Acoustic head and ultrasonic probe

Abstract

Disclosed are an acoustic head and an ultrasonic probe, wherein an array element conductive layer of an array element has an array element chip socket, a signal processing chip has an array element convex disc for abutting the array element, and the array element convex disc and the array element chip socket are inserted and matched to form a conductive connection. In this structure, the array element is directly connected with the signal processing chip, and an intermediate adapter component can be omitted, which is conducive to the miniaturization of the entire acoustic head in the stacking direction of the components. Furthermore, compared with the surface-to-surface conductive abutment in the prior art, the insertion and matching of the array element convex disc and the array element chip socket in this structure not only increases the conductive contact area between the array element convex disc and the array element chip socket, but also enables the bottom surface and the side surface of the array element chip socket to form conductive contact with the top surface and the side surface of the array element convex disc, respectively, to form conductive contact points in multiple directions. Even if the contact in a certain direction is poor, the conductive contact can still be achieved through the contact in other directions, and thus the conductive stability can be improved.

Description

Technical Field

[0001] This application relates to the field of medical devices, specifically to the acoustic head structure of an ultrasound probe. Background Technology

[0002] Ultrasound testing technology uses the emission and reception of sound waves through an ultrasound transducer to measure the data morphology of physiological or tissue structures, thus achieving diagnosis. It is a non-invasive, convenient, and intuitive testing method. As a key component in the testing process, the ultrasound transducer can be subdivided into categories such as abdominal, rectal, ophthalmic, cranial, and cardiac, depending on the diagnostic site. Among these, the cardiac field has particularly stringent requirements for the performance and stability of ultrasound transducers.

[0003] To acquire richer image information, some ultrasound probes are increasingly employing more array elements, such as area array TEE probes, or other linear, phased array, or convex array probes with a large number of elements. In these probes with a large number of elements, a signal processing chip (ASIC board) is typically added to better transmit signals between the elements and the lead-out circuit board. This signal processing chip is electrically connected to each individual element, and through signal processing, simplifies the driving method of the lead-out circuit board for each element.

[0004] However, as the number of array elements increases, the manufacturing difficulty of the sound heads also increases accordingly. In particular, these sound heads also need to be small in size. Therefore, when faced with a large number of array elements and small sound heads, how to ensure stable signal transmission between the array elements, especially between the array elements and the signal processing chip (ASIC board), is a major challenge.

[0005] In current structures, some solutions involve adding an insulating resin frame with hollow channels. Array elements are placed on the insulating resin frame, corresponding to the hollow channels. The insulating resin frame is also placed on a signal processing chip (ASIC board), which has array pins corresponding to the hollow channels (each array element position is unique). Electrical connection is achieved by filling the hollow channels with conductive adhesive, thus electrically connecting each pin to its corresponding array element. However, structurally, the addition of the insulating resin frame makes the structure more complex and cumbersome, and the bonding strength of this method is widely recognized as relatively weak in the industry. Utility Model Content

[0006] This application provides a sound head and an ultrasonic probe, the purpose of which is to provide a connection structure between array elements and signal processing chips that is simpler in structure and more reliable in conductive connection.

[0007] To achieve the above objectives, one embodiment of this application provides an acoustic head for a planar array ultrasonic probe, comprising:

[0008] Matching layer;

[0009] An array element layer includes multiple array elements arranged in a planar array. Each array element has a piezoelectric material layer for emitting and receiving ultrasonic signals and an array element conductive layer. The piezoelectric material layer and the array element conductive layer are stacked, fixed, and electrically connected. One end of the piezoelectric material layer facing away from the array element conductive layer is the negative electrode of the array element, and the other end is the positive electrode of the array element. The array element conductive layer is electrically connected to the positive electrode. A matching layer is located on one side of the negative electrode. The end of the array element conductive layer facing away from the positive electrode has a docking chip slot.

[0010] A signal processing chip having a plurality of mating array element protrusions arranged in an array, wherein at least a portion of the mating array element protrusions correspond one-to-one with at least a portion of the array elements, and the mating array element protrusions are inserted into and fixed in the mating chip slot of the corresponding array element, and form a conductive connection with the mating chip slot.

[0011] And a lead-out circuit board, which is electrically connected to the signal processing chip to input a drive signal to the corresponding positive terminal through the signal processing chip; the negative terminal is electrically connected to the lead-out circuit board.

[0012] In the acoustic head shown in the above embodiment, the conductive layer of the array element has a docking chip slot, and the signal processing chip has a docking array element bump. The docking array element bump and the docking chip slot are inserted and engaged to form a conductive connection. In this structure, the array element is directly connected to the signal processing chip, eliminating intermediate transition components and facilitating a smaller overall acoustic head in the stacking direction of the components. Moreover, compared to the surface-to-surface conductive docking in the prior art, the insertion and engagement of the docking array element bump and the docking chip slot in this structure not only increases the conductive contact area between the docking array element bump and the docking chip slot, but also allows the bottom and side surfaces of the docking chip slot to form conductive contacts with the top and side surfaces of the docking array element bump, respectively, creating conductive contact points in multiple directions. Even if the contact in one direction is poor, conductivity can be achieved through contact in other directions, thus improving conductivity stability.

[0013] In one embodiment, the docking array protrusion is fixed to the sidewall and bottom wall of the docking chip slot and forms a conductive connection.

[0014] In one embodiment, conductive adhesive is filled between the docking chip slot and the docking array protrusion for fixation and conductivity.

[0015] In one embodiment, the protrusion height of the mating array bump is greater than or equal to the depth of the mating chip slot.

[0016] In one embodiment, the lateral dimension of the mating array protrusion is smaller than the lateral dimension of the mating chip slot.

[0017] In one embodiment, the protrusion height of the docking element convex disk ranges from 40 to 100 μm, and the depth of the docking chip slot ranges from 45 to 110 μm.

[0018] In one embodiment, the maximum lateral dimension of the docking array protrusion ranges from 40 to 100 μm, and the maximum lateral dimension of the docking chip slot ranges from 45 to 110 μm.

[0019] In one embodiment, the docking array element convex disk is square-column-shaped, cylindrical, conical, rugby ball-shaped, pyramidal, frustum-shaped, or trapezoidal.

[0020] In one embodiment, the array element conductive layer is made of a conductive acoustic material, which serves both to conductively connect the piezoelectric material layer to the signal processing chip and to absorb ultrasonic signals emitted by the piezoelectric material layer.

[0021] Alternatively, the array element conductive layer may be made of a non-acoustic conductive material, which is used to conductively connect the piezoelectric material layer to the signal processing chip.

[0022] In one embodiment, the piezoelectric material layer is made of piezoelectric ceramic, or a single crystal and piezoelectric composite material; the array element conductive layer is made of tungsten steel.

[0023] To achieve the above objectives, one embodiment of this application provides an acoustic probe for an ultrasonic probe, comprising:

[0024] An array element layer, wherein the array element layer comprises multiple array elements;

[0025] A signal processing chip has multiple docking array elements, at least a portion of the docking array elements correspond one-to-one with at least a portion of the array elements; one end of each array element facing the docking array element has a docking chip portion, and the docking array element and the corresponding docking chip portion are fixed and electrically connected by a concave-convex insertion.

[0026] And a lead-out circuit board, which is electrically connected to the signal processing chip so that one end of the corresponding array element is electrically connected through the signal processing chip, and the other end of the corresponding array element is electrically connected to the lead-out circuit board through a lead-out structure.

[0027] In the acoustic head shown in the above embodiment, the array element has a docking chip portion, and the signal processing chip has a docking array element protrusion. The docking array element portion and the corresponding docking chip portion are fixed and electrically connected through a concave-convex insertion. In this structure, the array element is directly connected to the signal processing chip, eliminating intermediate transition components and facilitating a smaller overall acoustic head in the stacking direction of the components. Moreover, compared to the surface-to-surface conductive docking in the prior art, the insertion and connection between the docking array element portion and the docking chip portion in this structure not only increases the conductive contact area between the docking array element portion and the docking chip portion, but also forms conductive contact points in multiple directions. Even if the contact in one direction is poor, conductivity can be achieved through contact in other directions, thus improving conductivity stability.

[0028] In one embodiment, the array element has a piezoelectric material layer for emitting and receiving ultrasonic signals and an array element conductive layer. The piezoelectric material layer and the array element conductive layer are stacked and fixed and electrically connected. The docking chip portion is disposed at one end of the array element conductive layer away from the piezoelectric material layer.

[0029] In one embodiment, the docking element part is a docking element protrusion that protrudes toward the element, the docking chip part is a docking chip slot, the docking element protrusion is inserted into and fixed in the docking chip slot of the corresponding element, and at least one of the side wall and bottom wall of the docking chip slot forms an conductive connection with the docking element protrusion.

[0030] Alternatively, the docking element part is a docking element slot, and the docking chip part is a docking chip protrusion that protrudes toward the signal processing chip. The docking chip protrusion is inserted into and fixed in the docking element slot of the corresponding element, and at least one of the side wall and bottom wall of the docking element slot forms a conductive connection with the docking chip protrusion.

[0031] In one embodiment, the protrusion height of the docking array bump is greater than or equal to the depth of the docking chip slot;

[0032] Alternatively, the protrusion height of the mating chip cam is greater than or equal to the depth of the mating array slot.

[0033] In one embodiment, the lateral dimension of the docking array protrusion is smaller than the lateral dimension of the docking chip slot;

[0034] Alternatively, the lateral dimension of the docking chip bump is smaller than the lateral dimension of the docking array slot.

[0035] In one embodiment, the protrusion height of the docking array element convex disk or the docking chip convex disk ranges from 40 to 100 μm, and the depth of the docking chip slot or the docking array element slot ranges from 45 to 110 μm.

[0036] In one embodiment, the maximum lateral dimension of the docking array bump or the docking chip bump ranges from 40 to 100 μm, and the maximum lateral dimension of the docking chip slot or the docking array slot ranges from 45 to 110 μm.

[0037] In one embodiment, the docking array convex disk or the docking chip convex disk is square-column-shaped, cylindrical, conical, rugby ball-shaped, pyramidal, frustum-shaped, or trapezoidal.

[0038] In one embodiment, conductive adhesive is filled between the docking chip slot and the docking array protrusion for fixation and conductivity;

[0039] Alternatively, conductive adhesive can be filled between the docking element slot and the docking chip bump for fixation and conductivity.

[0040] In one embodiment, the array element conductive layer is made of a conductive acoustic material, which serves both to conductively connect the piezoelectric material layer to the signal processing chip and to absorb ultrasonic signals emitted by the piezoelectric material layer.

[0041] Alternatively, the array element conductive layer may be made of a non-acoustic conductive material, which is used to conductively connect the piezoelectric material layer to the signal processing chip.

[0042] In one embodiment, the piezoelectric material layer is made of piezoelectric ceramic, or a single crystal and piezoelectric composite material; the array element conductive layer is made of tungsten steel.

[0043] For the purposes described above, one embodiment of this application provides an ultrasonic probe, which includes the acoustic head as described in any of the preceding claims. Attached Figure Description

[0044] Figure 1 This is an exploded view of the sound head in one embodiment of this application;

[0045] Figure 2 for Figure 1 The exploded view shown is a schematic diagram of the assembled assembly.

[0046] Figure 3 This is an exploded view of the various parts of the sound head in one embodiment of this application from a stereoscopic perspective;

[0047] Figure 4 This is an enlarged schematic diagram of the connection structure between the array element and the signal processing chip in one embodiment of this application. Detailed Implementation

[0048] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0049] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0050] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0051] Some ultrasound probes used in the medical field have a large number of array elements in their acoustic heads. Therefore, they are usually equipped with a signal processing chip (commonly referred to in the art as an ASIC board, the internal circuit structure of which can be found in existing technology) to process the electrical signals of the array elements. This signal processing chip simplifies the lead-out structure of the array elements when there are many elements, ultimately enabling conductivity between the array elements and the lead-out circuit board of the acoustic head. This lead-out circuit board is then used to connect the signal to the main control board of the ultrasound equipment. This application mainly demonstrates some connection structures between array elements and signal processing chips that are simpler in structure and more reliable in conductive connection.

[0052] In some embodiments of this application, an acoustic head for an ultrasonic probe is provided. The ultrasonic probe can be not only an area array probe (such as an area array TEE probe), but also, but is not limited to, a linear, phased array, convex array, or other types of ultrasonic probes. As long as its acoustic head adopts a combination structure of array elements and a signal processing chip, the connection structure shown in this application can be used.

[0053] Please refer to Figure 1-3In some embodiments, the sound head includes an array element layer 100, a signal processing chip 200, and a lead-out circuit board 300. Of course, the sound head may also include other related components as needed, such as a negative lead-out element 400, a matching layer 500, and a backing layer 600, etc., which can be referred to in the prior art.

[0054] Please refer to Figure 1-3 In some embodiments, the array element layer 100 includes a plurality of array elements 110, which can be configured as follows: Figure 3 The diagram shows a planar array arrangement (i.e., a planar array probe, with array elements arranged in multiple rows and columns). Adjacent array elements 110 can be insulated and fixedly connected using insulating adhesive 101 or other insulating materials, effectively preventing short circuits between array elements 110. Of course, these array elements 110 can also be arranged in other ways to form other types of probes, as can be seen in the structures disclosed in the prior art. The signal processing chip 200 has multiple mating array elements (such as, but not limited to, mating array element bumps 210 mentioned later, or mating chip slots for inserting mating chip bumps), with at least a portion of the mating array elements corresponding one-to-one with at least a portion of the array elements 110. Figure 1-3 In this embodiment, the number and position of the docking array elements and array elements 110 are completely one-to-one. Of course, in other embodiments, a portion of array elements 110 may correspond one-to-one with a portion of the docking array elements. The one-to-one correspondence mentioned here means that one docking array element is electrically connected to one array element 110 to complete the input and output of electrical signals to that array element 110.

[0055] Please refer to Figure 1-3 The array element 110 has a docking chip portion (such as, but not limited to, a docking chip slot 102 or a docking chip bump for insertion into the docking array element bump 210, as mentioned later) at one end facing its docking array element portion. This docking array element portion and the corresponding docking chip portion are fixedly and electrically connected. The lead-out circuit board 300 is electrically connected to the signal processing chip 200, so that the signal processing chip 200 is electrically connected to one end of the corresponding array element 110, and the other end of the corresponding array element 110 is electrically connected to the lead-out circuit board 300 through a lead-out structure.

[0056] To improve the connection reliability and conductivity reliability between array element 110 and signal processing chip 200, please refer to... Figure 4 The docking element and the corresponding docking chip are fixed and electrically connected by a concave-convex insertion joint. This concave-convex insertion joint means that at least one of the docking element and the corresponding docking chip has a groove structure, and the other has a protrusion structure. The groove structure and the corresponding protrusion structure are inserted to form a concave-convex fit. The shape of the protrusion structure can be, but is not limited to, square prism, cylindrical, conical, rugby ball, pyramidal, frustum, trapezoidal, or similar shapes.

[0057] In this structure, the array element 110 is directly connected to the signal processing chip 200, eliminating the need for intermediate transition components (such as the insulating resin frame used in the prior art). This is beneficial for the overall sound head in the stacking direction of the components (i.e., Figure 1 and 2 The dimensions (vertical direction of the middle panel) are smaller, which is more conducive to miniaturization. Furthermore, compared to the surface-to-surface conductive connections in existing technologies, the insertion and connection between the docking array element and the docking chip in this structure not only increases the conductive contact area between the docking array element and the docking chip, but also allows for the formation of conductive contact points in multiple directions, such as... Figure 4 As shown, conductive contact points are formed in both the horizontal and vertical directions. Even if the contact is poor in one direction, conductivity can be achieved through contact in other directions, thus improving conductivity stability.

[0058] Specifically, please refer to Figure 4 In this embodiment, the docking chip portion is a docking chip slot 102 disposed on the array element 110, and the docking array element portion is a docking array element protrusion 210 disposed on the signal processing chip 200. When the docking chip slot 102 and the docking array element protrusion 210 are inserted and mated, since the bottom and side surfaces of the docking chip slot 102 and the top and side surfaces of the docking array element protrusion 210 can be used for conductive contact and fixation, not only can the conductive contact area between the docking array element portion and the docking chip portion be increased, but also the bottom and side surfaces of the docking chip slot 102 can form conductive contact points in multiple directions with the top and side surfaces of the docking array element protrusion 210, respectively.

[0059] Of course, in other embodiments, the reverse can also be true. The docking element part can be a docking element slot, and the docking chip part can be a docking chip bump that protrudes onto the signal processing chip 200. The docking chip bump is inserted into and fixed in the docking element slot of the corresponding element 110, and at least one of the side wall and bottom wall of the docking element slot forms an conductive connection with the docking chip bump.

[0060] Furthermore, such as Figure 1-3 As shown, in some embodiments, the mating chip portion (such as the mating chip slot 102) on the array element 110 is located on the positive side of the array element 110, that is, the matching layer 500 is located on the negative side of the array element 110. The lead-out circuit board 300 and the signal processing chip 200 are both located on the positive side of the array element 110, and the positive terminal of each array element 110 is electrically connected to the signal processing chip 200. Its negative terminal can be led out to the negative terminal of the lead-out circuit board 300 through a negative terminal lead-out component 400 (such as copper foil, a conductive layer, or other existing negative terminal lead-out structures). Furthermore, in other embodiments, the positions of the positive and negative terminals of the array element 110 can be reversed, with the array element 110 electrically connected to the signal processing chip 200 via its negative terminal.

[0061] Furthermore, in some embodiments, the sidewalls of the docking chip slot 102 and the sidewalls and topwalls of the docking array protrusion 210 are fixed and form a conductive connection, which can not only improve the connection reliability, but also improve the conductivity reliability.

[0062] In some more specific embodiments, the mating chip portion (such as mating chip slot 102 or other types of mating chip portions) and the mating element portion (such as mating element protrusion 210 or other types of mating element portions) can be fixed and conductive by filling with conductive adhesive. This structure ensures that even if the conductive adhesive on one side detaches during the concave-convex mating fit, the conductive adhesive on the other side can still provide fixation and conductivity. Moreover, this structure employs a concave-convex mating structure, which expands the contact surface. Therefore, combined with conductive adhesive, the reliability of the connection can be further improved by increasing the adhesive area.

[0063] To ensure more reliable contact between the mating chip portion and the mating element portion during manufacturing, in some embodiments, the protrusion height of the mating element bump 210 (which can also be a mating chip bump or other forms of protrusion structure) is greater than or equal to the depth of the corresponding mating chip slot 102 (which can also be a mating element slot or other forms of groove structure). This makes it easier to insert the mating element bump 210 into the bottom of the corresponding mating chip slot 102, avoiding problems such as insufficient insertion depth during manufacturing that could affect conductivity and connection.

[0064] In other embodiments, the lateral dimension (i.e. width) of the mating element bump 210 (which may also be a mating chip bump or other form of protrusion structure) is smaller than the lateral dimension of the corresponding mating chip slot 102 (which may also be a mating element slot or other form of groove structure) so that there is a gap between the two, which can be used to fill conductive adhesive and facilitate the flow of conductive adhesive to the bottom.

[0065] In some embodiments, the protrusion height of the mating element convex disk 210 (which may also be a mating chip convex disk or other forms of protrusion structure) ranges from 40 to 100 μm, while the depth of the corresponding mating chip slot 102 (which may also be a mating element slot or other forms of groove structure) ranges from 45 to 110 μm.

[0066] In some embodiments, the maximum lateral dimension of the docking element convex disk 210 (which may also be a docking chip convex disk or other forms of protrusion structure) ranges from 40 to 100 μm, while the maximum lateral dimension of the corresponding docking chip slot 102 (which may also be a docking element slot or other forms of groove structure) ranges from 45 to 110 μm.

[0067] In some embodiments, the mating element convex disk 210 (which may also be a mating chip convex disk or other forms of protrusion structure) is square columnar, cylindrical, conical, rugby ball-shaped, pyramidal, frustum-shaped, or trapezoidal, and the mating chip slot 102 (which may also be a mating element slot or other forms of groove structure) has a shape and structure that can form a concave-convex mating fit with it.

[0068] Furthermore, in some embodiments, please refer to Figure 2 and 3 The array element 110 may have one or more piezoelectric material layers 111, which can convert electrical signals into ultrasonic waves for emission and receive ultrasonic echoes and convert them back into electrical signals. Furthermore, the array element 110 also has an array element conductive layer 112, with the piezoelectric material layer 111 and the array element conductive layer 112 stacked and fixed together and electrically connected. One end of the piezoelectric material layer 111 facing away from the array element conductive layer 112 is the negative electrode of the array element 110, and the other end is the positive electrode of the array element 110. The array element conductive layer 112 is electrically connected to the positive electrode. The docking chip portion (such as a docking chip slot 102, a docking chip bump, or other form of docking chip portion) is disposed on the array element conductive layer 112. The advantage of this structure is that the placement of the docking chip portion does not affect the size and structure of the piezoelectric material layer 111 itself, and therefore does not affect its function of emitting ultrasonic waves and receiving ultrasonic echoes.

[0069] Furthermore, in some embodiments, the array element conductive layer 112 may be made of a conductive acoustic material, which serves both to conductively connect the piezoelectric material layer 111 to the signal processing chip 200 and to absorb ultrasonic signals emitted by the piezoelectric material layer 111. Alternatively, in other embodiments, the array element conductive layer 112 may be made of a non-acoustic conductive material, which serves to conductively connect the piezoelectric material layer 111 to the signal processing chip 200 and does not serve to absorb ultrasonic signals.

[0070] More specifically, in some embodiments, the piezoelectric material layer 111 is made of piezoelectric ceramic, or a single crystal and piezoelectric composite material; the array element conductive layer 112 is made of tungsten steel.

[0071] Of course, in other embodiments, solely for the purpose of improving conductivity and connection reliability, the mating chip portion (such as mating chip slot 102, mating chip bump, or other forms of mating chip portion) may also extend onto the piezoelectric material layer 111. Alternatively, in some embodiments, the sound head may only have the piezoelectric material layer 111, in which case the mating chip portion (such as mating chip slot 102, mating chip bump, or other forms of mating chip portion) may also be directly disposed on the piezoelectric material layer 111.

[0072] On the other hand, some embodiments of this application also provide an ultrasonic probe, which includes a sound head as shown in any of the above embodiments.

[0073] The above-described specific examples are for illustrative purposes only and are not intended to limit the scope of this invention. Those skilled in the art to which this invention pertains can make various simple deductions, modifications, or substitutions based on the concept of this invention.

Claims

1. An acoustic head for a planar ultrasonic probe, characterized in that, include: Matching layer; An array element layer includes multiple array elements arranged in a planar array. Each array element has a piezoelectric material layer for emitting and receiving ultrasonic signals and an array element conductive layer. The piezoelectric material layer and the array element conductive layer are stacked, fixed, and electrically connected. One end of the piezoelectric material layer facing away from the array element conductive layer is the negative electrode of the array element, and the other end is the positive electrode of the array element. The array element conductive layer is electrically connected to the positive electrode. A matching layer is located on one side of the negative electrode. The end of the array element conductive layer facing away from the positive electrode has a docking chip slot. A signal processing chip having a plurality of mating array element protrusions arranged in an array, wherein at least a portion of the mating array element protrusions correspond one-to-one with at least a portion of the array elements, and the mating array element protrusions are inserted into and fixed in the mating chip slot of the corresponding array element, and form a conductive connection with the mating chip slot. And a lead-out circuit board, which is electrically connected to the signal processing chip to input a drive signal to the corresponding positive terminal through the signal processing chip; the negative terminal is electrically connected to the lead-out circuit board.

2. The sound head as described in claim 1, characterized in that, The docking array protrusion is fixed to the sidewall and bottom wall of the docking chip slot, forming a conductive connection.

3. The sound head as described in claim 1, characterized in that, Conductive adhesive is filled between the docking chip slot and the docking array protrusion for fixation and conductivity.

4. The sound head as described in claim 1, characterized in that, The protrusion height of the mating array element convex disk is greater than or equal to the depth of the mating chip slot.

5. The acoustic head as described in claim 1, characterized in that, The lateral dimension of the docking array protrusion is smaller than the lateral dimension of the docking chip slot.

6. The acoustic head as described in claim 1, characterized in that, The protrusion height of the docking array element convex disk ranges from 40 to 100 μm, and the depth of the docking chip slot ranges from 45 to 110 μm.

7. The acoustic head as described in claim 1, characterized in that, The maximum lateral dimension of the docking array convex disk ranges from 40 to 100 μm, and the maximum lateral dimension of the docking chip slot ranges from 45 to 110 μm.

8. The sound head as described in claim 1, characterized in that, The docking array element convex disk is square columnar, cylindrical, conical, rugby ball-shaped, pyramidal, frustum-shaped, or trapezoidal.

9. The acoustic head as described in any one of claims 1-8, characterized in that, The array element conductive layer is made of conductive acoustic material, which is used both to conductively connect the piezoelectric material layer to the signal processing chip and to absorb the ultrasonic signals emitted by the piezoelectric material layer. Alternatively, the array element conductive layer may be made of a non-acoustic conductive material, which is used to conductively connect the piezoelectric material layer to the signal processing chip.

10. The acoustic head as described in any one of claims 1-8, characterized in that, The piezoelectric material layer is made of piezoelectric ceramic, or a single crystal and a piezoelectric composite material; the array element conductive layer is made of tungsten steel.

11. An acoustic probe for use in an ultrasonic probe, characterized in that, include: An array element layer, wherein the array element layer comprises multiple array elements; A signal processing chip has multiple docking array elements, at least a portion of the docking array elements correspond one-to-one with at least a portion of the array elements; one end of each array element facing the docking array element has a docking chip portion, and the docking array element and the corresponding docking chip portion are fixed and electrically connected by a concave-convex insertion. And a lead-out circuit board, which is electrically connected to the signal processing chip so that one end of the corresponding array element is electrically connected through the signal processing chip, and the other end of the corresponding array element is electrically connected to the lead-out circuit board through a lead-out structure.

12. The acoustic head as described in claim 11, characterized in that, The array element has a piezoelectric material layer for emitting and receiving ultrasonic signals and an array element conductive layer. The piezoelectric material layer and the array element conductive layer are stacked and fixed and electrically connected. The docking chip is located at the end of the array element conductive layer away from the piezoelectric material layer.

13. The acoustic head as described in claim 11, characterized in that, The docking element part is a docking element protrusion that protrudes towards the element, and the docking chip part is a docking chip slot. The docking element protrusion is inserted into and fixed in the docking chip slot of the corresponding element, and at least one of the side wall and bottom wall of the docking chip slot forms an conductive connection with the docking element protrusion. Alternatively, the docking element part is a docking element slot, and the docking chip part is a docking chip protrusion that protrudes toward the signal processing chip. The docking chip protrusion is inserted into and fixed in the docking element slot of the corresponding element, and at least one of the side wall and bottom wall of the docking element slot forms a conductive connection with the docking chip protrusion.

14. The acoustic head as described in claim 13, characterized in that, The protrusion height of the docking array protrusion is greater than or equal to the depth of the docking chip slot; Alternatively, the protrusion height of the mating chip cam is greater than or equal to the depth of the mating array slot.

15. The acoustic head as described in claim 13, characterized in that, The lateral dimension of the docking array protrusion is smaller than the lateral dimension of the docking chip slot; Alternatively, the lateral dimension of the docking chip bump is smaller than the lateral dimension of the docking array slot.

16. The acoustic head as described in claim 13, characterized in that, The protrusion height of the docking array element convex disk or the docking chip convex disk ranges from 40 to 100 μm, and the depth of the docking chip slot or the docking array element slot ranges from 45 to 110 μm.

17. The acoustic head as described in claim 13, characterized in that, The maximum lateral dimension of the docking array element convex disk or the docking chip convex disk ranges from 40 to 100 μm, and the maximum lateral dimension of the docking chip slot or the docking array element slot ranges from 45 to 110 μm.

18. The acoustic head as described in claim 13, characterized in that, The docking array element convex disk or the docking chip convex disk is square columnar, cylindrical, conical, rugby ball-shaped, pyramidal, frustum-shaped, or trapezoidal.

19. The acoustic head as described in claim 13, characterized in that, The space between the docking chip slot and the docking array protrusion is filled with conductive adhesive for fixation and conductivity. Alternatively, conductive adhesive can be filled between the docking element slot and the docking chip bump for fixation and conductivity.

20. The acoustic head as described in claim 12, characterized in that, The array element conductive layer is made of conductive acoustic material, which is used both to conductively connect the piezoelectric material layer to the signal processing chip and to absorb the ultrasonic signals emitted by the piezoelectric material layer. Alternatively, the array element conductive layer may be made of a non-acoustic conductive material, which is used to conductively connect the piezoelectric material layer to the signal processing chip.

21. The acoustic head as described in claim 12, characterized in that, The piezoelectric material layer is made of piezoelectric ceramic, or a single crystal and a piezoelectric composite material; the array element conductive layer is made of tungsten steel.

22. An ultrasonic probe, characterized in that, It includes the sound head as described in any one of claims 1-21.

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