Semiconductor chip vacuum suction nozzle

Abstract

The application relates to the technical field of semiconductor chip transfer, in particular to a semiconductor chip vacuum suction nozzle, which is characterized by sequentially connecting an operating rod, a connecting rod and a rectangular suction nozzle from top to bottom, wherein the width of the cross section of the operating rod is larger than that of the connecting rod, forming a unique ladder structure. This design enables the operating rod and the connecting rod to be stably clamped by an external automatic device, effectively improving the clamping stability and positioning accuracy of the automatic device on the vacuum suction nozzle, thereby avoiding damage to the semiconductor chip during the transfer process and significantly improving the production efficiency and product qualification rate.

Description

Technical Field

[0001] This application relates to the field of semiconductor chip transfer technology, and more specifically, to a semiconductor chip vacuum nozzle. Background Technology

[0002] In the manufacturing, packaging, and testing of semiconductor chips, high-precision transfer of the chips is required, and vacuum nozzles are key components for achieving this operation. To improve production efficiency, automated equipment is typically used to clamp vacuum nozzles, thereby enabling the transfer of semiconductor chips.

[0003] However, existing vacuum nozzles generally suffer from structural design flaws when clamped by automated equipment. For example, the clamping portion of existing vacuum nozzles often lacks a clear positioning structure or has an irregularly designed clamping surface, leading to slippage or unstable clamping when automated equipment grasps and secures the nozzle. This unstable clamping not only affects the transfer accuracy of semiconductor chips but may also damage them during transfer, thereby reducing production efficiency and product yield.

[0004] There is currently no effective technical solution to the above problems. Utility Model Content

[0005] The purpose of this application is to provide a semiconductor chip vacuum nozzle, which aims to solve the technical problems of unreasonable structural design, unstable clamping, and impact on transfer accuracy of existing semiconductor chip vacuum nozzles when clamped in automated equipment.

[0006] In a first aspect, this application provides a semiconductor chip vacuum nozzle, comprising an operating lever, a connecting lever, and a rectangular nozzle connected sequentially from top to bottom; The control lever has a first through hole at its center, the connecting rod has a second through hole at its center, and the rectangular suction nozzle has a third through hole. The first, second, and third through holes are all connected. The width of the operating lever's cross-section is larger than the width of the connecting rod's cross-section. The operating lever and the connecting rod are used to be clamped by external automated equipment. The end of the operating lever away from the connecting rod is used to connect with an external vacuum device to enable communication between the external vacuum device and the first through hole, and to evacuate a vacuum from the first through hole. The rectangular suction nozzle is used to adsorb semiconductor chips.

[0007] By making the cross-sectional width of the operating lever larger than that of the connecting rod, a stepped connection is formed between the operating lever and the connecting rod, which facilitates the precise clamping and positioning of automated equipment. This effectively solves the problems of unstable clamping and impaired transfer accuracy in existing technologies, thereby improving production efficiency and product qualification rate.

[0008] In some implementations, both the operating lever and the connecting rod are cylindrical structures.

[0009] This technical solution, with its cylindrical structure design, enables the nozzle to have better symmetry and stability during automated clamping, further simplifying the clamping operation and improving clamping efficiency.

[0010] In some implementations, the end of the operating lever near the connecting rod has a rounded corner.

[0011] This technical solution effectively prevents damage to automated equipment or the nozzle itself during clamping, while also helping to guide clamping and improve clamping smoothness.

[0012] In some implementations, the operating lever, connecting rod, and rectangular suction nozzle are connected by welding.

[0013] In some implementations, the diameter of the operating rod is in the range of 1.5mm-5mm, and the diameter of the connecting rod is in the range of 1mm-3mm.

[0014] In some embodiments, the surface of the rectangular suction nozzle is provided with multiple strip grooves, all of which are connected to a third through hole.

[0015] In some embodiments, there are four slots, which are arranged around the third through hole.

[0016] In some embodiments, a strip groove is provided on each of the top, bottom, left, and right sides of the third through hole, and two V-shaped grooves are also provided on the surface of the rectangular suction nozzle, with the two V-shaped grooves respectively connecting to the two strip grooves.

[0017] In some implementations, the operating lever and the connecting rod are integrally formed.

[0018] In some implementations, the operating lever and connecting rod are made of stainless steel or mold steel, and the rectangular suction nozzle is made of alloy or cermet.

[0019] Beneficial Effects: This application provides a semiconductor chip vacuum nozzle, which features an operating rod, a connecting rod, and a rectangular suction nozzle connected sequentially from top to bottom. The operating rod has a wider cross-section than the connecting rod, forming a unique stepped structure. This design allows the operating rod and connecting rod to be securely clamped by external automated equipment, solving the problems of slippage or unstable clamping during gripping and fixing in existing vacuum nozzles due to the lack of a clear positioning structure or non-standard clamping surface design. The end of the operating rod away from the connecting rod connects to an external vacuum device, achieving vacuum adsorption through the connection of a first through hole, a second through hole, and a third through hole. The rectangular suction nozzle is used to adsorb semiconductor chips. This technical solution, by optimizing the clamping structure, effectively improves the clamping stability and positioning accuracy of the vacuum nozzle by automated equipment, thereby preventing damage to semiconductor chips during transport, significantly improving production efficiency and product qualification rate, and overcoming the shortcomings of existing technologies such as unstable clamping and impact on transport accuracy and efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the first structure of the semiconductor chip vacuum nozzle provided in this application.

[0021] Figure 2 This is a schematic diagram showing the location of the first through hole in the semiconductor chip vacuum nozzle provided in this application.

[0022] Figure 3 This is a schematic diagram of a second structure of the semiconductor chip vacuum nozzle provided in this application.

[0023] Figure 4 This is a cross-sectional view of the first structure of the semiconductor chip vacuum nozzle provided in this application.

[0024] Labeling explanation: 10, operating lever; 101, first through hole; 20, connecting rod; 30, rectangular suction nozzle; 301, third through hole; 302, strip groove; 303, V-groove. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] Therefore, please refer to Figures 1-4 This application provides a semiconductor chip vacuum nozzle, including an operating rod 10, a connecting rod 20 and a rectangular nozzle 30 connected in sequence from top to bottom; The operating lever 10 has a first through hole 101 at its center, the connecting rod 20 has a second through hole at its center, and the rectangular suction nozzle 30 has a third through hole 301. The first through hole 101, the second through hole, and the third through hole 301 are all connected. The width of the cross-section of the operating lever 10 is larger than the width of the cross-section of the connecting rod 20. The operating lever 10 and the connecting rod 20 are used to be clamped by external automated equipment. The end of the operating lever 10 away from the connecting rod 20 is used to connect with an external vacuum device to enable communication between the external vacuum device and the first through hole 101, and to evacuate a vacuum from the first through hole 101. The rectangular suction nozzle 30 is used to adsorb semiconductor chips.

[0028] Specifically, this application forms a complete suction nozzle body by sequentially connecting the operating lever 10, the connecting rod 20, and the rectangular suction nozzle 30. The width of the cross-section of the operating lever 10 (which refers to the cross-section along the extension direction of the operating lever 10) is designed to be... Figure 4 The width of point A in the diagram is greater than the width of the cross-section of the connecting rod 20 (which refers to the cross-section along the extension direction of the connecting rod 20). Figure 4 The width of the lever (at point B) is larger, forming a stepped width design for the operating lever 10 and the connecting rod 20, providing a clear and stable clamping surface for the clamping of external automated equipment. When the automated equipment clamps the operating lever 10 and the connecting rod 20, because the width of the operating lever 10 is greater than that of the connecting rod 20, the clamp of the automated equipment can be reliably positioned on the operating lever 10, avoiding slippage or unstable clamping.

[0029] During operation, an external vacuum device introduces negative vacuum pressure into the first through-hole 101 via the end of the connecting rod 10 away from the connecting rod 20. Since the first through-hole 101, the second through-hole, and the third through-hole 301 are interconnected, the negative vacuum pressure can be smoothly transmitted to the adsorption surface of the rectangular suction nozzle 30. When the rectangular suction nozzle 30 contacts the semiconductor chip, a sealed space is formed between the adsorption surface and the chip. The negative vacuum pressure generates a strong suction force within this space, thus firmly adsorbing the semiconductor chip onto the rectangular suction nozzle 30. Subsequently, the automated equipment can precisely move the suction nozzle to transfer the chip to the target position. After the chip is placed, it can be released by releasing the negative vacuum pressure. The entire process effectively avoids vibration, displacement, or damage to the chip during transfer due to the stability of the suction nozzle structure, significantly improving transfer accuracy and efficiency.

[0030] The innovation of this application lies in the improved clamping stability and operational efficiency resulting from its structural optimization. Existing suction nozzles may use a single-diameter rod or lack a clear positioning structure, making it difficult for automated equipment to accurately align and securely clamp the nozzle. The stepped design of this application, namely the difference in diameter between the operating rod 10 and the connecting rod 20, not only provides a physical positioning step but also allows the clamp to apply clamping force more effectively, thereby ensuring the stability of the suction nozzle during high-speed, high-precision transfer. Therefore, the semiconductor chip vacuum suction nozzle of this application can significantly improve the transfer accuracy and efficiency of semiconductor chips, reduce the risk of chip damage, and thus improve the overall yield and economic benefits of the production line.

[0031] In some embodiments, both the operating lever 10 and the connecting rod 20 are cylindrical structures.

[0032] Specifically, both the operating lever 10 and the connecting rod 20 are designed as cylindrical structures, creating a stepped cylindrical transition between them. This provides a standardized clamping interface for external automated equipment. When the automated equipment grips and positions the nozzle, the cylindrical surface and defined stepped structure help achieve precise and stable clamping, reducing positioning errors or insecure clamping caused by irregular shapes. Furthermore, the cylindrical structure offers advantages in rotational symmetry, ensuring consistent clamping performance of the nozzle in different directions, further enhancing the flexibility and reliability of automated operations.

[0033] In some embodiments, the end of the operating lever 10 near the connecting rod 20 is provided with a rounded corner.

[0034] Specifically, rounding refers to smoothing out any sharp or right-angled edges that might otherwise exist in the transition area between the operating rod 10 and the connecting rod 20, forming a smooth arc surface. This smooth rounding also reduces friction and jamming with the clamping mechanism, thereby improving clamping efficiency and stability. In practical applications, this rounding can be achieved through machining, grinding, or integral molding, and its radius can be rationally designed based on material properties, expected load, and manufacturing process precision.

[0035] In some embodiments, the operating lever 10, connecting rod 20, and rectangular suction nozzle 30 are connected by welding to provide a permanent, high-strength connection.

[0036] In some embodiments, the diameter of the operating lever 10 is in the range of 1.5mm-5mm, and the diameter of the connecting rod 20 is in the range of 1mm-3mm.

[0037] In some embodiments, the surface of the rectangular suction nozzle 30 is provided with a plurality of strip grooves 302, and the plurality of strip grooves 302 are all connected to the third through hole 301.

[0038] Specifically, the surface of the rectangular suction nozzle 30 is designed with multiple strip-shaped grooves 302, all of which communicate with the third through-hole 301 inside the rectangular suction nozzle 30. The strip-shaped grooves 302 refer to elongated groove structures formed on the adsorption surface of the rectangular suction nozzle 30, and their shape and size can be optimized according to the size and characteristics of the semiconductor chip to be adsorbed. The arrangement of these strip-shaped grooves 302 aims to increase the adsorption area and allow the adsorption force to be more evenly distributed on the surface of the semiconductor chip. Simultaneously, the solid portions between the strip-shaped grooves 302 provide necessary physical support for the ultra-thin semiconductor chip, preventing the chip from bending or deforming due to uneven force during vacuum adsorption.

[0039] The solution of this application effectively increases the effective contact area and vacuum adsorption area between the nozzle and the semiconductor chip by setting multiple strip grooves 302 on the surface of the rectangular nozzle 30. When the external vacuum device evacuates from the first through hole 101, the vacuum pressure is transmitted to all the connected strip grooves 302 through the first through hole 101, the second through hole, and the third through hole 301, so that the adsorption force can be evenly applied to multiple areas of the semiconductor chip. In addition, the solid portion between the strip grooves 302 provides additional physical support for the semiconductor chip during adsorption, especially for large or ultra-thin chips, which can effectively resist the deformation that may be caused by vacuum suction, thereby ensuring the integrity and stability of the chip during gripping and transfer.

[0040] In some embodiments, there are four strip grooves 302, which are arranged around the third through hole 301.

[0041] The surface of the rectangular suction nozzle 30 can be provided with four strip grooves 302, which are symmetrically or evenly distributed around the third through hole 301. For example, one strip groove 302 can be provided in each of the four directions (up, down, left, and right) of the third through hole 301 to ensure the uniformity of the adsorption force. The length and width of these strip grooves 302 can be adjusted according to the size of the semiconductor chip actually being adsorbed.

[0042] In some embodiments, a strip groove 302 is provided on each of the top, bottom, left and right sides of the third through hole 301, and two V-shaped grooves 303 are also provided on the surface of the rectangular suction nozzle 30, with the two V-shaped grooves 303 respectively connecting to the two strip grooves 302.

[0043] Specifically, the solution of this application ensures a balanced distribution of vacuum adsorption force on the chip surface by setting strip grooves 302 on all four sides of the third through hole 301, avoiding local stress concentration during the adsorption process. This symmetrical arrangement of the strip grooves 302 provides more stable support for the chip during adsorption. Furthermore, by setting two V-shaped grooves 303 and connecting them to the two strip grooves 302 respectively, the vacuum conduction efficiency and coverage are further enhanced. The V-shaped grooves 303, as additional vacuum channels, effectively guide the vacuum from the third through hole 301 to a wider adsorption area, especially between or at the edges of the strip grooves 302. This effectively increases the utilization rate of the adsorption area without increasing the overall size of the nozzle, ensuring that even larger chips can be firmly and uniformly adsorbed.

[0044] In some embodiments, the operating lever 10 and the connecting lever 20 are integrally formed.

[0045] Specifically, one-piece molding means that the operating lever 10 and the connecting lever 20 are formed into a single structure through a single manufacturing process, such as precision machining, casting, forging, or 3D printing. The purpose is to eliminate the connection interfaces between components, thereby improving the integrity and stability of the overall structure.

[0046] In some embodiments, the operating lever 10 and connecting lever 20 are made of stainless steel or mold steel, and the rectangular suction nozzle 30 is made of alloy or cermet.

[0047] Specifically, the operating lever 10 and connecting lever 20 are made of stainless steel or mold steel, which greatly improves the mechanical strength and wear resistance of the nozzle, effectively extends the service life of the nozzle, reduces downtime for maintenance due to component wear or deformation, and thus reduces production costs. Secondly, the rectangular nozzle 30 is made of alloy or metal ceramic, which not only ensures the high hardness and wear resistance of the adsorption surface, effectively preventing scratches or contamination of the semiconductor chip surface, but also improves the stability and accuracy of adsorption.

[0048] In this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying any such actual relationship or order between these entities or operations.

[0049] The above are merely embodiments of this application and are not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A semiconductor chip vacuum nozzle, characterized in that, It includes an operating lever (10), a connecting rod (20), and a rectangular suction nozzle (30) connected from top to bottom. The operating lever (10) has a first through hole (101) at its center, the connecting rod (20) has a second through hole at its center, and the rectangular suction nozzle (30) has a third through hole (301). The first through hole (101), the second through hole, and the third through hole (301) are all connected. The width of the cross section of the operating lever (10) is larger than the width of the cross section of the connecting rod (20). The operating lever (10) and the connecting rod (20) are used to be clamped by external automated equipment. The end of the operating lever (10) away from the connecting rod (20) is used to connect with an external vacuum device to enable the external vacuum device to communicate with the first through hole (101) and to draw a vacuum from the first through hole (101). The rectangular suction nozzle (30) is used to adsorb semiconductor chips.

2. The semiconductor chip vacuum nozzle according to claim 1, characterized in that, Both the operating lever (10) and the connecting rod (20) are cylindrical structures.

3. The semiconductor chip vacuum nozzle according to claim 2, characterized in that, The end of the operating lever (10) near the connecting rod (20) has a rounded corner.

4. The semiconductor chip vacuum nozzle according to claim 3, characterized in that, The operating lever (10), connecting rod (20) and rectangular suction nozzle (30) are connected by welding.

5. The semiconductor chip vacuum nozzle according to claim 2, characterized in that, The diameter of the operating rod (10) is in the range of 1.5mm-5mm, and the diameter of the connecting rod (20) is in the range of 1mm-3mm.

6. The semiconductor chip vacuum nozzle according to claim 1, characterized in that, The rectangular suction nozzle (30) has multiple strip grooves (302) on its surface, and all of the multiple strip grooves (302) are connected to the third through hole (301).

7. The semiconductor chip vacuum nozzle according to claim 6, characterized in that, There are four strip grooves (302), which are arranged around the third through hole (301).

8. The semiconductor chip vacuum nozzle according to claim 7, characterized in that, A strip groove (302) is provided on the top, bottom, left and right sides of the third through hole (301), and two V-shaped grooves (303) are also provided on the surface of the rectangular suction nozzle (30), and the two V-shaped grooves (303) are connected to the two strip grooves (302) respectively.

9. The semiconductor chip vacuum nozzle according to claim 1, characterized in that, The operating lever (10) and the connecting rod (20) are integrally formed.

10. The semiconductor chip vacuum nozzle according to claim 1, characterized in that, The operating lever (10) and connecting rod (20) are made of stainless steel or mold steel, and the rectangular suction nozzle (30) is made of alloy or metal ceramic.

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