Anti-condensation structure of temperature test chamber

Abstract

The utility model relates to the technical field of test tool especially is related to a temperature test case's anti -condensation structure, it includes the shell, the shell outside is equipped with the temperature -raising spare, the utility model discloses an anti -condensation structure can when carrying out low temperature test, through the temperature -raising spare heating to the plug -in spare, when the low temperature test of inside work piece is carried out, makes the outside air difficultly condensation backflow.

Description

Technical Field

[0001] This utility model relates to the technical field of testing tools, and in particular to an anti-condensation structure for a temperature test chamber. Background Technology

[0002] High and low temperature test chambers are used to conduct reliability tests on industrial products at high and low temperatures. They are used to test the performance of components and materials of related products in electronics, electrical engineering, automobiles, motorcycles, aerospace, shipbuilding, weaponry, universities, and research institutions under high and low temperature cycling conditions.

[0003] The development of the chip industry today requires testing of semiconductor materials such as chips. Testing these components requires internal power-on testing, and sometimes it is necessary to transmit internal data in real time. Therefore, the test chamber needs to be connected to external devices through a transmission port to transmit data.

[0004] During low-temperature testing, external air may condense at the transmission port and flow back, affecting the test results or even damaging the components. Summary of the Invention

[0005] In view of the shortcomings of the existing technology, one of the purposes of this utility model is to provide an anti-condensation structure for a temperature test chamber that makes it difficult for the external air of the test chamber to condense and flow back.

[0006] The above-mentioned objective of this utility model is achieved through the following technical solution: An anti-condensation structure for a temperature test chamber includes an outer shell, and a heating element is provided on the outside of the outer shell.

[0007] In a further embodiment of the anti-condensation structure of a temperature test chamber according to the present invention, the heating element is wound in a coil shape around the outside of the connector.

[0008] In a further embodiment of the anti-condensation structure of the temperature test chamber of this utility model, a PCB board is placed inside the outer shell, and barrier components are installed on both sides of the PCB board. The barrier components are more hydrophilic than the PCB board.

[0009] In a further embodiment of the anti-condensation structure of the temperature test chamber of this utility model, the barrier components are arranged in a sequential layer.

[0010] In a further embodiment of the anti-condensation structure of a temperature test chamber according to the present invention, a connecting cavity is provided in the base frame, the plug-in is located in the connecting cavity, the connecting cavity is provided with a transmission port, and the PCB board in the plug-in is connected to the transmission port.

[0011] In summary, this utility model has at least one of the following beneficial technical effects: The anti-condensation structure of this utility model can heat the connector through the heating element during low-temperature testing, making it difficult for external air to condense and flow back when the internal workpiece is being tested at low temperatures. The anti-condensation structure of this utility model is equipped with a positioning post, which can cooperate with the test plate on which the workpiece is placed to quickly position the PCB board and the test plate for insertion. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of one embodiment of the anti-condensation structure of a temperature test chamber disclosed in this utility model. Figure 2 This is a side view of one embodiment of an anti-condensation structure for a temperature test chamber disclosed in this utility model. Figure 3 yes Figure 2 Sectional view of AA; In the picture, 1. Outer shell; 11. Inner opening; 12. Outer interface; 2. PCB board; 3. Heating components; 4. Barrier components; 5. Fixed layer; 51. Positioning column. Detailed Implementation

[0013] The present invention will be further described in detail below with reference to the accompanying drawings.

[0014] Reference Figures 1-3 This utility model discloses an anti-condensation structure for a temperature test chamber, comprising an outer shell 1 and an internal PCB board 2. The outer shell 1 is rectangular with openings on both sides for connecting to the interfaces of the PCB board 2. The opening at one end of the PCB board 2, used to connect with the test workpiece, is called an inner opening 11, and the opening at the other end of the PCB board 2, used to connect with external equipment for transmitting test data, is called an outer interface 12. Specifically, a heating element 3 is wrapped around the outside of the outer shell 1. The heating element 3 is coiled around the outside of the connector and can be selected as an electric heating wire that heats up when energized. By heating the connector through the heating element 3, when the internal workpiece is subjected to low-temperature testing, it is difficult for external air to condense and flow back, thus affecting the test.

[0015] Barrier components 4 are placed on both sides of the PCB board 2. The barrier components 4 are more hydrophilic than the PCB board 2. The barrier components 4 can be made of wool felt or other materials with strong water absorption. By placing the barrier components 4, condensation backflow is further reduced. Of course, the barrier components 4 can be set in multiple layers and placed in sequence to further improve the anti-condensation effect.

[0016] A fixing layer 5 is placed between the barrier 4 and the outer casing 1, and the barrier 4 is locked in place by the fixing layers 5 on both sides. The fixing layer 5 can be made of an insulating solid material such as plastic.

[0017] The fixing layer 5 extends from the side wall of the inner opening 11 with several positioning posts 51. The positioning posts 51 can cooperate with the test plate on which the workpiece is placed, so as to quickly position the PCB board 2 and the test plate for insertion.

[0018] Specifically, the openings at both ends of the outer shell 1 are bent, which increases the contact area between the outer shell 1 and the inner back plate, as well as between the outer shell 1 and the outer back plate, thus facilitating the fixing of the outer shell 1. Specifically, the outer shell 1 can be fixed at the bent locations using bolts; of course, other fixing methods such as welding can also be used.

[0019] The implementation principle of this embodiment is as follows: heating is performed by heating element 3. When the test workpiece is tested at low temperature, the anti-condensation structure of this utility model makes it difficult for external air to condense and flow back.

[0020] The embodiments described herein are preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape, and principle of this utility model should be included within the scope of protection of this utility model.

Claims

1. An anti-condensation structure for a temperature test chamber, characterized in that: It includes an outer shell (1), and a heating element (3) is provided on the outside of the outer shell (1); The heating element (3) is wrapped in a coil around the outside of the connector; The outer casing (1) contains a PCB board (2), and barrier components (4) are installed on both sides of the PCB board (2). The barrier components (4) are more hydrophilic than the PCB board (2).

2. The anti-condensation structure of a temperature test chamber according to claim 1, characterized in that: The barrier elements (4) are arranged in a series of layers.

3. The anti-condensation structure of a temperature test chamber according to claim 2, characterized in that: It is also equipped with several positioning posts (51), which can cooperate with the test plate on which the workpiece is placed.

Images