A graded manifold microchannel heat sink for high power chip cooling

Abstract

The utility model belongs to chip heat dissipation technical field, concretely relates to a kind of for the progressive manifold microchannel radiator of high-power chip heat dissipation, including cover, manifold shunt plate, microchannel bottom plate, cover is equipped with fluid inlet, fluid outlet, manifold shunt plate is equipped with several manifold liquid inlet channel, manifold liquid outlet channel that length is not all equal and penetrates manifold shunt plate, microchannel bottom plate distribution has several microchannels, manifold liquid inlet channel is connected with fluid inlet, microchannel, manifold liquid outlet channel is connected with fluid outlet, microchannel.The utility model has increased manifold shunt layer structure in the upper layer of traditional microchannel, so that fluid flows into microchannel from multiple inlets, and flows out from multiple outlets, shorten the process of fluid in microchannel to realize lower pressure drop value, reduce flow resistance, simultaneously, manifold shunt layer structure is designed as progressive structure, improve heat dissipation efficiency and temperature uniformity, satisfy the high-performance heat dissipation demand of modern electronic equipment.

Description

Technical Field

[0001] This utility model belongs to the field of chip heat dissipation technology, specifically relating to a gradient manifold microchannel heat sink for high-power chip heat dissipation. Background Technology

[0002] With the rapid miniaturization and integration of electronic devices, their power density is increasing, and the heat dissipation problem of electronic devices is becoming more and more serious. In particular, with the rapid development of microelectronics, large-scale integrated circuits, high-speed computers and other scientific and technological advancements, the transient heat flux density of microelectronic chips in some cutting-edge technology fields can reach as high as 10. 7 W / m 2 If effective heat dissipation methods are not adopted to solve the heat dissipation problem, the temperature of electronic devices will rise, greatly reducing their reliability and even causing damage. Heat dissipation has become one of the bottlenecks in the technological development of high-power electronic devices.

[0003] Traditional microchannel heat sinks, as a highly efficient heat dissipation solution, have shown significant advantages in solving the heat dissipation problem of high heat flux electronic devices because they can increase the convective heat transfer area and improve the convective heat transfer intensity, thereby achieving effective heat transfer. They are considered one of the effective ways to solve the heat dissipation problem of high power consumption chips.

[0004] However, traditional microchannel heat sinks also have certain limitations. For example, as the fluid gradually absorbs heat and heats up along the flow direction within the straight microchannel, the heat exchange capacity deteriorates, leading to a sharp increase in the temperature of the flow end wall. This results in a large temperature difference across the entire chip, significantly reducing the heat dissipation effect of the cold plate and making it impossible to achieve uniform heat dissipation across all areas of the chip. Secondly, the small hydraulic diameter of the microchannel generates significant flow resistance. These limitations of microchannel heat sinks make it difficult to solve the increasingly prominent thermal management problems. Utility Model Content

[0005] To address the technical problems of uneven heat dissipation and high flow resistance in traditional microchannel heat sinks, this invention provides a gradient manifold microchannel heat sink for high-power chip heat dissipation.

[0006] The purpose of this utility model is achieved by the following technical solution. According to this utility model, a gradient manifold microchannel heat sink for high-power chip heat dissipation includes a cover plate, a manifold distribution plate, and a microchannel base plate, which are stacked sequentially and sealed at their mating surfaces. The cover plate has a fluid inlet and a fluid outlet. The manifold distribution plate has several manifold inlet channels and manifold outlet channels that penetrate the manifold distribution plate and have unequal lengths. The microchannel base plate has several microchannels distributed on its mating surface with the manifold distribution plate. The manifold inlet channels communicate with the fluid inlet and the microchannels, and the manifold outlet channels communicate with the fluid outlet and the microchannels.

[0007] Compared with the prior art, the advantages of this utility model are: This invention provides a novel gradient manifold microchannel radiator structure that can effectively reduce flow resistance, achieve uniform flow distribution, and improve heat transfer efficiency along the flow path. A manifold distribution layer structure is added to the upper layer of the traditional microchannel, allowing fluid to flow into the microchannel from multiple inlets and out from multiple outlets. By shortening the fluid flow path within the microchannel, a lower pressure drop value is achieved, reducing flow resistance. At the same time, the manifold distribution layer structure is designed as a gradient structure, which improves heat dissipation efficiency and temperature uniformity, meeting the high-performance heat dissipation requirements of modern electronic devices.

[0008] Furthermore, the manifold distribution plate and the cover plate are provided with a flow guide groove, one end of which is connected to the fluid inlet and the other end is connected to the liquid inlet channel of each manifold.

[0009] Furthermore, the bottom surface of the guide channel is provided with several inlet guide structures that uniformly guide the fluid into each manifold inlet channel, and the shape of the inlet guide structure is a long strip-shaped isolation boss.

[0010] Compared with the prior art, the advantages of this utility model are: The fluid is evenly introduced into the liquid inlet channels of each manifold through the guide channel and the inlet guide structure, so that the fluid is evenly dispersed.

[0011] Furthermore, a reflux groove is provided on the surface of the manifold distribution plate that mates with the cover plate, and the reflux groove is connected to the liquid outlet channel and fluid outlet of each manifold.

[0012] Furthermore, the manifold inlet channel and the manifold outlet channel are parallel to each other or on the same straight line, and the lengths of the manifold inlet channel and the manifold outlet channel gradually change in a direction perpendicular to the manifold inlet channel or the manifold outlet channel.

[0013] Compared with the prior art, the advantages of this utility model are: The manifold inlet and outlet channels are parallel or on the same straight line, which makes it easy for the processed microchannels to be connected to each manifold inlet and outlet channel.

[0014] Furthermore, adjacent manifold inlet channels, adjacent manifold outlet channels, and adjacent manifold inlet and outlet channels are separated by channel partition structures. The channel partition structures include longitudinal channel partition structures parallel to the manifold inlet and outlet channels and transverse channel partition structures perpendicular to the manifold inlet and outlet channels. Furthermore, adjacent manifold inlet channels and adjacent manifold outlet channels are separated by longitudinal channel partition structures. The outermost manifold inlet channel and the outermost manifold outlet channel are also separated by longitudinal channel partition structures. Transverse channel partition structures are set between two adjacent longitudinal channel partition structures. The manifold inlet channel and the manifold outlet channel between two adjacent longitudinal channel partition structures are separated by transverse channel partition structures. The reflux tank and the manifold inlet channel are also separated by transverse channel partition structures.

[0015] Furthermore, the surface of the manifold diverter plate that mates with the microchannel base plate is provided with a reinforcing rib structure, and the upper surface of the microchannel base plate mates with the reinforcing rib structure.

[0016] Compared with the prior art, the advantages of this utility model are: By reinforcing the structure, the strength of the manifold inlet and outlet channels is increased, thereby reducing their impact on the strength of the manifold distributor plate.

[0017] Furthermore, the microchannel base plate is provided with a toothed structure, which includes multiple parallel teeth that form microchannels for fluid passage.

[0018] Compared with the prior art, the advantages of this utility model are: The method of machining microchannels using shovel teeth is simple and low-cost.

[0019] Furthermore, the manifold inlet channel and the manifold outlet channel are parallel to each other or on the same straight line, and each microchannel is perpendicular to the manifold inlet channel and the manifold outlet channel.

[0020] Compared with the prior art, the advantages of this utility model are: The microchannels extend perpendicularly to the manifold inlet and outlet channels, enabling each microchannel to connect with the manifold inlet and outlet channels, facilitating the timely discharge of the heat-exchanged fluid.

[0021] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the purpose, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of a gradient manifold microchannel heat sink for high-power chip heat dissipation according to the present invention. Figure 2 for Figure 1A three-dimensional structural diagram of the middle cover plate; Figure 3 for Figure 1 Schematic diagram of the top structure of the manifold splitter; Figure 4 for Figure 1 Schematic diagram of the bottom structure of the central airway diverter plate; Figure 5a for Figure 1 Schematic diagram of the structure of the microchannel base plate; Figure 5b for Figure 5a Enlarged view of point A in the middle; Figure 6 for Figure 1 A front sectional view of a gradient manifold microchannel radiator. Figure 7 for Figure 1 A schematic diagram of fluid flow in a medium-gradient manifold microchannel radiator.

[0023] Figure label: 1-Cover plate, 2-Manifold diverter plate, 3-Microchannel base plate, 4-Fluid inlet, 5-Fluid outlet, 6-Manifold liquid inlet channel, 7-Manifold liquid outlet channel, 8-Inlet guide structure, 9-Reinforcing rib structure, 10-Shovel tooth structure, 11-Guide groove, 12-Channel partition structure, 121-Longitudinal channel partition structure, 122-Transverse channel partition structure, 13-Return groove. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] This utility model discloses an embodiment of a gradient manifold microchannel heat sink for high-power chip heat dissipation, such as... Figures 1 to 7 As shown. The heat sink includes a cover plate 1, a manifold distribution plate 2, and a microchannel base plate 3, which are stacked from top to bottom.

[0026] The structure of cover plate 1 is as follows Figure 2 As shown, the cover plate 1 is provided with a fluid inlet 4 and a fluid outlet 5. In this embodiment, both the fluid inlet 4 and the fluid outlet 5 are circular through holes opened on the cover plate 1, and the positions of the fluid inlet 4 and the fluid outlet 5 are close to both ends of the cover plate 1, respectively.

[0027] The liquid distribution structure of manifold distributor 2 is as follows: Figure 3As shown, the upper part of the manifold diverter plate 2 is provided with a manifold inlet channel 6, a manifold outlet channel 7, and an inlet guide structure 8. The bottom plate of the manifold diverter plate 2 is provided with a reinforcing rib structure 9, such as... Figure 4 As shown.

[0028] like Figure 3 As shown, a guide groove 11 is provided on the upper surface of the manifold diverter plate 2 near one end. The guide groove 11 is an isosceles triangle, and its vertex corresponds to the position of the fluid inlet 4 of the cover plate 1. The shape of the vertex matches the shape of the fluid inlet 4, so that after the fluid enters and passes through the fluid inlet 4, it directly enters the guide groove 11.

[0029] The bottom surface of the flow guide channel 11 has several inlet flow guide structures 8. Each inlet flow guide structure 8 is a long, narrow isolation protrusion. These inlet flow guide structures 8 radiate outwards from the apex of the flow guide channel 11. After the fluid enters from the apex of the flow guide channel 11, it is dispersed by the inlet flow guide structures 8, allowing the fluid to flow evenly along the bottom edge of the flow guide channel 11. In this embodiment, the flow guide channel 11 has four inlet flow guide structures 8, symmetrically arranged within it.

[0030] The bottom edge of the guide channel 11 is connected to the manifold inlet channel 6, which penetrates the manifold distribution plate 2. Several manifold inlet channels 6 are distributed in the middle of the manifold distribution plate 2. These channels are parallel to each other and perpendicular to the bottom edge of the guide channel 11. The lengths between adjacent manifold inlet channels 6 are not equal. Figure 3 As shown. In this embodiment, five manifold liquid inlet channels 6 are provided. The manifold liquid inlet channel 6 at the middle position of the bottom edge of the guide channel 11 is the shortest. The lengths of the manifold liquid inlet channels 6 on both sides gradually increase as the distance from the middle manifold liquid inlet channel 6 increases.

[0031] Several manifold outlet channels 7 are distributed in the middle of the manifold distributor plate 2, and these channels 7 penetrate the manifold distributor plate 2. The manifold outlet channels 7 are parallel to each other and perpendicular to the bottom edge of the guide groove 11. The lengths between adjacent manifold outlet channels 7 are not equal, such as... Figure 3 As shown. In this embodiment, five manifold outlet channels 7 are provided. The manifold outlet channel 7 in the middle position is longer, the manifold outlet channels 7 on both sides of the middle position are the shortest, and the outermost manifold outlet channel 7 is the longest.

[0032] A return channel 13 is provided near the other end of the manifold diverter plate 2. In this embodiment, the return channel 13 is a rectangular channel and is connected to the manifold liquid outlet channel 7. The return channel 13 corresponds to the position of the fluid outlet 5 on the cover plate 1. After the fluid enters the return channel 13 through the gas pipe liquid outlet channel 7, it is discharged through the fluid outlet 5 on the cover plate 1.

[0033] As shown Figure 3 , in this embodiment, the adjacent manifold liquid inlet channels 6, the adjacent manifold liquid outlet channels 7, and the adjacent manifold liquid inlet channel 6 and manifold liquid outlet channel 7 are separated by a channel separation structure 12. The channel separation structure 12 includes a longitudinal channel separation structure 121 parallel to the manifold liquid inlet channel 6 and the manifold liquid outlet channel 7, and further includes a transverse channel separation structure 122 perpendicular to the manifold liquid inlet channel 6 and the manifold liquid outlet channel 7.

[0034] The adjacent manifold liquid inlet channels 6 and the adjacent manifold liquid outlet channels 7 are separated by the longitudinal channel separation structure 121, and the outermost manifold liquid inlet channel 6 and the outermost manifold liquid outlet channel 7 are also separated by the longitudinal channel separation structure 121, so that the lengths of the manifold liquid inlet channel 6 and the manifold liquid outlet channel 7 reach the maximum. The corresponding manifold liquid inlet channel 6 and manifold liquid outlet channel 7 are separated by the transverse channel separation structure 122, and the transverse channel separation structure 122 is arranged between two adjacent longitudinal channel separation structures 121. The return tank 13 and the manifold liquid inlet channel 6 are also separated by the transverse channel separation structure 122.

[0035] A reinforcing rib structure 9 is arranged at the middle position of the bottom surface of the manifold flow distribution plate 2, and the reinforcing rib structure 9 covers the other side of the manifold liquid inlet channel 6 and the manifold liquid outlet channel 7, so as to enhance the strength here. In this embodiment, the reinforcing rib structure 9 is in a shape of Chinese character "ri". In this embodiment, the reinforcing rib structure 9 is welded to the microchannel base plate 3 to ensure the pressure resistance of the radiator.

[0036] The microchannel base plate 3 is as shown Figure 5a , Figure 5b , a gear milling structure 10 is arranged on the upper surface of the microchannel base plate 3. In this embodiment, the gear milling structure 10 on the microchannel base plate 2 is divided into two areas, and there is a gap between the two areas to cooperate with the reinforcing rib structure 9 in the shape of Chinese character "ri". The microchannel base plate 3 is matched with the manifold flow distribution plate 2, the top surface of the gear milling structure 10 abuts against the bottom surface where the manifold liquid inlet channel 6 and the manifold liquid outlet channel 7 are located, and the upper surface of the microchannel base plate 3 abuts against the reinforcing rib structure 9. The gear milling structure 10 includes a plurality of mutually parallel gear milling teeth, and microchannels for fluid to pass through are formed between the gear milling teeth. The manifold liquid inlet channel 6 and the manifold liquid outlet channel 7 are communicated with the microchannels.

[0037] In this embodiment, the gear milling structure 10 is manufactured on the microchannel base plate 3 by a gear milling method to form parallel rectangular straight microchannels. The length, width and height of a single microchannel are 26mm, 0.15mm and 2.5mm respectively, the tooth thickness is 0.15mm, and the material is a high thermal conductivity metal material such as copper or aluminum.

[0038] The horizontal rib in the middle of the reinforcing rib structure 9 is perpendicular to the manifold inlet channel 6 and the manifold outlet channel 7. The interval between the two microchannel areas in the microchannel base plate 3 forms a groove to accommodate the horizontal rib. The microchannel is parallel to the groove and the horizontal rib, thereby making the microchannel perpendicular to the manifold inlet channel 6 and the manifold outlet channel 7, so that each microchannel is connected to the manifold inlet channel 6 and the manifold outlet channel 7.

[0039] The cover plate 1 is placed over the upper surface of the manifold distributor plate 2, and the microchannel base plate 3 is placed over the bottom surface of the manifold distributor plate 2. The cover plate 1, the manifold distributor plate 2, and the microchannel base plate 3 are formed into a sealed radiator structure by welding techniques such as vacuum brazing or continuous brazing.

[0040] The cover plate 1 is provided with a fluid inlet 4 and a fluid outlet 5, which are respectively connected to external pipes / connectors for inputting and outputting fluid. The bottom surface of the microchannel base plate 3 is in close contact with the chip to be cooled.

[0041] Within the enclosed radiator, the fluid flow path is as follows: fluid inlet 4, manifold distribution plate 2, microchannel base plate 3, manifold distribution plate 2, fluid outlet 5. Cold fluid enters the manifold distribution plate 2 through the fluid inlet 4 for distribution, and is evenly dispersed into the complex microchannel structure of the microchannel base plate 3 for sufficient heat exchange. It then converges through the manifold outlet channel 7 and finally flows out from the fluid outlet 5.

[0042] like Figure 6 As shown, this is a front cross-sectional view of a gradient manifold microchannel radiator. The fluid flows in from the fluid inlet 4 and flows downward to the manifold distribution plate 2 for diversion. After diversion, the fluid enters the microchannel bottom plate 3 for flow heat exchange, and then flows out from the fluid outlet 5 through the manifold distribution plate 2.

[0043] In the manifold distributor plate 2, the cold fluid enters from the fluid inlet 4 and is guided by the inlet guide structure 8, making its flow into the manifold liquid inlet channel 6 more uniform. The cold fluid then enters the manifold liquid inlet channel 6, which is distributed from short to long, allowing the cold fluid to enter the microchannels evenly and orderly, improving the heat exchange uniformity of the cold plate. After sufficient heat exchange, the hot fluid flows out from the manifold liquid outlet channel 7. By setting multiple manifold liquid outlet channels 7, the flow resistance is reduced. The liquid outlet channel 7 is converged through the return channel 13 and then flows out from the fluid outlet 5.

[0044] The manifold microchannel radiator uses a gradient manifold-style fluid distribution, with the specific fluid flow pattern as follows: Figure 7 As shown, the manifold fluid distribution method forms a complex manifold inlet channel 6 and manifold outlet channel 7. The manifold inlet channel 6 and manifold outlet channel 7 contain multiple parallel gradient flow distribution structures.

[0045] The manifold-style fluid distribution method effectively reduces the flow length of fluid within the channel, lowers the pressure drop of the heat sink, and improves the uniformity of temperature distribution. The manifold layer is designed with a gradient, and compared to fluid inlets and outlets parallel to the flow direction within the manifold or microchannels, the fluid enters vertically from the fluid inlet 4 and diffuses, resulting in a shorter entry channel. Through the manifold inlet channel 6, fluid distribution is more uniform. After heat exchange, the fluid is promptly discharged from the outlet channel 7, which is more conducive to heat exchange in the chip. Therefore, the gradient manifold structure design effectively solves the problem of heat dissipation difficulties for high-power chips and is of great significance for heat dissipation of high-heat-fluidity electronic devices.

[0046] Numerical simulations show that, compared to traditional rectangular microchannel heat sinks, at a flow rate of 3 L / min and a heat flux density of 138 W / cm², [the heat sink achieves better performance]. 2 At this time, the voltage drop of this gradient manifold microchannel heat sink is reduced by 15%, the maximum chip temperature is reduced by 3°C, and the maximum temperature difference is reduced by 10°C. This will effectively reduce the thermal stress on the chip, ensuring its reliable operation, while the reduction in voltage drop effectively reduces the operating cost of the heat sink.

[0047] The heat exchange medium can be deionized water, refrigerant, or other fluids. Based on the heat dissipation requirements of the electronic chip and the selected heat exchange medium, the inflow rate is determined, and a gradient manifold microchannel heat sink is used to cool and exchange heat with the chip.

[0048] The advantages of this utility model are summarized as follows: (1) The manifold layer (manifold inlet channel 7 and manifold outlet channel 8 in manifold distribution plate 2) is designed as a gradient structure, which improves the uniformity of fluid distribution and the temperature distribution is more uniform, which is beneficial to the heat dissipation of high power consumption chips.

[0049] (2) The manifold fluid distribution method effectively reduces the flow length of the fluid in the channel and the flow length of the cooling medium in the microchannel, which greatly reduces the flow resistance of the cold plate. (3) Multiple liquid outlet channels are designed on the manifold distribution plate 2, which greatly shortens the flow path of the cooling medium in the microchannel, so that the cooling medium can be quickly discharged from the microchannel and the heat exchange efficiency is increased.

[0050] In other embodiments, based on the above embodiments, the number of fluid inlets and outlets and the width of the parallel manifold channels (including manifold inlet channel 6 and manifold outlet channel 7) can be designed and optimized according to the actual chip power and size and other actual conditions.

[0051] In other embodiments, based on the above embodiments, the length variation trend of the manifold inlet channel 6 and the manifold outlet channel 7 is modified. For example, the length of each manifold inlet channel 6 gradually increases in the direction perpendicular to the manifold inlet channel 6, and correspondingly, the length of each manifold outlet channel 7 gradually decreases in the same direction. The manifold inlet channels 6 and the manifold outlet channels 7 that are on the same straight line are located between adjacent longitudinal channel separation structures 121 and separated by transverse channel separation structures 122.

[0052] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A gradient manifold microchannel heat sink for high-power chip heat dissipation, comprising a cover plate (1), a manifold distribution plate (2), and a microchannel base plate (3) stacked sequentially and sealed at their mating surfaces, characterized in that: The cover plate (1) is provided with a fluid inlet (4) and a fluid outlet (5). The manifold distribution plate (2) is provided with a number of manifold inlet channels (6) and manifold outlet channels (7) that penetrate the manifold distribution plate (2) and are not all of equal length. The microchannel bottom plate (3) has a number of microchannels distributed on the surface that mates with the manifold distribution plate (2). The manifold inlet channel (6) is connected to the fluid inlet (4) and the microchannel. The manifold outlet channel (7) is connected to the fluid outlet (5) and the microchannel.

2. The gradient manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The manifold diverter plate (2) is provided with a guide groove (11) on the surface that mates with the cover plate (1). One end of the guide groove (11) is connected to the fluid inlet (4), and the other end is connected to the liquid inlet channel (6) of each manifold.

3. A gradient manifold microchannel heat sink for high-power chip heat dissipation according to claim 2, characterized in that: The bottom surface of the guide groove (11) is provided with several inlet guide structures (8) that uniformly guide the fluid into each manifold inlet channel (6). The shape of the inlet guide structure (8) is a long strip-shaped isolation boss.

4. A gradient manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The manifold distribution plate (2) is provided with a return groove (13) on the surface that mates with the cover plate (1). The return groove (13) is connected to the liquid outlet channel (7) of each manifold and the fluid outlet (5).

5. A gradient manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The manifold inlet channel (6) and manifold outlet channel (7) are parallel to each other or on the same straight line. The lengths of the manifold inlet channel (6) and manifold outlet channel (7) gradually change in a direction perpendicular to the manifold inlet channel (6) or manifold outlet channel (7).

6. A gradient manifold microchannel heat sink for high-power chip heat dissipation according to claim 5, characterized in that: The adjacent manifold inlet channels (6), the adjacent manifold outlet channels (7), and the adjacent manifold inlet channels (6) and manifold outlet channels (7) are separated by a channel separation structure (12). The channel separation structure (12) includes a longitudinal channel separation structure (121) parallel to the manifold inlet channels (6) and the manifold outlet channels (7) and a transverse channel separation structure (122) perpendicular to the manifold inlet channels (6) and the manifold outlet channels (7).

7. A gradient manifold microchannel heat sink for high-power chip heat dissipation according to claim 6, characterized in that: The adjacent manifold inlet channels (6) and the adjacent manifold outlet channels (7) are separated by a longitudinal channel partition structure (121). The outermost manifold inlet channel (6) and the outermost manifold outlet channel (7) are also separated by a longitudinal channel partition structure (121). A transverse channel partition structure (122) is set between two adjacent longitudinal channel partition structures (121). The manifold inlet channel (6) and the manifold outlet channel (7) between two adjacent longitudinal channel partition structures (121) are separated by a transverse channel partition structure (122). The reflux tank (13) and the manifold inlet channel (6) are also separated by a transverse channel partition structure (122).

8. A gradient manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The manifold splitter plate (2) is provided with a reinforcing rib structure (9) on the surface that mates with the microchannel base plate (3), and the upper surface of the microchannel base plate (3) mates with the reinforcing rib structure (9).

9. A gradient manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The microchannel base plate (3) is provided with a toothed structure (10), which includes multiple parallel teeth that form a microchannel for fluid passage.

10. A gradient manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The manifold inlet channel (6) and manifold outlet channel (7) are parallel to each other or on the same straight line, and each microchannel is perpendicular to the manifold inlet channel (6) and manifold outlet channel (7).

Images