A semiconductor package structure

Abstract

The utility model discloses a kind of semiconductor packaging structures, including upper cover plate, component to be encapsulated and bottom shell, bottom shell is provided with cavity, upper cover plate, component to be encapsulated and bottom shell are respectively provided with multiple one-to-one corresponding first installation hole, second installation hole and third installation hole, the first installation hole, the second installation hole and third installation hole are connected fixed by the first installation component passing through it, form detachable structure, by the above mode, the utility model can be in equipment maintenance debugging, only need to dismount device installation fixed structure to replace or check printed board, silicon wafer etc. Device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductors, and in particular to a semiconductor packaging technology. Background Technology

[0002] Semiconductor structures play a crucial role in modern electronic devices, but as the power density of electronic devices continues to increase, semiconductor packaging technology has also revealed some significant shortcomings. The following are the main drawbacks of semiconductor packaging technology: In existing semiconductor packaging technologies, a single-piece packaging structure is used, which is not conducive to the replacement and maintenance of semiconductor devices. At the same time, the cable routing in the packaging structure is messy, and the accumulation of cables also hinders heat dissipation. Due to the small product size, the coefficient of performance (COP) is generally small, the energy conversion efficiency is low, and the heat generation is high, which means that the heat dissipation structure cannot carry away all the heat. The structure does not dissipate heat sufficiently, and the stress generated by heat can affect the failure of semiconductor function. In addition, the product precision requirements are also relatively high. Utility Model Content

[0003] The main technical problem solved by this utility model is to provide a semiconductor packaging structure in which, during equipment maintenance and debugging, only the device mounting and fixing structure needs to be disassembled to replace or inspect printed circuit boards, silicon wafers and other devices, without disassembling the equipment mounting and fixing structure, thus avoiding interference with the overall installation stability. At the same time, it reduces maintenance operation steps and process risks, improves structural accuracy and stability and component reliability, and extends equipment life; and it can be adapted to complex manufacturing environments such as high temperature, high humidity and high cleanliness.

[0004] To solve the above-mentioned technical problems, the present invention adopts a technical solution as follows: providing a top cover plate, a component to be packaged, and a bottom shell, wherein the bottom shell is provided with a cavity, and the top cover plate, the component to be packaged, and the bottom shell are respectively provided with a plurality of one-to-one corresponding first mounting holes, second mounting holes, and third mounting holes, wherein the first mounting holes, the second mounting holes, and the third mounting holes are connected and fixed to the top cover plate, the component to be packaged, and the bottom shell through a first mounting component passing through them, forming a detachable structure.

[0005] Furthermore, a semi-enclosed boss is provided on the bottom shell, and a mounting part is provided on each of the four corners of the boss, and a third mounting hole is provided on each mounting part.

[0006] The component to be packaged includes a printed circuit board, a chip assembly, and a stainless steel cover plate. Each of the four corners of the printed circuit board is provided with a second mounting hole. The upper surface of the stainless steel cover plate is provided with a groove for placing a mirror, and a first window is provided inside the groove. The chip assembly is provided on the lower surface of the stainless steel cover plate. At least part of the chip assembly is exposed through the first window. The chip assembly is connected to the printed circuit board by gold wire bonding. The stainless steel cover plate is mounted on the printed circuit board.

[0007] The chip assembly includes a PCB board and a silicon wafer, the silicon wafer being soldered onto the PCB board, the PCB board being bonded to the stainless steel cover plate with epoxy adhesive, and the first window being used to expose the silicon wafer.

[0008] The stainless steel cover plate and the printed circuit board are respectively provided with a fourth mounting hole and a fifth mounting hole. The fourth mounting hole and the fifth mounting hole are connected and fixed to the stainless steel cover plate and the printed circuit board through a second mounting component passing through them, forming a detachable structure.

[0009] The printed circuit board is provided with through holes, the shape of which is adapted to the shape of the chip assembly, and the chip assembly is disposed in the through holes.

[0010] The upper cover plate is provided with a second window, the shape of which is adapted to the shape of the stainless steel cover plate, and the second window is used to expose the silicon wafer.

[0011] The lower surface of the printed circuit board is also provided with a reinforcing component. The reinforcing component adopts a square frame structure and is provided with a sixth mounting hole. The sixth mounting hole, the fourth mounting hole, and the fifth mounting hole correspond one-to-one. The fourth mounting hole, the fifth mounting hole, and the sixth mounting hole are connected and fixed to the stainless steel cover plate, the printed circuit board, and the reinforcing component through a second mounting component passing through them, forming a detachable structure. The reinforcing component is made of metal material.

[0012] The first mounting component and the second mounting component have the same structure, both being bolts. The first, second, third, fourth, fifth, and sixth mounting holes are threaded holes adapted to the first mounting component and the second mounting component.

[0013] The bottom shell cavity is provided with multiple cable tie frames for organizing the printed circuit board cables. A thermal pad is also provided on the lower surface of the bottom shell. The upper cover and the bottom shell are made of high thermal conductivity material.

[0014] The beneficial effects of this utility model are as follows: By designing the device mounting and fixing structure separately from the equipment mounting and fixing structure, the printed circuit board, silicon wafer and other devices can be replaced or inspected by simply disassembling the device mounting and fixing structure during equipment maintenance and debugging, without having to disassemble the equipment mounting and fixing structure. This avoids interference with the overall installation stability, reduces maintenance operation steps and process risks, improves structural accuracy and stability and component reliability, and extends equipment life. By placing a reinforcing component under the printed circuit board, the rigidity of the printed circuit board is increased, preventing it from bending and deforming under insertion, vibration, or thermal expansion. At the same time, since the reinforcing component is made of metal, it can help conduct heat from the printed circuit board and improve heat dissipation. Multiple cable tie brackets are installed inside the bottom shell to organize the cables leading out of the printed circuit board, restricting the cable routing and preventing the cable weight from directly affecting the connector. This also reduces right-angle bends and messy accumulation of cables. A thermal pad is installed on the lower surface of the bottom shell, which fits into the external mounting mechanism to provide fixation, support, protection for internal components, and auxiliary heat dissipation. Attached Figure Description

[0015] Figure 1 This is an exploded view of the overall structure of this semiconductor package; Figure 2 This is a schematic diagram of the overall assembly structure of this semiconductor packaging structure; Figure 3 This is a top view of the semiconductor package structure; Figure 4 This is a cross-sectional view along line A of the semiconductor package structure; Figure 5 This is a cross-sectional view along line B of the semiconductor package structure; Figure 6 This is a schematic diagram of the chip component structure; Reference numerals: 1-Top cover; 2-Stainless steel cover; 3-Chip assembly; 4-Printed circuit board; 5-Heat dissipation structure; 6-Bottom shell; 7-Wire tie; 31-PCB board; 32-Silicon wafer. Detailed Implementation

[0016] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0017] like Figure 1As shown, this utility model embodiment includes: a semiconductor packaging structure, including an upper cover plate 1, a component to be packaged, and a bottom shell 6. The bottom shell 6 is provided with a cavity, the upper cover plate 1 is provided with a first mounting hole, the component to be packaged is provided with a second mounting hole, and the bottom shell 6 is provided with a third mounting hole. The first mounting hole, the second mounting hole, and the third mounting hole correspond one-to-one, and a first mounting component passes through the first mounting hole, the second mounting hole, and the third mounting hole, thereby connecting and fixing the upper cover plate 1, the component to be packaged, and the bottom shell 6 to form a detachable structure. The detachable method allows for the replacement or inspection of internal components by only disassembling the device mounting structure, without disassembling the device mounting structure, avoiding interference with the overall installation stability, reducing maintenance operation steps and process risks, improving structural accuracy and stability and component reliability, and extending equipment life.

[0018] Furthermore, a semi-enclosed boss is provided on the bottom shell 6, and a mounting part is provided on each of the four corners of the boss, and a third mounting hole is provided on each mounting part.

[0019] The components to be packaged in this packaging structure include a printed circuit board 4, a chip assembly 3, and a stainless steel cover plate 2. The printed circuit board 4 has second mounting holes at each of its four corners. A groove is provided in the middle of the upper surface of the stainless steel cover plate 2 for placing a mirror. A first window is provided inside the groove, which exposes at least part of the chip assembly 3. The chip assembly 3 is disposed on the lower surface of the stainless steel cover plate 2. The chip assembly 3 is connected to the printed circuit board 4 by gold wire bonding. The stainless steel cover plate 2 is mounted on the printed circuit board 4. The connection between the stainless steel cover plate 2 and the printed circuit board 4 can also be detachable.

[0020] The chip assembly 3 consists of a PCB board 31 and a silicon wafer 32. The silicon wafer 32 is soldered onto the PCB board 31. The PCB board 31 is bonded to the stainless steel cover plate 2 with epoxy adhesive. The first window is used to expose the silicon wafer 32.

[0021] like Figure 5 As shown, the stainless steel cover plate 2 is also provided with a fourth mounting hole, and the printed circuit board 4 is also provided with a fifth mounting hole. The fourth mounting hole and the fifth mounting hole are also one-to-one corresponding, and a second mounting component passes through the fourth mounting hole and the fifth mounting hole, thereby connecting and fixing the stainless steel cover plate 2 and the printed circuit board 4 to form a detachable structure.

[0022] To further reduce the size of the packaging component, a through hole is provided on the printed circuit board 4. The shape of the through hole is adapted to the shape of the chip component 3, so that the chip component 3 is placed in the through hole to reduce the size.

[0023] Similarly, the upper cover plate 1 is provided with a second window, the shape of which is adapted to the shape of the stainless steel cover plate 2. The stainless steel cover plate 2 is disposed inside the second window, which is used to expose the silicon wafer 32.

[0024] To further increase the rigidity of the printed circuit board 4 and prevent it from bending and deforming under the action of insertion, vibration, or thermal expansion, a reinforcing member 5 is also provided on the lower surface of the printed circuit board 4. In this embodiment, the reinforcing member 5 adopts a square frame structure and is provided with a sixth mounting hole. The sixth mounting hole corresponds one-to-one with the fourth and fifth mounting holes mentioned above. The second mounting member passes through the fourth mounting hole, the fifth mounting hole, and the sixth mounting hole at the same time, thereby connecting and fixing the upper cover plate 1, the component to be packaged, and the bottom shell 6 to form a detachable structure. The reinforcing member 5 is made of metal material, which can help conduct the heat of the printed circuit board and improve the heat dissipation effect.

[0025] In this embodiment, the first mounting component and the second mounting component have the same structure, both being bolts. The first, second, third, fourth, fifth, and sixth mounting holes are all threaded holes adapted to the first mounting component and the second mounting component.

[0026] To further improve the heat dissipation performance of the packaging structure and the stability of the internal components, multiple cable tie frames 7 are provided in the cavity of the bottom shell 6 to organize the cables of the printed circuit board 4. A thermal pad is also provided on the lower surface of the bottom shell 6. The upper cover plate 1 and the bottom shell 6 are made of high thermal conductivity materials, thereby playing the role of fixing and supporting, protecting internal components and assisting in heat dissipation.

[0027] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A semiconductor packaging structure, characterized in that, The device includes an upper cover plate (1), a component to be packaged, and a bottom shell (6). The bottom shell (6) is provided with a cavity. The upper cover plate (1), the component to be packaged, and the bottom shell (6) are respectively provided with a plurality of one-to-one corresponding first mounting holes, second mounting holes, and third mounting holes. The first mounting holes, the second mounting holes, and the third mounting holes are connected and fixed to the upper cover plate (1), the component to be packaged, and the bottom shell (6) through a first mounting component passing through them, forming a detachable structure.

2. The semiconductor packaging structure according to claim 1, characterized in that, The bottom shell (6) is provided with a semi-enclosed boss, and each of the four corners of the boss is provided with a mounting part, and each mounting part is provided with a third mounting hole.

3. A semiconductor packaging structure according to claim 2, characterized in that, The component to be packaged includes a printed circuit board (4), a chip assembly (3), and a stainless steel cover plate (2). The printed circuit board (4) has a second mounting hole at each of its four corners. The upper surface of the stainless steel cover plate (2) has a groove for placing a mirror in the middle. The groove has a first window inside. The lower surface of the stainless steel cover plate (2) has the chip assembly (3). The first window exposes at least part of the chip assembly (3). The chip assembly (3) is connected to the printed circuit board (4) by gold wire bonding. The stainless steel cover plate (2) is mounted on the printed circuit board (4).

4. A semiconductor packaging structure according to claim 3, characterized in that, The chip assembly (3) includes a PCB board (31) and a silicon wafer (32), the silicon wafer (32) being soldered onto the PCB board (31), the PCB board (31) being bonded to the stainless steel cover plate (2) with epoxy adhesive, and the first window being used to expose the silicon wafer (32).

5. A semiconductor packaging structure according to claim 4, characterized in that, The stainless steel cover plate (2) and the printed circuit board (4) are respectively provided with a fourth mounting hole and a fifth mounting hole. The fourth mounting hole and the fifth mounting hole are connected and fixed to the stainless steel cover plate (2) and the printed circuit board (4) through a second mounting component passing through them, forming a detachable structure.

6. A semiconductor packaging structure according to claim 5, characterized in that, The printed circuit board (4) is provided with a through hole, the shape of which is adapted to the shape of the chip assembly (3), and the chip assembly (3) is disposed in the through hole.

7. A semiconductor packaging structure according to claim 6, characterized in that, The upper cover plate (1) is provided with a second window, the shape of which is adapted to the shape of the stainless steel cover plate (2), and the second window is used to expose the silicon wafer (32).

8. A semiconductor packaging structure according to claim 7, characterized in that, The lower surface of the printed circuit board (4) is also provided with a reinforcing component (5). The reinforcing component (5) adopts a square frame structure. The reinforcing component (5) is provided with a sixth mounting hole. The fourth mounting hole, the fifth mounting hole and the sixth mounting hole correspond one to one. The fourth mounting hole, the fifth mounting hole and the sixth mounting hole are connected and fixed by a second mounting component passing through them to form a detachable structure. The reinforcing component (5) is made of metal material.

9. A semiconductor packaging structure according to claim 8, characterized in that, The first mounting component and the second mounting component have the same structure, both being bolts. The first, second, third, fourth, fifth, and sixth mounting holes are threaded holes adapted to the first mounting component and the second mounting component.

10. A semiconductor packaging structure according to claim 9, characterized in that, The bottom shell (6) is provided with multiple cable tie frames (7) for combing the cables of the printed circuit board (4). A thermal pad is also provided on the lower surface of the bottom shell (6). The upper cover plate (1) and the bottom shell (6) are made of high thermal conductivity material.

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