Fan-out package structure of heterogeneous chip

Abstract

The utility model discloses a kind of fan-out package structures of heterogeneous chip, it is related to chip packaging technical field, including package shell, package shell upper end is fixedly installed with package cover body, package shell both sides are equipped with installation port, pin assembly is installed in the installation port, the pin assembly includes the rubber mounting sleeve fixedly installed in installation port, pin body is connected in the rubber mounting sleeve, the pin body both sides are equipped with wedge-shaped tenon, chip assembly is installed in the package shell, the tenon groove is equipped on the inner wall of the rubber mounting sleeve, the wedge-shaped tenon is limited in rubber mounting sleeve by tenon groove, and rubber mounting sleeve is filled with sealant, and the rubber mounting sleeve is installed in package shell both sides by installation port;The fan-out package structure of the heterogeneous chip, by the cooperation of pin assembly and chip assembly, the situation that pin can be fallen off can be reduced, and the service life of equipment is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically a fan-out packaging structure for heterogeneous chips. Background Technology

[0002] Chip packaging is a key back-end process in integrated circuit manufacturing. It refers to the process of placing, fixing, sealing, and protecting the individual bare dies cut from the wafer through packaging technology, and forming an interface for connection with external circuits.

[0003] The packaged chip is soldered to the circuit board via pins on both sides of the package housing, with the pins permanently connected to the package housing. Some circuit boards need to be used in vibrating environments, where vibration causes a certain degree of deformation, which in turn subjects the chip pins to torque. Since the pins are permanently connected to the package housing, they can easily detach from the circuit board when it deforms.

[0004] For example, patent (CN222953093U) discloses a chip packaging structure including a chip, a redistribution layer, and at least one component. The chip has opposing front and back sides. The front side of the chip has multiple pads, including functional pads. The front side of the chip has an empty area where no pads are arranged.

[0005] In the above packaging structure, the pins are directly fixed to the packaging shell, lacking sufficient flexibility and buffering capacity. When the circuit board deforms due to mechanical stress or other reasons, the connection between the pins and the circuit board is easily subjected to excessive stress, which may cause the pins to fall off the circuit board or make poor contact, thereby affecting the normal use and reliability of electronic devices. Summary of the Invention

[0006] The purpose of this invention is to provide a fan-out packaging structure for heterogeneous chips to solve the problems in the prior art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a fan-out packaging structure for heterogeneous chips, comprising a packaging shell, a packaging cover fixedly mounted on the upper end of the packaging shell, mounting openings on both sides of the packaging shell, a pin assembly mounted in the mounting opening, the pin assembly comprising a rubber mounting sleeve fixedly mounted in the mounting opening, a pin body connected inside the rubber mounting sleeve, wedge-shaped latches on both sides of the pin body, and a chip assembly mounted inside the packaging shell.

[0008] Preferably, the inner wall of the rubber mounting sleeve is provided with a tenon groove, the wedge-shaped tenon is restricted in the rubber mounting sleeve by the tenon groove, and the rubber mounting sleeve is filled with sealant.

[0009] Preferably, the rubber mounting sleeve is installed on both sides of the encapsulation housing through the mounting port, and the mounting port is filled with sealant.

[0010] Preferably, the pin body is confined within a rubber mounting sleeve by a wedge-shaped latch, and the pin body is mounted on both sides of the package housing by the rubber mounting sleeve.

[0011] Preferably, the chip assembly includes a mounting base fixedly installed inside the package housing, a chip body fixedly installed on the mounting base, partitions fixedly installed at both sides of the mounting base, wire holes opened on the partitions, and leads installed between the chip body and the pin body.

[0012] Preferably, the mounting base has a mounting slot, and the chip body is mounted on the mounting base through the mounting slot.

[0013] Preferably, one end of the lead is fixedly mounted on the chip body, and the other end of the lead is fixedly mounted on the pin body.

[0014] Preferably, the lead wire passes through the partition via a wire hole.

[0015] Compared with the prior art, the beneficial effects of this utility model are: 1. In this application, a rubber mounting sleeve is fitted onto both sides of the package housing via an mounting port. Then, the pin body is mounted inside the rubber mounting sleeve using a locking groove and a wedge-shaped locking tenon. The chip can be soldered onto the circuit board using the pin body. Circuit board deformation can generate torque on the pin body, which can easily cause the pin to detach from the circuit board. The rubber mounting sleeve can counteract this torque through deformation, reducing the risk of pin detachment.

[0016] 2. In this application, the lead wires pass through the wire hole partition, and both ends are connected to the pin body and the chip body respectively. After the connection is completed, thermally conductive silicone is filled into the package housing, and finally the package cover is closed to complete the chip packaging. The partition inside the package housing separates the chip body and the pin body, preventing silicone from flowing to the pin body, preventing it from being fixed, and ensuring that the torsion function is not affected. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a partial structural schematic diagram of the present invention; Figure 3 This is a schematic diagram of the pin assembly of this utility model; Figure 4 This is a schematic diagram of the chip assembly of this utility model.

[0018] The markings in the diagram are: 1. Encapsulation housing; 2. Mounting port; 3. Encapsulation cover; 4. Pin assembly; 401. Pin body; 402. Rubber mounting sleeve; 403. Locking groove; 404. Wedge locking; 5. Chip assembly; 501. Mounting base; 502. Chip body; 503. Wire hole; 504. Separator; 505. Lead wire. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] like Figure 1 and Figure 2 As shown, this utility model provides a technical solution for a fan-out package structure of heterogeneous chips, including a package housing 1, a package cover 3 fixedly installed on the upper end of the package housing 1, mounting ports 2 on both sides of the package housing 1, pin assemblies 4 installed in the mounting ports 2, and chip assemblies 5 installed inside the package housing 1. The cooperation between the pin assemblies 4 and the chip assemblies 5 can reduce the occurrence of pin detachment and extend the service life of the device.

[0021] Example 1: As Figure 2 and Figure 3 As shown, the pin assembly 4 includes a rubber mounting sleeve 402 fixedly installed in the mounting port 2. The pin body 401 is connected inside the rubber mounting sleeve 402. The pin body 401 has wedge-shaped tenons 404 on both sides. The inner wall of the rubber mounting sleeve 402 has a tenon groove 403. The wedge-shaped tenons 404 are restricted in the rubber mounting sleeve 402 by the tenon groove 403. The rubber mounting sleeve 402 is filled with sealant. The rubber mounting sleeve 402 is installed on both sides of the encapsulation housing 1 through the mounting port 2. The mounting port 2 is filled with sealant.

[0022] Specifically, the rubber mounting sleeves 402 can be installed on both sides of the package housing 1 via the mounting port 2. After the rubber mounting sleeves 402 are installed on both sides of the package housing 1, the pin bodies 401 can be installed inside the rubber mounting sleeves 402 on both sides of the package housing 1 by means of the cooperation of the locking grooves 403 and the wedge-shaped locking tenons 404. The pin bodies 401 enable the chip to be soldered to the circuit board. When the circuit board deforms, it will apply torque to the pin bodies 401. Under the action of torque, the pin bodies 401 are prone to detach from the circuit board. However, the rubber mounting sleeves 402 will offset the effect of torque through their own deformation, thereby reducing the probability of pin detachment.

[0023] Example 2: Figure 2 and Figure 4 As shown, the chip assembly 5 includes a mounting base 501 fixedly installed inside the package housing 1. A chip body 502 is fixedly installed on the mounting base 501. Partitions 504 are fixedly installed on both sides of the mounting base 501. Wire holes 503 are opened on the partitions 504. A lead wire 505 is installed between the chip body 502 and the pin body 401. A mounting groove is opened on the mounting base 501. The chip body 502 is installed on the mounting base 501 through the mounting groove. One end of the lead wire 505 is fixedly installed on the chip body 502, and the other end of the lead wire 505 is fixedly installed on the pin body 401. The lead wire 505 passes through the partitions 504 through the wire holes 503.

[0024] Specifically, the lead 505 can pass through the partition 504 via the wire hole 503, allowing both ends of the lead 505 to be connected to the pin body 401 and the chip body 502 respectively. After the pin body 401 and the chip body 502 are connected, thermally conductive silicone can be filled into the package housing 1, and finally the package cover 3 is placed on top, thus quickly completing the chip packaging process. Furthermore, the partition 504 inside the package housing 1 separates the chip body 502 from the pin body 401, preventing the silicone filling the package housing 1 from flowing to the pin body 401, preventing the pin body 401 from being fixed by the silicone, and ensuring that the torsional function of the pin body 401 is not affected.

[0025] Working principle: Rubber mounting sleeves 402 can be installed on both sides of the package housing 1 through mounting port 2. After the rubber mounting sleeves 402 are installed on both sides of the package housing 1, the pin body 401 can be installed in the rubber mounting sleeves 402 on both sides of the package housing 1 through the cooperation of the locking groove 403 and the wedge-shaped locking tenon 404. The chip can be soldered onto the circuit board through the pin body 401. When the circuit board deforms, it will generate torque on the pin body 401. After being subjected to torque, the pin body 401 is prone to falling off the circuit board. The rubber mounting sleeves 402 will offset the effect of torque through deformation, reducing the occurrence of pin falling off. The lead wire 505 can pass through the wire hole 503 and the partition 504, so that the two ends of the lead wire 505 can be connected to the pin body 401 and the chip body 502 respectively. After the pin body 401 and the chip body 502 are connected, thermally conductive silicone can be filled into the package housing 1. Finally, the package cover 3 is closed, and the chip packaging work can be quickly installed. The partition 504 in the package housing 1 can separate the chip body 502 from the pin body 401, prevent the silicone filling the package housing 1 from flowing to the pin body 401, prevent the pin body 401 from being fixed by the silicone, and ensure that the torsional function of the pin body 401 is not affected.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A fan-out package structure for a heterogeneous chip, comprising a package housing (1), wherein a package cover (3) is fixedly mounted on the upper end of the package housing (1), and mounting openings (2) are provided on both sides of the package housing (1), characterized in that: A pin assembly (4) is installed in the mounting port (2). The pin assembly (4) includes a rubber mounting sleeve (402) fixedly installed in the mounting port (2). A pin body (401) is connected inside the rubber mounting sleeve (402). Wedge-shaped latches (404) are provided on both sides of the pin body (401). A chip assembly (5) is installed inside the packaging shell (1).

2. The heterogeneous chip fan-out packaging structure according to claim 1, characterized in that: The inner wall of the rubber mounting sleeve (402) is provided with a tenon groove (403), the wedge-shaped tenon (404) is restricted in the rubber mounting sleeve (402) by the tenon groove (403), and the rubber mounting sleeve (402) is filled with sealant.

3. The fan-out packaging structure for heterogeneous chips according to claim 2, characterized in that: The rubber mounting sleeve (402) is installed on both sides of the encapsulation housing (1) through the mounting port (2), and the mounting port (2) is filled with sealant.

4. The fan-out packaging structure for heterogeneous chips according to claim 3, characterized in that: The pin body (401) is restricted within the rubber mounting sleeve (402) by a wedge-shaped latch (404), and the pin body (401) is mounted on both sides of the package housing (1) by the rubber mounting sleeve (402).

5. The fan-out packaging structure for heterogeneous chips according to claim 4, characterized in that: The chip assembly (5) includes a mounting base (501) fixedly installed in the package housing (1), a chip body (502) fixedly installed on the mounting base (501), partitions (504) fixedly installed on both sides of the mounting base (501), wire holes (503) are opened on the partitions (504), and leads (505) are installed between the chip body (502) and the pin body (401).

6. The fan-out packaging structure for heterogeneous chips according to claim 5, characterized in that: The mounting base (501) has a mounting slot, and the chip body (502) is mounted on the mounting base (501) through the mounting slot.

7. The fan-out packaging structure for heterogeneous chips according to claim 6, characterized in that: One end of the lead (505) is fixedly mounted on the chip body (502), and the other end of the lead (505) is fixedly mounted on the pin body (401).

8. The fan-out packaging structure for heterogeneous chips according to claim 7, characterized in that: The lead wire (505) passes through the partition (504) through the wire hole (503).

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