A mushroom head magic tape with reinforced backing layer

CN224910713UActive Publication Date: 2026-10-30QIANDA NEW MATERIAL CO LTD
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Patent Information

Application Number
CN202522308830.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-31
Publication Date
2026-10-30
Estimated Expiration
2035-10-31

AI Technical Summary

Technical Problem

但是如何将魔术贴固定在这些织物层或皮革层上也是一个很大的挑战

Benefits of technology

[0012]与现有技术相比,本实用新型提供的一种具有增强背衬层的蘑菇头魔术贴及其制备方法,其在制作时首先在所述基材层上粘附一层缓冲层,该缓冲层与注塑机的浇口对准,从而使得该缓冲层不仅可以缓冲来自所述浇口的冲击力,避免高压高温的增强层的原料直接冲击到所述基材层,从而可以保护该基材层不受高压的熔融的原料的冲击而损坏,进而可以制作出合格的具有增强背衬层的蘑菇头魔术贴。

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Abstract

A mushroom head magic tape with a reinforced backing layer includes a mushroom head layer, a substrate layer, a cushion layer, and a reinforcing layer. The reinforcing layer is formed on the cushion layer and the substrate layer by injection molding. The heat of the reinforcing layer melts the side of the substrate layer and the cushion layer in contact with the reinforcing layer during injection molding, while the gate of the raw material of the reinforcing layer is aligned with the cushion layer during injection molding. The mushroom head magic tape is first adhered with a cushion layer on the substrate layer when it is made, so that the substrate layer can be protected from damage by the impact of high pressure molten raw material, and thus a qualified mushroom head magic tape can be made.
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Description

Technical Field

[0001] This utility model relates to the manufacturing technology of automotive connectors, and in particular to a mushroom-shaped Velcro with a reinforced backing layer. Background Technology

[0002] As cars become an indispensable means of transportation, the number of decorative items inside them is also increasing to enhance their aesthetics. Car decoration refers to the act of adding accessories to improve the appearance of a car's exterior and interior; these added accessories are called decorative items. According to the authoritative definition of CAR2100, car decoration refers to the act of adding or replacing accessories to improve the aesthetics, practicality, and comfort of a car's exterior and interior; this is called car decoration.

[0003] These interior trim pieces, often referred to as soft furnishings, are mostly attached together using Velcro, such as headliners, seat fabrics, and leather. However, securing the Velcro to these fabric or leather layers presents a significant challenge. Sewing would compromise the aesthetics. Adhesive bonding not only increases interior odors but also weakens as the adhesive ages, since cars typically last over ten years. Summary of the Invention

[0004] In view of this, the present invention provides a mushroom-shaped Velcro with an enhanced backing layer that can solve the above problems.

[0005] A mushroom-shaped hook and loop fastener with a reinforced backing layer includes a mushroom-shaped layer, a substrate layer connected to the mushroom-shaped layer, a buffer layer disposed on the substrate layer and located on the side opposite to the mushroom-shaped layer, and a reinforcing layer fused to the substrate layer and the buffer layer. The reinforcing layer is formed on the buffer layer and the substrate layer by injection molding. During injection molding, the heat of the reinforcing layer melts the substrate layer and the side of the buffer layer in contact with the reinforcing layer, while the gate for injecting the raw material of the reinforcing layer is aligned with the buffer layer.

[0006] Furthermore, the substrate layer is bonded to the buffer layer.

[0007] Furthermore, the reinforcing layer is formed on one side of the substrate layer and the buffer layer by secondary injection molding.

[0008] Furthermore, the substrate layer, buffer layer, and reinforcing layer are made of the same material.

[0009] Furthermore, the buffer layer is located at the very center of the substrate layer.

[0010] Furthermore, the temperature of the raw material used in the reinforcing layer during injection is such that at least part of the substrate layer and the buffer layer melt.

[0011] Furthermore, the mushroom head layer is integrally formed with the substrate layer.

[0012] Compared with the prior art, the present invention provides a mushroom-shaped hook and loop fastener with a reinforced backing layer and its preparation method. In the manufacturing process, a buffer layer is first adhered to the substrate layer. The buffer layer is aligned with the gate of the injection molding machine, so that the buffer layer can not only buffer the impact force from the gate, but also prevent the raw material of the high-pressure and high-temperature reinforcing layer from directly impacting the substrate layer. This protects the substrate layer from damage caused by the impact of the high-pressure molten raw material, thereby producing a qualified mushroom-shaped hook and loop fastener with a reinforced backing layer. Attached Figure Description

[0013] Figure 1 A process flow diagram for the preparation of a mushroom-shaped hook and loop fastener with an enhanced backing layer provided by this utility model.

[0014] Figure 2 This is a schematic diagram of the structure of the mushroom-shaped Velcro before the injection-molded layer provided by this utility model.

[0015] Figure 3 This is a schematic diagram of the mushroom-shaped hook and loop fastener after the injection-molded reinforcement layer. Detailed Implementation

[0016] The specific embodiments of this utility model are described in further detail below. It should be understood that the description of the embodiments of this utility model herein is not intended to limit the scope of protection of this utility model.

[0017] First, it should be noted that hook and loop fasteners are a very existing product, manufactured by specialized manufacturers. Therefore, their specifications are generally standardized, meaning their base layer is very thin. This is because hook and loop fasteners are primarily used in light industrial sectors such as clothing and bags, where a thin base layer facilitates sewing. However, in the automotive industry, where sewing is not feasible and adhesion is weak, welding is often used. This involves heating and melting the base layer of the hook and loop fastener to weld it onto the fabric or leather component. However, existing hook and loop fasteners have base layers that are too thin to be melted easily due to heat. Therefore, this invention provides a mushroom-shaped hook and loop fastener with a reinforced backing layer and its manufacturing method. Figure 1 As shown, the method for manufacturing the mushroom-shaped Velcro with a reinforced backing layer includes the following steps: STEP 101: Provide at least one mushroom-shaped hook and loop fastener, the mushroom-shaped hook and loop fastener comprising a mushroom-shaped layer 10 and a substrate layer 20 connected to the mushroom-shaped layer 10.

[0018] In STEP 101, the mushroom-shaped hook and loop fastener can be a commercially available product, typically a single roll approximately 10 meters long and 40 centimeters wide. It is then slit into individual rolls, each 2 centimeters wide and 10 meters long, according to specific requirements. Using a commercially available product and processing it according to actual needs helps reduce costs. This is because manufacturers of mushroom-shaped hook and loop fasteners usually have large production volumes and wide widths, making customized production unsuitable as it would significantly increase costs. The mushroom-shaped hook and loop fastener is typically made of polyester fiber, which helps ensure its high toughness and high tensile strength. Furthermore, it is well known that the mushroom-shaped layer 10 and the substrate layer 20 are integrally formed.

[0019] STEP 102: Provide at least one buffer layer 30, the buffer layer 30 being bonded to the substrate layer 20, and the buffer layer 30 being located on the side of the substrate layer 20 facing away from the mushroom head layer 10.

[0020] The buffer layer 30 can also be made of polyester fiber. It is pre-bonded to the substrate layer 20 with adhesive. The buffer layer 30 is used to prevent molten injection molding material from directly hitting the substrate layer 20 and melting it during the injection molding process, thereby damaging the substrate layer 20 and the mushroom-shaped Velcro. Therefore, the thickness and size of the buffer layer 30 are set according to actual needs. Specifically, since the buffer layer 30 in this embodiment is used to prevent molten injection molding material from melting the substrate layer 20, the thickness and size of the buffer layer 30 are designed so that the molten injection molding material does not directly hit the substrate layer 20 during injection molding, but rather overflows from the buffer layer 30 onto the substrate layer 20. For ease of manufacturing, the buffer layer 30 is located in the center of the substrate layer 20, such as... Figure 2 As shown.

[0021] STEP 103: Provide an injection molding machine and place a mushroom-shaped Velcro with a cushioning layer 30 attached into the injection molding machine, with the cushioning layer 30 aligned with the gate of the injection molding machine.

[0022] As is well known, injection molding machines are a very existing type of equipment that can mold molten, viscous liquids such as plastics into structures and shapes designed by the user. In injection molding machines, the injection mold is one of the key mold components, mainly composed of a moving mold, a fixed mold, and core functional components such as a gating system, a temperature control system, a molding parts system, a venting system, a guiding system, and an ejection system. A mold core is located between the moving mold and the fixed mold, used to mold the product to be produced. The gating system is equipped with a gate, used to guide the molten injection material into the mold core to produce the desired product. In this embodiment, a two-stage injection molding process is used. Two-stage injection molding is also an existing technology, also known as overmolding or overmolding. It involves molding a certain plastic raw material in a primary mold, removing the molded part, and placing it into a secondary mold to inject the same or another type of plastic material for molding again. Therefore, it will not be elaborated further here.

[0023] In this embodiment, in order to make full use of the buffer layer 30, the buffer layer 30 is aligned with the gate. Preferably, the center of the gate coincides with the center of the buffer layer 30, so as to make full use of the buffer layer 30.

[0024] STEP104: Provide raw materials for preparing the reinforcing layer 40, and use the injection molding machine to inject the raw materials of the reinforcing layer 40 into one side of the substrate layer 20 and the buffer layer 30, wherein the reinforcing layer 40 is fused together with the substrate layer 20 and the buffer layer 30.

[0025] In STEP 104, the raw material of the reinforcing layer 40 can be the same as that of the substrate layer 20 and the buffer layer 30, such as using polyester fiber, or using a material with a slightly higher melting point than the materials of the substrate layer 20 and the buffer layer 30, so that when the raw material used in the reinforcing layer 40 is injected, the temperature of the raw material can melt at least part of the substrate layer 20 and the buffer layer 30. When the molten material of the reinforcing layer 40 is injected into the mold core from the gate, the liquid material first contacts the buffer layer 30 and partially melts it, thus bonding the molten material of the reinforcing layer 40 with the molten buffer layer 30. As the molten material of the reinforcing layer 40 continues to be introduced, it spreads onto the base layer 20. At this point, although the temperature of the molten material of the reinforcing layer 40 can still melt part of the base layer 20, because it is far from the gate, the impact force is small and will not damage the base layer 20. Therefore, the reinforcing layer 40 is formed on the base layer 20 without damaging the base layer 20. Figure 3 .

[0026] A mushroom-shaped hook and loop fastener with a reinforced backing layer is produced using the above-described manufacturing process. The mushroom-shaped hook and loop fastener with a reinforced backing layer includes a mushroom-shaped layer 10, a substrate layer 20 connected to the mushroom-shaped layer 10, a buffer layer 30 disposed on the substrate layer 20 and located on the side opposite to the mushroom-shaped layer 10, and a reinforcing layer 40 fused to the substrate layer 20 and the buffer layer 30.

[0027] Compared with the prior art, the present invention provides a mushroom-shaped hook and loop fastener with a reinforced backing layer and its preparation method. In the manufacturing process, a buffer layer 30 is first adhered to the substrate layer 20. The buffer layer 30 is aligned with the gate of the injection molding machine, so that the buffer layer 30 can not only buffer the impact force from the gate, but also prevent the raw material of the high-pressure and high-temperature reinforcing layer 40 from directly impacting the substrate layer 20. This can protect the substrate layer 20 from damage caused by the impact of the high-pressure molten raw material, thereby producing a qualified mushroom-shaped hook and loop fastener with a reinforced backing layer.

[0028] The above are merely preferred embodiments of the present utility model and are not intended to limit the scope of protection of the present utility model. Any modifications, equivalent substitutions or improvements within the spirit of the present utility model are covered within the scope of the claims of the present utility model.

Claims

1. A mushroom-shaped Velcro strap with a reinforced backing layer, characterized in that: The mushroom-shaped hook and loop fastener with a reinforced backing layer includes a mushroom-shaped layer, a substrate layer connected to the mushroom-shaped layer, a buffer layer disposed on the substrate layer and located on the side opposite to the mushroom-shaped layer, and a reinforcing layer fused onto the substrate layer and the buffer layer, wherein the reinforcing layer is formed on the buffer layer and the substrate layer by injection molding.

2. The mushroom-shaped Velcro with a reinforced backing layer as described in claim 1, characterized in that: The substrate layer is bonded to the buffer layer.

3. The mushroom-shaped Velcro with a reinforced backing layer as described in claim 1, characterized in that: The reinforcing layer is formed on one side of the substrate layer and the buffer layer by secondary injection molding.

4. The mushroom-shaped Velcro with a reinforced backing layer as described in claim 1, characterized in that: The substrate layer, buffer layer, and reinforcement layer are made of the same material.

5. The mushroom-shaped Velcro with a reinforced backing layer as described in claim 1, characterized in that: The buffer layer is located in the center of the substrate layer.

6. The mushroom-shaped Velcro with a reinforced backing layer as described in claim 1, characterized in that: The temperature of the raw material used in the reinforcing layer is such that at least part of the substrate layer and the buffer layer melts when the raw material is injected.

7. The mushroom-shaped Velcro with a reinforced backing layer as described in claim 1, characterized in that: The mushroom head layer is integrally formed with the substrate layer.