Elastic buffering mechanism and ultrasonic hot-pressing device

Abstract

The utility model belongs to the technical field of semiconductor die bonding, specifically relates to a elastic buffer mechanism and ultrasonic hot pressing equipment, the elastic buffer mechanism includes frame, first elastic component, second elastic component, connecting shaft, connecting plate, pressure detection element and compensation unit, the inside of frame is equipped with pressure detection element and connecting plate, both sides of pressure detection element are connected connecting shaft respectively, and the other end of two connecting shafts is connected first elastic component and second elastic component respectively, and first elastic component and frame between second elastic component and connecting plate between respectively have buffer space in vertical direction, the lower extreme of frame is equipped with compensation unit, and compensation unit is connected with connecting shaft, the utility model discloses through the buffer, avoids the chip to be destroyed when the welding head is pressed down, to guarantee normal welding effect, also is favorable to the protection of bonding head structure.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor die bonding technology, specifically relating to an elastic buffer mechanism and an ultrasonic hot pressing device. Background Technology

[0002] Thermocompression bonding (TCB) is an advanced packaging technology that uses heat and pressure to achieve robust electrical and mechanical connections between stacked chips or between a chip and a substrate in 3D integration and chip stacking. TCB is crucial for enabling fine-pitch interconnects, especially in the miniaturization of electronic products and high-performance applications such as artificial intelligence, high-speed computing, and mobile devices.

[0003] In existing ultrasonic hot pressing equipment, on the one hand, when the Z-axis drives the bonding head mechanism to move up and down, the load of the ultrasonic components can easily damage the chip when the bonding head presses against it due to the lack of buffering, thus affecting the normal welding effect; on the other hand, the bonding head may collide with other components during its movement, damaging the bonding head's parts.

[0004] Therefore, it is necessary to improve the shortcomings of the existing technology in order to overcome its deficiencies in practical applications. Utility Model Content

[0005] Based on the aforementioned shortcomings and deficiencies in the prior art, one of the objectives of this utility model is to at least solve one or more of the aforementioned problems in the prior art. In other words, one of the objectives of this utility model is to provide an elastic buffer mechanism and ultrasonic hot pressing device that meet one or more of the aforementioned requirements.

[0006] To achieve the above-mentioned objectives, this utility model adopts the following technical solution:

[0007] This utility model provides an elastic buffer mechanism, including a frame, a first elastic component, a second elastic component, a connecting shaft, a connecting plate, a pressure detection element, and a compensation unit. The pressure detection element and the connecting plate are disposed inside the frame. The two sides of the pressure detection element are respectively connected to the connecting shaft, and the other ends of the two connecting shafts are respectively connected to the first elastic component and the second elastic component. There are buffer spaces in the vertical direction between the first elastic component and the frame, and between the second elastic component and the connecting plate. The compensation unit is disposed at the lower end of the frame and is connected to the connecting shaft.

[0008] As a preferred embodiment, the first elastic component and the second elastic component have the same structure, each including a first spring sheet, a second spring sheet, a third spring sheet, and a buffer ring. The connecting shaft passes through the first spring sheet, the second spring sheet, and the third spring sheet in sequence, and a buffer ring is installed between the first spring sheet and the second spring sheet.

[0009] As a preferred embodiment, the frame is provided with a first recess, which is used to provide a buffer space for the first elastic component.

[0010] As a preferred embodiment, the connecting plate is provided with a second recess, which is used to provide a buffer space for the second elastic component.

[0011] As a preferred embodiment, the upper and lower sides of the pressure sensing element are respectively connected to a first connecting shaft and a second connecting shaft, and the first connecting shaft and the second connecting shaft are coaxially arranged.

[0012] As a preferred embodiment, the frame is provided with several guide rods, which pass through the connecting plate respectively, and a gasket is provided between the connecting plate and the frame.

[0013] As a preferred embodiment, the compensation unit includes a voice coil motor and a drive shaft, wherein the voice coil motor is connected to the drive shaft, and the drive shaft is connected to the connecting shaft.

[0014] As a preferred embodiment, a displacement detection element is installed at the lower end of the frame.

[0015] This utility model also provides an ultrasonic hot pressing device, including an ultrasonic head, a heating module, and an elastic buffer mechanism as described in any of the above embodiments. The ultrasonic head is connected to the compensation unit, and the heating module is used to heat the ultrasonic head.

[0016] Compared with the prior art, the advantages of this utility model are:

[0017] This utility model provides an elastic buffer mechanism. When the Z-axis drives the bonding head mechanism to move up and down, the load of the ultrasonic component prevents damage to the chip when the bonding head presses against it, thus ensuring a normal bonding effect. The buffer also prevents the bonding head from colliding with other components during its movement, which helps protect the bonding head structure. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other embodiments can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of the elastic buffer mechanism according to an embodiment of the present invention;

[0020] Figure 2 This is a cross-sectional view of the elastic buffer mechanism according to an embodiment of the present utility model;

[0021] Figure 3 This is a schematic diagram of the elastic buffer mechanism of this utility model embodiment from another perspective;

[0022] In the figure: 1 Frame, 11 First recessed part, 12 Guide rod, 13 Gasket, 2 Elastic component, 21 First spring plate, 22 Second spring plate, 23 Third spring plate, 24 Buffer ring, 3 Connecting shaft, 31 First connecting shaft, 32 Second connecting shaft, 4 Connecting plate, 41 Second recessed part, 5 Pressure detection element, 6 Compensation unit, 61 Voice coil motor, 62 Drive shaft, 7 Displacement detection element. Detailed Implementation

[0023] To more clearly illustrate the embodiments of this application, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0024] In the description of the embodiments of this application, the terms "upper," "lower," "front," "rear," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the application. In addition, the terms "first," "second," etc., are only used for distinction in description and have no special meaning.

[0025] According to some embodiments of this application, such as Figures 1 to 3As shown, an elastic buffer mechanism is provided, including a frame 1, a first elastic component, a second elastic component, a connecting shaft 3, a connecting plate 4, a pressure detection element 5, and a compensation unit 6. The frame 1 is provided with a pressure detection element 5 and a connecting plate 4. The two sides of the pressure detection element 5 are respectively connected to the connecting shaft 3, and the other ends of the two connecting shafts 3 are respectively connected to the first elastic component and the second elastic component. There are buffer spaces in the vertical direction between the first elastic component and the frame 1 and between the second elastic component and the connecting plate 4. The lower end of the frame 1 is provided with a compensation unit 6, which is connected to the connecting shaft 3.

[0026] In some embodiments of this application, the first elastic component and the second elastic component have the same structure, each including a first spring sheet 21, a second spring sheet 22, a third spring sheet 23 and a buffer ring 24. The connecting shaft passes through the first spring sheet 21, the second spring sheet 22 and the third spring sheet 23 in sequence, and the buffer ring 24 is installed between the first spring sheet 21 and the second spring sheet 22.

[0027] In some embodiments of this application, the frame 1 is provided with a first recess 11, which is used to provide a buffer space for the first elastic component so as to provide a buffering effect when the first elastic component deforms.

[0028] In some embodiments of this application, the connecting plate 4 is provided with a second recess 41, which is used to provide a buffer space for the second elastic component so as to provide a buffering effect when the second elastic component deforms.

[0029] In some embodiments of this application, the upper and lower sides of the pressure detection element 5 are respectively connected to a first connecting shaft 31 and a second connecting shaft 32. The first connecting shaft 31 and the second connecting shaft 32 are coaxially arranged. The first connecting shaft 31 is connected to the first elastic component, and the second connecting shaft 32 is connected to the second elastic component.

[0030] In some embodiments of this application, the frame 1 is provided with several guide rods 12, which pass through the connecting plate 4. The number of guide rods is set to four, which are respectively located at the four azimuth angles of the frame to guide the connecting plate 4. A gasket 13 is provided between the connecting plate 4 and the frame 1. When the connecting plate 4 moves downward, the gasket can play a buffering role to avoid a hard impact between the connecting plate 4 and the frame 1.

[0031] In some embodiments of this application, the compensation unit 6 includes a voice coil motor 61 and a drive shaft 62. The voice coil motor 61 is connected to the drive shaft 62, and the drive shaft 62 is connected to the second connecting shaft 32. When an ultrasonic head is connected below the compensation unit, the compensation unit can counteract the gravity of the ultrasonic head and the force of the balance spring assembly, preventing the ultrasonic hot pressing mechanism from shaking or swaying during movement, thus helping to maintain the stability of the overall structure.

[0032] In some embodiments of this application, a displacement detection element 7 is mounted at the lower end of the frame 1. The displacement detection element is used to detect the displacement changes of the ultrasonic bonding head during the wafer pick-up, transfer, and placement processes.

[0033] According to some embodiments of this application, an ultrasonic hot-pressing device is also provided, including an ultrasonic bonding head, a heating module, and the elastic buffer mechanism described above. The ultrasonic bonding head is connected to a compensation unit, and the heating module is used to heat the ultrasonic bonding head, thereby realizing ultrasonic hot-press bonding of the chip. The compensation unit can counteract the gravity of the ultrasonic bonding head, prevent overall vibration, and balance the force of the elastic component.

[0034] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0035] The above description is only a detailed explanation of the preferred embodiments and principles of this application. For those skilled in the art, there may be changes in the specific implementation methods based on the ideas provided in this application, and these changes should also be considered within the scope of protection of this application.

Claims

1. A resilient buffer mechanism, characterized in that, The device includes a frame, a first elastic component, a second elastic component, a connecting shaft, a connecting plate, a pressure detection element, and a compensation unit. The pressure detection element and the connecting plate are located inside the frame. The connecting shaft is connected to both sides of the pressure detection element. The other ends of the two connecting shafts are connected to the first elastic component and the second elastic component, respectively. There are buffer spaces in the vertical direction between the first elastic component and the frame, and between the second elastic component and the connecting plate. The compensation unit is located at the lower end of the frame and is connected to the connecting shaft.

2. The elastic buffer mechanism according to claim 1, characterized in that, The first elastic component and the second elastic component have the same structure, each including a first spring sheet, a second spring sheet, a third spring sheet, and a buffer ring. The connecting shaft passes through the first spring sheet, the second spring sheet, and the third spring sheet in sequence, and a buffer ring is installed between the first spring sheet and the second spring sheet.

3. The elastic buffer mechanism according to claim 2, characterized in that, The frame has a first recess, which provides a buffer space for the first elastic component.

4. The elastic buffer mechanism according to claim 2, characterized in that, The connecting plate is provided with a second recess, which is used to provide a buffer space for the second elastic component.

5. The elastic buffer mechanism according to claim 1, characterized in that, The pressure sensing element is connected to a first connecting shaft and a second connecting shaft on its upper and lower sides, respectively, and the first connecting shaft and the second connecting shaft are coaxially arranged.

6. The elastic buffer mechanism according to claim 1, characterized in that, The frame is provided with several guide rods inside, and the guide rods pass through the connecting plate respectively. A gasket is provided between the connecting plate and the frame.

7. The elastic buffer mechanism according to claim 1, characterized in that, The compensation unit includes a voice coil motor and a drive shaft, the voice coil motor being connected to the drive shaft, and the drive shaft being connected to the connecting shaft.

8. The elastic buffer mechanism according to claim 1, characterized in that, Displacement detection elements are installed at the lower end of the frame.

9. An ultrasonic hot pressing device, characterized in that, It includes an ultrasonic probe, a heating module, and an elastic buffer mechanism as described in any one of claims 1 to 8, wherein the ultrasonic probe is connected to the compensation unit, and the heating module is used to heat the ultrasonic probe.

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