Chip heat dissipation device and aging board

Abstract

The application discloses a chip heat dissipation device and an aging board, and relates to the technical field of chip heat dissipation. The chip heat dissipation device comprises a limiting seat, a fixing seat and a heat dissipation block. The limiting seat is provided with a through hole, is used for being fixedly installed on an aging board provided with a chip, and the orthographic projection of the chip on the aging board is located in the orthographic projection range of the through hole on the aging board. The fixing seat is fixedly installed above the limiting seat and is provided with a through hole. The heat dissipation block comprises oppositely arranged connecting ends and heat dissipation ends. The connecting end is inserted into the through hole and is threadedly connected with the fixing seat. The end face of the connecting end is inserted into the through hole and is in contact with the top surface of the chip to dissipate heat from the chip through the heat dissipation end. The chip heat dissipation device is threadedly connected with the fixing seat through the heat dissipation block, can flexibly adjust the contact degree of the heat dissipation block and the chip, can be adapted to different specifications of chips and can be repeatedly used, can guarantee heat dissipation stability, and can reduce test cost and waste of metal resources.

Description

Technical Field

[0001] This application relates to the field of chip heat dissipation technology, and more specifically, to a chip heat dissipation device and an aging board. Background Technology

[0002] During the chip aging test phase, heat dissipation of the chips on the aging board is a critical factor in ensuring the effectiveness of the test and the safety of the chips. Chips on the aging board need to operate at full load for extended periods during the aging test, generating a large amount of heat in a short time. If this heat cannot be dissipated in time, it will not only cause fluctuations in chip performance and affect the accuracy of test data, but may also damage core chip components due to high temperatures, leading to test failure.

[0003] To address this issue, a suitable heat dissipation device is required for the chip during testing. A common approach is to use thermal grease or other thermally conductive media to tightly fix a dedicated heat sink to the chip surface for rapid heat conduction and dissipation. However, most heat sinks in existing solutions are custom-made for specific chips, adapting only to a single product specification. They cannot be reused after testing, increasing hardware costs in the testing process and causing unnecessary waste of metal resources. Utility Model Content

[0004] The purpose of this application is to provide a chip heat dissipation device and aging board. The heat sink is threadedly connected to the mounting base, which allows for flexible adjustment of the fit between the heat sink and the chip. It can be adapted to chips of different specifications and can be reused, which not only ensures heat dissipation stability but also reduces testing costs and waste of metal resources.

[0005] The embodiments of this application are implemented as follows: A first aspect of this application provides a chip heat dissipation device, including a limiting seat, a fixing seat, and a heat sink. The limiting seat has a through hole and is used to fix it on an aging board on which a chip is mounted. The orthographic projection of the chip on the aging board is located within the orthographic projection range of the through hole on the aging board. The fixing seat is fixedly mounted above the limiting seat and has a through hole. The heat sink includes a connecting end and a heat dissipation end disposed opposite to each other. The connecting end extends into the through hole and is threadedly connected to the fixing seat. The end face of the connecting end extends into the through hole and is in contact with the top surface of the chip to dissipate heat from the chip through the heat dissipation end. This chip heat dissipation device, with the heat sink threadedly connected to the fixing seat, allows for flexible adjustment of the fit between the heat sink and the chip, adapts to chips of different specifications, and is reusable. This ensures heat dissipation stability while reducing testing costs and the waste of metal resources.

[0006] As one possible implementation, a slot is provided on the side wall of the limiting seat, and a buckle is hinged on the side wall of the fixing seat. The buckle is engaged in the slot so that the fixing seat and the limiting seat are fixedly connected.

[0007] In one possible implementation, the buckle includes a pressing part and a locking part disposed opposite to each other, and a connecting part located between the pressing part and the locking part. The connecting part is hinged to the fixed base. The pressing part is driven to rotate the locking part about the hinge axis of the connecting part and the fixed base, so that the locking part engages with the slot.

[0008] As one possible implementation, it also includes an elastic element, the two ends of which are fixedly connected to the fixed base and the pressing part, respectively. The elastic element is used to provide a restoring force to the pressing part so that the pressing part rotates in the opposite direction relative to the fixed base.

[0009] As one possible implementation, the fixing seat and / or the pressing part are provided with limiting holes, and the end of the elastic member is clearance-fitted with the limiting holes.

[0010] In one possible implementation, the number of the buckles is even, and the even number of buckles are symmetrically distributed on opposite sides of the fixing base. The number of the snap-fit ​​parts is equal to the number of the slots, and the snap-fit ​​parts and the slots are arranged in a one-to-one correspondence.

[0011] In one possible implementation, the diameter of the heat dissipation end is larger than the diameter of the connection end, and multiple heat dissipation fins are spaced apart on the end face of the heat dissipation end.

[0012] In one possible implementation, a handheld portion is provided on the end face of the heat dissipation end. The handheld portion protrudes from the heat dissipation fins. The handheld portion is driven to rotate the heat dissipation block relative to the fixed base, so as to adjust the distance between the connection end and the chip.

[0013] As one possible implementation, it also includes fasteners. The limiting seat is provided with a connecting hole, and the aging plate is provided with a mounting hole. The fasteners are assembled into the connecting hole and the mounting hole to fix the limiting seat and the aging plate together. The limiting seat is provided with a first positioning hole, and the aging plate is provided with a first positioning pin. The first positioning pin passes through the first positioning hole to position the relative positions of the limiting seat and the aging plate.

[0014] A second aspect of this application provides an aging board, including a board body, a chip disposed on the board body, and the aforementioned chip heat dissipation device, wherein the chip heat dissipation device is used to dissipate heat from the chip. This chip heat dissipation device is threadedly connected to a mounting base via a heat sink, allowing for flexible adjustment of the fit between the heat sink and the chip. It can adapt to chips of different specifications and is reusable, ensuring heat dissipation stability while reducing testing costs and the waste of metal resources.

[0015] The beneficial effects of the embodiments of this application include: This chip heat dissipation device includes a limiting seat, a fixing seat, and a heat sink. The limiting seat has a through hole and is used to fix it on an aging board on which the chip is mounted. The orthographic projection of the chip on the aging board is within the orthographic projection range of the through hole on the aging board. The fixing seat is fixedly mounted above the limiting seat and has a through hole. The heat sink includes a connecting end and a heat dissipation end arranged opposite each other. The connecting end extends into the through hole and is threaded to the fixing seat. The end face of the connecting end extends into the through hole and contacts the top surface of the chip to dissipate heat from the chip through the heat dissipation end. In use, first fix the limiting seat on the aging board and arrange the through holes around the chip. Then fix the fixing seat on the limiting seat. Next, extend the connecting end of the heat sink into the through hole until the end face of the connecting end contacts the top surface of the chip. This indicates that the device is properly installed and heat dissipation is achieved through the heat sink. This chip heat dissipation device employs a three-layer structured design: precise positioning with a limiting seat, stable support with a fixed base, and threaded adjustment of the heat sink. This allows the heat sink to flexibly adapt to chips of different thicknesses and package types, eliminating the need for customized heat dissipation components. Furthermore, the detachable design of the limiting seat, fixed base, and heat sink makes the entire device reusable. Disassembly simply requires rotating the heat sink in the opposite direction to detach it from the chip. After cleaning the end face of the connection, it can be used for the next chip. Compared to traditional disposable thermal pads or customized heat sinks, this reduces equipment costs during the testing phase and minimizes metal waste. In addition, the insulating material of the limiting seat complements the metal materials of the fixed base and heat sink, ensuring electrical safety and constructing an efficient heat dissipation path. Combined with the anti-loosening structure and positioning design, this ensures heat dissipation stability. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the chip heat dissipation device provided in the embodiments of this application; Figure 2 for Figure 1 A cross-sectional view from one perspective; Figure 3 for Figure 1 A cross-sectional view from another perspective; Figure 4 This is a schematic diagram of the structure of the mounting base, heat sink, and clip provided in the embodiments of this application; Figure 5 for Figure 4 An explosion diagram; Figure 6 A schematic diagram of the structure of the limiting seat, aging board and chip provided in the embodiments of this application; Figure 7 for Figure 6 An explosion diagram; Figure 8 This is a schematic diagram of the limiting seat and fixing seat provided in the embodiments of this application.

[0018] Icons: 100-Chip heat dissipation device; 10-Limit seat; 11-Through hole; 12-Slot; 13-Connecting hole; 14-First positioning hole; 15-Second positioning hole; 20-Fixing seat; 21-Through hole; 22-Snap fastener; 221-Pressing part; 222-Snap-fit ​​part; 223-Connecting part; 224-Connecting shaft; 23-Limit hole; 24-Allowing groove; 25-Second positioning pin; 30-Heat dissipation block; 31-Connecting end; 32-Heat dissipation end; 321-Heat dissipation fins; 322-Handheld part; 40-Elastic element; 50-Fastener; 60-Nut; 200-Aging board; 210-Mounting hole; 220-First positioning pin; 300-Chip. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. Similar reference numerals and letters in the following drawings indicate similar items. Once an item is defined in one drawing, it does not need to be further defined in other drawings.

[0020] The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and should not be construed as limiting this application. The terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] Unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to connections within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] Please refer to the reference. Figures 1 to 8 This application provides a chip heat dissipation device 100, including a limiting seat 10, a fixing seat 20, and a heat sink 30. The limiting seat 10 is provided with a through hole 11 and is used to fix the limiting seat 10 on an aging board 200 on which the chip 300 is disposed. The orthographic projection of the chip 300 on the aging board 200 is located within the orthographic projection range of the through hole 11 on the aging board 200. The fixing seat 20 is fixedly installed above the limiting seat 10 and is provided with a through hole 21. The heat sink 30 includes a connecting end 31 and a heat dissipation end 32 disposed opposite to each other. The connecting end 31 extends into the through hole 21 and is threadedly connected to the fixing seat 20. The end face of the connecting end 31 extends into the through hole 11 and is in contact with the top surface of the chip 300 so as to dissipate heat from the chip 300 through the heat dissipation end 32. The chip heat dissipation device 100 is connected to the fixing base 20 by a heat sink 30 threadedly. It can flexibly adjust the fit between the heat sink 30 and the chip 300, adapt to different specifications of chips 300 and can be reused. This ensures heat dissipation stability and reduces testing costs and waste of metal resources.

[0023] It should be noted that the chip heat dissipation device 100 includes a limiting seat 10, a fixing seat 20, and a heat sink 30. The limiting seat 10 serves as the basic positioning core of the entire device. The limiting seat 10 can be integrally injection molded from high-temperature resistant and highly insulating engineering plastics (such as polyphenylene sulfide PPS, flame-retardant ABS, or glass fiber reinforced nylon) to avoid electrical short circuits with the aging board 200 and to withstand the ambient temperature during chip 300 operation. The limiting seat 10 is provided with a through hole 11, which can be designed in a stepped manner, away from the upper part of the aging board 200. The aperture is slightly larger than the aperture of the lower section near the aging board 200 so that it can be adapted to the through hole 21 of the upper section and the mounting base 20. The aperture of the lower section should be larger than the size of the largest product among the multiple chips 300. This ensures that the connection end 31 of the heat sink 30 can be smoothly inserted into the through slot, and guides the connection end 31 to be accurately aligned with the core heat-generating area on the top surface of the chip 300. The orthogonal projection of the chip 300 on the aging board 200 falls completely within the projection range of the through hole 11, ensuring that the heat conduction path will not be deviated. From the structural design, this prevents the chip 300 from failing to dissipate heat due to positioning deviation.

[0024] The mounting base 20 can be made of high-strength metal materials (such as aluminum alloy or stainless steel) to provide both structural rigidity and heat dissipation assistance. The mounting base 20 is provided with a through hole 21, and the inner wall of the through hole 21 is machined with a first thread, which forms a precise fit with the second thread on the outer wall of the connecting end 31 of the heat sink 30. The thread pitch can be designed according to actual conditions to achieve micro-adjustment of the insertion length of the connecting end 31 of the heat sink 30, thereby precisely adjusting the contact pressure of the heat sink 30 on the chip 300. To prevent the threads from loosening due to equipment vibration during long-term use, the port of the through hole 21 can also be provided with an anti-loosening structure (such as a built-in elastic washer or anti-loosening adhesive applied to the threads) to ensure a stable contact state between the heat sink 30 and the chip 300. The external dimensions of the mounting base 20 should be compatible with the external dimensions of the limiting base 10. For example, both the mounting base 20 and the limiting base 10 are rectangular or circular structures.

[0025] The heat sink 30 includes a connecting end 31 and a heat dissipation end 32 arranged opposite to each other. The connecting end 31 and the heat dissipation end 32 can be integrally formed to ensure uninterrupted heat conduction. The heat sink 30 can be made of a material with high thermal conductivity (such as oxygen-free copper or pure copper). The end face of the connecting end 31 can be polished to ensure that the end face of the connecting end 31 is in close contact with the top surface of the chip 300. The end face of the connecting end 31 can be coated with thermal grease to further improve heat conduction efficiency. The heat dissipation end 32 can be designed with a multi-fin structure (such as 8 to 12 fins) to increase the contact area between the heat dissipation end 32 and the air, accelerating heat dissipation. In addition, a cooling fan can be added to the top of the heat dissipation end 32 to form an active cooling system to meet the heat dissipation requirements of the high-power chip 300. By rotating and adjusting the heat sink 30, the operator can make the end face of the connecting end 31 and the top surface of the chip 300 form a suitable contact pressure, ensuring close contact while avoiding excessive pressure that could damage the chip 300 packaging structure.

[0026] In use, first fix the limiting seat 10 on the aging board 200 and arrange the through holes 11 around the chip 300. Then fix the fixing seat 20 on the limiting seat 10. Then insert the connecting end 31 of the heat sink 30 into the through hole 21 until the end face of the connecting end 31 is in contact with the top surface of the chip 300. This is considered to be in place. The chip heat dissipation device 100 employs a three-layer structured design: precise positioning with a limiting seat 10, stable support with a fixing seat 20, and threaded adjustment with a heat sink 30. This allows the heat sink 30 to flexibly adapt to chips 300 of different thicknesses and packaging forms without the need for customized heat dissipation components. Furthermore, the detachable design of the limiting seat 10, fixing seat 20, and heat sink 30 makes the entire device reusable. Disassembly simply requires rotating the heat sink 30 in the reverse direction to detach it from the chip 300. After cleaning the end face of the connection end 31, it can be used for the next chip 300. Compared to traditional disposable thermal pads or customized heat sinks, this reduces equipment costs during the testing phase and minimizes metal waste. In addition, the insulating material of the limiting seat 10 complements the metal materials of the fixing seat 20 and the heat sink 30, ensuring electrical safety and constructing an efficient heat dissipation path. Combined with the anti-loosening structure and positioning design, this ensures heat dissipation stability.

[0027] As one possible implementation method, such as Figures 3 to 7 As shown, a slot 12 is provided on the side wall of the limiting seat 10, and a buckle 22 is hinged on the side wall of the fixing seat 20. The buckle 22 is engaged in the slot 12 so that the fixing seat 20 is fixedly connected to the limiting seat 10.

[0028] It should be noted that the side wall of the limiting seat 10 is provided with a slot 12, which can be trapezoidal or rectangular in shape. A buckle 22 is hinged to the side wall of the fixing seat 20 at the position corresponding to the slot 12 (a clearance groove 24 can also be provided at the position of the buckle 22 to allow clearance from the buckle 22). The buckle 22 can be made of spring steel with excellent elasticity or high-strength engineering plastic (such as POM), and its overall structure is approximately L-shaped. The vertical section can be connected to the side wall of the fixing seat 20 via a connecting shaft 224. The hinge hole of the wall is hinged so that the buckle 22 can rotate around the connecting shaft 224. The horizontal section can serve as the snap-fit ​​part 222, and its end is bent upward to form a hook-shaped structure. The length of the hook-shaped structure should be adapted to the depth of the slot 12 of the limiting seat 10 to ensure that the fixing seat 20 and the limiting seat 10 are fixedly connected and in close contact after snap-fit, without any loosening or shaking. The outer side of the vertical section of the buckle 22 can be designed with anti-slip texture (such as fine diagonal texture or dotted anti-slip texture) to facilitate finger gripping and improve operability during disassembly and assembly.

[0029] During installation, place the bottom surface of the fixing seat 20 against the top surface of the limiting seat 10 and align their positioning references (e.g., the positioning boss at the bottom of the fixing seat 20 is embedded in the positioning groove at the top of the limiting seat 10). Then, rotate the buckle 22 around the connecting shaft 224 so that its hook-like structure at the bottom is embedded in the slot 12 of the limiting seat 10, thus completing the fixing. At this time, the elastic deformation of the buckle 22 generates a continuous pre-tightening force, allowing the fixing seat 20 and the limiting seat 10 to fit tightly together. With the help of the positioning structure, the coaxiality of the through hole 21 of the fixing seat 20 and the through hole 11 of the limiting seat 10 is ensured, laying the material basis for the precise adjustment of the depth of the heat sink 30. During disassembly, simply pull the buckle 22 upwards to disengage the hook-shaped structure at its bottom from the slot 12, and the fixing seat 20 and the limiting seat 10 can be easily separated. No tools are required throughout the process. The disassembly and assembly time of a single connection is short, which is far superior to traditional bolt connections. It is especially suitable for application scenarios in chip 300 testing where the aging board 200 and the test chip 300 are frequently replaced.

[0030] As one possible implementation method, such as Figures 3 to 7 As shown, the buckle 22 includes a pressing part 221 and a locking part 222 disposed opposite to each other, and a connecting part 223 located between the pressing part 221 and the locking part 222. The connecting part 223 is hinged to the fixed base 20. The pressing part 221 is driven to rotate the locking part 222 around the hinge axis of the connecting part 223 and the fixed base 20 so that the locking part 222 engages with the slot 12.

[0031] It should be noted that the buckle 22 includes a pressing part 221, a connecting part 223, and a locking part 222 arranged sequentially along the line connecting the fixing seat 20 and the limiting seat 10. The pressing part 221 is the core interactive end for the operator. It can be designed as a flat protrusion, and its surface can be pressed with diagonal or dotted anti-slip textures to increase the friction between the fingers and the pressing part 221 and prevent slippage during operation. The end of the pressing part 221 away from the locking part 222 can be slightly raised outward to form a lever fulcrum, further reducing the operating force and adapting to the feel in scenarios of frequent disassembly and assembly. Requirements: The locking part 222 is the functional end for locking. It is set opposite to the pressing part 221 and is hook-shaped. The end of the locking part 222 away from the pressing part 221 can be bent inward to form a hook-shaped structure so that the hook-shaped structure can be accurately embedded in the slot 12 of the limiting seat 10. The connecting part 223 is the "rotation hub" connecting the pressing part 221 and the locking part 222. It can be hinged to the hinge hole on the side wall of the fixed seat 20 through the connecting shaft 224. The connecting shaft 224 and the hinge hole adopt a clearance fit to ensure flexible rotation and avoid locking offset caused by shaking.

[0032] When the operator presses the pressing part 221, the force is transmitted to the hinge axis through the connecting part 223, causing the locking part 222 to rotate upward around the hinge axis. At this time, the fixing seat 20 is aligned with the limiting seat 10 and lowered. After pulling the pressing part 221, the reverse force is transmitted to the hinge axis through the connecting part 223, causing the locking part 222 to rotate downward, so that its hook-like structure is accurately embedded in the slot 12 of the limiting seat 10, forming a mechanical lock, thereby completing the fixing of the fixing seat 20 and the limiting seat 10. During disassembly, simply press the pressing part 221 again to drive the locking part 222 to rotate upward and disengage from the slot 12, and the fixing seat 20 and the limiting seat 10 can be easily separated. The elasticity of the connecting part 223 itself can ensure that the buckle 22 can maintain its original stroke and preload after multiple rotations.

[0033] As one possible implementation method, such as Figure 1 , Figures 3 to 5 As shown, the chip heat dissipation device 100 also includes an elastic member 40. The two ends of the elastic member 40 are fixedly connected to the fixed base 20 and the pressing part 221, respectively. The elastic member 40 is used to provide a restoring force to the pressing part 221 so that the pressing part 221 rotates in the opposite direction relative to the fixed base 20.

[0034] It should be noted that the chip heat dissipation device 100 also includes an elastic element 40. The elastic element 40 can be selected as a torsion spring or a spring according to the layout of the buckle 22. If it is a torsion spring, its inner diameter should be adapted to the diameter of the connecting shaft 224 and it can be directly sleeved on the connecting shaft 224. The torsion arms at both ends are fixed by hooks or slots 12 respectively. If it is a spring, its length should be adapted to the space between the buckle 22 and the fixing seat 20. One end is fixed to the side of the fixing seat 20 near the pressing part 221, and the other end is fixed to the side of the pressing part 221 near the fixing seat 20. It provides a restoring force through tensile deformation.

[0035] When the operator presses the pressing part 221, the pressing part 221 rotates around the connecting shaft 224, causing the locking part 222 to rotate around the connecting shaft 224. At the same time, the elastic element 40 undergoes elastic deformation and stores elastic potential energy. At this time, the locking part 222 rotates upward and is in the unlocked state. When the pressing part 221 is released, the elastic element 40 releases elastic potential energy, driving the pressing part 221 to rotate in the opposite direction around the connecting shaft 224, thereby causing the locking part 222 to rotate downward until it is embedded in the slot 12 of the limiting seat 10 and forms a pre-tightening force, completing the automatic reset of the buckle 22, thereby locking it with the slot 12.

[0036] As one possible implementation method, such as Figures 3 to 5 As shown, the fixed base 20 and / or the pressing part 221 are provided with limiting holes 23, and the end of the elastic member 40 is clearance-fitted with the limiting hole 23.

[0037] It should be noted that the fixing base 20 and / or the pressing part 221 are provided with limiting holes 23. The design of the limiting holes 23 must be precisely matched with the type and installation position of the elastic element 40. The limiting holes 23 can be formed by drilling. The end of the elastic element 40 is clearance-fitted with the limiting holes 23, which will not allow the end of the elastic element 40 to shake significantly in the limiting holes 23, thus avoiding the offset of the reset force, and will also reserve space for the deformation of the elastic element 40. When the pressing part 221 is subjected to force and causes the elastic element 40 to deform, the end of the elastic element 40 can rotate or slide slightly in the limiting holes 23, eliminating the rigid constraints caused by installation errors or thermal expansion and contraction, preventing the elastic element 40 from being unable to deform smoothly due to jamming, thereby avoiding the attenuation of the reset force or the locking buckle 22 from getting stuck.

[0038] As one possible implementation method, such as Figures 3 to 7 As shown, the number of buckles 22 is even, and the even number of buckles 22 are symmetrically distributed on opposite sides of the fixing base 20. The number of engaging parts 222 is equal to the number of slots 12, and the engaging parts 222 and the slots 12 are arranged in a one-to-one correspondence.

[0039] It should be noted that the latches 22 are designed with an even number of symmetrically distributed on opposite sides of the fixing base 20, and the latching parts 222 correspond one-to-one with the latching slots 12, which can form a balanced locking force between the fixing base 20 and the limiting base 10. For example, when there are two latches 22, they are symmetrically distributed on opposite sides of the fixing base 20 along the length or width direction. The pre-tightening force provided by each latch 22 is transmitted to the limiting base 10 through the fixing base 20, forming a pair of opposing balanced forces. This allows the pressure distribution on the contact surface of the fixing base 20 and the limiting base 10 to be uniform, avoiding torque offset caused by a single latch 22, and ensuring that the heat sink 30 is always vertically aligned with the core area of ​​the chip 300, thus structurally ensuring the stability of the heat dissipation path.

[0040] As one possible implementation method, such as Figures 1 to 5 As shown, the diameter of the heat dissipation end 32 is larger than the diameter of the connection end 31, and multiple heat dissipation fins 321 are spaced apart on the end face of the heat dissipation end 32.

[0041] It should be noted that the diameter of the heat dissipation end 32 is larger than that of the connection end 31 to increase the contact area between the heat dissipation end 32 and the air. In addition, the larger diameter can provide more space for the heat dissipation fins 321 to avoid insufficient heat dissipation area due to the diameter limitation of the connection end 31. The diameter of the connection end 31 is smaller so that it can accurately pass through the through hole 21 and extend into the through hole 11, reducing interference with the limiting seat 10 and the fixing seat 20. The functional division of the two is clear, ensuring that the heat conduction path from the connection end 31 to the heat dissipation end 32 is short and smooth.

[0042] Multiple heat dissipation fins 321 are spaced apart on the end face of the heat dissipation end 32. The number of heat dissipation fins 321 is designed according to the diameter of the heat dissipation end 32. The heat dissipation fins 321 can be arranged radially or in parallel. Radial heat dissipation fins 321 (extending from the center to the edge of the heat dissipation end 32) are suitable for all-round air convection. Parallel heat dissipation fins 321 (extending in the same direction) can be used with a fan to assist in heat dissipation, which can significantly improve the heat dissipation effect of the chip 300.

[0043] As one possible implementation method, such as Figures 1 to 5 As shown, a handheld part 322 is provided on the end face of the heat dissipation end 32. The handheld part 322 protrudes from the heat dissipation fins 321. The handheld part 322 is driven to rotate the heat dissipation block 30 relative to the fixed base 20 to adjust the distance between the connection end 31 and the chip 300.

[0044] It should be noted that a handle 322 is provided on the end face of the heat dissipation end 32. The handle 322 is integrally formed with the heat dissipation end 32 and must protrude from the heat dissipation fins 321. The side of the handle 322 can be provided with an anti-slip structure, such as fine vertical grooves, a grid pattern, or multiple evenly distributed anti-slip bumps, to increase the friction between the hand and the handle 322. When the handle 322 is driven (manually rotated), the torque is transmitted to the threaded structure of the connecting end 31 through the heat dissipation end 32. Since the lever arm of the handle 322 is longer than that of the connecting end 31, the force required for rotation adjustment can be significantly reduced, making the spacing adjustment easier to control.

[0045] As one possible implementation method, such as Figure 6 and Figure 7 As shown, the chip heat dissipation device 100 also includes a fastener 50, a connection hole 13 is provided on the limiting seat 10, and an installation hole 210 is provided on the aging board 200. The fastener 50 is assembled in the connection hole 13 and the installation hole 210 so that the limiting seat 10 is fixedly connected to the aging board 200.

[0046] It should be noted that the chip heat dissipation device 100 also includes fasteners 50, such as screws and bolts, which can be used with nuts 60. The limiting seat 10 is provided with a connecting hole 13, and the aging board 200 is provided with a mounting hole 210. The fasteners 50 are assembled in the connecting hole 13 and the mounting hole 210 and tightened by the nuts 60 to fix the limiting seat 10 to the aging board 200, thereby ensuring that the position of the limiting seat 10 remains stable when the aging board 200 vibrates or deforms due to heat. Two to four fasteners 50 can be symmetrically arranged along the circumference of the limiting seat 10 (such as one at each of the four corners of the rectangular limiting seat 10) to form a balanced locking force, avoid the limiting seat 10 from warping due to single-point fixing, ensure that the limiting seat 10 is tightly attached to the surface of the aging board 200, and thus ensure the alignment accuracy of the through hole 11 and the chip 300.

[0047] As one possible implementation method, such as Figures 6 to 8 As shown, the limiting seat 10 is provided with a first positioning hole 14, and the aging plate 200 is provided with a first positioning pin 220. The first positioning pin 220 passes through the first positioning hole 14 to position the relative position of the limiting seat 10 and the aging plate 200.

[0048] It should be noted that a first positioning hole 14 is provided on the bottom surface of the limiting seat 10, and a first positioning pin 220 is provided on the aging plate 200. The shape and size of the first positioning hole 14 and the first positioning pin 220 are compatible. During installation, the first positioning pin 220 can be inserted into the first positioning hole 14 first to position the relative position of the limiting seat 10 and the aging plate 200, and then the fastener 50 can be assembled into the connecting hole 13 and the mounting hole 210. For example, in this embodiment, there are two first positioning holes 14 and two first positioning pins 220, which are respectively provided on two opposite corners of the rectangular limiting seat 10. Furthermore, the diameters of the two first positioning holes 14 are different, and the diameters of the two first positioning pins 220 are respectively compatible with the diameters of the two first positioning holes 14 to prevent mistaken assembly.

[0049] Similarly, such as Figure 8 As shown, a second positioning hole 15 is provided on the top surface of the limiting seat 10 (the second positioning hole 15 may or may not completely penetrate the limiting seat 10), and a second positioning pin 25 is provided on the bottom surface of the fixing seat 20. The shapes and sizes of the second positioning hole 15 and the second positioning pin 25 are adapted to each other. During installation, the second positioning pin 25 can be inserted into the second positioning hole 15 first to position the relative positions of the fixing seat 20 and the limiting seat 10, and then the buckle 22 can be snapped into the slot 12. For example, in this embodiment, there are also two second positioning holes 15 and two second positioning pins 25, which are respectively provided on the other two opposite corners of the rectangular limiting seat 10. Furthermore, the diameters of the two second positioning holes 15 are different, and the diameters of the two second positioning pins 25 are adapted to the diameters of the two second positioning holes 15, so as to prevent mistaken assembly.

[0050] This application also provides an aging board 200, including a board body, a chip 300 disposed on the board body, and the aforementioned chip heat dissipation device 100. The chip heat dissipation device 100 is used to dissipate heat from the chip 300 to ensure the effectiveness of the test and the safety of the chip 300. Since the structure and beneficial effects of the chip heat dissipation device 100 have been described in detail in the foregoing embodiments, they will not be repeated here.

[0051] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0052] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A chip heat dissipation device, characterized in that, The device includes a limiting seat, a fixing seat, and a heat sink. The limiting seat has a through hole and is used to fix it on an aging board on which a chip is mounted. The orthographic projection of the chip on the aging board is located within the orthographic projection range of the through hole on the aging board. The fixing seat is fixedly mounted above the limiting seat and has a through hole. The heat sink includes a connecting end and a heat dissipation end disposed opposite to each other. The connecting end extends into the through hole and is threadedly connected to the fixing seat. The end face of the connecting end extends into the through hole and is in contact with the top surface of the chip to dissipate heat from the chip through the heat dissipation end.

2. The chip heat dissipation device according to claim 1, characterized in that, The limiting seat has a slot on its side wall, and the fixing seat has a buckle hinged to its side wall. The buckle engages with the slot so that the fixing seat and the limiting seat are fixedly connected.

3. The chip heat dissipation device according to claim 2, characterized in that, The buckle includes a pressing part and a locking part disposed opposite to each other, and a connecting part located between the pressing part and the locking part. The connecting part is hinged to the fixed base. The pressing part is driven to rotate the locking part around the hinge axis of the connecting part and the fixed base so that the locking part engages with the slot.

4. The chip heat dissipation device according to claim 3, characterized in that, It also includes an elastic element, the two ends of which are fixedly connected to the fixed base and the pressing part, respectively. The elastic element is used to provide a restoring force to the pressing part so that the pressing part rotates in the opposite direction relative to the fixed base.

5. The chip heat dissipation device according to claim 4, characterized in that, The fixing seat and / or the pressing part are provided with limiting holes, and the end of the elastic element is clearance-fitted with the limiting holes.

6. The chip heat dissipation device according to claim 3, characterized in that, The number of the buckles is even, and the even number of buckles are symmetrically distributed on opposite sides of the fixing base. The number of the snap-fit ​​parts is equal to the number of the slots, and the snap-fit ​​parts and the slots are arranged in a one-to-one correspondence.

7. The chip heat dissipation device according to claim 1, characterized in that, The diameter of the heat dissipation end is larger than the diameter of the connection end, and multiple heat dissipation fins are spaced apart on the end face of the heat dissipation end.

8. The chip heat dissipation device according to claim 7, characterized in that, A handheld portion is provided on the end face of the heat dissipation end. The handheld portion protrudes from the heat dissipation fins. The handheld portion is driven to rotate the heat dissipation block relative to the fixed base to adjust the distance between the connection end and the chip.

9. The chip heat dissipation device according to claim 1, characterized in that, It also includes fasteners. The limiting seat is provided with a connecting hole, and the aging plate is provided with a mounting hole. The fasteners are assembled into the connecting hole and the mounting hole to fix the limiting seat and the aging plate in place. The limiting seat is provided with a first positioning hole, and the aging plate is provided with a first positioning pin. The first positioning pin passes through the first positioning hole to position the relative position of the limiting seat and the aging plate.

10. An aging board, characterized in that, The device includes a board, a chip disposed on the board, and a chip heat dissipation device according to any one of claims 1 to 9, wherein the chip heat dissipation device is used to dissipate heat from the chip.

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