Tgv fever atomizing chip

Abstract

The utility model relates to a TGV heating atomization chip, including memory metal heating sheet, heating pulp, conductive pulp and high borosilicate glass structure, the high borosilicate glass structure is located at the bottom of TGV heating atomization chip, high borosilicate glass has transparent, temperature resistance 500 DEG C above, high borosilicate glass adopts laser cutting process and cuts, the high borosilicate glass structure middle position is provided with honeycomb structure, the honeycomb structure is formed by a plurality of honeycomb holes, the high borosilicate glass structure upper portion is printed with heating pulp, and the printing heating pulp forms heating surface, the printing surface when printing heating pulp avoids the position of honeycomb hole, adopts high temperature sintering solidification, when the TGV heating atomization chip of the application heats atomization, has the characteristics of not leaking, strong explosive force, atomization is sufficient, little condensate, atomization particle is small, atomization amount is big, taste reduction is good, not bubble liquid, not block hole no burnt smell, suction resistance automatic matching, temperature output continues stable, and material, process, application etc. are matched more safely.

Description

Technical Field

[0001] This utility model relates to the field of atomization chip technology, specifically a TGV heating atomization chip. Background Technology

[0002] The atomizing chip is the core component of an atomizer. Currently, ceramic heating elements on the market suffer from problems such as moisture absorption, powder shedding, unstable porosity, airflow disorder, clogging leading to a burnt taste, leakage, excessive condensation, the heating element being submerged in liquid, and heat loss due to simultaneous heating of the liquid during atomization. The mesh heating wire, which prohibits the addition of glass fiber conductive liquid, suffers from issues such as the heating element being submerged in liquid, excessive condensation, heat loss due to simultaneous heating of the metal tube during atomization, and overall assembly difficulties.

[0003] Therefore, those skilled in the art have provided a TGV heating atomizing chip to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this invention is to provide a TGV heating atomizing chip to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A TGV heating atomizing chip includes a shape memory metal heating element, a heating paste, a conductive paste, and a borosilicate glass structure. The borosilicate glass structure is located at the bottom of the TGV heating atomizing chip. A honeycomb structure is provided in the middle of the borosilicate glass structure, and the honeycomb structure is composed of a plurality of honeycomb holes. The heating paste is printed on the upper part of the borosilicate glass structure, forming a heating surface after the heating paste is printed. The printed surface avoids the honeycomb holes during the printing of the heating paste and is solidified by high-temperature sintering, with a resistance of 0.8-1.8 ohms.

[0007] As a further embodiment of this utility model: conductive paste is printed on the rectangular structures located at both ends of the heating surface to form a conductive surface; high-temperature sintering and curing are used for contact conductive and memory metal heating element laser welding fixation.

[0008] As a further improvement of this invention: a shape memory metal heating element is laser-welded onto the conductive slurry. The shape memory metal heating element is formed by etching or stamping. The resistance of the shape memory metal heating element is 2.5-3.5 times that of the heating slurry. When energized, the central heating surface bulges outward, forming a raised space according to the suction force and liquid volume. After cooling, it returns to its original shape, possessing a memory function. The honeycomb structure is formed by TGV process, with the honeycomb holes having a diameter of 0.03-0.05mm. Laser drilling is used, followed by etching, to connect the holes into a "peanut shape".

[0009] As a further improvement of this invention: the printing position of the heating paste is not connected to the honeycomb holes. During operation, the liquid is drawn to the glass heating surface and then comes into contact with the heating element, achieving 100% atomization. The two ends of the shape memory metal heating element are fixed to the surface of the conductive paste by laser welding. There is a gap between the shape memory metal heating element and the high borosilicate glass structure, forming a semi-enclosed oil storage and atomization space.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] 1. The heating slurry, shape memory metal heating element, and glass surface of this application form a heating and atomization space with 100% liquid atomization coverage and 0.03-0.05mm liquid guiding holes, improving the atomization effect by 3 times compared to traditional atomization. The heating surface does not contact the liquid guiding holes, so it does not block the liquid and does not produce a burnt smell. The TGV chip design, with photolithography and etching to form a honeycomb structure inside the glass, achieves a dimensional accuracy of 0.001mm, forming microfluidic control technology. The shape memory metal heating element automatically matches the atomization amount according to the individual's suction habits. The secondary liquid storage space achieves liquid control, and the three-layer heating achieves temperature control, making it safer.

[0012] 2. When the TGV heating atomizing chip of this application is heated and atomized, it has the characteristics of no leakage, strong burst power, full atomization, less condensate, small atomized particles, large atomization volume, good flavor reproduction, no soaking, no clogging and no burnt taste, automatic suction resistance matching, and continuous and stable temperature output. The materials, processes and applications are also safer. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of a TGV heating atomizing chip.

[0014] Figure 2 This is a schematic diagram of the heating surface in a TGV heating atomizing chip.

[0015] Figure 3 This is a schematic diagram of the structure of the heating slurry in a TGV heating atomizing chip.

[0016] Figure 4 In a TGV heating atomizing chip Figure 2 Enlarged view of point A.

[0017] Figure 5 This is a diagram showing different structures of laser-drilled and etched holes in a TGV heating atomizing chip.

[0018] In the diagram: 1. Shape memory metal heating element; 2. Heating paste; 3. Heating surface; 4. High borosilicate glass structure; 5. Honeycomb structure; 6. Conductive paste; 7. Honeycomb pores; Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figures 1-5 In this embodiment of the present invention, a TGV heating atomizing chip includes a memory metal heating element 1, a heating slurry 2, a conductive slurry 6, and a high borosilicate glass structure 4. The high borosilicate glass structure 4 is located at the bottom of the TGV heating atomizing chip, and a honeycomb structure 5 is provided in the middle of the high borosilicate glass structure 4. The honeycomb structure 5 is composed of a plurality of honeycomb holes 7.

[0021] The high borosilicate glass structure 4 has a heating and conductive paste 6 printed on its upper part, and the heating surface 3 is formed after the conductive paste 6 is printed. The printing surface of the heating paste 2 avoids the position of the honeycomb holes 7 and is sintered and cured at high temperature, with a resistance of 0.8-1.8 ohms.

[0022] Conductive paste 6 is printed on the rectangular structures located at both ends of the heating surface 3 to form a conductive surface; it is cured by high-temperature sintering and is used for contact with conductive and memory metal heating elements 1 by laser welding.

[0023] The conductive slurry 6 is laser-welded with a shape memory metal heating element 1, which is formed by etching or stamping. The resistance of the shape memory metal heating element 1 is 2.5-3.5 times that of the heating slurry 2. When energized, the middle heating surface will bulge outward, forming a bulge space according to the suction force and liquid volume. After cooling, it will recover and have a memory function.

[0024] The honeycomb structure 5 is formed by TGV process. The diameter of the honeycomb holes 7 is 0.03-0.05mm. They are drilled by laser and then etched to make the holes connected to form a "peanut shape".

[0025] The printing position of the heating paste 2 is not connected to the honeycomb hole 7. When working, the liquid is drawn to the glass heating surface and then comes into contact with the heating element to achieve 100% atomization.

[0026] The two ends of the shape memory metal heating element are fixed to the surface of the conductive slurry 6 by laser welding. There is a gap between the shape memory metal heating element and the high borosilicate glass structure 4, forming a semi-enclosed oil storage and atomization space.

[0027] By adding TGV integrated circuitry, die bonding / SMT processes can be used, and control electronic components, chips, and wafers can be added to the glass surface to form new control functions.

[0028] The TGV heating atomizing chip of this application forms a three-layer heating surface: the heating slurry surface and the front and back of the shape memory metal heating element, achieving preheating, heating, and reheating functions, resulting in strong explosive power and large vapor production. After inhalation, a secondary liquid storage space is formed. The gap between the shape memory metal heating element and the glass surface, combined with the surface tension of the liquid, creates a controllable liquid storage space. Airflow is used to regulate the liquid flow, solving the leakage problem. The gap between the shape memory metal heating element and the glass surface forms a semi-closed atomization space, reducing the contact between the heating surface and outside air, significantly reducing condensation and adhesion during temperature fluctuations, thus improving the flavor reproduction of the liquid atomization. The airway design, with honeycomb pores and the shape memory metal heating element forming an airway, is adapted to the suction force, ensuring the suction force matches the user's suction strength. Two resistors are superimposed: one for the heating slurry and one for the shape memory metal heating element. The resistance tolerance is 1 / 3 that of traditional heating atomizing components, increasing the heating area by 3 times and making the atomization output more stable. For safety, it uses FDA medical-grade materials, employs a light-processing technique, and has small dimensional tolerances. The glass surface of the heating element is in contact with the liquid. When not in use, the liquid does not come into contact with the heating element. When in use, oil is guided to the heating surface. In the absence of liquid storage, it can be used for gas heating. The honeycomb hole arrangement design in the middle of the high borosilicate glass structure is designed to meet the basic requirements of liquid storage, drainage, and locking.

[0029] This application utilizes a heating slurry, a conductive slurry, a shape memory metal heating element, and a glass surface to form a heating and atomization space, achieving 100% liquid atomization coverage. With 0.03-0.05mm liquid guiding holes, the atomization effect is three times better than traditional atomization methods. The heating surface does not contact the liquid guiding holes, preventing liquid blockage and the generation of a burnt smell. The TGV chip design, using photolithography and etching to form a honeycomb structure inside the glass with a dimensional accuracy of 0.001mm, enables microfluidic control technology. The shape memory metal heating element automatically adjusts the atomization amount according to individual suction habits. A secondary liquid storage space allows for liquid control, and three-sided heating ensures temperature control and enhanced safety.

[0030] Existing ceramic heating elements on the market suffer from problems such as moisture absorption, powder shedding, unstable porosity, disordered airflow, pore blockage leading to a burnt taste, leakage, excessive condensation, heating element soaking in liquid, and heat loss due to simultaneous heating of the liquid during atomization. Mesh heating wires, which prohibit the addition of glass fiber conductive liquid, suffer from issues such as heating element soaking in liquid, excessive condensation, heat loss due to simultaneous heating of the metal tube during atomization, and assembly difficulties. The TGV heating atomizing chip of this application, when heating and atomizing, features no leakage, strong burst power, complete atomization, minimal condensation, small atomized particles, large atomization volume, good flavor reproduction, no soaking in liquid, no pore blockage or burnt taste, automatic suction resistance matching, and continuous and stable temperature output. Furthermore, its materials, processes, and applications are all safer.

[0031] In addition, the dimensions of semiconductor-processed parts can be set with reference to the product application requirements.

[0032] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A TGV heating atomizing chip, characterized in that, It includes a shape memory metal heating element (1), a heating paste (2), a conductive paste (6), and a high borosilicate glass structure (4). The high borosilicate glass structure (4) is located at the bottom of the TGV heating atomizing chip. A honeycomb structure (5) is provided in the middle of the high borosilicate glass structure (4). The honeycomb structure (5) is composed of several honeycomb holes (7). The upper part of the high borosilicate glass structure (4) is printed with a heating paste (2), and a heating surface (3) is formed after the heating paste (2) is printed. The printing surface of the heating paste (2) avoids the position of the honeycomb hole (7) and is sintered and cured at high temperature, with a resistance of 0.8-1.8 ohms.

2. The TGV heating atomizing chip according to claim 1, characterized in that, Conductive paste (6) is printed on the rectangular structure at both ends of the heating surface (3) to form a conductive surface; it is solidified by high-temperature sintering and is used for contact conductive and memory metal heating element (1) laser welding fixation.

3. The TGV heating atomizing chip according to claim 1, characterized in that, The conductive paste (6) is laser-welded with a memory metal heating element (1), which is formed by etching or stamping. The resistance of the memory metal heating element (1) is 2.5-3.5 times that of the heating paste (2).

4. The TGV heating atomizing chip according to claim 1, characterized in that, The honeycomb structure (5) is formed by TGV process. The diameter of the honeycomb holes (7) is 0.03-0.05mm. Laser drilling is used, followed by etching, so that the holes are connected to form a "peanut shape".

5. The TGV heating atomizing chip according to claim 1, characterized in that, The printing position of the heating paste (2) is not connected to the honeycomb hole (7).

6. The TGV heating atomizing chip according to claim 3, characterized in that, The two ends of the memory metal heating element (1) are laser welded to the surface of the conductive slurry (6). There is a gap between the memory metal heating element (1) and the high borosilicate glass structure (4), forming a semi-closed oil storage and atomization space.

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