A water vapor removal apparatus for semiconductor processing

Abstract

The utility model relates to the technical field of semiconductor processing equipment, concretely relates to a water vapour removal equipment for semiconductor processing, especially suitable for the processing technology that water vapour is bigger, effectively reduces the water vapour content in processing environment, reduces the influence of water vapour to processing device quality, specific, through drive assembly drive piston assembly reciprocating motion in refrigeration cylinder to drive refrigeration gas expansion work heat absorption and realize refrigeration, refrigeration cylinder and cold head assembly thermal contact, cold head assembly and cold piece thermal contact, that is, the low temperature formed by refrigeration gas work is transferred from refrigeration cylinder to cold head assembly, then is transferred from cold head assembly to cold piece, finally through the adsorption of cold piece to water vapour, reduces the water vapour in processing environment.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, and specifically to a water vapor removal device for semiconductor processing. Background Technology

[0002] In semiconductor processing, many processes require a vacuum environment to ensure the purity of the processing environment and reduce the adverse effects of unnecessary gases and other impurities on the quality of the final product. However, certain processes, such as vacuum deposition and chemical vapor deposition, can indirectly involve the generation or introduction of water vapor. Especially in processes with high water vapor content, the presence of water vapor can cause oxidation of silicon wafers or other metal materials, or carry tiny particles or organic contaminants that can affect the wafer, impacting the quality and accuracy of subsequent products. Therefore, based on these issues, it is necessary to remove water vapor from the processing environment in a timely manner. This application provides a water vapor removal device for semiconductor processing. Utility Model Content

[0003] The purpose of this invention is to provide a water vapor removal device for semiconductor processing, so as to solve the existing technical problems in the background art.

[0004] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows: a semiconductor processing water vapor removal device is provided, including a cooling cylinder, a piston assembly, a cold head assembly, and a cold plate. Cooling gas flows inside the cooling cylinder. The piston assembly is disposed inside the cooling cylinder and is driven to move by a drive assembly. The reciprocating motion of the piston assembly drives the cooling gas to do work to achieve cooling. One end of the cold head assembly is fixedly connected to the end of the cooling cylinder, and the other end is fixedly connected to the cold plate. The cold plate is used to capture water vapor.

[0005] Based on the above technical solution, the piston assembly includes a piston body, a copper mesh, and lead pellets. The piston body has an air inlet and an air outlet for cooling gas at both ends. The copper mesh is disposed inside the piston body and has multiple layers. The copper mesh is filled with lead pellets.

[0006] Based on the above technical solution, the cold head assembly includes a cold head body, a first connecting post and a second connecting post. The cold head body is fixedly disposed at the end of the refrigeration cylinder, the first connecting post is fixedly disposed at the top of the cold head body, and one end of the second connecting post is connected to the first connecting post and the other end is connected to the cold plate.

[0007] Based on the above technical solution, the first connecting post is cylindrical, the second connecting post is semi-cylindrical, and the cold plate is annular.

[0008] Based on the above technical solution, the drive assembly includes a drive motor, an eccentric shaft, an eccentric wheel, and a drive frame. The eccentric shaft is driven to rotate by the drive motor. The eccentric wheel is fixedly sleeved on the eccentric shaft and is disposed in the drive frame. The drive frame is connected to the piston body.

[0009] Based on the above technical solution, the refrigeration gas is controlled to enter and exit through a gas control device. The gas control device includes a base, an inlet valve, an outlet valve, and valve switches. The base is fixedly connected to the refrigeration cylinder. The inlet valve and outlet valve are respectively installed inside the base. The valve switches are respectively installed corresponding to the inlet valve and outlet valve to control the opening and closing of the inlet valve and outlet valve.

[0010] Based on the above technical solution, the valve switch includes a timing valve arm, a push pin, and an eccentric bearing. One side of the timing valve arm is connected to the inlet valve or the outlet valve through the push pin, and the other side abuts against the eccentric bearing, which is sleeved on the eccentric shaft.

[0011] Based on the above technical solution, the cooling gas is set as helium.

[0012] Based on the above technical solution, a cylinder shell is fitted on the outside of the refrigeration cylinder, and a regeneration mechanism is provided inside the cylinder shell. The regeneration mechanism is fixedly connected to the cold head assembly.

[0013] Based on the above technical solution, the regeneration mechanism is configured as an electric heating rod, one end of which is connected to a power source and the other end is fixedly connected to the cold head assembly.

[0014] The beneficial effects of the technical solution provided by this utility model are as follows: This invention provides a water vapor removal device for semiconductor processing, which is particularly suitable for processing processes with high water vapor content. It effectively reduces the water vapor content in the processing environment and reduces the impact of water vapor on the quality of processed devices. Specifically, a driving component drives a piston assembly to reciprocate within a cooling cylinder, thereby causing the cooling gas to expand, perform work, and absorb heat to achieve cooling. The cooling cylinder is in thermal contact with the cold head assembly, and the cold head assembly is in thermal contact with the cold plate. That is, the low temperature generated by the work done by the cooling gas is transferred from the cooling cylinder to the cold head assembly, and then from the cold head assembly to the cold plate. Finally, the water vapor is adsorbed by the cold plate, reducing the water vapor in the processing environment. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the structure of the present invention with the cylinder shell removed; Figure 3This is an internal cross-sectional view of the present invention; Figure 4 This is a schematic diagram of the structure of the cold head assembly in this utility model; Figure 5 This is a schematic diagram of the structure of the intercooler plate of this utility model; Detailed Implementation The present invention will be further described below with reference to the accompanying drawings and embodiments: In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0016] In the description of this utility model, it should be understood that the terms "left", "right", "front", "rear", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0017] like Figures 1 to 5 As shown, a semiconductor processing water vapor removal device includes a cooling cylinder 1, a piston assembly 2, a cold head assembly 3, and a cold plate 4. Cooling gas flows inside the cooling cylinder 1. The piston assembly 2 is disposed inside the cooling cylinder 1 and is driven to move by a drive assembly 5. The reciprocating motion of the piston assembly 2 drives the cooling gas to perform work to achieve cooling. One end of the cold head assembly 3 is fixedly connected to the end of the cooling cylinder 1, and the other end is fixedly connected to the cold plate 4. The cold plate 4 is used to capture water vapor.

[0018] This invention provides a water vapor removal device for semiconductor processing, which is particularly suitable for processing processes with high water vapor content. It effectively reduces the water vapor content in the processing environment and reduces the impact of water vapor on the quality of processed devices. Specifically, the piston assembly 2 is driven by the drive assembly 5 to reciprocate within the cooling cylinder 1, thereby causing the cooling gas to expand, do work, and absorb heat to achieve cooling. The cooling cylinder 1 is in thermal contact with the cold head assembly 3, and the cold head assembly 3 is in thermal contact with the cold plate 4. That is, the low temperature generated by the work done by the cooling gas is transferred from the cooling cylinder 1 to the cold head assembly 3, and then from the cold head assembly 3 to the cold plate 4. Finally, the water vapor is adsorbed by the cold plate 4, reducing the water vapor in the processing environment.

[0019] Based on the above technical solution, the piston assembly 2 includes a piston body 21, a copper mesh 22 and lead pellets. The piston body 21 has an air inlet and an air outlet for cooling gas at both ends. The copper mesh 22 is disposed inside the piston body 21 and has multiple layers. The copper mesh 22 is filled with lead pellets.

[0020] Preferably, the cooling gas is helium; By providing inlet and outlet ports at both ends of the piston body 21, refrigerant gas can flow within the piston body 21. A copper mesh 22, filled with lead particles, is installed within the piston body 21. The lead particles and the multi-layered, dense copper mesh serve to store cold and absorb heat, facilitating heat exchange with the passing helium gas, reducing temperature drift and fluctuations, and ensuring stable water vapor adsorption, thereby guaranteeing a stable processing environment. The lead particles also act as a filter, removing impurities from the helium gas during its flow and improving its efficiency. It is understood that the mesh diameter of the copper mesh is smaller than the diameter of the lead particles, thus limiting the range of the lead particles.

[0021] Based on the above technical solution, the cold head assembly 3 includes a cold head body 31, a first connecting post 32 and a second connecting post 33. The cold head body 31 is fixedly installed at the end of the refrigeration cylinder 1, the first connecting post 32 is fixedly installed at the top of the cold head body 31, and one end of the second connecting post 33 is connected to the first connecting post 31 and the other end is connected to the cold plate 4.

[0022] Based on the above technical solution, the first connecting post 32 is cylindrical, the second connecting post 33 is semi-cylindrical, and the cold plate 4 is annular.

[0023] Preferably, the cold head body 31 is adapted to the end structure of the refrigeration cylinder 1, that is, the part of the cold head body 31 located at the top of the refrigeration cylinder 1 is circular plate-shaped; at the same time, the low temperature of the cold head body 31 is transferred to the cold plate 4 through the first connecting post 32 and the second connecting post 33. More preferably, the first connecting post 32 is cylindrical and the second connecting post 33 is semi-cylindrical. The above structural configuration can maximize the transfer of low temperature and achieve good sealing performance.

[0024] More preferably, the first connecting post 32 and the second connecting post 33 are integrally formed and both are made of oxygen-free copper material, which facilitates installation.

[0025] More preferably, the cooling plate 4 is configured as a C-shaped ring plate, which is easy to capture water vapor.

[0026] Based on the above technical solution, the drive assembly 5 includes a drive motor 51, an eccentric shaft 52, an eccentric wheel 53, and a drive frame 54. The eccentric shaft 52 is driven to rotate by the drive motor 51. The eccentric wheel 53 is fixedly sleeved on the eccentric shaft 52. The eccentric wheel 53 is disposed in the drive frame 54. The drive frame 54 is connected to the piston body 21.

[0027] The drive frame 54 is arranged in a U-shape; the drive motor 51 drives the eccentric shaft 52 and the eccentric wheel 53 on it to move, which drives the drive frame 54 to reciprocate, thereby driving the piston body 21 to reciprocate, doing work on the helium gas, compressing the helium gas and absorbing heat during the compression and expansion process, reducing the temperature of the cold head, thereby realizing the adsorption of water vapor by the cold plate 4 at low temperature.

[0028] Based on the above technical solution, the refrigeration gas is controlled to enter and exit through a gas control device. The gas control device includes a base 61, an inlet valve, an outlet valve, and a valve switch 62. The base 61 is fixedly connected to the refrigeration cylinder 1. The inlet valve and the outlet valve are respectively installed in the base 61. The valve switch 62 is respectively installed corresponding to the inlet valve and the outlet valve to control the opening and closing of the inlet valve and the outlet valve.

[0029] Based on the above technical solution, the valve switch 62 includes a timing valve arm 621, a push pin 622, and an eccentric bearing 623. One side of the timing valve arm 621 is connected to the air inlet valve or the air outlet valve through the push pin 622, and the other side abuts against the eccentric bearing 623. The eccentric bearing 623 is sleeved on the eccentric shaft 52.

[0030] It is understood that two eccentric bearings are fitted on the eccentric shaft 52 corresponding to the intake valve and the exhaust valve. Correspondingly, two valve swing arms are provided, one on each side of the intake valve or the other on the exhaust valve. During the rotation of the eccentric shaft driven by the drive motor, the different eccentric bearings on it drive different valves to realize the intake or exhaust process. Based on the above technical solution, the cooling gas is set as helium.

[0031] Based on the above technical solution, a cylinder shell 11 is sleeved on the outside of the refrigeration cylinder 1, and a regeneration mechanism 7 is provided inside the cylinder shell 11. The regeneration mechanism 7 is fixedly connected to the cold head assembly 3.

[0032] Based on the above technical solution, the regeneration mechanism 7 is configured as an electric heating rod, one end of which is connected to a power source and the other end is fixedly connected to the cold head assembly.

[0033] In a preferred embodiment, the electric heating rod is disposed through the cylinder housing 11, with one end connected to a power source and the other end connected to the cold head assembly 3. By providing the electric heating rod, the cold head assembly 3 and its connected cold plate 4 structure can be heated. When the device needs to be regenerated and maintained, the water vapor adsorbed on the cold plate can be released, and it is convenient to remove any impurities that may be adsorbed on the cold plate, making it more convenient to use.

[0034] The foregoing has shown and described the basic principles and main features of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments. Therefore, the embodiments should be regarded as exemplary and non-limiting. The scope of this utility model is defined by the appended claims rather than the foregoing description. Therefore, it is intended to include all changes that fall within the meaning and scope of the equivalents of the claims within this utility model.

[0035] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A water vapor removal device for semiconductor processing, characterized in that, The device includes a refrigeration cylinder (1), a piston assembly (2), a cold head assembly (3), and a cold plate (4). Refrigeration gas flows inside the refrigeration cylinder (1). The piston assembly (2) is located inside the refrigeration cylinder (1) and is driven to move by a drive assembly (5). The reciprocating motion of the piston assembly (2) drives the refrigeration gas to do work and achieve refrigeration. One end of the cold head assembly (3) is fixedly connected to the end of the refrigeration cylinder (1), and the other end is fixedly connected to the cold plate (4). The cold plate (4) is used to capture water vapor.

2. The semiconductor processing water vapor removal equipment according to claim 1, characterized in that, The piston assembly (2) includes a piston body (21), a copper mesh (22) and lead pellets. The piston body (21) has an air inlet and an air outlet for cooling gas at both ends. The copper mesh (22) is located inside the piston body (21) and has multiple layers. The copper mesh (22) is filled with lead pellets.

3. The semiconductor processing water vapor removal equipment according to claim 1, characterized in that, The cold head assembly (3) includes a cold head body (31), a first connecting post (32) and a second connecting post (33). The cold head body (31) is fixedly installed at the end of the refrigeration cylinder (1). The first connecting post (32) is fixedly installed at the top of the cold head body (31). One end of the second connecting post (33) is connected to the first connecting post (32), and the other end is connected to the cold plate (4).

4. The semiconductor processing water vapor removal equipment according to claim 3, characterized in that, The first connecting post (32) is cylindrical, the second connecting post (33) is semi-cylindrical, and the cold plate (4) is annular.

5. A semiconductor processing water vapor removal device according to claim 1, characterized in that, The drive assembly (5) includes a drive motor (51), an eccentric shaft (52), an eccentric wheel (53), and a drive frame (54). The eccentric shaft (52) is driven to rotate by the drive motor (51). The eccentric wheel (53) is fixedly sleeved on the eccentric shaft (52). The eccentric wheel (53) is disposed in the drive frame (54). The drive frame (54) is connected to the piston body (21).

6. The semiconductor processing water vapor removal equipment according to claim 1, characterized in that, The refrigeration gas is controlled by a gas control device. The gas control device includes a base (61), an inlet valve, an outlet valve, and a valve switch (62). The base (61) is fixedly connected to the refrigeration cylinder (1). The inlet valve and the outlet valve are respectively installed in the base (61). The valve switch (62) is respectively installed corresponding to the inlet valve and the outlet valve to control the opening and closing of the inlet valve and the outlet valve.

7. A semiconductor processing water vapor removal device according to claim 6, characterized in that, The valve switch (62) includes a timing valve arm (621), a push pin (622), and an eccentric bearing (623). One side of the timing valve arm (621) is connected to the inlet valve or the outlet valve through the push pin (622), and the other side abuts against the eccentric bearing (623). The eccentric bearing (623) is sleeved on the eccentric shaft (52).

8. A semiconductor processing water vapor removal apparatus according to any one of claims 1 to 7, characterized in that, The cooling gas is helium.

9. A semiconductor processing water vapor removal device according to claim 1, characterized in that, The outer side of the refrigeration cylinder (1) is fitted with a cylinder shell (11), and a regeneration mechanism (7) is provided inside the cylinder shell (11). The regeneration mechanism (7) is fixedly connected to the cold head assembly (3).

10. A semiconductor processing water vapor removal device according to claim 9, characterized in that, The regeneration mechanism (7) is configured as an electric heating rod, one end of which is connected to a power source and the other end is fixedly connected to the cold head assembly.

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