An integrated endoscope camera module assembly packaging welding
Patent Information
- Application Number
- CN202521932194.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-09
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-09-09
AI Technical Summary
否则,将会致使LED安装高度不平,例如出现一高一低的状况
[0015]1、采用设置有U形槽的PCB板来代替传统的电线与LED灯进行连接,LED灯通过贴片方式固定在PCB板的U型两端,取代传统逐根线缆焊接方式,将原本需要多次手工焊接的操作,优化为一次性空间贴片焊接,大幅提升焊接效率,而且贴片方式避免了人工焊接中常见的焊点错位、焊线断裂等问题,提高产品良率。
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Figure CN224910129U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of endoscope camera module technology, and in particular to the packaging and welding of an integrated endoscope camera module assembly. Background Technology
[0002] Currently, in the manufacturing process of ultra-fine endoscopes, the LED light and chip are mainly soldered manually using ultra-fine wires. This soldering process is extremely complex because the LED light of the endoscope is very small, and two to four wires need to be soldered to the LED light during the soldering process. This greatly increases the difficulty of operation and makes it very easy for failure to occur due to solder joint deviation.
[0003] During the soldering process, the coaxial cable and LED light wires require two separate wire stripping processes, and the wire lengths must be strictly consistent. Otherwise, the LED installation height will be uneven, resulting in one being higher than the other. Furthermore, the LED mounting position needs to be manually aligned with the chip's horizontal plane; however, consistent precision is difficult to achieve, easily leading to scrap due to misalignment or solder joints exceeding the LED's dimensions. Additionally, given the relatively low mechanical strength of soldered cables, connections are easily damaged by pulling or vibration.
[0004] Because the LED lights for endoscopes are soldered individually by hand, mass production is impossible, resulting in extremely low production efficiency and consequently, high prices for endoscopes. This manual soldering method not only consumes a lot of manpower and time but also produces inconsistent quality, making it difficult to meet the high-efficiency and precision requirements of large-scale production. Utility Model Content
[0005] The utility model overcomes the shortcomings of the prior art and provides a packaging and welding method for an integrated endoscope camera module component. It uses a PCB board with a U-shaped groove to replace the traditional cable connection for LED lights. The LEDs are fixed to both ends of the PCB through a surface mount process, realizing one-time spatial welding, improving efficiency and avoiding problems such as solder joint misalignment and wire breakage, and significantly improving production yield and product reliability.
[0006] To solve the above-mentioned technical problems, the utility model is implemented through the following technical solution:
[0007] A packaging and welding method for an integrated endoscope camera module assembly includes an endoscope lens assembly, which includes a PCB board with a U-shaped groove in which a camera chip assembly is embedded, and LED lights are connected to the two ends of the U-shape of the PCB board.
[0008] Furthermore, the PCB board and LED lights are fixedly connected by surface mount technology.
[0009] Furthermore, the camera chipset is soldered to the PCB board using a double-sided synchronous soldering method.
[0010] Furthermore, the endoscope lens assembly is fitted into the endoscope housing.
[0011] Furthermore, the endoscope housing is cylindrical in shape, with rounded corners at both ends.
[0012] Furthermore, the depth of the U-shaped groove is adapted to the height of the camera chipset to ensure that the camera chipset is stably fitted in the U-shaped groove.
[0013] Furthermore, a sealing structure is provided between the endoscope lens assembly and the endoscope housing.
[0014] Compared with existing technologies, the advantages of this utility model are:
[0015] 1. A PCB board with U-shaped grooves is used to replace the traditional wires for connecting to LED lights. The LED lights are fixed to both ends of the U-shape of the PCB board by surface mounting, replacing the traditional method of soldering each wire one by one. The operation that originally required multiple manual solderings is optimized into one-time spatial surface mounting, which greatly improves the soldering efficiency. Moreover, the surface mounting method avoids the problems of misaligned solder joints and broken solder wires that are common in manual soldering, thus improving the product yield.
[0016] 2. The PCB board has a U-shaped groove, which is specially designed for embedding the camera chipset to achieve precise structural positioning. The camera chipset and the PCB board adopt a double-sided synchronous welding method. Compared with single-sided welding, double-sided welding effectively enhances the contact area and bonding strength of the welding surface, and improves the overall durability and reliability of the component.
[0017] 3. The surface mount technology (SMT) process, combined with standardized PCB design, facilitates the introduction of automated equipment for mass production, significantly improving manufacturing efficiency. Traditional soldering requires high levels of manual skill, while SMT reduces reliance on operator skills and lowers training costs.
[0018] 4. When producing PCB boards, mass production can be carried out as shown in the figure, thereby improving production efficiency. Moreover, since the structural dimensions of PCB boards are easy to standardize, it is more conducive to the standardized positioning of subsequent LED lights and improves the installation accuracy of LEDs. Attached Figure Description
[0019] The accompanying drawings are provided to further illustrate the utility model and, together with the embodiments of the utility model, are used to explain the utility model. They do not constitute a limitation on the utility model. In the drawings:
[0020] Figure 1 This is a schematic diagram of the overall structure of the endoscope according to an embodiment of the present invention;
[0021] Figure 2 This is a schematic diagram of the first structure of the endoscope lens assembly according to an embodiment of the present invention;
[0022] Figure 3 This is a schematic diagram of the second structure of the endoscope lens assembly according to an embodiment of the present invention;
[0023] Figure 4 This is a schematic diagram of the third structure of the endoscope lens assembly according to an embodiment of the present invention;
[0024] Figure 5 This is a diagram showing the arrangement of the PCB board during production according to an embodiment of this utility model.
[0025] In the diagram: 1. Endoscopic lens assembly; 101. Camera chipset; 102. LED light; 103. PCB board; 104. Module line; 2. Endoscopic housing. Detailed Implementation
[0026] The preferred embodiments of the utility model are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the utility model.
[0027] like Figures 1 to 5 As shown, an integrated endoscope camera module assembly is packaged and welded to address issues such as low LED welding efficiency, inaccurate positioning, and poor welding reliability in traditional ultra-fine endoscopes. Through structural optimization and process improvement, the camera chip and LED are integrated into a single package, improving production efficiency and product yield. The assembly includes an endoscope lens assembly 1, which includes a PCB board 103 with a U-shaped groove. A camera chip assembly 101 is embedded in the U-shaped groove, with the depth of the groove matching the height of the chip assembly 101 to ensure stable embedding and prevent displacement or loosening.
[0028] The two ends of the U-shaped PCB board 103 are connected to the LED light 102. The PCB board 103 and the LED light 102 are fixedly connected by surface mount technology. Compared with the traditional method of soldering each wire individually, this method changes the single-wire soldering method to a spatial surface mount method, which can solder all the points at once. It is also more convenient to operate and will not easily cause faults such as misaligned solder points or broken solder wires, which can greatly improve the yield rate.
[0029] The camera chipset 101 and the PCB board 103 are connected by double-sided synchronous welding, which improves the welding strength and reliability.
[0030] The endoscope lens assembly 1 is fitted into the endoscope housing 2, which is cylindrical in shape with rounded corners at both ends to facilitate insertion into human cavities or industrial pipelines and other application scenarios.
[0031] A sealing structure is provided between the endoscope lens assembly 1 and the endoscope housing 2 to ensure that the assembly has good waterproof and dustproof performance during use and to extend its service life.
[0032] This utility model uses a PCB board 103 with a U-shaped groove to replace the traditional wires and connect to the LED light 102. The LED light 102 is fixed to both ends of the U-shape of the PCB board 103 by a patch method, replacing the traditional method of soldering each cable one by one. This optimizes the operation that originally required multiple manual soldering operations into a one-time spatial patch soldering, which greatly improves the soldering efficiency. Moreover, the patch method avoids the problems of misaligned solder joints and broken solder wires that are common in manual soldering, thus improving the product yield.
[0033] The PCB board 103 is equipped with a U-shaped groove, which is designed specifically for embedding the camera chip group 101 to achieve precise structural positioning. The camera chip group 101 and the PCB board 103 adopt a double-sided synchronous welding method. Compared with single-sided welding, double-sided welding effectively enhances the contact area and bonding strength of the welding surface, and improves the durability and reliability of the overall component.
[0034] Surface mount technology (SMT) combined with standardized PCB design facilitates the introduction of automated equipment for mass production, significantly improving manufacturing efficiency. Traditional soldering requires high levels of manual skill, while SMT reduces reliance on operator skills and lowers training costs.
[0035] In addition, during the production of PCB board 103, it is also possible to achieve the same results. Figure 5 As shown, mass production can be carried out to improve production efficiency. Moreover, since the structural dimensions of PCB board 103 are easy to standardize, it is more conducive to the standardized positioning of subsequent LED lights and improves the installation accuracy of LEDs.
[0036] Finally, it should be noted that the above are merely preferred embodiments of the utility model and are not intended to limit the utility model. Although the utility model has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the utility model should be included within the protection scope of the utility model.
Claims
1. A packaging and welding method for an integrated endoscope camera module assembly, characterized in that, The endoscopic lens assembly (1) includes a PCB board (103), the PCB board (103) is provided with a U-shaped groove, the camera chip group (101) is embedded in the U-shaped groove, and the two ends of the U-shape of the PCB board (103) are connected to LED lights (102). The depth of the U-shaped groove is adapted to the height of the camera chip group (101) to ensure that the camera chip group (101) is stably fitted in the U-shaped groove; The camera chip group (101) and the PCB board (103) are connected by double-sided synchronous welding. The endoscope lens assembly (1) is fitted into the endoscope housing (2), and a sealing structure is provided between the endoscope lens assembly (1) and the endoscope housing (2).
2. The packaging and welding of the integrated endoscope camera module assembly according to claim 1, characterized in that, The PCB board (103) and the LED light (102) are fixedly connected by a surface mount method.
3. The packaging and welding of the integrated endoscope camera module assembly according to claim 2, characterized in that, The endoscope housing (2) is cylindrical in shape, with rounded corners at both ends.