A radio frequency device product packaging apparatus

Abstract

The utility model discloses a kind of radio frequency device product packaging devices, belong to radio frequency device product packaging device technical field, its technical scheme main points include flip chip bonding packaging equipment, the bottom of the flip chip bonding packaging equipment is provided with recess, the inside bolt of the recess is connected with cleaning component, the bottom fixed connection of the cleaning component has collection component;The cleaning component includes electric telescopic rod, the front side fixed connection of the electric telescopic rod has frame, the top of the frame is provided with hole, the rear side fixed connection of the hole inner wall has hollow plate, can solve the packaging structure of the radio frequency device chip of most existing radio frequency device chip needs to use vacuum chuck to the position of chip transfer, vacuum chuck surface can be adsorbed dust, dust can cause vacuum chuck to reduce suction, and dust is not cleaned in time, possibly stick on the surface of chip, cause the problem of affecting chip packaging quality.

Description

Technical Field

[0001] This utility model relates to the technical field of radio frequency device product packaging devices, and in particular to a radio frequency device product packaging device. Background Technology

[0002] A radio frequency (RF) device packaging device is a specialized piece of equipment designed to transform RF devices into finished products that can be directly applied to communication equipment using high-precision processes. Its core function is to address the three key requirements of "signal integrity, environmental reliability, and functional integration," completing the entire process from "discrete components" to "usable devices." First, a positioning module precisely aligns the RF chip, substrate, and other components. Then, a bonding module establishes the electrical path between the chip and external circuitry. Next, a packaging module encapsulates and seals the chip and bonding structure with materials that resist electromagnetic interference, are temperature- and moisture-proof. In some scenarios, electromagnetic shielding and heat dissipation optimization processes are also integrated. Finally, a testing module verifies the signal transmission efficiency, sealing performance, and electrical performance of the packaged device, ensuring that the finished RF device can stably transmit high-frequency signals and withstand external humidity, temperature shocks, and mechanical vibrations. Simultaneously, it achieves miniaturization and multi-functional integration, meeting the application requirements of terminal equipment for RF components that are "high-performance, highly reliable, and small in size."

[0003] To address the above issues, existing patents provide solutions. The packaging structures used for most RF chips require the use of vacuum chucks to move the chips. Dust may adhere to the surface of the vacuum chuck, which can reduce the suction power of the vacuum chuck. If the dust is not cleaned in time, it may stick to the surface of the chip, affecting the chip packaging quality.

[0004] To address this, a packaging device for radio frequency devices is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a packaging device for radio frequency (RF) devices, which can solve the problem that most existing RF chip packaging structures require the use of vacuum chucks to move the chips, and the surface of the vacuum chuck may attract dust, which will reduce the suction power of the vacuum chuck. If the dust is not cleaned in time, it may stick to the surface of the chip, thus affecting the chip packaging quality.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a radio frequency device product packaging device, including a flip-chip bonding packaging device, wherein a groove is provided at the bottom of the flip-chip bonding packaging device, a cleaning component is bolted inside the groove, and a collection component is fixedly connected to the bottom of the cleaning component;

[0007] The cleaning assembly includes an electric telescopic rod, a frame is fixedly connected to the front side of the electric telescopic rod, a hole is opened at the top of the frame, a hollow plate is fixedly connected to the rear side of the inner wall of the hole, a number of air nozzles are connected to the top of the hollow plate, a connecting pipe is connected to the rear side of the hollow plate, and a miniature air pump is connected to the side of the connecting pipe away from the hollow plate. The miniature air pump is bolted to the top of the inner wall of the groove.

[0008] Preferably, the collection component includes a housing, an internal collection box is provided inside the housing, and a miniature exhaust fan is connected to the rear side of the housing.

[0009] Preferably, sliding grooves are provided on the left and right sides of the inner wall of the box shell, and sliding blocks that cooperate with the sliding grooves are fixedly connected to the left and right sides of the collection box.

[0010] Preferably, a connecting frame is fixedly connected inside the collection box, and an intercepting net is fixedly connected inside the connecting frame.

[0011] Preferably, a sealing groove is provided at the top of the frame, and a sealing block is fixedly connected inside the sealing groove. The sealing block is made of silicone.

[0012] Preferably, a pull-out block is fixedly connected to the front side of the collection box, and the pull-out block is made of stainless steel.

[0013] Preferably, a sliding rod is fixedly connected to the rear side of the frame, and the sliding rod is movably connected to the surface of the electric telescopic rod.

[0014] Preferably, the surface of the connecting pipe is covered with a protective sleeve, and the protective sleeve is made of silicone.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. The present application sets up an automated cleaning and dust collection system for vacuum suction cups by integrating cleaning and collection components. A micro air pump drives the jet nozzle to blow away dust from the surface of the suction cup, preventing dust from causing a decrease in suction power and dust from sticking to the chip. The local enclosed space formed by the sealing block and the negative pressure dust collection design of the collection component further prevent secondary pollution of the packaging environment by dust, and significantly reduce the packaging defect rate caused by dust accumulation in the suction cup.

[0017] 2. The cleaning component's electric telescopic rod can flexibly adjust the cleaning position, the sliding rod ensures cleaning accuracy, and the collection component's pull-out collection box and interception net design facilitates dust cleaning and protects the exhaust fan. The overall structure is deeply integrated with the flip-chip bonding packaging equipment. Attached Figure Description

[0018] Figure 1This is an overall structural diagram of the radio frequency device product packaging device of this utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the cleaning component of this utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the collection component of this utility model;

[0021] Figure 4 This is a schematic diagram showing the disassembled sealing groove and sealing block of this utility model;

[0022] Figure 5 This is a cross-sectional schematic diagram of the connecting tube of this utility model.

[0023] In the diagram, 1. Flip-chip bonding packaging equipment; 2. Groove; 3. Cleaning assembly; 301. Electric telescopic rod; 302. Frame; 303. Hole; 304. Hollow plate; 305. Air nozzle; 306. Connecting pipe; 307. Miniature air pump; 4. Collection assembly; 401. Housing; 402. Collection box; 403. Miniature exhaust fan; 404. Sliding groove; 405. Sliding block; 406. Connecting frame; 407. Interception net; 5. Sealing groove; 6. Sealing block; 7. Pull-out block; 8. Sliding rod; 9. Protective sleeve. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-5 The present invention provides the following technical solution:

[0026] A radio frequency device product packaging device includes a flip-chip bonding packaging device 1. The bottom of the flip-chip bonding packaging device 1 has a groove 2. A cleaning component 3 is bolted inside the groove 2. A collection component 4 is fixedly connected to the bottom of the cleaning component 3.

[0027] The cleaning component 3 includes an electric telescopic rod 301. A frame 302 is fixedly connected to the front side of the electric telescopic rod 301. A hole 303 is opened at the top of the frame 302. A hollow plate 304 is fixedly connected to the rear side of the inner wall of the hole 303. Several air nozzles 305 are connected to the top of the hollow plate 304. A connecting pipe 306 is connected to the rear side of the hollow plate 304. A miniature air pump 307 is connected to the side of the connecting pipe 306 away from the hollow plate 304. The miniature air pump 307 is bolted to the top of the inner wall of the groove 2.

[0028] In this embodiment: By setting up a flip-chip bonding and packaging device 1, the core body of the device serves as both the core function of flip-chip bonding and packaging of radio frequency devices and the component integration carrier. On the one hand, it can complete the precise flip-chip bonding of radio frequency chips and substrates, ensuring the integrity of radio frequency signal transmission. By setting a groove 2, a specific spatial structure opened at the bottom of the flip-chip bonding and packaging device 1, its main function is to fix the cleaning component 3, so that the cleaning component is embedded inside the device and not exposed in the packaging operation area, preventing spatial interference between the cleaning component 3 and chip transfer, bonding and other packaging operations. By setting up the cleaning component 3, a functional module specifically used to remove dust from the surface of the vacuum chuck in the flip-chip bonding and packaging device 1, the problem of reduced suction power of the chuck and dust sticking to the chip is solved. To address the dust issue, a collection component 4, used in conjunction with the cleaning component 3, is installed to collect the dust blown away by the cleaning component 3, preventing secondary contamination of the packaging environment or equipment. An electric telescopic rod 301, the displacement drive component of the cleaning component 3, moves the frame 302 and air nozzle 305 through its telescopic movement. This allows adjustment of the cleaning mechanism's front-to-back distance based on the vacuum suction cup's position, eliminating the need for manual adjustment and adapting to the cleaning needs of suction cups at different workstations. The frame 302 serves as the structural support for the cleaning component 3, securing core cleaning components such as the hollow plate 304 and air nozzle 305, ensuring stable positioning of each component. Simultaneously, the sealing block 6 at the top of the frame 302 fits snugly against the surrounding equipment structure of the suction cup, forming... The partially enclosed cleaning area prevents dust from scattering during air blowing and provides structural support for precise cleaning. Through the perforations 303, a channel structure is created at the top of the frame 302. This provides installation space for the hollow plate 304 and the air nozzles 305, allowing the air nozzles 305 to be precisely aligned with the vacuum suction cup surface through the perforations 303. It also facilitates the connection between the hollow plate 304 and the connecting pipe 306, ensuring a smooth and unobstructed airflow path from the connecting pipe 306 to the air nozzles 305. The hollow plate 304 acts as a distribution component for the cleaning airflow. One end connects to the connecting pipe 306 to receive compressed air, while the other end distributes the airflow evenly through multiple air nozzles 305, ensuring consistent air pressure and airflow intensity from each air nozzle 305. To prevent uneven airflow from causing unremoved dust from the suction cup and ensure thorough cleaning, air nozzles 305 are used as the cleaning actuators. Compressed air delivered through the hollow plate 304 forms a directional, high-pressure airflow that directly impacts the surface of the vacuum suction cup, blowing away the dust adsorbed on it. The number and arrangement of these nozzles must be adapted to the suction cup size to ensure complete coverage of the suction cup's adsorption surface for thorough cleaning. A connecting pipe 306 serves as the airflow transmission channel, connecting a miniature air pump 307 to the hollow plate 304. This ensures that the compressed air generated by the air pump is stably delivered to the hollow plate 304, providing cleaning power to the air nozzles 305. The air nozzles are typically made of a flexible material that can be slightly bent as the electric telescopic rod 301 moves the frame 302.To prevent pipe breakage or airflow interruption due to frame 302 displacement, a miniature air pump 307 is installed as the power source for cleaning airflow. Fixed to the top of the inner wall of the groove 2, it generates stable compressed air pressure upon being powered on, which is then delivered to the hollow plate 304 through the connecting pipe 306. This is the core power guarantee for the air nozzle 305 to blow away dust.

[0029] Specifically, such as Figure 3 As shown, the collection component 4 includes a housing 401, a collection box 402 is provided inside the housing 401, and a miniature exhaust fan 403 is connected to the rear side of the housing 401.

[0030] Specifically, such as Figure 3 As shown, sliding grooves 404 are provided on the left and right sides of the inner wall of the housing 401, and sliding blocks 405 that cooperate with the sliding grooves 404 are fixedly connected to the left and right sides of the collection box 402.

[0031] Specifically, such as Figure 3 As shown, a connecting frame 406 is fixedly connected inside the collection box 402, and an intercepting net 407 is fixedly connected inside the connecting frame 406.

[0032] In this embodiment: by setting the housing 401, the outer shell structure of the collecting component 4 forms a closed dust collection space, preventing the leakage of sucked-in dust. It also provides mounting support for the collection box 402 and the mini exhaust fan 403, ensuring the fixed position of each collecting component. The collection box 402, a direct storage container for dust, is located inside the housing 401 to receive dust sucked in by the mini exhaust fan 403. When the dust accumulates to a certain amount, it can be removed from the housing 401 for cleaning, preventing long-term dust accumulation from clogging the exhaust fan or contaminating the equipment. The mini exhaust fan 403 serves as the negative pressure power source for the collecting component 4, connected to the rear side of the housing 401. During operation, a negative pressure environment is created inside the housing 401, which quickly sucks the dust blown away from the suction cup by the cleaning component 3 into the collection box 402 inside the housing 401, achieving "cleaning and collecting simultaneously". This prevents dust from drifting to the encapsulation area or being re-adsorbed onto the suction cup surface. By setting a sliding groove 404 and a sliding block 405, the sliding block 405 works in conjunction with the sliding groove 404 to facilitate the disassembly and removal of the collection box 402 inside the housing 401. By setting a connecting frame 406 and an intercepting net 407, the connecting frame 406 supports the intercepting net 407, and the intercepting net 407 prevents dust from entering the interior of the mini exhaust fan 403 and causing the mini exhaust fan 403 to become clogged.

[0033] Specifically, such as Figure 4 As shown, a sealing groove 5 is provided on the top of the frame 302, and a sealing block 6 is fixedly connected inside the sealing groove 5. The sealing block 6 is made of silicone.

[0034] Specifically, such as Figure 3As shown, a pull-out block 7 is fixedly connected to the front side of the collection box 402. The pull-out block 7 is made of stainless steel.

[0035] In this embodiment: by setting a sealing groove 5 and a sealing block 6, the sealing groove 5 is the preset installation position of the sealing block 6, and the sealing block 6 prevents gas leakage at the contact position between the frame 302 and the flip-chip bonding packaging device 1. By setting a pull-out block 7, it is convenient for the user to disassemble the collection box 402 on the inner wall of the housing 401.

[0036] Specifically, such as Figure 2 As shown, a sliding rod 8 is fixedly connected to the rear side of the frame 302, and the sliding rod 8 is movably connected to the surface of the electric telescopic rod 301.

[0037] Specifically, such as Figure 5 As shown, a protective sleeve 9 is fitted on the surface of the connecting pipe 306, and the protective sleeve 9 is made of silicone.

[0038] In this embodiment: By setting a sliding rod 8, a guide component fixed to the rear side of the frame 302, and movably connected to the surface of the electric telescopic rod 301, when the electric telescopic rod 301 drives the frame 302 to move back and forth, the sliding rod 8 can limit the movement direction of the frame 302, preventing the frame 302 from shifting left and right or shaking due to uneven force, ensuring that the air nozzle 305 is always accurately aligned with the surface of the vacuum suction cup, without deviating from the cleaning target, and ensuring cleaning accuracy. By setting a protective sleeve 9, a protective component made of silicone, which is sleeved on the surface of the connecting pipe 306, the main function is to isolate the connecting pipe 306 from damage caused by oil, water vapor or mechanical friction in the external environment, and to prevent the connecting pipe 306 from aging, cracking or leaking due to long-term use.

[0039] Working principle: After the vacuum suction cup of the device completes one chip transfer, the cleaning component 3 synchronously starts the electric telescopic rod 301 to move the frame 302 and the air nozzle 305 to below the suction cup. The micro air pump 307 delivers compressed air to the hollow plate 304 through the connecting pipe 306, and then sprays high-pressure airflow through multiple air nozzles 305 to directly impact the surface of the suction cup to blow away dust. At the same time, the silicone sealing block 6 on the top of the frame 302 fits with the surrounding structure of the suction cup to form a local closed space to prevent dust from spreading. The collection component 4, which is linked with the cleaning component 3, works synchronously. The micro exhaust fan 403 generates negative pressure in the housing 401, sucking the dust blown away by the air nozzle 305 into the collection box 402 inside the housing 401. The intercepting net 407 in the collection box 402 prevents dust from entering the exhaust fan, and the collection box 402 can be pulled out by sliding block 405 along the sliding groove 404 of the housing 401 for easy subsequent dust cleaning.

[0040] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A packaging apparatus for radio frequency devices, comprising flip-chip bonding packaging equipment (1), characterized in that: The bottom of the flip-chip bonding packaging device (1) is provided with a groove (2), a cleaning component (3) is bolted inside the groove (2), and a collection component (4) is fixedly connected to the bottom of the cleaning component (3). The cleaning component (3) includes an electric telescopic rod (301), a frame (302) is fixedly connected to the front side of the electric telescopic rod (301), a hole (303) is opened at the top of the frame (302), a hollow plate (304) is fixedly connected to the rear side of the inner wall of the hole (303), a plurality of air nozzles (305) are connected to the top of the hollow plate (304), a connecting pipe (306) is connected to the rear side of the hollow plate (304), a micro air pump (307) is connected to the side of the connecting pipe (306) away from the hollow plate (304), and the micro air pump (307) is bolted to the top of the inner wall of the groove (2).

2. The radio frequency device product packaging device according to claim 1, characterized in that: The collection component (4) includes a housing (401), inside which a collection box (402) is provided, and a miniature exhaust fan (403) is connected to the rear side of the housing (401).

3. The radio frequency device product packaging device according to claim 2, characterized in that: The left and right sides of the inner wall of the box shell (401) are provided with sliding grooves (404), and the left and right sides of the collection box (402) are fixedly connected with sliding blocks (405) that cooperate with the sliding grooves (404).

4. The radio frequency device product packaging device according to claim 2, characterized in that: The collection box (402) is fixedly connected to a connecting frame (406), and the connecting frame (406) is fixedly connected to an intercepting net (407).

5. The radio frequency device product packaging device according to claim 1, characterized in that: The top of the frame (302) is provided with a sealing groove (5), and a sealing block (6) is fixedly connected inside the sealing groove (5). The sealing block (6) is made of silicone.

6. The radio frequency device product packaging device according to claim 2, characterized in that: The collection box (402) is fixedly connected to the front side with a pull block (7), and the pull block (7) is made of stainless steel.

7. The radio frequency device product packaging device according to claim 1, characterized in that: A sliding rod (8) is fixedly connected to the rear side of the frame (302), and the sliding rod (8) is movably connected to the surface of the electric telescopic rod (301).

8. The radio frequency device product packaging device according to claim 1, characterized in that: The surface of the connecting pipe (306) is covered with a protective sleeve (9), and the protective sleeve (9) is made of silicone.

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