Probe station main chuck compatible with taiko wafer and matching mechanical hand

Abstract

The utility model relates to wafer detection technical field, in order to solve the existing probe station transmission Taiko wafer mechanical hand scratch back circuit, main chuck vacuum adsorption failure's technical problem, propose a kind of compatible Taiko wafer's probe station main chuck and matched mechanical hand, the main chuck includes main body, the main body is composite adsorption type step structure, its working surface four circumferential edges are integrally formed step type subsidence structure, still include multiple annular adsorption grooves, set up in the central region of main body, the air outlet is opened on it. Through edge step type subsidence structure to accommodate the edge ring of Taiko wafer, make wafer circuit surface and chuck edge surface flush and form flat test plane, while matched reconstruction mechanical hand, adopt to avoid design and position its vacuum suction nozzle to edge ring safety zone, realize lossless transmission.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology. Background Technology

[0002] To address the fragility and deformation issues of ultra-thin wafers during manufacturing, Taiko wafers significantly improve overall mechanical strength by retaining a thick outer ring and grinding only the central area. However, this non-uniform thickness planar structure makes reliable testing on existing probe stations impossible. The global vacuum adsorption of the main chuck fails to form an effective seal due to the suspended center of the Taiko wafer, resulting in wafer instability and interrupted heat conduction paths. Furthermore, standard robotic arms, when handling wafers, are highly susceptible to contact and scratching of the core circuitry area on the back of the wafer with their vacuum nozzles or supports, introducing contamination and severely hindering the widespread application and yield improvement of Taiko wafer technology. Utility Model Content

[0003] To address the technical problems of robotic arms scratching the back circuitry and main chuck vacuum adsorption failure during the transfer of Taiko wafers using existing probe stations, this invention provides a probe station main chuck and matching robotic arm compatible with Taiko wafers.

[0004] A probe station master chuck and matching robot arm compatible with Taiko wafers are disclosed. The master chuck includes a main body with a composite adsorption stepped structure. The working surface of the main body has an integrally formed stepped recessed structure around its perimeter. The recessed structure is used to accommodate the edge ring of the wafer under test, so that the circuit functional surface of the wafer under test can form a stable and continuous test plane with the upper surface of the edge of the main body. It also includes multiple annular adsorption grooves located in the central area of ​​the main body. Each annular adsorption groove has an air extraction port to generate a vacuum negative pressure to adsorb and fix the central thin area of ​​the wafer under test. The robot arm includes two support parts, which are fixed by a connecting part and extend to the other side to be connected to a drive mechanism. The vacuum nozzle of the robot arm is located on the two support parts and the connecting part, so that the edge ring of the wafer under test is in safe contact with the vacuum nozzle during transport.

[0005] Technical effects: This invention discloses a probe station main chuck and matching robotic arm compatible with Taiko wafers. The core of the design lies in modifying the main chuck into a composite adsorption-type stepped structure. An edge-stepped recessed structure accommodates the edge ring of the Taiko wafer, ensuring the wafer's circuit surface is flush with the chuck's edge, forming a flat testing plane. This provides ideal conditions for optical alignment and probe contact during subsequent testing. Furthermore, innovative support pillars are incorporated into the recessed area specifically to support the thickened edge region of the Taiko wafer. This design achieves coordinated, regional adsorption fixation and support of the Taiko wafer's central region and edge ring, ensuring equipment stability and conduction efficiency. It provides rigidity and stability far exceeding that of single clamping methods, while establishing an effective conduction path to ensure the accuracy and repeatability of testing, especially high and low temperature testing. The accompanying modified robotic arm employs a clearance design and positions its vacuum nozzle within the safe zone of the edge ring, achieving lossless transmission. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of the overall structure of this novel invention.

[0007] Figure 2 This is a top view of the new main chuck.

[0008] Figure 3 This is a front view of the main chuck when the support column of this new type is not raised.

[0009] Figure 4 This is a schematic diagram of the overall structure of this novel robotic arm. Detailed Implementation

[0010] The technical solution will now be clearly and completely described with reference to the accompanying drawings of the embodiments of this invention. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. All other embodiments obtained by those skilled in the art without creative effort using the embodiments of this invention are within the scope of protection of this invention.

[0011] like Figures 1-4As shown, this embodiment provides a probe station main chuck and matching robot arm compatible with Taiko wafers. The main chuck includes a main body 1, which is a composite adsorption stepped structure. The working surface of the main body has a stepped recessed structure 2 formed by precision machining around its perimeter. The recessed structure 2 is used to accommodate the edge ring of the wafer under test, so that the circuit functional surface of the wafer under test can form a stable and continuous test plane with the upper surface of the edge of the main body 1. It also includes multiple annular adsorption grooves 3, which are set in the central area of ​​the main body. Each annular adsorption groove 3 has an air extraction port 4, which is used to generate a vacuum negative pressure to adsorb and fix the central thin area of ​​the wafer under test. The robot arm 5 includes two support parts 501, which are fixed by a connecting part 502 and extend to the other side to be connected to the drive mechanism. The vacuum nozzle of the robot arm 5 is located on the two support parts 501 and the connecting part 502, so that the edge ring of the wafer under test is in safe contact with the vacuum nozzle during the transfer.

[0012] The shape and depth of the recessed structure 2 on the main body 1 can be precisely configured according to the specific dimensions of the Taiko wafer. Typically, the depth of the recessed structure 2 is slightly greater than the thickness of the edge ring of the wafer being tested, so as to ensure that after the wafer is placed, its circuit surface can be flush with the upper edge surface of the main body 1, forming a continuous plane for testing.

[0013] It also includes multiple non-continuously distributed retractable support columns 6, which are fixed to the bottom of the sinking structure 2 and located below the edge ring of the wafer being tested. When the wafer is placed, the support columns 6 pass through the sinking structure and rise to provide upward mechanical support for the edge ring. Together with the central vacuum adsorption, they work to ensure the overall stability of the wafer.

[0014] Furthermore, the top of the support column 6 is embedded with a buffer pad made of low-friction, anti-static material to provide stable support while preventing any surface damage or electrostatic disruption to the wafer edge ring.

[0015] Furthermore, there are 5 support columns 6, which are circumferentially non-uniformly distributed. Their distribution positions are precisely offset from the projection of the robot arm 5 on the horizontal plane. Through kinematic simulation, they are precisely calculated to perfectly avoid all possible motion interference areas of the robot arm 5's vacuum nozzle and support part when picking up and placing wafers.

[0016] like Figure 4 As shown, the robotic arm 5 employs a clearance design, with its mechanical structure avoiding the suspended back circuit area at the center of the wafer being tested in three-dimensional space. Furthermore, its vacuum nozzle is repositioned to ensure that it only contacts the non-circuit safety area above the edge ring when picking up and placing the wafer, achieving lossless and safe wafer transfer.

[0017] Furthermore, with the vacuum nozzle of the connecting part 502 as the center line, the vacuum nozzles on the two supporting parts 501 are symmetrically distributed around the center line, and the three vacuum nozzles form an isosceles triangle, making the adsorption more stable.

[0018] The same technology for setting a vacuum adsorption groove in the central area of ​​the main chuck can also be applied to the sub-chuck for adsorbing the thin central area of ​​the wafer. The sub-chuck is used for precise positioning during wafer transport. Its physical dimensions are reconfigured according to the wafer, with a radius significantly smaller than the inner diameter of the wafer's edge ring. This ensures that the sub-chuck remains physically isolated from the edge ring of the Taiko wafer throughout the entire positioning and testing process, completely preventing contact and eliminating the risk of breakage due to incorrect support.

[0019] All contents not described in detail in this specification are existing technologies known to those skilled in the art. Furthermore, for those skilled in the art, there will be changes in specific implementation methods and application scope based on the ideas of this invention. Therefore, the contents of this specification should not be construed as limiting this invention.

Claims

1. A probe station master chuck and matching robotic arm compatible with Taiko wafers, characterized in that, The main chuck includes a main body (1), which is a composite adsorption stepped structure. The working surface of the main body has an integrally formed stepped recessed structure (2) around its perimeter. The recessed structure (2) is used to accommodate the edge ring of the wafer under test, so that the circuit functional surface of the wafer under test can form a stable and continuous test plane with the upper surface of the edge of the main body (1). It also includes multiple annular adsorption grooves (3) set in the central area of ​​the main body (1). Each annular adsorption groove (3) has an air extraction port (4) to generate a vacuum negative pressure to adsorb and fix the central thin area of ​​the wafer under test. The robotic arm (5) includes two support parts (501). The two support parts (501) are fixed by the connecting part (502) and extend to the other side to be connected to the drive mechanism. The vacuum nozzle of the robotic arm (5) is located on the two support parts (501) and the connecting part (502), so that the edge ring of the wafer under test is in contact with the vacuum nozzle during transmission.

2. The probe station master chuck and matching robotic arm compatible with Taiko wafers according to claim 1, characterized in that, It also includes multiple non-continuously distributed retractable support columns (6), which are fixed at the bottom of the sinking structure (2) and located below the edge ring of the wafer being tested. When the wafer is placed, the support columns (6) pass through the sinking structure and rise to provide upward mechanical support for the edge ring.

3. The probe station master chuck and matching robotic arm compatible with Taiko wafers according to claim 2, characterized in that, The top of the support column (6) is embedded with a buffer pad made of low-friction, anti-static material to provide stable support while preventing any surface damage or electrostatic disruption to the wafer edge ring.

4. The probe station master chuck and matching robotic arm compatible with Taiko wafers according to claim 2, characterized in that, The number of support columns (6) is 5, and they are distributed in a non-uniform circumferential manner. The projection of their distribution positions on the horizontal plane is precisely offset from that of the robotic arm (5).

5. The probe station master chuck and matching robotic arm compatible with Taiko wafers according to claim 1, characterized in that, The robotic arm (5) has the vacuum nozzle of the connecting part (502) as the center line, and the vacuum nozzles on the two support parts (501) are symmetrically distributed about the center line.

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