Ultrasonic horn heating mechanism

Abstract

The utility model belongs to the technical field of semiconductor die bonding, specifically relates to an ultrasonic bonding head heating mechanism, including mounting seat, base plate, drive module, ultrasonic assembly and heating assembly, base plate is connected with mounting seat, installs drive module on base plate, installs ultrasonic assembly on mounting seat, ultrasonic assembly includes ultrasonic welding head and transducer, and ultrasonic welding head includes welding head body and welding portion, welding head body is connected with transducer, and the both sides of welding portion are equipped with heating assembly respectively, and heating assembly is connected with drive module, when drive module drives two heating assemblies to abut on welding portion each other, is used for heating welding portion, when drive module drives two heating assemblies to be far away from welding portion each other, to make ultrasonic welding head be used for welding work piece, the utility model discloses that the both sides of welding portion are heated evenly through heater, can guarantee the welding firm degree when welding chip, and the pressure that ultrasonic welding head applies to each place of chip keeps even, thereby guaranteeing the welding quality.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor die bonding technology, and specifically relates to an ultrasonic die bonding heating mechanism. Background Technology

[0002] In semiconductor component packaging interconnects, the connection between the chip and the substrate provides the circuit connection for power and signal distribution. For example, thermosetting bonding can be used to achieve the interconnection between the chip and the substrate.

[0003] A thermocompression bonding apparatus is a device that separates individual semiconductor chips from a wafer, picks up the semiconductor chips with the lower surface (bump forming surface) of the chip facing down using a thermocompression bonding head, and applies heat and pressure to bond the semiconductor chips to the bonding target substrate by thermocompression bonding.

[0004] Traditional thermocompression bonding devices suffer from two main problems: firstly, uneven heating of the thermocompression bonding head during the thermocompression bonding process between the chip and the substrate can lead to unreliable chip bonding; secondly, uneven pressure applied by the thermocompression bonding head to different parts of the chip can affect the bonding quality.

[0005] Therefore, it is necessary to improve upon the shortcomings of existing technologies in order to overcome their deficiencies in practical applications. Utility Model Content

[0006] Based on the aforementioned shortcomings and deficiencies in the prior art, one of the objectives of this utility model is to at least solve one or more of the aforementioned problems in the prior art. In other words, one of the objectives of this utility model is to provide an ultrasonic head heating mechanism that meets one or more of the aforementioned requirements.

[0007] To achieve the above-mentioned objectives, this utility model adopts the following technical solution:

[0008] This utility model provides an ultrasonic welding head heating mechanism, including a mounting base, a base plate, a drive module, an ultrasonic component, and a heating component. The base plate is connected to the mounting base, the drive module is mounted on the base plate, and the ultrasonic component is mounted on the mounting base. The ultrasonic component includes an ultrasonic welding head and a transducer. The ultrasonic welding head includes a welding head body and a welding part. The welding head body is connected to the transducer. Heating components are respectively provided on both sides of the welding part, and the heating components are connected to the drive module.

[0009] When the drive module drives the two heating components to abut against each other at the welding part, it is used to heat the welding part. When the drive module drives the two heating components to move away from each other at the welding part, the ultrasonic welding head is used to weld the workpiece.

[0010] As a preferred embodiment, the drive module includes a gripper cylinder and a limiting component. The two grippers of the gripper cylinder are respectively connected to the limiting component, and each limiting component is respectively connected to the heating component. The gripper cylinder drives the two limiting components to move synchronously, so as to move the two heating components synchronously closer or further away.

[0011] As a preferred embodiment, each of the heating components includes a heater and a housing, the housing covering the outside of the heater, and the inside of the heater abutting against the welded portion.

[0012] As a preferred embodiment, each of the limiting components includes a fixing plate, a heat insulation plate, and a limiting rod. The gripper cylinder is connected to the heat insulation plate, the heat insulation plate is connected to the fixing plate, one end of the fixing plate is connected to the heating component, and the other end of the fixing plate is connected to the limiting rod.

[0013] As a preferred embodiment, the lower end of the substrate is provided with a limiting block, and the limiting rod abuts against the limiting block.

[0014] As a preferred embodiment, a limiting nut is connected to the limiting rod, and the limiting nut is threadedly engaged with the limiting rod.

[0015] As a preferred embodiment, the welding head body is arranged perpendicularly to the welding part, and the welding part has an adsorption hole running through its interior.

[0016] As a preferred embodiment, the length of the welding head body is set to be twice or more than half the wavelength, and the welding head body is in full-wave vibration mode at the resonant frequency, with at least two acoustic nodes in the vibration mode.

[0017] As a preferred embodiment, the welding head body is provided with several vibration damping structures, and the several vibration damping structures are respectively connected to the mounting base.

[0018] Compared with the prior art, the advantages of this utility model are:

[0019] This invention provides an ultrasonic welding head heating mechanism that uses two heaters to uniformly heat both sides of the welding part, ensuring a reliable weld when welding chips. The ultrasonic welding head applies uniform pressure to all parts of the chip, thereby ensuring welding quality.

[0020] This invention provides an ultrasonic welding head heating mechanism, which enables the ultrasonic welding head to withstand greater pressure during the welding process, improves the welding pressure range and welding stability, and also enhances the structural rigidity of the ultrasonic welding head. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other embodiments can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the ultrasonic head heating mechanism according to an embodiment of the present invention;

[0023] Figure 2 This is another perspective schematic diagram of the ultrasonic head heating mechanism according to an embodiment of the present invention;

[0024] Figure 3 This is a rear view of the ultrasonic head heating mechanism according to an embodiment of the present invention;

[0025] In the figure: 1 Mounting base, 2 Base plate, 21 Limiting block, 3 Drive module, 31 Gripper cylinder, 32 Limiting component, 321 Fixing plate, 322 Heat insulation plate, 323 Limiting rod, 324 Limiting nut, 4 Ultrasonic component, 41 Ultrasonic welding head, 411 Welding head body, 4111 Vibration damping structure, 412 Welding part, 4121 Adsorption hole, 42 Transducer, 5 Heating component, 51 Heater, 52 Cover. Detailed Implementation

[0026] To more clearly illustrate the embodiments of this application, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0027] In the description of the embodiments of this application, the terms "upper," "lower," "front," "rear," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the application. In addition, the terms "first," "second," etc., are only used for distinction in description and have no special meaning.

[0028] According to some embodiments of this application, such as Figures 1 to 3As shown, an ultrasonic welding head heating mechanism is provided, including a mounting base 1, a base plate 2, a drive module 3, an ultrasonic component 4, and a heating component 5. The base plate 2 is connected to the mounting base 1, the drive module 3 is mounted on the base plate 2, and the ultrasonic component 4 is mounted on the mounting base 1. The ultrasonic component 4 includes an ultrasonic welding head 41 and a transducer 42. The ultrasonic welding head 41 includes a welding head body 411 and a welding part 412. The welding head body 411 is connected to the transducer 42. Heating components 5 are respectively provided on both sides of the welding part 412. The heating components 5 are connected to the drive module 3. When the drive module 3 drives the two heating components 5 to abut against each other on the welding part 412, it is used to heat the welding part 412. When the drive module 3 drives the two heating components 5 to move away from each other on the welding part 412, the ultrasonic welding head 41 is used to weld the workpiece.

[0029] In some embodiments of this application, the drive module 3 includes a gripper cylinder 31 and a limiting component 32. The two grippers of the gripper cylinder 31 are respectively connected to the limiting component 32, and each limiting component 32 is respectively connected to the heating component 5. The gripper cylinder 31 drives the two limiting components 32 to move synchronously, so as to move the two heating components 5 synchronously closer or further away.

[0030] Specifically, each heating component 5 includes a heater 51 and a housing 52. The housing 52 covers the outside of the heater 51, and the inside of the heater 51 abuts against the welding part 412 so that the welding part 412 is heated when the heater 51 is energized.

[0031] Furthermore, each limiting component 32 includes a fixing plate 321, a heat insulation plate 322, and a limiting rod 323. The gripper cylinder 31 is connected to the heat insulation plate 322, the heat insulation plate 322 is connected to the fixing plate 321, one end of the fixing plate 321 is connected to the heating component 5, and the other end of the fixing plate 321 is connected to the limiting rod 323.

[0032] In some embodiments of this application, a limiting block 21 is provided at the lower end of the substrate 2, and a limiting rod 323 abuts against the limiting block 21.

[0033] In some embodiments of this application, a limiting nut 324 is connected to the limiting rod 323 (thread not shown). The limiting nut 324 is threadedly engaged with the limiting rod 323. The width range of the two heaters 51 when they are close together can be adjusted by the limiting nuts 323 on both sides.

[0034] In some embodiments of this application, the two sides of the welding part are uniformly heated by a heater, which can ensure the welding reliability when welding the chip. The pressure applied by the ultrasonic welding head to all parts of the chip remains uniform, thereby ensuring the welding quality.

[0035] In some embodiments of this application, the welding head body 411 and the welding part 412 are arranged perpendicularly, and the welding part 412 is provided with a through-hole 4121. By connecting an external vacuum device through the through-hole 4121, it can be ensured that the welding part 412 adsorbs the workpiece to be welded, so as to facilitate welding.

[0036] In some embodiments of this application, the length of the welding head body 411 is set to be twice or more than half the wavelength, and the welding head body 411 is in full-wave vibration mode at the resonant frequency, including at least two acoustic wave nodes. By setting the welding head body 411 as a full-wave structure, the limitations of half-wavelength ultrasonic welding heads in applications can be overcome, the pressure application range of ultrasonic welding heads can be broadened, and the structural rigidity of ultrasonic welding heads can also be improved.

[0037] In some embodiments of this application, since the ultrasonic welding head vibrates at high frequency during the welding process, to avoid affecting the welding, the welding head body 411 is provided with several vibration damping structures 4111, which are respectively connected to the mounting base 1. There are four vibration damping structures 4111, which are respectively located at the four azimuth angles of the welding head body 411. The four vibration damping structures 4111 are symmetrically arranged on both side walls of the welding head body 411. The four vibration damping structures not only facilitate the clamping and fixing of the welding head body to ensure the stability of the welding part when welding the workpiece, but also effectively reduce the high-frequency vibration of the welding head body during welding, ensuring the structural rigidity of the welding head body.

[0038] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0039] The above description is only a detailed explanation of the preferred embodiments and principles of this application. For those skilled in the art, there may be changes in the specific implementation methods based on the ideas provided in this application, and these changes should also be considered within the scope of protection of this application.

Claims

1. An ultrasonic head heating mechanism, characterized in that, The device includes a mounting base, a base plate, a drive module, an ultrasonic component, and a heating component. The base plate is connected to the mounting base, the drive module is mounted on the base plate, and the ultrasonic component is mounted on the mounting base. The ultrasonic component includes an ultrasonic welding head and a transducer. The ultrasonic welding head includes a welding head body and a welding part. The welding head body is connected to the transducer. Heating components are respectively provided on both sides of the welding part, and the heating components are connected to the drive module. When the drive module drives the two heating components to abut against each other at the welding part, it is used to heat the welding part. When the drive module drives the two heating components to move away from each other at the welding part, the ultrasonic welding head is used to weld the workpiece.

2. The ultrasonic head heating mechanism according to claim 1, characterized in that, The drive module includes a gripper cylinder and a limiting component. The two grippers of the gripper cylinder are respectively connected to the limiting component, and each limiting component is respectively connected to the heating component. The gripper cylinder drives the two limiting components to move synchronously, so as to move the two heating components closer or further away synchronously.

3. The ultrasonic head heating mechanism according to claim 2, characterized in that, Each of the heating components includes a heater and a housing, the housing covering the outside of the heater and the inside of the heater abutting against the welded part.

4. The ultrasonic head heating mechanism according to claim 2, characterized in that, Each of the limiting components includes a fixing plate, a heat insulation plate, and a limiting rod. The gripper cylinder is connected to the heat insulation plate, the heat insulation plate is connected to the fixing plate, one end of the fixing plate is connected to the heating component, and the other end of the fixing plate is connected to the limiting rod.

5. The ultrasonic head heating mechanism according to claim 4, characterized in that, The lower end of the substrate is provided with a limiting block, and the limiting rod abuts against the limiting block.

6. The ultrasonic head heating mechanism according to claim 4, characterized in that, A limiting nut is connected to the limiting rod, and the limiting nut is threadedly engaged with the limiting rod.

7. The ultrasonic head heating mechanism according to claim 1, characterized in that, The welding head body is arranged perpendicularly to the welding part, and the welding part has an adsorption hole running through its interior.

8. The ultrasonic head heating mechanism according to claim 1, characterized in that, The length of the welding head body is set to be twice or more than half the wavelength, and the welding head body is in full-wave vibration mode at the resonant frequency, with at least two acoustic nodes in the vibration mode.

9. The ultrasonic head heating mechanism according to claim 1, characterized in that, The welding head body is provided with several vibration damping structures, and the vibration damping structures are respectively connected to the mounting base.

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