Totally enclosed molded rectifier bridge

Abstract

The utility model relates to rectifier bridge technical field especially relates to a full -enclosed pressure plastic type rectifier bridge. Its technical scheme includes: casing assembly, casing assembly includes bottom shell and upper cover, and the bottom shell is located below upper cover in and is provided with rectifier chip assembly, and rectifier chip assembly includes radiating baseplate, and the symmetry of radiating baseplate is provided with four groups of silicon diode chip, and the both sides of radiating baseplate are provided with multiple groups of pin, and the inner wall of bottom shell is located the outer ring of rectifier chip assembly and is provided with protective ring pad, and the lower side between upper cover and rectifier chip assembly is provided with radiating plate. The utility model discloses through casing assembly adopts pressure plastic full -enclosed structure, and cooperates the double -sealed design of pin groove and sealing foot ring at pin, and the protection level greatly promotes, can effectively block water vapor, dust and corrosive gas, is applicable to the severe working environment, and through the setting of radiating plate and radiating rib intercoordination greatly improved the radiating efficiency, and through the setting of fastening groove improved the connecting strength and stability of pin.

Description

Technical Field

[0001] This utility model relates to the field of rectifier bridge technology, and in particular to a fully enclosed compression-molded rectifier bridge. Background Technology

[0002] The rectifier bridge is a core component in power electronic circuits, used to convert alternating current (AC) to direct current (DC), and is widely used in power adapters, industrial controllers, and new energy equipment. Most existing rectifier bridges are packaged using compression molding. However, conventional compression molding partially encapsulates the internal components with a plastic shell, leaving the exposed pins without an effective sealing structure. This not only provides insufficient protection but also results in weak connection strength between the pins and the shell, making them prone to loosening under vibration, affecting circuit stability. Furthermore, it has poor heat dissipation, making it difficult to quickly dissipate the heat generated during chip operation. Prolonged high-temperature operation reduces the rectifier bridge's lifespan and reliability. Therefore, we propose a fully enclosed compression-molded rectifier bridge. Utility Model Content

[0003] The purpose of this invention is to address the problems existing in the background technology by proposing a fully enclosed compression-molded rectifier bridge.

[0004] The technical solution of this utility model is as follows: A fully enclosed compression-molded rectifier bridge includes a housing assembly, which includes a bottom shell and an upper cover. A rectifier chip assembly is disposed inside the bottom shell below the upper cover. The rectifier chip assembly includes a heat dissipation substrate. Four sets of silicon diode chips are symmetrically arranged on the heat dissipation substrate. Multiple sets of pins are arranged on both sides of the heat dissipation substrate. A protective ring gasket is disposed on the inner wall of the bottom shell around the outer ring of the rectifier chip assembly. Pin slots are provided on the bottom shell and the protective ring gasket at the corresponding pin slot positions. Sealing feet are provided on the outer side of the bottom shell and the inner side of the protective ring gasket at the corresponding pin slot positions. A heat dissipation plate is disposed between the lower side of the upper cover and the rectifier chip assembly. Positioning pins are provided at the four corner positions of the lower side of the upper cover. Hooks are provided at the four edge positions of the lower side of the upper cover.

[0005] Preferably, multiple sets of waist-shaped holes are provided on both sides of the bottom shell, and a mounting groove is provided on the upper side of the bottom shell, with the mounting end of the heat dissipation substrate corresponding to one side of the inner wall of the mounting groove.

[0006] Preferably, the upper side of the protective ring pad is folded, the outer ring of the protective ring pad is in contact with the inner wall of the mounting groove, and the inner ring of the protective ring pad is in contact with the outer ring of the heat dissipation substrate.

[0007] Preferably, the mounting end of the silicon diode chip is mounted corresponding to the upper side of the heat dissipation substrate, the mounting end of the pin is mounted corresponding to one side of the heat dissipation substrate, and a fastening groove is provided at the top of each group of pins.

[0008] Preferably, multiple sets of sealing feet located on the outer side of the bottom shell are installed corresponding to one side of the bottom shell, and multiple sets of sealing feet located on the inner ring of the protective ring gasket are installed corresponding to the protective ring gasket. The outer ring of the pin is respectively in contact with the pin groove and the inner ring of the sealing feet.

[0009] Preferably, the heat sink has multiple sets of heat dissipation holes, the lower side of the heat sink is in contact with the upper side of the multiple sets of silicon diode chips, and a heat-conducting plate is provided on the lower side of the upper cover, with the upper side of the heat sink and the side of the heat-conducting plate in contact.

[0010] Preferably, the lower side of the upper cover fits into the upper side of the bottom shell, the mounting end of the positioning pin is installed corresponding to one side of the upper cover, and positioning holes are provided at the four corners of the bottom shell, with the positioning pin and positioning holes being mutually compatible.

[0011] Preferably, the mounting end of the hook is installed corresponding to the lower side of the upper cover, and the upper side of the bottom shell is provided with slots near the four edges. When the upper cover is in the installed state, the hook and the slots are locked together.

[0012] Preferably, multiple sets of heat dissipation ribs are provided on the upper side of the upper cover, and the mounting ends of the heat dissipation ribs are installed corresponding to the upper side of the upper cover.

[0013] Compared with the prior art, the present invention has the following beneficial technical effects: This utility model has a simple overall structure and high production efficiency. The housing assembly adopts a compression-molded fully enclosed structure, combined with the pin slots and sealing foot rings at the pins, which greatly improves the protection level and can effectively block moisture, dust and corrosive gases, making it suitable for harsh working environments. The heat sink, together with the heat conduction plate and heat dissipation ribs, greatly improves the heat dissipation efficiency and extends the service life of the rectifier bridge. At the same time, the fastening groove improves the connection strength and stability of the pins. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a partial sectional view of the present invention; Figure 3 This is an exploded view of the structure of this utility model; Figure 4 This is a schematic diagram of the upper cover structure in this utility model.

[0015] Reference numerals: 1. Housing assembly; 11. Bottom shell; 12. Top cover; 13. Slot; 14. Heat dissipation rib; 15. Waist-shaped hole; 2. Rectifier chip assembly; 21. Heat dissipation substrate; 22. Silicon diode chip; 23. Pin; 24. Fastening groove; 3. Protective ring gasket; 4. Pin slot; 5. Sealing foot ring; 6. Heat sink; 7. Positioning pin; 8. Hook; 9. Heat conduction plate; 10. Positioning hole. Detailed Implementation

[0016] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments. Example

[0017] like Figure 1-4 As shown, this utility model proposes a fully enclosed compression-molded rectifier bridge, including a housing assembly 1. The housing assembly 1 includes a bottom shell 11 and an upper cover 12. The housing assembly 1 is configured as a compression-molded fully enclosed structure. Positioning pins 7 are provided at the four corners of the lower part of the upper cover 12. One side of the lower part of the upper cover 12 fits against the upper part of the bottom shell 11. When the upper cover 12 and the bottom shell 11 are assembled, they fit tightly together. The mounting ends of the positioning pins 7 are correspondingly installed on one side of the upper cover 12 and are fixedly connected to one side of the upper cover 12. Positioning holes 10 are provided at the four corners of the bottom shell 11. The positioning pins 7 and the positioning holes 10 are mutually adapted and slidably connected. The positioning pins 7 and the positioning holes 10 allow the upper cover 12 to slide freely. 2. The bottom cover 11 is positioned and installed to ensure the stability of the bottom cover 11 and the upper cover 12 when they are assembled. The lower side of the upper cover 12 is provided with hooks 8 at four edges. The mounting end of the hooks 8 is installed corresponding to the lower side of the upper cover 12 and is fixedly connected to one side of the upper cover 12. The upper side of the bottom cover 11 is provided with slots 13 near the four edges. When the upper cover 12 is installed, the hooks 8 and slots 13 are locked together. When the upper cover 12 and the bottom cover 11 are assembled, the hooks 8 are locked in the slots 13 to ensure that the upper cover 12 can be stably assembled with the bottom cover 11. Multiple sets of waist-shaped holes 15 are provided on both sides of the bottom cover 11. The multiple sets of waist-shaped holes 15 facilitate the operator to fasten the rectifier bridge. A rectifier chip assembly 2 is disposed inside the bottom shell 11, below the upper cover 12. The rectifier chip assembly 2 includes a heat dissipation substrate 21. A mounting groove is formed on the upper side of the bottom shell 11. The mounting end of the heat dissipation substrate 21 is installed corresponding to one side of the inner wall of the mounting groove. The mounting end of the heat dissipation substrate 21 is fixedly connected to the inner wall of the mounting groove. The surface of the heat dissipation substrate 21 is nickel-plated. Four sets of silicon diode chips 22 are symmetrically arranged on the heat dissipation substrate 21. The mounting ends of the silicon diode chips 22 are installed corresponding to one side of the upper part of the heat dissipation substrate 21. The silicon diode chips 22 are fixedly soldered to one side of the upper part of the heat dissipation substrate 21 by high-temperature soldering. A full-bridge circuit is formed by copper wire bonding. The arrangement of the heat dissipation substrate 21 can improve the heat dissipation performance of multiple sets of silicon diode chips 22 in the working state. Multiple sets of pins 23 are arranged on both sides of the heat dissipation substrate 21. The mounting ends of the pins 23 are installed corresponding to one side of the heat dissipation substrate 21. One end of the pins 23 is connected to the silicon diode chips 22 by bonding wires. The electrodes of the diode chip 22 are electrically connected. Each set of pins 23 has a fastening groove 24 at its top. The fastening groove 24 makes the pins 23 more stable when they are connected and assembled, greatly improving the connection strength of the pins 23. The inner wall of the bottom shell 11 is provided with a protective ring pad 3 on the outer ring of the rectifier chip assembly 2. The upper side of the protective ring pad 3 is folded and slightly higher than the upper side of the bottom shell 11. The folded edge and slightly higher upper side of the protective ring pad 3 can better seal the gap between the bottom shell 11 and the upper cover 12, ensuring the internal sealing performance when the bottom shell 11 and the upper cover 12 are assembled. The outer ring of the protective ring pad 3 fits into the inner wall of the mounting groove, and the inner ring of the protective ring pad 3 fits into the outer ring of the heat sink substrate 21. The protective ring pad 3 can protect the outer periphery of the heat sink substrate 21 and further improve the stability of the rectifier chip assembly 2 installed in the bottom shell 11. Pin slots 4 are provided on the bottom shell 11 and the protective ring pad 3 at the positions corresponding to each group of pins 23. The pin slots 4 allow the top of the pins 23 to pass through the outside of the housing assembly 1 for connection. Sealing feet 5 are provided on the outer side of the bottom shell 11 and the inner side of the protective ring pad 3 at the positions corresponding to the pin slots 4. Multiple sets of sealing feet 5 on the outer side of the bottom shell 11 are installed corresponding to one side of the bottom shell 11 and are fixedly connected to one side of the bottom shell 11. Multiple sets of sealing feet 5 on the inner ring of the protective ring pad 3 are installed corresponding to the protective ring pad 3 and are fixedly connected to the protective ring pad 3. The outer ring of the pins 23 is respectively in contact with the pin slots 4 and the inner rings of the sealing feet 5. The sealing feet 5 can seal the position of the pin slots 4 to prevent moisture and dust from entering the interior of the housing assembly 1 through the pin slots 4 and damaging the rectifier chip assembly 2. This improves the sealing performance of the rectifier bridge and enhances the protection performance. A heat sink 6 is provided between the lower side of the upper cover 12 and the rectifier chip assembly 2. The heat sink 6 has multiple sets of heat dissipation holes, which can better dissipate heat from the upper side of the multiple silicon diode chips 22. The lower side of the heat sink 6 is in contact with the upper side of the multiple silicon diode chips 22. A heat-conducting plate 9 is provided on the lower side of the upper cover 12. The mounting end of the heat-conducting plate 9 is fixedly connected to one side of the upper cover 12. The upper side of the heat sink 6 is in contact with one side of the heat-conducting plate 9. The heat-conducting plate 9 can absorb the heat on the heat sink 6. Multiple sets of heat dissipation ribs 14 are provided on the upper side of the upper cover 12. The mounting ends of the heat dissipation ribs 14 are installed corresponding to the upper side of the upper cover 12 and fixedly connected to the upper side of the upper cover 12. The heat dissipation ribs 14 can dissipate the heat on the heat-conducting plate 9 through transfer, which greatly improves the heat dissipation effect of the rectifier bridge.

[0018] In this embodiment, the operator first uses glass fiber reinforced plastic to press-molde the bottom shell 11 and the upper cover 12 using an injection molding machine. Then, the operator installs the protective ring pad 3 onto the inner wall of the mounting groove on the bottom shell 11. Next, the operator symmetrically assembles four sets of silicon diode chips 22 on one side above the nickel-plated heat dissipation substrate 21. Then, the operator fixes the rectifier chip assembly 2 into the mounting groove on the bottom shell 11, so that the outer periphery of the heat dissipation substrate 21 is tightly fitted with the inner wall of the protective ring pad 3. Then, the operator inserts one end of the pin 23 into the bottom shell 11 through the pin groove 4. At this time, the sealing foot ring 5 is tightly fitted with the outside of the pin 23. One end of pin 23 is electrically connected to the electrode of silicon diode chip 22 via a bonding wire. At this time, the end of pin 23 with fastening groove 24 extends out of the bottom shell 11. Then, the operator places heat sink 6 above silicon diode chip 22 and presses down the upper cover 12 with heat conduction plate 9 above the bottom shell 11 to assemble it, so that positioning pin 7 is inserted into positioning hole 10. Then, continue to press down to make heat conduction plate 9 and heat sink 6 fit together. At this time, the lower side of the upper cover 12 presses the upper side of the protective ring pad 3, so that the hook 8 is snapped into the slot 13, thereby completing the fully enclosed assembly of the rectifier bridge.

[0019] The above-described specific embodiments are merely preferred embodiments of the present invention. Based on the technical solution of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above-described specific embodiments.

Claims

1. A fully enclosed compression-molded rectifier bridge, comprising a housing assembly (1), characterized in that: The housing assembly (1) includes a bottom shell (11) and an upper cover (12). A rectifier chip assembly (2) is disposed inside the bottom shell (11) below the upper cover (12). The rectifier chip assembly (2) includes a heat dissipation substrate (21). Four sets of silicon diode chips (22) are symmetrically arranged on the heat dissipation substrate (21). Multiple sets of pins (23) are arranged on both sides of the heat dissipation substrate (21). A protective ring gasket (3) is disposed on the inner wall of the bottom shell (11) around the outer ring of the rectifier chip assembly (2). Pin slots (4) are provided on the protective ring pad (3) at the corresponding pin (23) positions. Sealing feet (5) are provided on the outer side of the bottom shell (11) and the inner side of the protective ring pad (3) at the corresponding pin slots (4) positions. A heat sink (6) is provided between the lower side of the upper cover (12) and the rectifier chip assembly (2). Positioning pins (7) are provided at the four corner positions of the lower side of the upper cover (12). Hooks (8) are provided at the four edges positions of the lower side of the upper cover (12).

2. The fully enclosed compression-molded rectifier bridge according to claim 1, characterized in that, Multiple sets of waist-shaped holes (15) are opened on both sides of the bottom shell (11). An installation groove is opened on the upper side of the bottom shell (11). The installation end of the heat dissipation substrate (21) is installed corresponding to one side of the inner wall of the installation groove.

3. The fully enclosed compression-molded rectifier bridge according to claim 2, characterized in that, The upper side of the protective ring pad (3) is folded, the outer ring of the protective ring pad (3) is in contact with the inner wall of the mounting groove, and the inner ring of the protective ring pad (3) is in contact with the outer ring of the heat dissipation substrate (21).

4. The fully enclosed compression-molded rectifier bridge according to claim 1, characterized in that, The mounting end of the silicon diode chip (22) is mounted on the upper side of the heat dissipation substrate (21), and the mounting end of the pin (23) is mounted on the side of the heat dissipation substrate (21). A fastening groove (24) is provided at the top of each set of pins (23).

5. The fully enclosed compression-molded rectifier bridge according to claim 1, characterized in that, Multiple sets of sealing feet (5) located on the outside of the bottom shell (11) are installed corresponding to one side of the bottom shell (11). Multiple sets of sealing feet (5) located on the inner ring of the protective ring pad (3) are installed corresponding to the protective ring pad (3). The outer ring of the pin (23) is in contact with the inner ring of the pin groove (4) and the sealing feet (5) respectively.

6. The fully enclosed compression-molded rectifier bridge according to claim 1, characterized in that, The heat sink (6) has multiple sets of heat dissipation holes. The lower side of the heat sink (6) is in contact with the upper side of the multiple sets of silicon diode chips (22). The lower side of the upper cover (12) is provided with a heat-conducting plate (9). The upper side of the heat sink (6) is in contact with the side of the heat-conducting plate (9).

7. The fully enclosed compression-molded rectifier bridge according to claim 1, characterized in that, The lower side of the upper cover (12) is in contact with the upper side of the bottom shell (11). The mounting end of the positioning pin (7) is installed corresponding to one side of the upper cover (12). Positioning holes (10) are provided at the four corners of the bottom shell (11). The positioning pin (7) and the positioning holes (10) are compatible with each other.

8. The fully enclosed compression-molded rectifier bridge according to claim 1, characterized in that, The mounting end of the hook (8) is installed corresponding to the lower side of the upper cover (12). The upper side of the bottom shell (11) is provided with slots (13) near the four edges. When the upper cover (12) is in the installation state, the hook (8) and the slots (13) are locked together.

9. A fully enclosed compression-molded rectifier bridge according to claim 1, characterized in that, Multiple sets of heat dissipation ribs (14) are provided on one side above the upper cover (12), and the mounting ends of the heat dissipation ribs (14) are installed corresponding to the upper side of the upper cover (12).

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