A cold and hot compress head

Abstract

The utility model relates to a cold and hot compress head, include: fan subassembly, heat conduction spare is set below fan subassembly, semiconductor cold and hot sheet is set in the heat conduction spare one side of back to fan subassembly, negative ion ceramic contact spare is set in the semiconductor cold and hot sheet one side of back to heat conduction spare, negative ion ceramic contact spare recesses and forms the arc to the semiconductor cold and hot sheet direction of location.

Description

Technical Field

[0001] This utility model relates to the field of massage device technology, and in particular to a hot and cold compress head. Background Technology

[0002] Hot and cold compresses are common functions in massage devices. Existing hot and cold compress devices use metal contact components, typically stainless steel or aluminum alloy. In winter, the temperature is too cold for the face at room temperature, or too hot in summer. Furthermore, their flat shape doesn't conform to the face. Existing hot and cold compress heads also have many cavities and ineffective spaces, resulting in a non-compact structure. The semiconductor and temperature sensing modules are also spaced from the contact components; the former leads to low efficiency, and the latter to low measurement accuracy. Additionally, the small size of the heat-conducting components results in poor heat dissipation, causing the cooling effect to significantly decrease over time. Utility Model Content

[0003] In view of the above situation, it is necessary to propose a hot and cold compress head that is convenient for use at low temperatures.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a hot and cold compress head, comprising:

[0005] Fan assembly;

[0006] A heat-conducting component is disposed below the fan assembly;

[0007] A semiconductor heating element is disposed on the side of the heat-conducting component facing away from the fan assembly;

[0008] A negative ion ceramic contact is disposed on the side of the semiconductor heating element that faces away from the heat-conducting element, and the negative ion ceramic contact is recessed in the direction of the semiconductor heating element to form an arc shape.

[0009] Furthermore, the fan assembly includes a cooling fan and a fan bracket, the fan bracket being connected to the heat-conducting component to fasten and fix the cooling fan.

[0010] Furthermore, the middle part of the heat-conducting component is a heat dissipation grid, and each end of the heat dissipation grid is provided with a connecting part, which is fixedly connected to the negative ion ceramic contact component.

[0011] Furthermore, it also includes a fixing base, which is disposed on the side of the heat-conducting component facing away from the fan assembly. The fixing base is fixedly connected to the heat-conducting component, and screws pass through the connecting part. The fixing base is screwed to the negative ion ceramic contact. The fixing base has a groove for accommodating the semiconductor heating and cooling plate.

[0012] Furthermore, it also includes a temperature measuring element, which is attached to the side of the negative ion ceramic contact element facing the heat-conducting element.

[0013] Furthermore, the heat-conducting component is provided with a groove for the leads of the semiconductor heating element and the temperature measuring element to extend out.

[0014] Furthermore, it also includes a connecting bracket, which is fastened to the side of the heat-conducting component facing away from the negative ion ceramic contact, and the connecting bracket is provided with lugs for connecting to the outside.

[0015] Furthermore, it also includes a silicone sleeve, which is located between the connecting bracket and the negative ion ceramic contact. The lower end of the silicone sleeve is nested with the negative ion ceramic contact and the upper end is nested with the connecting bracket. The side wall of the silicone sleeve is provided with several air holes.

[0016] Furthermore, the negative ion ceramic contact element includes tourmaline-type negative ion ceramic.

[0017] Furthermore, the negative ion ceramic contact is bent in the width direction.

[0018] The beneficial effects of this invention are as follows: the semiconductor heating and cooling sheet cools on one side and heats on the other. When hot compress is needed, the heating surface faces the negative ion ceramic contact element, and the fan assembly does not work. When cold compress is needed, the cooling surface faces the negative ion ceramic contact element, and the heating surface faces the heat conduction element. The heat conduction element transfers the heat from the heating surface, and the fan assembly dissipates the heat. Because of the use of the negative ion ceramic contact element, it can release negative ions, which can inhibit the growth of bacteria and viruses, improve skin quality, and make the skin more delicate and smooth. Furthermore, the ceramic material is gentler on the eye area, with a more moderate temperature and lower irritation. Compared to stainless steel and aluminum, its temperature is more suitable, and the microporous structure of the ceramic itself allows for breathability and soothing. In addition, the negative ion ceramic contact element uses an arc-shaped contact, which can better conform to the human face. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a hot and cold compress head according to an embodiment of this utility model;

[0020] Figure 2 This is a cross-sectional structural diagram of a hot and cold compress head according to an embodiment of the present invention;

[0021] Figure 3 This is an exploded structural diagram of a hot and cold compress head according to an embodiment of the present invention;

[0022] Figure 4 This is an exploded structural diagram of a hot and cold compress head according to another embodiment of the present invention.

[0023] Label Explanation:

[0024] 100. Fan assembly; 110. Cooling fan; 120. Fan bracket; 121. Limiting slot;

[0025] 200, heat-conducting component; 210, heat dissipation grid; 220, connecting part; 230, wire channel;

[0026] 300. Semiconductor heating / cooling sheet; 400. Negative ion ceramic contact; 410. Groove; 420. Boss;

[0027] 500. Fixed base; 510. Alignment hole; 520. Limiting groove; 530. Mounting slot;

[0028] 600. Temperature measuring element; 700. Connecting bracket; 710. Lug; 800. Silicone sleeve; 810. Air vent;

[0029] 820, upper limit slot; 830, lower limit slot. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description of a hot and cold compress head, in conjunction with the accompanying drawings and embodiments, is provided. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the scope of the utility model.

[0031] Please refer to Figures 1-4 A type of hot and cold compress head, comprising:

[0032] Fan assembly 100;

[0033] The heat-conducting component 200 is disposed below the fan assembly 100;

[0034] The semiconductor heating element 300 is disposed on the side of the heat-conducting component 200 facing away from the fan assembly 100;

[0035] The negative ion ceramic contact 400 is disposed on the side of the semiconductor heating and cooling plate 300 away from the heat conduction component 200, and the negative ion ceramic contact 400 is recessed in the direction of the semiconductor heating and cooling plate 300 to form an arc shape.

[0036] The semiconductor heating element 300 cools on one side and heats on the other. When a hot compress is needed, the heating side faces the negative ion ceramic contact element 400, and the fan assembly 100 is not working. When a cold compress is needed, the cooling side faces the negative ion ceramic contact element 400, and the heating side faces the heat conduction element 200. The heat conduction element 200 transfers the heat from the heating side, and the fan assembly 100 dissipates the heat. Because of the use of the negative ion ceramic contact element 400, it can release negative ions, which can inhibit the growth of bacteria and viruses, improve skin quality, and make the skin more delicate and smooth. Furthermore, the ceramic material is gentler on the eye area, with a milder temperature and lower irritation. Compared to stainless steel and aluminum, its temperature is more suitable, and the microporous structure of ceramic allows for breathability and soothing. Additionally, the negative ion ceramic contact element 400 uses a curved contact shape, which can better conform to the human face.

[0037] Please refer to Figures 1-4 The fan assembly 100 includes a cooling fan 110 and a fan bracket 120. The fan bracket 120 is connected to the heat-conducting component 200 to fasten and fix the cooling fan 110. Preferably, the fan bracket 120 has a limiting groove 121, the top of the cooling fan 110 is embedded in the limiting groove 121, and the fan bracket 120 is screwed to the heat-conducting component 200 to fasten and fix the cooling fan 110.

[0038] Please refer to Figure 3 and Figure 4 The heat-conducting component 200 has a heat dissipation grid 210 in the middle, and a connecting part 220 is provided at each end of the heat dissipation grid 210. The connecting part 220 is fixedly connected to the negative ion ceramic contact component 400. The heat dissipation grid 210 is provided to facilitate airflow and thus remove heat during cooling.

[0039] Please refer to Figures 2-4 The system also includes a fixing base 500, which is mounted on the side of the heat-conducting component 200 facing away from the fan assembly 100. The fixing base 500 is fixedly connected to the heat-conducting component 200, and screws pass through the connecting part 220. The fixing base 500 is screwed to the negative ion ceramic contact 400. The fixing base 500 has a groove 410 for accommodating the semiconductor heating element 300. The fixing base 500 allows for better control of the gap between the heat-conducting component 200 and the negative ion ceramic contact 400, thereby making the semiconductor heating element 300 and the temperature measuring element 600 fit more closely to the negative ion ceramic contact 400 and the heat-conducting component 200, facilitating heat dissipation and temperature measurement. Preferably, the bottom of the heat dissipation grid 210 is connected by a connecting plate and protrudes downwards, and the fixing base 500 has a clearance hole 510 for its protrusion; preferably, the fixing base 500 has a limiting groove 520410 that matches the bottom of the connecting part 220. Preferably, the fixed base 500 has a mounting groove 530 on the side facing the negative ion ceramic contact 400 that is compatible with the temperature measuring element 600.

[0040] Please refer to Figures 3-4 It also includes a temperature sensing element 600, which is attached to one side of the negative ion ceramic contact element 400 facing the heat conduction element 200. Generally, the temperature sensing element 600 uses an NTC temperature sensor.

[0041] Please refer to Figure 3 and Figure 4 The heat-conducting component 200 is provided with a wire groove 230 for the leads of the semiconductor heating element 300 and the temperature measuring element 600 to extend out, facilitating electrical and signal connections.

[0042] Please refer to Figures 1-4 It also includes a connecting bracket 700, which is fastened to the side of the heat-conducting component 200 facing away from the negative ion ceramic contact component 400. The connecting bracket 700 is provided with a lug 710 for connecting to the outside. The connecting bracket 700 facilitates the installation of the hot / cold compress head onto an eye mask or other devices. Understandably, the middle of the connecting bracket 700 is hollow to allow heat dissipation from the heat-conducting component 200, facilitating the entry of air from the heat dissipation grid 210 into the cooling fan 110.

[0043] Please refer to Figures 1-4 It also includes a silicone sleeve 800, which is located between the connecting bracket 700 and the negative ion ceramic contact 400. The lower end of the silicone sleeve 800 is nested with the negative ion ceramic contact 400, and the upper end is nested with the connecting bracket 700. Several air vents 810 are provided on the side wall of the silicone sleeve 800. Understandably, the air vents 810 are connected to the heat dissipation grid 210. Simply put, the upper end of the silicone sleeve 800 has an upper limit groove 820, which is nested with the connecting bracket 700, and the lower end of the silicone sleeve 800 has a lower limit groove 830, which is nested with the negative ion ceramic contact 400.

[0044] Preferably, the negative ion ceramic contact element 400 includes tourmaline-type negative ion ceramic. Tourmaline-type negative ion ceramic can continuously release negative ions at room temperature, and the release of negative ions will accelerate as the temperature rises during heat application. After combining with oxygen in the air, negative ions can form negative oxygen ions that are beneficial to the human body, thus having a positive impact on human health. Generally, the negative ion ceramic contact 400 includes components such as kaolin, alumina, aluminum carbonate, titanium dioxide, and tourmaline negative ion powder; preferably, it takes 1 part kaolin, 91 parts alumina, 2 parts aluminum carbonate, 1 part titanium dioxide, and 5 parts tourmaline negative ion powder; the kaolin, alumina, aluminum carbonate, titanium dioxide, and tourmaline negative ion powder are thoroughly mixed evenly, and then a binder and CaO-Al2O3-SiO2 microcrystalline glass are added. The mixture is ball-milled in a planetary ball mill for 5-10 hours to obtain a slurry. Nitric acid is added and the mixture is ball-milled for another 1-2 hours. The pH is adjusted to 10-11 with ammonia water, stirred evenly, and then poured into a mold. The mold is placed in a constant temperature drying oven and solidified under certain temperature and humidity conditions. Finally, it is fired at 1200-1300℃ for 2-4 hours.

[0045] Please refer to Figure 3 The negative ion ceramic contact element is bent 400 degrees in the width direction. This allows it to fit the area around the eye bags, providing better massage.

[0046] Preferably, the negative ion ceramic contact 400 has a groove 410 inside and rounded corners on the outside. A boss 420 is provided within the groove 410 to fit against the semiconductor heating / cooling plate 300 and / or the temperature measuring element 600. Understandably, the fixing base 500 is located within the groove 410 so that the silicone sleeve 800 can be nested and connected to the negative ion ceramic contact 400.

[0047] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0048] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0049] In summary, this utility model provides a hot and cold compress head with a semiconductor heating element that cools on one side and heats on the other. When hot compress is needed, the heating surface faces the negative ion ceramic contact element, and the fan assembly does not operate. When cold compress is needed, the cooling surface faces the negative ion ceramic contact element, and the heating surface faces the heat conduction element. The heat conduction element transfers the heat from the heating surface, and the fan assembly dissipates the heat. Because it uses a negative ion ceramic contact element, it can release negative ions, which can inhibit the growth of bacteria and viruses, improve skin quality, and make the skin more delicate and smooth. Furthermore, the ceramic material is gentler on the under-eye area, with a more moderate temperature and lower irritation, making it more suitable for the temperature compared to stainless steel and aluminum. The microporous structure of the ceramic itself also allows for breathability and soothing. Additionally, the negative ion ceramic contact element uses an arc-shaped contact, which can better conform to the human face.

[0050] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A hot and cold compress head, characterized in that, include: Fan assembly; A heat-conducting component is disposed below the fan assembly; A semiconductor heating element is disposed on the side of the heat-conducting component facing away from the fan assembly; A negative ion ceramic contact is disposed on the side of the semiconductor heating element that faces away from the heat-conducting element, and the negative ion ceramic contact is recessed in the direction of the semiconductor heating element to form an arc shape.

2. The hot and cold compress head according to claim 1, characterized in that, The fan assembly includes a cooling fan and a fan bracket, and the fan bracket is connected to the heat-conducting component to fasten and fix the cooling fan.

3. The hot and cold compress head according to claim 1, characterized in that, The heat-conducting component has a heat dissipation grid in the middle, and a connecting part is provided at each end of the heat dissipation grid. The connecting part is fixedly connected to the negative ion ceramic contact component.

4. A hot and cold compress head according to claim 3, characterized in that, It also includes a fixing base, which is disposed on the side of the heat-conducting component facing away from the fan assembly. The fixing base is fixedly connected to the heat-conducting component, and screws pass through the connecting part. The fixing base is screwed to the negative ion ceramic contact. The fixing base has a groove for accommodating the semiconductor heating and cooling plate.

5. A hot and cold compress head according to claim 1, characterized in that, It also includes a temperature measuring element, which is attached to the side of the negative ion ceramic contact element facing the heat-conducting element.

6. A hot and cold compress head according to claim 5, characterized in that, The heat-conducting component is provided with a groove for the leads of the semiconductor heating element and the temperature measuring element to extend out.

7. A hot and cold compress head according to claim 1, characterized in that, It also includes a connecting bracket, which is fastened to the side of the heat-conducting component facing away from the negative ion ceramic contact, and the connecting bracket is provided with lugs for connecting to the outside.

8. A hot and cold compress head according to claim 7, characterized in that, It also includes a silicone sleeve, which is located between the connecting bracket and the negative ion ceramic contact. The lower end of the silicone sleeve is nested with the negative ion ceramic contact and the upper end is nested with the connecting bracket. The side wall of the silicone sleeve is provided with several air holes.

9. A hot and cold compress head according to claim 1, characterized in that, The negative ion ceramic contact includes tourmaline-type negative ion ceramic.

10. A hot and cold compress head according to claim 1, characterized in that, The negative ion ceramic contact is bent in the width direction.

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