A multilayer thermally conductive uniform temperature metal substrate for chip packaging

Abstract

The utility model discloses a kind of multilayer heat-conducting uniform temperature metal substrates for chip packaging, including chip packaging layer, the chip packaging layer is installed with heat conduction plate, heat conduction plate is installed with multiple fixing seat, the side surface of fixing seat is equipped with connecting groove, connecting groove is equipped with connecting column, the outer ring surface of connecting column is installed with radiating fin leaf, radiating fin leaf is inclined distribution.The utility model structure is simple, through the multilayer radiating channel of heat conduction plate and the radiating fin leaf of adjustable angle are combined, significantly improve the heat dissipation efficiency of chip packaging.Simultaneously, its modular design and stowable characteristic enhance practicality and maintenance convenience, effectively prolong the service life of chip.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically to a multilayer thermally conductive and temperature-equalizing metal substrate for chip packaging. Background Technology

[0002] Chip packaging involves protecting the chip with a robust casing to resist external impacts, dust, moisture, and chemical corrosion.

[0003] However, current casings are generally made of insulating epoxy molding compound, and their external structure lacks the necessary heat dissipation function. As a result, the chip cannot dissipate heat quickly after continuous operation, thus affecting the chip's lifespan. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a multilayer thermally conductive and temperature-equalizing metal substrate for chip packaging, which increases heat dissipation efficiency by combining multilayer heat dissipation channels with heat dissipation fins, thereby solving the problems mentioned in the background art.

[0005] This utility model is achieved through the following technical solution: a multilayer thermally conductive and temperature-equalizing metal substrate for chip packaging, including a chip packaging layer, a heat-conducting plate mounted on the chip packaging layer, a plurality of fixing seats mounted on the heat-conducting plate, a connecting groove provided on one side of each fixing seat, a connecting post provided in each connecting groove, and heat dissipation fins mounted on the outer ring surface of each connecting post, with the heat dissipation fins being inclinedly distributed.

[0006] As a preferred technical solution, the heat-conducting plate is provided with multiple heat dissipation channels along its length, and the heat dissipation channels are all set through the heat-conducting plate.

[0007] As a preferred technical solution, one end of the connecting groove protrudes to form a positioning part that blocks the opening at one end of the connecting groove, and the other end of the connecting groove is provided with a sealing plug. The outer ring surface of the sealing plug is provided with external threads, and the inner wall surface of the opening at the other end of the connecting groove is provided with internal threads. The sealing plugs are connected by the external threads and the internal threads on the connecting groove. The outer end face of the sealing plug is provided with a cross groove.

[0008] As a preferred technical solution, the cross-section of the connecting groove is set in a "C" shape, and the diameter of the connecting column is greater than the width of the opening of the connecting groove.

[0009] As a preferred technical solution, the heat-conducting plate, the mounting base, the connecting column, and the heat dissipation fins are all made of brass.

[0010] As a preferred technical solution, anti-slip textures are provided on the outer wall surface of the connecting column and the inner wall surface of the connecting groove, and the connecting column is positioned by friction with the connecting groove through the anti-slip textures.

[0011] As a preferred technical solution, each of the mounting bases forms a space for the heat dissipation fins to lie flat.

[0012] The beneficial effects of this utility model are: the utility model has a simple structure, and the heat dissipation area is increased by the heat-conducting plate and the multi-layer heat dissipation channels. Combined with the heat dissipation fins, the heat dissipation area and heat dissipation efficiency can be further increased. Moreover, the heat dissipation fins can be rotated and can be placed on a platform when not in use to reduce the height of the entire unit, which facilitates subsequent storage. They can also be replaced independently to avoid damage that would affect heat dissipation. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a side view of the present invention;

[0016] Figure 3 This is a schematic diagram of the structure of this utility model after removing the heat dissipation fins;

[0017] Figure 4 This is a schematic diagram of the structure of the heat dissipation fins of this utility model.

[0018] The components include: 1. Chip packaging layer; 2. Heat-conducting plate; 3. Fixing base; 4. Heat dissipation fins; 5. Sealing plug; 6. Positioning part; 7. Connecting post; 8. Connecting groove; and 9. Heat dissipation channel. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0020] All features disclosed in this specification, or steps in all methods or processes disclosed herein, may be combined in any way, except for mutually exclusive features and / or steps.

[0021] This specification includes any feature disclosed in any appended claims, abstract, and drawings, which, unless specifically stated otherwise, may be replaced by other equivalent or similar features. That is, unless specifically stated otherwise, each feature is merely one example of a series of equivalent or similar features.

[0022] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, this utility model discloses a multilayer thermally conductive and temperature-equalizing metal substrate for chip packaging, including a chip packaging layer 1, a heat-conducting plate 2 mounted on the chip packaging layer 1, a plurality of fixing seats 3 mounted on the heat-conducting plate 2, a connecting groove 8 provided on one side of each fixing seat 3, a connecting post 7 provided in each connecting groove 8, and heat dissipation fins 4 mounted on the outer ring surface of each connecting post 7, with the heat dissipation fins 4 being inclinedly distributed.

[0023] In this embodiment, the heat-conducting plate 2 is provided with multiple heat dissipation channels 9 along the length direction, and the heat dissipation channels 9 are all arranged through the heat-conducting plate 2.

[0024] In this embodiment, one end of the connecting groove 8 protrudes to form a positioning part 6 that blocks the opening of one end of the connecting groove 8. The other end of the connecting groove 8 is provided with a sealing plug 5. The outer ring surface of the sealing plug 5 is provided with external threads, and the inner wall surface of the opening of the other end of the connecting groove 8 is provided with internal threads. The sealing plug 5 is connected to the internal threads on the connecting groove 8 through the external threads. The outer end face of the sealing plug 5 is provided with a cross groove. A screwdriver can be inserted into the cross groove, so that the cross groove can be removed from the connecting groove. After the sealing plug is no longer blocked, the connecting post can be removed axially from the connecting groove.

[0025] In this embodiment, the cross-section of the connecting groove 8 is all set in a "C" shape, and the diameter of the connecting post 7 is all greater than the width of the opening of the connecting groove 8, so as to prevent the connecting post from falling directly out of the opening on the side of the connecting groove.

[0026] In this embodiment, the heat-conducting plate 2, the fixing base 3, the connecting column 7, and the heat dissipation fins 4 are all made of brass.

[0027] In this embodiment, anti-slip textures are provided on the outer wall surface of the connecting column 7 and the inner wall surface of the connecting groove 8. The connecting column 7 is positioned by friction with the connecting groove 8 through the anti-slip textures, which increases the friction between the connecting column and the connecting groove, thereby enabling the rotating heat dissipation fins to be positioned.

[0028] In this embodiment, a space is formed between the fixed bases 3 for the heat dissipation fins 4 to lie flat, so that the heat dissipation fins can rotate smoothly and lie flat in the space.

[0029] Working principle:

[0030] The heat generated by the chip during operation is first transferred to the chip packaging layer 1, and then rapidly conducted through the closely contacting heat-conducting plate 2. The heat-conducting plate is made of brass, which has good thermal conductivity and can quickly dissipate heat from the chip packaging layer.

[0031] The heat-conducting plate 2 has multiple through-type heat dissipation channels 9. These channels increase the contact area between the heat-conducting plate and the surrounding air, forming a multi-layer heat dissipation path. When air flows in the heat dissipation channels, it can carry away heat through convection, significantly improving the overall heat dissipation efficiency.

[0032] Heat is further conducted to the mounting base 3 and connecting column 7, and finally reaches the inclined heat dissipation fins 4. These fins are also made of brass, and their inclined design increases the contact area with air, accelerating heat dissipation through natural convection or forced airflow. The inclination angle of the heat dissipation fins can be adjusted according to actual heat dissipation needs to optimize the heat dissipation effect.

[0033] When maximum heat dissipation efficiency is required, the heat dissipation fins are kept tilted to maximize the heat dissipation area.

[0034] When not in use or in storage, the heat dissipation fins can rotate around the connecting column to a horizontal position and lie flat in the space between the fixed bases, thereby reducing the overall height and facilitating storage and transportation.

[0035] The heat dissipation fins are fixed at an angle by the friction positioning structure of the connecting post and the connecting groove, which has anti-slip texture, to ensure stability during use.

[0036] The heat dissipation fins are fixed in the connecting groove by the sealing plug 5. During disassembly, simply unscrew the sealing plug to remove the connecting post and heat dissipation fins. This design allows for independent replacement of damaged heat dissipation fins without replacing the entire heat dissipation structure, reducing maintenance costs.

[0037] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A multilayer thermally conductive and temperature-monopolizing metal substrate for chip packaging, characterized in that: The chip package includes a chip packaging layer (1), on which a heat-conducting plate (2) is installed. Multiple fixing seats (3) are installed on the heat-conducting plate (2). Each fixing seat (3) has a connecting groove (8) on one side. Each connecting groove (8) has a connecting post (7). Each connecting post (7) has a heat dissipation fin (4) installed on the outer ring surface of the connecting post (7). The heat dissipation fins (4) are all distributed at an angle.

2. The multilayer thermally conductive and temperature-regulating metal substrate for chip packaging according to claim 1, characterized in that: Multiple heat dissipation channels (9) are provided along the length of the heat-conducting plate (2), and the heat dissipation channels (9) all penetrate the heat-conducting plate (2).

3. The multilayer thermally conductive and temperature-regulating metal substrate for chip packaging according to claim 1, characterized in that: One end of the connecting groove (8) protrudes to form a positioning part (6) that blocks the opening at one end of the connecting groove (8). The other end of the connecting groove (8) is provided with a sealing plug (5). The outer ring surface of the sealing plug (5) is provided with an external thread, and the inner wall surface of the opening at the other end of the connecting groove (8) is provided with an internal thread. The sealing plug (5) is connected to the internal thread on the connecting groove (8) by the external thread. The outer end face of the sealing plug (5) is provided with a cross groove.

4. The multilayer thermally conductive and temperature-regulating metal substrate for chip packaging according to claim 1, characterized in that: The cross-section of the connecting groove (8) is set in a "C" shape, and the diameter of the connecting column (7) is greater than the width of the opening of the connecting groove (8).

5. The multilayer thermally conductive and temperature-regulating metal substrate for chip packaging according to claim 1, characterized in that: The heat-conducting plate (2), the mounting base (3), the connecting column (7), and the heat dissipation fins (4) are all made of brass.

6. The multilayer thermally conductive and temperature-regulating metal substrate for chip packaging according to claim 1, characterized in that: Anti-slip textures are provided on the outer wall of the connecting column (7) and the inner wall of the connecting groove (8). The connecting column (7) is positioned by friction with the connecting groove (8) through the anti-slip textures.

7. The multilayer thermally conductive and temperature-regulating metal substrate for chip packaging according to claim 1, characterized in that: Space is formed between the fixed bases (3) for the heat dissipation fins (4) to be laid flat.

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