural schematic diagram of a tooling for fixing a semiconductor structure provided in an exemplary embodiment of this application; Figure 2 This is a three-dimensional structural schematic diagram of a tooling for fixing a semiconductor structure provided in an exemplary embodiment of this application; Figure 3 This is a schematic diagram of the structure of the first driving part and the pressing part of the tooling for fixing a semiconductor structure provided in an exemplary embodiment of this application; Figure 4 This is a schematic diagram of the structure of the crimping part and connecting block provided in an exemplary embodiment of this application. Specific Implementation

[0017] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0018] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0019] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0020] This application provides a tooling for fixing semiconductor structures. For example... Figure 1 and Figure 2As shown, the tooling for fixing the semiconductor structure includes a base 10, a pressing structure 20, a first driving part and at least one second driving part 40.

[0021] The base 10 has a support surface 11. The pressing structure 20 includes two pressing parts 21, which are disposed on the same side of the support surface 11 and are arranged opposite to each other. A first driving part is connected to each pressing part 21 and is used to drive each pressing part 21 to move, so that each pressing part 21 moves closer to and away from the support surface 11. Each second driving part 40 is connected to one pressing part 21 and is used to drive the pressing part 21 connected to it to move closer to and away from the other pressing part 21.

[0022] The fixture for fixing semiconductor structures provided in this application embodiment has a first driving unit that can adjust the distance between each pressing part 21 and the support surface 11 of the base 10, thereby facilitating the placement and removal of the semiconductor structure from the support surface 11, and can fix semiconductor structures of different thicknesses; the second driving unit 40 can adjust the distance between the two pressing parts 21, so that the fixture can be used to fix semiconductor structures of different widths. It can be seen that the fixture for fixing semiconductor structures provided in this application embodiment can be used to fix semiconductor structures of various sizes, and has better applicability.

[0023] In one embodiment, the semiconductor structure may include a lead frame and a chip. The lead frame includes a base island, pins, and a frame. The base island and pins are located within and connected to the frame, and the chip is mounted on the base island. A crimping portion 21 is crimped onto the frame of the lead frame to fix the semiconductor structure.

[0024] For ease of description, we now introduce a first direction X, a second direction Y, and a third direction Z. For example... Figure 1 and Figure 2 As shown, the first direction X is perpendicular to the support surface 11; the direction from one crimping part 21 to the other crimping part 21 is the second direction Y, which is perpendicular to the first direction X; the third direction Z is perpendicular to both the first direction X and the second direction Y.

[0025] In one embodiment, such as Figure 1 As shown, the base 10 has a mounting plate 12 on its side, and the mounting plate 12 has mounting holes 121. The base 10 can be mounted on the bonding equipment of its bonding device via a connector passing through the mounting holes 121.

[0026] Furthermore, mounting plates 12 are provided on opposite sides of the base 10. This allows the tooling to be installed more securely on the bonding equipment. Figure 1In the illustrated embodiment, two mounting plates 12 are respectively provided on opposite sides of the base 10. In other embodiments, one mounting plate 12 may be provided on each opposite side of the base 10, or three or more mounting plates 12 may be provided.

[0027] In one embodiment, such as Figure 3 and Figure 4 As shown, the crimping portion 21 includes a first crimping plate 211 and two second crimping plates 212 connected to the first crimping plate 211. The two second crimping plates 212 are arranged in the Z-direction and are connected to one of the two opposite ends of the first crimping plate 211, respectively. The crimping portion 21 is approximately U-shaped. With this configuration, one crimping portion 21 can crimp three edges of the semiconductor structure, and two crimping portions 21 of the same crimping structure 20 can crimp four edges of the semiconductor structure, thereby firmly fixing the semiconductor structure to the bonding device. Specifically, two opposite edges of the semiconductor structure are crimped by two first crimping plates 211, and the other two opposite edges are crimped by second crimping plates 212.

[0028] Furthermore, the extension directions of the first pressing plates 211 of the two pressing portions 21 can be parallel to each other, and the second pressing plates 212 of the two pressing portions 21 located on the same side can extend in the same direction.

[0029] Furthermore, in the same pressing part 21, the extending directions of the two second pressing plates 212 can be perpendicular to the extending direction of the first pressing plate 211.

[0030] In one embodiment, such as Figure 3 and Figure 4 As shown, the pressing portion 21 includes a main body 201 and a flexible pad 202 located on the side of the main body 201 facing the support surface 11. This arrangement ensures that the pressing portion 21 will not damage the semiconductor structure when it comes into contact with it. The first pressing plate 211 and the second pressing plate 212 each include a portion of the flexible pad 202. In some embodiments, the flexible pad 202 may be made of rubber.

[0031] In one embodiment, the crimping portion 21 is detachably connected to the first driving portion. This configuration allows for the selection of a matching crimping portion 21 based on the size of the semiconductor structure, enabling the crimping portion 21 to better secure the semiconductor structure. Specifically, the tooling may include multiple sets of crimping structures 20, with different distances between the two second crimping plates 212 of the crimping portion 21 in different crimping structures 20. A matching crimping structure 20 can be selected based on the size of the semiconductor structure. This allows the tooling to secure semiconductor structures of more different sizes, further improving the tooling's applicability.

[0032] In one embodiment, such as Figures 1 to 3 As shown, the tooling for fixing the semiconductor structure also includes two support seats 50, which are mounted on the base 10; the first driving part includes two driving members 30, each of which is connected to one of the pressing parts 21, and each of which is disposed on one of the support seats 50. The driving component 30 includes a first motor 311, a gear 312, and a moving part 313. The first motor 311 is fixed to the support base 50 and is drivenly connected to the gear 312. The gear 312 has a plurality of first meshing teeth 3121, and the moving part 313 has a plurality of second meshing teeth 3131 arranged along a first direction X. The second meshing teeth 3131 mesh with the first meshing teeth 3121. The moving part 313 is slidably connected to the support base 50 and can slide relative to the support base 50 along the first direction X. The moving part 313 is connected to the pressing part 21. The first motor 311 drives the gear 312 to rotate, and the gear 312 drives the moving part 313 to slide relative to the support base 50 along the first direction X. The first motor 311 can rotate in both directions. For example, when the output shaft of the first motor 311 rotates clockwise, the gear 312 drives the moving part 313 to slide along the first direction X, causing the sliding part 313 to move away from the support surface 11, thereby increasing the distance between the pressing part 21 connected to the sliding part 313 and the support surface 11; when the output shaft of the first motor 311 rotates counterclockwise, the gear 312 drives the moving part 313 to slide along the first direction X, causing the sliding part 313 to move closer to the support surface 11, thereby decreasing the distance between the pressing part 21 connected to the sliding part 313 and the support surface 11. The reverse is also possible.

[0033] In one embodiment, such as Figure 3 As shown, the support base 50 includes a frame 51 and a fixing rod 52 extending along a first direction X. The frame 51 is mounted on the base 10, and the fixing rod 52 is fixed to the frame 51. The movable part 313 is sleeved on the fixing rod 52 and can slide relative to the fixing rod 52 along the first direction X. The fixing rod 52 makes the movement of the movable part 313 more stable.

[0034] In one embodiment, such as Figure 1 and Figure 2 As shown, the support base 50 also includes a cover plate 53, which is located on the side of the frame 51 facing the other support base 50 and is connected to the frame 51. The fixing rod 52 and the moving part 313 are located between the frame 51 and the cover plate 53. The cover plate 53 is provided with a strip-shaped opening 531, and the pressing part 21 is connected to the moving part 313 through the strip-shaped opening 531.

[0035] In one embodiment, such as Figure 4As shown, the first pressing plate 211 of the pressing part 21 has a first mounting groove 2111 on its surface facing the movable part 313 connected thereto, and the movable part 313 has a second mounting groove (not shown) on its surface facing the pressing part 21 connected thereto. The tooling also includes a connecting block 60, one end of which is engaged in the first mounting groove 2111, and the other end of which is engaged in the second mounting groove. In this way, the pressing part 21 and the movable part 313 can be detachably connected; and the connecting block 60 can be quickly inserted into the first mounting groove 2111 and the second mounting groove, and can also be quickly pulled out from the first mounting groove 2111 and the second mounting groove, which facilitates the installation and replacement of the pressing part 21.

[0036] In one embodiment, such as Figure 1 and Figure 2 As shown, the second driving part 40 includes a screw 42 and a connecting part 43; the screw 42 is rotatable relative to the base 10; the axis of the screw 42 is parallel to the support surface 11; the connecting part 43 is threadedly connected to the screw 42 and is limited in the circumferential direction surrounding the central axis of the screw 42; the connecting part 43 is connected to the crimping part 21. The axis of the screw 42 extends along the second direction Y. The connecting part 43 is connected to the crimping part 21 via a support base 50 and a moving part 313.

[0037] Since the connecting part 43 is threadedly connected to the screw 42 and is circumferentially limited around the central axis of the screw 42, applying a force to the screw 42 to cause it to rotate, or applying a force along the second direction Y to the connecting part 43, causes the connecting part 43 to move relative to the screw 42 along its axis. This causes the connecting part 43 to move the crimping part 21 connected to it, bringing the two crimping parts 21 closer together or further apart. Applying a force along the second direction Y to the connecting part 43 causes the screw 42 to rotate, thus moving the connecting part 43 relative to the screw 42 along its axis. Specifically, the screw 42 can rotate in both directions. For example, when the screw 42 rotates clockwise, the connecting part 43 moves along the second direction Y, bringing the crimping part 21 connected to it closer to the other crimping part 21; when the screw 42 rotates counterclockwise, the connecting part 43 moves along the second direction Y, moving the crimping part 21 connected to it away from the other crimping part 21. The reverse is also possible.

[0038] In one embodiment, such as Figure 2 As shown, the fixture for fixing the semiconductor structure includes two second driving parts 40, each connected to a different pressing part 21. This configuration allows both pressing parts 21 to be movable, resulting in a wider adjustable range of distance between them. Consequently, the fixture can be used to fix semiconductor structures of various sizes.

[0039] In one embodiment, such as Figure 1 and Figure 2 As shown, at least one second drive unit 40 includes a second motor 41, which is drivenly connected to the screw 42 to drive the screw 42 to rotate. Driving the screw 42 to rotate via the second motor 41 facilitates operation. Specifically, the second motor 41 can rotate in both directions. For example, when the output shaft of the second motor 41 rotates clockwise, it drives the screw 42 to rotate clockwise; when the output shaft of the second motor 41 rotates counterclockwise, it drives the screw 42 to rotate counterclockwise.

[0040] In one embodiment, such as Figure 2 As shown, one of the second drive units 40 includes a second motor 41, while the other second drive unit 40 does not. In most cases, the distance between the two pressing parts 21 is adjusted by controlling the operation of the second motor 41 to move the connecting part 43 of its associated second drive unit 40. In a few cases, when the width of the semiconductor structure is large, adjusting the movement of the connecting part 43 of the second drive unit 40 to which the second motor 41 belongs is insufficient to match the distance between the two pressing parts 21 with the semiconductor structure. In such cases, the operator can apply a force along the second direction Y to the support base 50 connected to the other second drive unit 40 to move the corresponding pressing part 21. By setting only one second drive unit 40 to include the second motor 41, the structural complexity of the tooling can be simplified, and the cost can be reduced.

[0041] In other embodiments, both second drive units 40 may include a second motor 41.

[0042] In one embodiment, such as Figure 1 and Figure 2 As shown, the base 10 is provided with a sliding groove 13, which extends along the second direction Y. The screw 42 is located within the sliding groove 13. The connecting portion 43 is at least partially located within the sliding groove 13 and is movable along the sliding groove 13. The portion of the connecting portion 43 exposed in the sliding groove 13 is connected to the crimping portion 21. The two opposite sides of the connecting portion 43 abut against the sides of the sliding groove 13, thereby allowing the connecting portion 43 to be limited in the circumferential direction around the central axis of the screw 42. In some embodiments, the connecting portion 43 is partially exposed in the sliding groove 13, and the exposed portion is connected to the support base 50.

[0043] In one embodiment, such as Figure 2As shown, one of the sides of the connecting part 43 and the sliding groove 13 is provided with a limiting block 431, and the other is provided with a limiting groove 131. The limiting block 431 is confined within the limiting groove 131 and can move relative to the limiting groove 131 along the axial direction of the screw 42. The cooperation between the limiting block 431 and the limiting groove 131 restricts the movement direction of the connecting part 43, preventing vibration of the connecting part 43 when it becomes loose between the screw 42 and the connecting part 43, ensuring the smooth movement of the connecting part 43, and thus ensuring the smooth movement of the pressing part 21. Figure 2 In the illustrated embodiment, the connecting portion 43 has a limiting block 431 on its side, and the sliding groove 13 has a limiting groove 131 on its side; in the second direction Y, the limiting groove 131 has a larger length, and the limiting block 431 has a smaller length. In other embodiments, the connecting portion 43 has a limiting groove on its side, and the sliding groove 13 has a limiting block on its side; in the second direction Y, the limiting groove has a smaller length, and the limiting block has a larger length.

[0044] In one embodiment, the connecting portion 43 has limiting blocks 431 on its two opposite sides, and the sliding groove 13 has limiting grooves 131 on its two opposite sides. Alternatively, the connecting portion 43 has limiting grooves 131 on its two opposite sides, and the sliding groove 13 has limiting blocks 431 on its two opposite sides. Each limiting block 431 is engaged within the limiting groove 131 located on the same side.

[0045] In one embodiment, such as Figure 2 As shown, when the fixture for fixing the semiconductor structure includes two second driving parts 40, the axes of the screws 42 of the two second driving parts 40 are in the same straight line or parallel to each other. With this configuration, when the two second driving parts 40 drive the corresponding pressing parts 21 to move, the two pressing parts 21 can always remain opposite each other, thereby ensuring that the pressing structure 20 firmly fixes the semiconductor structure to the bonding device.

[0046] This application also provides a bonding apparatus, which includes a bonding device and a tooling for fixing a semiconductor structure as described in any of the above embodiments. The base 10 is mounted on the bonding device. The bonding device can connect leads to the pins of the chip and the lead frame to achieve electrical connection between the chip and the pins.

[0047] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0048] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A tooling for fixing a semiconductor structure, characterized in that, include: The base has a supporting surface; The crimping structure includes two crimping parts disposed on the same side of the support surface, and the two crimping parts are disposed opposite to each other; A first driving unit is connected to each of the pressing parts and is used to drive each of the pressing parts to move, so that each of the pressing parts moves closer to and away from the support surface; At least one second driving part, each second driving part being connected to one of the crimping parts, for driving the crimping part connected thereto to move closer to and away from another crimping part.

2. The tooling for fixing a semiconductor structure according to claim 1, characterized in that, The tooling for fixing the semiconductor structure further includes two support bases, which are mounted on the base; the first driving part includes two driving members, each of which is connected to one of the pressing parts, and each of which is disposed on one of the support bases; The driving component includes a first motor, a gear, and a moving part. The first motor is fixed to the support base and is drivenly connected to the gear. The gear has a plurality of first meshing teeth, and the moving part has a plurality of second meshing teeth arranged along a first direction perpendicular to the support surface. The second meshing teeth mesh with the first meshing teeth. The moving part is slidably connected to the support base and can slide relative to the support base along the first direction. The moving part is connected to the pressing part. The first motor drives the gear to rotate, and the gear drives the moving part to slide relative to the support base along the first direction.

3. The tooling for fixing a semiconductor structure according to claim 2, characterized in that, The support base is provided with a fixed rod extending in a first direction, and the movable part is sleeved on the fixed rod and can slide relative to the fixed rod in the first direction.

4. The tooling for fixing a semiconductor structure according to claim 1, characterized in that, The second driving part includes a screw and a connecting part; the screw is rotatable relative to the base; the axis of the screw is parallel to the support surface; the connecting part is threadedly connected to the screw and is limited in the circumferential direction around the central axis of the screw; the connecting part is connected to the crimping part.

5. The tooling for fixing a semiconductor structure according to claim 4, characterized in that, The tooling for fixing the semiconductor structure includes two second driving units; at least one of the second driving units includes a second motor, which is fixed to the base and driven to rotate the screw.

6. The tooling for fixing a semiconductor structure according to claim 4, characterized in that, The base is provided with a sliding groove, and the screw is located in the sliding groove; the connecting part is at least partially located in the sliding groove and can move along the sliding groove; one of the side of the connecting part and the side of the sliding groove is provided with a limiting block, and the other is provided with a limiting groove. The limiting block is limited to the limiting groove and can move relative to the limiting groove along the axial direction of the screw.

7. The tooling for fixing a semiconductor structure according to claim 4, characterized in that, The fixture for fixing the semiconductor structure includes two second driving parts; the axes of the screws of the two second driving parts are in the same straight line or parallel to each other.

8. The tooling for fixing a semiconductor structure according to claim 1, characterized in that, The crimping portion includes a first crimping plate and two second crimping plates connected to the first crimping plate. The direction in which one crimping portion points to the other crimping portion is a second direction. The two second crimping plates of the same crimping portion are arranged in a direction perpendicular to the second direction and parallel to the support surface, and the opposite ends of the first crimping plate are respectively connected to one of the second crimping plates.

9. The tooling for fixing a semiconductor structure according to claim 1, characterized in that, The crimping portion is detachably connected to the first driving portion; and / or The crimping portion includes a main body and a flexible pad located on the side of the main body facing the support surface.

10. A bonding device, characterized in that, The bonding apparatus includes a bonding device and a tooling for fixing a semiconductor structure as described in any one of claims 1 to 9, wherein the base is mounted on the bonding device.

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