A hot press device for embedding a chip package

Abstract

The utility model discloses a kind of hot-pressing devices on embedding chip packaging equipment, including cabinet;Portal frame;Heating plate, the heating plate slidingly connected in the portal frame;Linear module, the linear module is set on the cabinet upper end;Electric rotary table, the electric rotary table can be selected to move to the directly below heating plate;The longitudinal sliding block is slidably connected on the portal frame and located the directly above heating plate;Spring is arranged between the sliding block and the heating plate;Adapter plate is slidably connected on the portal frame;Force sensor is arranged between the adapter plate and the sliding block;Stepping motor is provided on the portal frame. Rotatable platform, more flexible to adjust relative position, improve work efficiency and quality. Under the feedback of force sensor, pressure intensity can also be timely feedback and adjustment, guarantee pressure quality. Unlike negative pressure hole fixed, prevent flexible circuit board from deforming, guarantee pressure precision.

Description

Technical Field

[0001] This utility model belongs to the field of embedded chip packaging technology, and in particular relates to a hot pressing device on an embedded chip packaging equipment. Background Technology

[0002] FPC embedded chip packaging technology uses thermocompression to interconnect the chip with two layers of FPC circuitry, ultimately forming a sandwich-style integrated structure of "upper FPC-chip-lower FPC". Thermocompression is a core process that uses precise control of temperature, pressure, and time to achieve interlayer bonding of FPCs, cover film lamination, reinforcement plate fixation, or chip embedding. The core objective is to fully activate / cure the adhesive (such as PSA, epoxy) to form a strong yet flexible bonding structure, while avoiding deformation of the FPC substrate and damage to the circuitry.

[0003] Chinese patent document CN109121317B discloses a support device and a hot-pressing device. The support device includes: a support platform for supporting a display panel with a flexible circuit board; and a support member disposed outside the support platform, which supports and adsorbs the flexible circuit board, allowing the flexible circuit board to be flatly adhered to the support member. The hot-pressing device includes the aforementioned support device and a pressing mechanism. The pressing mechanism includes a pressing head, which is disposed opposite to the support member and is used to press a chip onto the flexible circuit board. By providing a support member outside the support platform and adsorbing the flexible circuit board, the flexible circuit board is flatly and stably adhered to the support member, avoiding interference from warping of the flexible circuit board on the pressing head.

[0004] In the aforementioned patented solutions, the fixed support components have significant limitations, and the movement of the flexible circuit board is also inconvenient. In the process of laminating multilayer flexible circuit boards, it is difficult to align two flexible circuit boards or chips. Furthermore, the hot-pressing pressure has a crucial impact on the hot-pressing quality; excessive pressure can lead to physical damage and performance degradation, while insufficient pressure can result in inadequate bonding. The aforementioned patented solutions also make it difficult to control the hot-pressing pressure. Utility Model Content

[0005] To overcome the technical problems in existing technologies, such as the inconvenience of aligning flexible circuits and chips due to fixed support components, and the difficulty in controlling the pressing force of the heating plate, one objective of this invention is to provide a hot pressing device for embedding chip packaging equipment. This device utilizes a rotating flexible circuit board platform to facilitate the alignment and adjustment of the two flexible circuit boards and the chip. Furthermore, a buffer spring and force sensor are installed on the heating plate to facilitate pressure control and improve pressing quality.

[0006] To achieve the above objectives, this utility model employs the following technical solution: a hot pressing device for embedding chip packaging equipment, comprising a cabinet; a gantry frame disposed on the upper end of the cabinet; a heating plate slidably connected longitudinally to the gantry frame; a linear module disposed on the upper end of the cabinet; and an electric turntable disposed on the moving end of the linear module, the electric turntable being selectively movable to directly below the heating plate; wherein, a sliding block is slidably connected longitudinally above the heating plate on the gantry frame; a spring is provided between the sliding block and the heating plate to keep them apart; a transition plate is slidably connected longitudinally above the sliding block on the gantry frame; a force sensor is provided between the transition plate and the sliding block; and a stepper motor is provided on the gantry frame to drive the sliding block to slide longitudinally.

[0007] The heating plate first contacts the flexible circuit board to press it together, and then gradually presses it together. The pressure is applied more gently, and the pressing force is easy to control with the feedback from the force sensor, which helps to improve the pressing quality.

[0008] Furthermore, a mounting base plate is slidably connected to the sliding block; a heat insulation block is provided at the lower end of the mounting base plate; a heating plate is provided at the lower end of the heat insulation block; and a spring is provided between the mounting base plate and the sliding block.

[0009] Specifically, the upper end of the mounting base is provided with two first optical axes; the gantry is provided with two linear bearings that are slidably connected to the two first optical axes respectively; and the upper end of the mounting base is provided with four second optical axes that are slidably connected to the sliding block.

[0010] Preferably, the adapter plate is provided with a detection plate; the gantry frame is provided with a mounting frame that is slidably connected to the adapter plate; and the mounting frame is provided with two photoelectric sensors for detecting the position of the detection plate.

[0011] In repetitive pressing operations, the photoelectric sensor can determine whether the pressing operation is completed by judging the starting position, thereby improving pressing efficiency. At the same time, the two photoelectric sensors also limit the range of motion of the adapter plate, preventing excessive movement of the adapter plate from damaging the equipment or flexible circuit board.

[0012] Furthermore, a suction cup is provided on the moving end of the electric turntable; a platform is detachably connected to the suction cup; and an adhesive is provided on the platform.

[0013] Specifically, the upper end of the suction cup is coaxially provided with an annular groove; the lower end of the suction cup is provided with an air guide plate; the upper end of the air guide plate is provided with an air guide groove communicating with the annular groove; and the lower center of the air guide plate is provided with a docking hole communicating with the air guide groove.

[0014] Preferably, a through hole is provided on the electric turntable directly below the docking hole.

[0015] Furthermore, the moving end of the linear module is provided with an upward-opening U-shaped platform; an auxiliary material platform is provided at the upper end of the U-shaped platform; the electric turntable is located at the inner bottom of the U-shaped platform; and a receiving area is provided through the upper end of the auxiliary material platform directly above the electric turntable.

[0016] Specifically, the upper end of the auxiliary material platform is provided with multiple adsorption grooves; the adsorption grooves are used to fix flexible circuit boards or chip boxes.

[0017] The auxiliary material station and the electric turntable are arranged closely adjacent to each other, which reduces the movement distance of the motion mechanism and improves assembly efficiency.

[0018] Specifically, a lead screw is longitudinally disposed on the stepper motor; the lower end of the lead screw is disposed on the upper end of the adapter plate; the lead screw is threadedly connected to the stepper motor.

[0019] The lead screw and the stepper motor reduce the overall height, making the structure compact and concentrated.

[0020] Compared to existing technologies, the advantages of this invention are as follows: This invention features a rotatable platform, allowing for more flexible adjustment of the relative positions of the two flexible circuit boards and the chip, thus improving work efficiency and quality. A spring and force sensor are installed above the heating plate. When the heating plate contacts the flexible circuit board, the increase in pressure is buffered more gently by the spring, and the force sensor provides timely feedback and adjustment of the pressing force, ensuring pressing quality. Furthermore, the platform and adhesive adhesive improve the flatness and fixation of the flexible circuit board, effectively preventing deformation and ensuring pressing accuracy, unlike commonly used negative pressure hole fixation. Attached Figure Description

[0021] Figure 1 This is a schematic diagram illustrating the application state of this utility model;

[0022] Figure 2 This is a schematic diagram of the structure of this utility model;

[0023] Figure 3 This is an exploded structural diagram of the present invention;

[0024] Figure 4This is a structural schematic diagram of the linear module and auxiliary material station of this utility model.

[0025] In the diagram: 11. Cabinet; 12. Gantry frame; 13. Mounting frame; 21. Heating plate; 22. Heat insulation block; 231. Mounting base plate; 232. Linear bearing; 233. First optical axis; 234. Second optical axis; 24. Sliding block; 25. Adapter plate; 251. Detection plate; 26. Force sensor; 27. Spring; 281. Stepper motor; 282. Lead screw; 29. ​​Photoelectric sensor; 31. Linear module; 32. U-shaped table; 33. Electric turntable; 34. Auxiliary material table; 341. Receptacle area; 342. Adsorption tank; 35. Suction cup; 351. Annular groove; 36. Platform; 37. Air guide plate; 371. Air guide groove. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0027] In the description of this utility model, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature. In this description of the utility model, "a number" means two or more, unless otherwise explicitly specified.

[0029] In this utility model, unless otherwise explicitly specified and limited, terms such as "set" and "install" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] See Figures 1-4 A hot pressing device for embedding chip packaging equipment includes a cabinet 11, a gantry frame 12 disposed on the upper end of the cabinet 11, a linear module 31 horizontally disposed on the upper end of the cabinet 11 and located inside the gantry frame 12, and a heating plate 21 longitudinally slidably connected to the gantry frame 12 and located directly above the linear module 31.

[0031] The gantry frame 12 is provided with an installation frame 13; the lower part of the installation frame 13 is provided with, from top to bottom, an adapter plate 25, a force sensor 26, a sliding block 24, a spring 27, an installation base plate 231, a heat insulation block 22, and a heating plate 21; the upper and lower ends of the heat insulation block 22 abut against the installation base plate 231 and the heating plate 21, respectively; the upper and lower ends of the spring 27 abut against the sliding block 24 and the installation base plate 231, respectively.

[0032] The mounting base plate 231 has two first optical axes 233 on its upper end; the gantry frame 12 has two linear bearings 232 that are slidably connected to the two first optical axes 233 respectively; the mounting base plate 231 has four second optical axes 234 that are slidably connected to the sliding block 24 respectively; the mounting frame 13 is an inverted U-shaped structure, and the adapter plate 25 is slidably connected inside the mounting frame 13; the adapter plate 25 has a detection piece 251; and the mounting frame 13 has two photoelectric sensors 29 for detecting the position of the detection piece 251.

[0033] A stepper motor 281 is provided on the upper end of the mounting frame 13; a lead screw 282 is longitudinally provided through the stepper motor 281; the lower end of the lead screw 282 is provided on the upper end of the adapter plate 25; the lead screw 282 is threadedly connected to the stepper motor 281.

[0034] The linear module 31 has a U-shaped platform 32 with an upward-facing opening on its movable end; an auxiliary material platform 34 is horizontally arranged on the upper end of the U-shaped platform 32; an electric turntable 33 is arranged at the inner bottom end of the U-shaped platform 32; a receiving area 341 is arranged through the upper end of the auxiliary material platform 34 directly above the electric turntable 33; the upper end of the electric turntable 33 protrudes above the auxiliary material platform 34; a plurality of adsorption grooves 342 are arranged on the upper end of the auxiliary material platform 34; the adsorption grooves 342 are used to fix flexible circuit boards or chip boxes.

[0035] An air guide plate 37 is provided on the moving end of the electric turntable 33; a suction cup 35 is provided on the upper end of the air guide plate 37; a platform 36 is detachably connected to the upper end of the suction cup 35; and an adsorption adhesive is provided on the platform 36.

[0036] The suction cup 35 has an annular groove 351 coaxially arranged on its upper end; the air guide plate 37 has an air guide groove 371 communicating with the annular groove 351 on its upper end; the air guide plate 37 has a docking hole communicating with the air guide groove 371 at its lower center position; the docking hole is connected to an external air source; and the electric turntable 33 has a through hole located directly below the docking hole.

[0037] Workflow: The loading component first places the first flexible circuit board onto the stage, then applies adhesive to the first flexible circuit board, places the chip in the preset position, and finally places the second flexible circuit board onto the chip. During this process, as the chip and the second flexible circuit board are placed, the motorized turntable 33 rotates and adjusts its position based on the posture information fed back by the vision module, ensuring alignment between the two flexible circuit boards and the chip.

[0038] Next, the linear module 31 moves the stage 36 to directly below the heating plate 21. The stepper motor 281 drives the adapter plate 25 downward. The heating plate 21 first presses against the second flexible circuit board. Then, as the adapter plate 25 continues to move downward, the spring 27 is gradually compressed, and the pressing force on the flexible circuit board gradually increases. During this process, the force sensor 26 detects the pressure change value in real time. After the pressure reaches the preset pressure, the pressing ends, and the stepper motor 281 drives the heating plate 21 back to its original position.

[0039] The above description is only a specific embodiment of the present utility model, but the technical features of the present utility model are not limited thereto. Any changes or modifications made by those skilled in the art within the scope of the present utility model are covered by the patent scope of the present utility model.

Claims

1. A hot pressing device for embedding chip packaging equipment, characterized in that: The device includes a cabinet; a gantry frame mounted on the upper part of the cabinet; a heating plate slidably connected longitudinally to the gantry frame; a linear module mounted on the upper part of the cabinet; and an electric turntable mounted on the moving end of the linear module, the turntable being selectively movable to be directly below the heating plate. A sliding block is slidably connected longitudinally above the heating plate on the gantry frame; a spring is provided between the sliding block and the heating plate to keep them apart; an adapter plate is slidably connected longitudinally above the sliding block on the gantry frame; a force sensor is provided between the adapter plate and the sliding block; and a stepper motor is provided on the gantry frame to drive the sliding block to slide longitudinally.

2. The hot pressing device as described in claim 1, characterized in that: A mounting base plate is slidably connected to the sliding block; a heat insulation block is provided at the lower end of the mounting base plate; a heating plate is provided at the lower end of the heat insulation block; and a spring is provided between the mounting base plate and the sliding block.

3. The hot pressing device as described in claim 2, characterized in that: The upper end of the mounting base is provided with two first optical axes; the gantry is provided with two linear bearings that are slidably connected to the two first optical axes respectively; the upper end of the mounting base is provided with four second optical axes that are slidably connected to the sliding block.

4. The hot pressing device according to any one of claims 1-3, characterized in that: The adapter plate is provided with a detection plate; the gantry frame is provided with a mounting frame that is slidably connected to the adapter plate; the mounting frame is provided with two photoelectric sensors for detecting the position of the detection plate.

5. The hot pressing apparatus according to any one of claims 1-3, characterized in that: The moving end of the electric turntable is equipped with a suction cup; a platform is detachably connected to the suction cup; and an adhesive is provided on the platform.

6. The hot pressing device as described in claim 5, characterized in that: The upper end of the suction cup is coaxially provided with an annular groove; the lower end of the suction cup is provided with an air guide plate; the upper end of the air guide plate is provided with an air guide groove communicating with the annular groove; the lower center of the air guide plate is provided with a docking hole communicating with the air guide groove.

7. The hot pressing device as described in claim 6, characterized in that: A through hole is provided on the electric turntable directly below the docking hole.

8. The hot pressing apparatus according to any one of claims 1-3, characterized in that: The linear module has a U-shaped platform with an upward opening on its movable end; an auxiliary material platform is provided at the upper end of the U-shaped platform; an electric turntable is located at the inner bottom of the U-shaped platform; and a receiving area is provided at the upper end of the auxiliary material platform directly above the electric turntable.

9. The hot pressing device as described in claim 8, characterized in that: The upper end of the auxiliary material platform is provided with multiple adsorption grooves; the adsorption grooves are used to fix flexible circuit boards or chip boxes.

10. The hot pressing apparatus according to any one of claims 1-3, characterized in that: A lead screw is longitudinally installed through the stepper motor; the lower end of the lead screw is located at the upper end of the adapter plate; the lead screw is threadedly connected to the stepper motor.

Images