Wafer breakage defect on-line detection device

Abstract

The utility model relates to a kind of wafer broken piece defect on-line detection device, including rack, wafer bearing platform, first drive mechanism, detection module, rotary arm, axle, extension plate and second drive mechanism;Wafer bearing platform is set on rack, first drive mechanism is connected with wafer bearing platform transmission, for driving wafer bearing platform rotation;Extension plate is installed in one corner of rack, axle is rotatably set on extension plate, rotary arm one end is fixedly connected in axle, another end installs detection module, detection module is set towards wafer bearing platform;Second drive mechanism is connected with axle transmission, for driving rotary arm to drive detection module rotation around axle, so that detection module moves between wafer edge and center along preset arc trajectory;Detection module moves along arc trajectory while wafer rotates, realizes to wafer entire surface broken piece defect and carries out on-line detection. By above setting, the structure of detection device is simple, coverage is wide, and detection efficiency is high.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to an online detection device for wafer breakage defects. Background Technology

[0002] During wafer processing, handling, and transport, wafer surfaces or edges often develop breakage defects due to uneven stress, collisions, or thermal stress. If these defects are not identified in time, the wafer damage may further expand, affecting the yield of subsequent processes and even causing equipment contamination or damage. Therefore, timely detection of wafer breakage defects is of great importance.

[0003] Existing wafer defect detection technologies are mostly based on optical microscopy, electron beam, and contour measurement, primarily used for detecting microscopic defects in wafers, and are typically deployed in back-end processes. These solutions are mostly offline inspections, which are slow, have large equipment sizes, and are difficult to implement for rapid, real-time scanning of the entire wafer.

[0004] Some online inspection devices use laser scattering or single-point imaging for fragment identification, but these often only scan local areas, leaving blind spots and making it difficult to achieve comprehensive coverage of fragment defects across the entire wafer surface. Furthermore, these devices typically acquire images when the wafer is stationary, resulting in limited inspection efficiency and failing to meet the demands of high-speed production lines for real-time, comprehensive defect identification.

[0005] Therefore, there is an urgent need for a technical solution that is simple in structure, has a wide detection range, and can complete the online detection of fragment defects on the entire wafer surface while the wafer is rotating, so as to improve detection efficiency and coverage and meet the requirements for real-time quality monitoring in the wafer production process. Utility Model Content

[0006] To address the shortcomings of existing technologies, the purpose of this invention is to provide an online wafer breakage defect detection device with a simple structure and wide coverage.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: An online wafer fragment defect detection device includes a frame, a wafer carrier platform, a first drive mechanism, a detection module, a rotating arm, a shaft, an extension plate, and a second drive mechanism. The wafer carrier platform is mounted on the frame. The first drive mechanism is mounted on the frame and is driven by the wafer carrier platform to drive the wafer carrier platform to rotate, so that the wafer it carries rotates around its central axis. The extension plate is fixedly installed at one corner of the frame, and the shaft is rotatably mounted on the extension plate. One end of the rotating arm is fixedly connected to the shaft, and the other end is equipped with the detection module, which faces the wafer carrier platform. The second drive mechanism is mounted on the frame and is driven by the shaft to drive the rotating arm to rotate the detection module around the shaft, so that the detection module moves along a preset arc trajectory between the edge and the center of the wafer. The detection module can move along the arc trajectory while the wafer rotates to achieve online detection of fragment defects on the entire surface of the wafer.

[0008] Furthermore, the four corners of the rack are provided with support columns; the first drive mechanism includes a first motor, a first mounting bracket and a first transmission component. The first mounting bracket is fixedly mounted on one of the support columns, the first motor is mounted on the first mounting bracket, and the first transmission component is mounted on the bottom of the rotating shaft of the wafer carrier platform and is connected to the first motor for transmission.

[0009] Furthermore, the second drive mechanism includes a second motor, a second mounting bracket, and a second transmission component. The second mounting bracket is fixedly mounted on another support column and is diagonally arranged with respect to the first drive mechanism. The second motor is mounted on the second mounting bracket. The second transmission component is mounted on the bottom of the shaft and is connected to the second motor for transmission.

[0010] Furthermore, a first bushing is provided on the frame, and the rotating shaft of the wafer carrier platform is rotatably disposed in the first bushing; a first photoelectric carrier plate is fixedly disposed circumferentially at the bottom of the first bushing, and a first rotation sensing plate is fixedly disposed at the bottom of the rotating shaft; a first photoelectric sensor is disposed inside the first photoelectric carrier plate, and the first photoelectric sensor is disposed facing the first rotation sensing plate.

[0011] Furthermore, a second bushing is provided on the extension plate, and the shaft is rotatably disposed in the second bushing; a second photoelectric support plate is provided circumferentially at the bottom of the second bushing, and a second rotation sensing plate is provided at the bottom of the shaft; a second photoelectric sensor is provided inside the second photoelectric support plate, and the second photoelectric sensor is disposed facing the second rotation sensing plate.

[0012] Furthermore, the top surface of the wafer carrier platform is equipped with multiple suction cups for adsorbing and fixing the wafers, and the suction cups are made of silicone.

[0013] Furthermore, the detection module is located inside the inverted U-shaped housing at the end of the rotating arm, with the top and sides of the housing surrounding the detection module.

[0014] The aforementioned online wafer defect detection device drives the wafer carrier platform to rotate via a first drive mechanism, keeping the wafer in a continuous rotation state. Simultaneously, a second drive mechanism drives the detection module to move along a set arc trajectory between the wafer edge and center, thereby achieving a comprehensive scan of the entire wafer surface. Compared to existing solutions that can only perform partial scanning or image acquisition in a static state, this device can complete the detection synchronously during wafer rotation, avoiding blind spots, improving detection coverage and real-time performance. It overcomes the problems of slow offline detection speed, bulky equipment, and inability to meet the needs of high-speed production lines, possessing significant advantages such as compact structure, wide detection range, and suitability for online high-speed detection. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the online wafer breakage defect detection device provided by this utility model; Figure 2 This is a top view of the online wafer breakage defect detection device provided by this utility model; Figure 3 This is a schematic diagram of the first photoelectric detection structure provided by this utility model; Figure 4 This is a schematic diagram of the second photoelectric detection structure provided by this utility model. Detailed Implementation

[0016] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0017] like Figures 1 to 4 As shown, this application provides an online detection device for wafer breakage defects. The device includes a frame 1, a wafer support platform 2, a first drive mechanism 3, a detection module 4, a rotating arm 5, a shaft 6, an extension plate 7, and a second drive mechanism 8.

[0018] Specifically, the wafer carrier platform 2 is mounted on the frame 1; the first drive mechanism 3 is mounted on the frame 1 and is connected to the wafer carrier platform 2 for driving the wafer carrier platform 2 to rotate so that the wafer it carries rotates around the central axis; the extension plate 7 is fixedly installed at one corner of the frame 1, and the shaft 6 is rotatably mounted on the extension plate 7; one end of the rotating arm 5 is fixedly connected to the shaft 6, and the other end is equipped with a detection module 4, which faces the wafer carrier platform 2; the second drive mechanism 8 is mounted on the frame 1 and is connected to the shaft 6 for driving the rotating arm 5 to rotate the detection module 4 around the shaft 6 so that the detection module 4 moves along a preset arc trajectory between the edge and the center of the wafer; the detection module 4 can move along the arc trajectory while the wafer rotates so as to realize online detection of fragment defects on the entire surface of the wafer.

[0019] The implementation method features a compact structure and a wide detection range. It employs a dual motion mechanism (wafer rotation and arc-shaped movement of the detection module) to achieve full-coverage online inspection of the entire wafer surface. Compared with traditional partial scanning methods, this device significantly improves the efficiency and completeness of defect identification. It is suitable for real-time monitoring needs in high-speed production lines, reduces manual intervention and blind spots, helps to promptly detect wafer edges or surface defects, improves yield, and avoids subsequent equipment contamination or damage.

[0020] The detection module 4 can employ multimodal imaging devices, such as linear array cameras, infrared sensors, or laser scanning components, to enhance detection sensitivity and adapt to diverse defect types.

[0021] The frame 1 has four support columns 11 at its four corners. The first drive mechanism 3 includes a first motor 31, a first mounting bracket 32, and a first transmission component 33. The first mounting bracket 32 ​​is fixedly mounted on one of the support columns 11. The first motor 31 is mounted on the first mounting bracket 32. The first transmission component 33 is mounted on the bottom of the rotating shaft of the wafer carrier platform 2 and is connected to the first motor 31 for transmission. By mounting the first drive mechanism 3 components on the support columns 11, not only is space saved, but the installation flexibility and maintenance convenience of the equipment are also improved. At the same time, the bottom transmission method drives the wafer carrier platform 2 to rotate, effectively avoiding the asymmetrical load problem that may be caused by side drive, and improving the concentricity and operating accuracy of the wafer rotation.

[0022] The second drive mechanism 8 includes a second motor 81, a second mounting assembly 82, and a second transmission component 83. The second mounting assembly 82 is fixedly mounted on another support column 11 and is diagonally positioned opposite the first drive mechanism 3. The second motor 81 is mounted on the second mounting assembly 82. The second transmission component 83 is mounted on the bottom of the shaft 6 and is connected to the second motor 81 for transmission. By positioning the second drive mechanism 8 on the support column 11 diagonally opposite the first drive mechanism 3, a symmetrical structural arrangement is achieved, improving the overall balance and operational stability of the equipment. Through the cooperation of the second motor 81 and the second transmission component 83, the shaft 6 is driven to rotate, effectively achieving smooth movement and high-precision path control of the detection module during the scanning process, meeting the technical requirements of high-speed online wafer inspection.

[0023] like Figure 3 As shown, a first bushing 12 is provided on the frame 1, and the rotating shaft of the wafer carrier platform 2 is rotatably disposed in the first bushing 12. A first photoelectric support plate 13 is fixedly disposed circumferentially at the bottom of the first bushing 12, and a first rotation sensing plate 14 is fixedly disposed at the bottom of the rotating shaft. A first photoelectric sensor 15 is disposed inside the first photoelectric support plate 13, and the first photoelectric sensor 15 is positioned facing the first rotation sensing plate 14. By introducing a rotation detection component, real-time feedback on the rotation state of the wafer carrier platform 2 is achieved, enhancing the closed-loop control capability of the entire system. The photoelectric sensor and the rotation sensing plate form a non-contact monitoring structure, which has the advantages of fast response speed, high accuracy, and no mechanical wear. By accurately monitoring the rotation position, the system can assist in the synchronous scheduling and position calibration of the detection module, improve the comprehensiveness and uniformity of wafer surface scanning, and significantly improve detection accuracy and stability.

[0024] like Figure 1 and Figure 4 As shown, the extension plate 7 is provided with a second bushing 71, and the shaft 6 is rotatably disposed in the second bushing 71. A second photoelectric support plate 72 is disposed circumferentially at the bottom of the second bushing 71, and a second rotation sensing plate 73 is disposed at the bottom of the shaft 6. A second photoelectric sensor 74 is disposed inside the second photoelectric support plate 72, and the second photoelectric sensor 74 is disposed facing the second rotation sensing plate 73. The second photoelectric sensor 74 and the second rotation sensing plate 73 constitute a non-contact angle detection system, which has the advantages of rapid response, compact structure, flexible installation, and high durability. This feedback mechanism helps to achieve precise control of the rotating arm, path optimization, and coordinated cooperation with wafer rotation, thereby improving the integrity and detection accuracy of wafer surface scanning.

[0025] like Figure 2 As shown, the top surface of the wafer carrier platform 2 is provided with multiple suction cups 21 for adsorbing and fixing the wafers. The suction cups 21 are made of silicone, which effectively improves the reliability of wafer fixing. Especially under high-speed rotation conditions, it can significantly reduce the detection error or equipment risk caused by wafer instability.

[0026] like Figure 1 As shown, the detection module 4 is housed inside the inverted U-shaped housing at the end of the rotating arm 5, with the top and sides of the housing surrounding the detection module 4. This design significantly improves the operational safety and environmental adaptability of the detection module 4. The inverted U-shaped housing structure possesses excellent mechanical strength and shielding performance, effectively isolating ambient light interference and preventing misjudgments and signal attenuation; it also provides a protective barrier for the detection module, reducing the impact of vibration, collision, or dust on sensitive elements, and improving the long-term reliability and image stability of the detection.

[0027] The above description of embodiments of the present invention, through which those skilled in the art are able to implement or use the present invention, will be readily apparent to those skilled in the art. Various modifications to these embodiments will be readily apparent to those skilled in the art. The general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novelty disclosed herein.

Claims

1. An online detection device for wafer breakage defects, comprising a frame (1), a wafer support platform (2), a first drive mechanism (3), a detection module (4), a rotating arm (5), a shaft (6), an extension plate (7), and a second drive mechanism (8); The wafer carrier platform (2) is mounted on the rack (1); The first driving mechanism (3) is mounted on the frame (1) and is connected to the wafer carrier platform (2) for driving the wafer carrier platform (2) to rotate so that the wafer it carries rotates around the central axis. The extension plate (7) is fixedly installed at one corner of the frame (1), and the shaft (6) is rotatably mounted on the extension plate (7); One end of the rotating arm (5) is fixedly connected to the shaft (6), and the other end is equipped with the detection module (4). The detection module (4) is positioned facing the wafer carrier platform (2). The second drive mechanism (8) is mounted on the frame (1) and is connected to the shaft (6) for driving the rotating arm (5) to rotate the detection module (4) around the shaft (6), so that the detection module (4) moves along a preset arc trajectory between the edge and center of the wafer; The detection module (4) can move along the arc trajectory while the wafer rotates, so as to realize online detection of fragment defects on the entire surface of the wafer.

2. The online wafer breakage defect detection device as described in claim 1, characterized in that, The frame (1) has support columns (11) at its four corners; the first drive mechanism (3) includes a first motor (31), a first mounting bracket (32) and a first transmission component (33). The first mounting bracket (32) is fixedly mounted on one of the support columns (11). The first motor (31) is mounted on the first mounting bracket (32). The first transmission component (33) is mounted on the bottom of the rotating shaft of the wafer carrier platform (2) and is connected to the first motor (31) in a transmission connection.

3. The online wafer breakage defect detection device as described in claim 2, characterized in that, The second drive mechanism (8) includes a second motor (81), a second mounting assembly (82), and a second transmission component (83). The second mounting assembly (82) is fixedly mounted on another support column (11) and is diagonally arranged with the first drive mechanism (3). The second motor (81) is mounted on the second mounting assembly (82). The second transmission component (83) is mounted on the bottom of the shaft (6) and is connected to the second motor (81) in a transmission manner.

4. The online wafer breakage defect detection device as described in claim 1, characterized in that, The frame (1) is provided with a first bushing (12), and the rotating shaft of the wafer carrier platform (2) is rotatably disposed in the first bushing (12); a first photoelectric carrier plate (13) is fixedly disposed circumferentially at the bottom of the first bushing (12), and a first rotation sensing plate (14) is fixedly disposed at the bottom of the rotating shaft; a first photoelectric sensor (15) is disposed inside the first photoelectric carrier plate (13), and the first photoelectric sensor (15) is disposed facing the first rotation sensing plate (14).

5. The online wafer breakage defect detection device as described in claim 1, characterized in that, The extension plate (7) is provided with a second bushing (71), and the shaft (6) is rotatably disposed in the second bushing (71); a second photoelectric support plate (72) is provided circumferentially at the bottom of the second bushing (71), and a second rotation sensing plate (73) is provided at the bottom of the shaft (6); a second photoelectric sensor (74) is provided inside the second photoelectric support plate (72), and the second photoelectric sensor (74) is disposed facing the second rotation sensing plate (73).

6. The online wafer breakage defect detection device as described in claim 1, characterized in that, The wafer carrier platform (2) has multiple suction cups (21) on its top surface for adsorbing and fixing wafers. The suction cups (21) are made of silicone.

7. The online wafer breakage defect detection device as described in claim 1, characterized in that, The detection module (4) is located inside the inverted U-shaped housing at the end of the rotating arm (5), and the top and sides of the housing surround the detection module (4).

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