Heat sink element and IGBT module

Abstract

The utility model discloses a kind of heat dissipation element and IGBT module, it is related to radiator technical field, wherein, heat dissipation element includes heat dissipation bottom plate, positioning plate and ceramic sheet;Positioning plate is located in heat dissipation bottom plate, and positioning plate is formed with positioning hole;Ceramic sheet is limitedly located in positioning hole, and is attached with heat dissipation bottom plate;The technical scheme provided by the utility model reduces the overall manufacturing cost of heat dissipation element.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, and in particular to a heat sink element and an IGBT module. Background Technology

[0002] In the field of power electronic equipment, taking energy storage converters as an example, the IGBT module, as its core power switching component, generates a large amount of heat under high-power operation. Currently, the industry generally adopts a three-layer heat dissipation structure consisting of "IGBT module - ceramic plate - heat sink" to ensure the thermal stability of the device. In this structure, to ensure that the thermal resistance of the heat dissipation path is minimized, the ceramic plate and the heat sink must achieve close contact and precise positioning.

[0003] In existing technologies, the mainstream process for achieving this positioning function involves directly milling a groove matching the dimensions of the ceramic plate onto the mounting surface of the radiator's substrate (i.e., the heat sink base) using a computer numerical control (CNC) machine. During assembly, the ceramic plate is embedded into this groove, thereby restricting its movement in the planar direction.

[0004] However, this CNC milling process is a typical subtractive manufacturing method, which requires the removal of a large amount of metal during processing. This not only leads to raw material waste but also results in high equipment depreciation, tool wear, and labor costs. In addition, the long processing cycle of this process restricts the overall production efficiency of the product and makes it difficult to meet the needs of large-scale manufacturing. Utility Model Content

[0005] The main purpose of this invention is to propose a heat dissipation element and an IGBT module, which aims to reduce the overall manufacturing cost of the heat dissipation element.

[0006] To achieve the above objectives, the heat dissipation element proposed in this utility model includes: Heat dissipation base plate; A positioning plate is disposed on the heat dissipation base plate, and the positioning plate has positioning holes; A ceramic sheet is positioned within the positioning hole and is attached to the heat dissipation base plate.

[0007] In one embodiment, the positioning plate has a plurality of positioning holes, and the heat dissipation element includes a plurality of ceramic plates, each of which is disposed in one of the positioning holes.

[0008] In one embodiment, two opposing inner walls of the positioning hole are respectively formed with isolation protrusions, and the two isolation protrusions divide the positioning hole into two connected positioning cavities, each of which is provided with a ceramic sheet.

[0009] In one embodiment, the positioning plate is made of epoxy board.

[0010] In one embodiment, the positioning plate is bonded to the heat dissipation base plate.

[0011] In one embodiment, the positioning plate is formed with a plurality of clearance holes.

[0012] In one embodiment, the positioning plate has a plurality of clearance notches formed on its periphery.

[0013] In one embodiment, the heat dissipation base plate has multiple heat dissipation fins on the side facing away from the positioning plate.

[0014] In one embodiment, the thickness of the positioning plate is 0.5 mm.

[0015] This utility model also proposes an IGBT module, comprising: The heat dissipation components described above; IGBT circuit board, wherein the IGBT circuit board has IGBT thyristors, and the IGBT thyristors are bonded to the ceramic sheet.

[0016] In the technical solution of this utility model, by using an independent positioning plate to support the positioning hole function, the high-cost CNC milling machining on the heat dissipation base plate body is avoided, thereby significantly reducing the overall manufacturing cost of the heat dissipation component. At the same time, the heat dissipation base plate itself can maintain its structural integrity and mechanical strength, avoiding local stress concentration or base plate deformation that may be caused by milling grooves, which helps to ensure the flatness of the heat dissipation surface, thereby indirectly improving the long-term heat dissipation reliability and stability. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of an embodiment of the heat dissipation element provided by this utility model; Figure 2 This is a structural schematic diagram of one embodiment of the positioning plate; Figure 3 This is a schematic diagram of the structure of an embodiment of the IGBT module provided by this utility model; Figure 4 This is an exploded view of the structure of an embodiment of the IGBT module provided by this utility model.

[0019] Explanation of icon numbers: 1000. Heat dissipation components; 1. Heat dissipation base plate; 11. Heat dissipation fins; 2. Positioning plate; 21. Positioning hole; 22. Isolation protrusion; 23. Clearance hole; 24. Clearance notch; 3. Ceramic sheet; 4. IGBT circuit board; 41. IGBT thyristor.

[0020] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0022] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0023] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0024] This utility model proposes a heat dissipation element 1000.

[0025] Please see Figure 1 and Figure 2 In one embodiment of the present invention, the heat dissipation element 1000 includes a heat dissipation base plate 1, a positioning plate 2, and a ceramic sheet 3; the positioning plate 2 is disposed on the heat dissipation base plate 1 and has a positioning hole 21; the ceramic sheet 3 is positioned in the positioning hole 21 and is attached to the heat dissipation base plate 1.

[0026] The heat dissipation base plate 1 is the basic component of the heat dissipation element 1000. It is usually made of a metal material with a high thermal conductivity, such as aluminum alloy or copper, and serves as the base of the entire heat dissipation system.

[0027] The positioning plate 2 is mounted on the mounting surface of the heat dissipation base plate 1. At least one positioning hole 21 is formed on the positioning plate 2 by means of stamping, laser cutting or injection molding. The outline shape of the positioning hole 21 matches the shape of the ceramic sheet 3, for example, it is rectangular or circular. Its size is designed to form an interference fit or a small clearance fit with the ceramic sheet 3, so as to accommodate and restrict the movement of the ceramic sheet 3 in the planar direction.

[0028] Positioning plate 2 is made of epoxy board, which refers to a laminate made of epoxy resin as the matrix, usually impregnated with fiber materials and cured by hot pressing. In the electronics industry, it is also often called "epoxy resin laminate" or "FR-4". Epoxy board itself is a standard electrical insulating material with extremely high volume resistivity and breakdown strength. When positioning plate 2 uses epoxy board, in addition to its mechanical positioning function, it adds a reliable insulating barrier between the heat dissipation base plate 1 and the IGBT circuit board 4 above. This improves the electrical safety of the entire heat dissipation system, providing double insulation protection. Even if the ceramic sheet 3 cracks in extreme cases, it can prevent high-voltage short circuits to a certain extent, enhancing the robustness of the system. Moreover, epoxy board has high mechanical strength and rigidity, maintaining shape stability and not easily deformed during assembly and long-term use, thus reliably limiting the position of ceramic sheet 3. At the same time, epoxy board has moderate hardness and softness, making it very suitable for secondary processing such as stamping, drilling, or laser cutting. The positioning hole 21 can be formed in one step by high-precision die stamping, with smooth hole walls, accurate dimensions, extremely high production efficiency and low cost.

[0029] The ceramic plate 3 is made of a highly thermally conductive insulating material, such as alumina ceramic or aluminum nitride ceramic. The ceramic plate 3 is positioned within the positioning hole 21 of the positioning plate 2, with its lower surface directly and tightly attached to the upper surface of the heat dissipation base plate 1. This structure ensures that heat can be transferred directly from the ceramic plate 3 to the heat dissipation base plate 1 with low thermal resistance.

[0030] In the technical solution of this utility model, by using an independent positioning plate 2 to support the positioning hole 21, the high-cost CNC milling machining on the heat dissipation base plate 1 body is avoided, thereby significantly reducing the overall manufacturing cost of the heat dissipation element 1000. At the same time, the heat dissipation base plate 1 itself can maintain its structural integrity and mechanical strength, avoiding local stress concentration or base plate deformation that may be caused by milling grooves, which helps to ensure the flatness of the heat dissipation surface, thereby indirectly improving the long-term heat dissipation reliability and stability.

[0031] Furthermore, in one embodiment of this utility model, the positioning plate 2 has a plurality of positioning holes 21, and the heat dissipation element 1000 includes a plurality of ceramic plates 3, each ceramic plate 3 being disposed in a positioning hole 21. These positioning holes 21 can be arranged on the positioning plate 2 in a specific layout, for example, they can be arranged in a matrix, distributed circumferentially, or adapted to the specific positions of the plurality of IGBT thyristors 41 in the IGBT circuit board 4 above them. Correspondingly, the heat dissipation element 1000 includes a plurality of ceramic plates 3, each ceramic plate 3 being installed in a corresponding positioning hole 21. By designing a plurality of positioning holes 21 on the positioning plate 2, the plurality of ceramic plates 3 can be precisely positioned simultaneously. Moreover, all positioning holes 21 can be formed synchronously in the same manufacturing process of the positioning plate 2, which ensures that the relative positions between the positioning holes 21 have extremely high precision and consistency. This high-precision layout is crucial for ensuring that the plurality of IGBT thyristors 41 above can make uniform contact with their respective ceramic plates 3 and achieve balanced heat dissipation.

[0032] Furthermore, in one embodiment of this utility model, please refer to... Figure 2 Two isolation protrusions 22 are formed on the two opposing inner walls of the positioning hole 21, dividing the positioning hole 21 into two connected positioning cavities. Each positioning cavity contains a ceramic plate 3. Specifically, an isolation protrusion 22 is formed on each of the two opposing inner walls of the positioning hole 21. These two isolation protrusions 22 extend from the inner wall towards the center of the positioning hole 21 but do not contact each other, thus dividing a single positioning hole 21 into two spatially connected positioning cavities. Each positioning cavity independently contains a ceramic plate 3. This allows two independent ceramic plates 3 to be accommodated and positioned within a single positioning hole 21, thereby increasing the device layout density per unit area.

[0033] Specifically, in one embodiment of this utility model, the positioning plate 2 is bonded to the heat dissipation base plate 1. The positioning plate 2 is fixedly bonded to the mounting surface of the heat dissipation base plate 1 by an adhesive layer. In actual operation, the adhesive (e.g., thermally conductive silicone grease, thermally conductive epoxy adhesive, or thermally conductive pressure-sensitive adhesive) can be evenly applied to the mounting surface of the heat dissipation base plate 1 or the back of the positioning plate 2. Then, the positioning plate 2 is aligned and pressed onto the heat dissipation base plate 1. After the adhesive cures, the fixation between the two is completed. The bonding fixation enables a large-area, continuous surface contact between the positioning plate 2 and the heat dissipation base plate 1. This connection method helps to evenly transfer the stress on the positioning plate 2 to the entire heat dissipation base plate 1, avoiding the local stress concentration problem that may be caused by screw fixing, and is conducive to maintaining the overall structural flatness of the heat dissipation base plate 1. Furthermore, when using an adhesive with high thermal conductivity, the adhesive layer not only provides mechanical fixation but also effectively fills the microscopic gaps between the contact surfaces of the positioning plate 2 and the heat dissipation base plate 1, forming an additional, low-thermal-resistance heat conduction path. Although the main heat is still directly conducted to the heat dissipation base plate 1 through the ceramic sheet 3, this additional path helps to more effectively dissipate some of the heat that may accumulate on the positioning plate 2, thereby optimizing the heat dissipation capacity of the entire heat dissipation system to a certain extent.

[0034] Furthermore, in one embodiment of this utility model, please refer to... Figure 2 The positioning plate 2 has multiple clearance holes 23. It is understood that the heat dissipation base plate 1 itself may already have or require other necessary structures. For example, the heat dissipation base plate 1 may already have mounting screw holes for fixing the entire heat dissipation element 1000 to the external cold plate or chassis; it may need through holes for passing through the IGBT circuit board 4 pins or external conductive connections; or it may need holes for installing auxiliary components such as temperature sensors and pressure sensors. The function of the clearance holes 23 is to provide physical channels for these existing or necessary structures on the heat dissipation base plate 1, ensuring that the positioning plate 2 will not cover or block these critical positions after installation, thereby achieving interference-free, integrated operation between the positioning plate 2 and other parts of the heat dissipation system. Furthermore, by selectively designing the clearance holes 23, the positioning plate 2 can flexibly adapt to various heat dissipation base plates 1 of different specifications and structures, or meet specific system layout requirements.

[0035] Furthermore, in one embodiment of this utility model, please refer to... Figure 2The positioning plate 2 has multiple clearance notches 24 formed on its periphery. Similarly, when the heat dissipation element 1000 is installed into the whole machine or module, its periphery space may contain adjacent structures such as structural reinforcing ribs, cable clamps, fixing brackets for adjacent components, and housing protrusions. These clearance notches 24 on the periphery of the positioning plate 2 can provide the necessary accommodation space for these surrounding structures, thereby effectively avoiding installation failures or assembly stress problems caused by interference from the outer contour of the positioning plate 2, and ensuring the smooth integration of the heat dissipation element 1000 in complex and confined spaces.

[0036] Specifically, in one embodiment of this utility model, the thickness of the positioning plate 2 is 0.5 mm. This 0.5 mm thickness allows the positioning plate 2 to perform its positioning and insulation functions while adding negligible amount to the overall thickness of the heat dissipation element 1000. This contributes to the compactness and lightweight design of the heat dissipation system in power electronic devices.

[0037] Furthermore, in one embodiment of this utility model, please refer to... Figure 1 The heat sink base plate 1 has multiple heat dissipation fins 11 on the side facing away from the positioning plate 2. These heat dissipation fins 11 are usually an integral structure with the heat sink base plate 1 or fixed together by processes such as brazing or welding. The core function of the heat dissipation fins 11 is to significantly increase the contact area between the heat dissipation element 1000 and the cooling medium (such as air). This allows the heat generated by the IGBT circuit board 4 and conducted to the heat sink base plate 1 via the ceramic plate 3 to be dissipated to the surrounding environment more quickly and efficiently.

[0038] Please see Figure 3 and Figure 4 This utility model also proposes an IGBT module, which includes an IGBT circuit board 4 and a heat dissipation element 1000. The specific structure of the heat dissipation element 1000 is as described in the above embodiments. Since this IGBT module adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. Among them, the IGBT circuit board 4 has an IGBT thyristor 41, which is attached to a ceramic plate 3. The heat generated by the IGBT thyristor 41 is dissipated from the heat dissipation base plate 1 through the ceramic plate 3.

[0039] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A heat dissipation element, characterized in that, include: Heat dissipation base plate; A positioning plate is disposed on the heat dissipation base plate, and the positioning plate has positioning holes; A ceramic sheet is positioned within the positioning hole and is attached to the heat dissipation base plate.

2. The heat dissipation element as described in claim 1, characterized in that, The positioning plate has a plurality of positioning holes, and the heat dissipation element includes a plurality of ceramic plates, each of which is disposed in a positioning hole.

3. The heat dissipation element as described in claim 1, characterized in that, The two inner walls opposite to the positioning hole are respectively formed with isolation protrusions, and the two isolation protrusions divide the positioning hole into two connected positioning cavities, and each positioning cavity is provided with a ceramic sheet.

4. The heat dissipation element as described in claim 1, characterized in that, The positioning plate is made of epoxy board.

5. The heat dissipation element as described in claim 1, characterized in that, The positioning plate is bonded to the heat dissipation base plate.

6. The heat dissipation element as described in claim 1, characterized in that, The positioning plate has multiple clearance holes.

7. The heat dissipation element as described in claim 1, characterized in that, The positioning plate has multiple clearance notches formed on its periphery.

8. The heat dissipation element as described in claim 1, characterized in that, The heat dissipation base plate has multiple heat dissipation fins on the side facing away from the positioning plate.

9. The heat dissipation element as described in claim 1, characterized in that, The thickness of the positioning plate is 0.5 mm.

10. An IGBT module, characterized in that, include: The heat dissipation element as described in any one of claims 1 to 9; IGBT circuit board, wherein the IGBT circuit board has IGBT thyristors, and the IGBT thyristors are bonded to the ceramic sheet.

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