A real-time particle removal device for vacuum chambers based on electrostatic attraction

Abstract

The utility model relates to a kind of real-time particle removal devices of vacuum chamber based on electrostatic adsorption, including plasma generator, power supply, first electrostatic dust collection component for being arranged on the inner side wall of vacuum chamber and second electrostatic dust collection component for being arranged near the sample holder of vacuum chamber, wherein first electrostatic dust collection component includes first electrode plate and second electrode plate, and insulating collection plate, and first electrostatic field is formed between first electrode plate and second electrode plate;Second electrostatic dust collection component includes first electrode ring and for second electrode ring, dust collection groove extending in ring is opened on the upper end face of first electrode ring and second electrode ring, and second electrostatic field is formed between first electrode ring and second electrode ring. Continuously remove the particle around side wall and sample holder, with the advantage that film processing quality and equipment operation stability are significantly improved.

Description

Technical Field

[0001] This utility model relates to the field of vacuum chamber internal cleaning technology using magnetron sputtering, and more particularly to a real-time particle removal device for vacuum chambers based on electrostatic adsorption. Background Technology

[0002] In the field of micro-nano fabrication, ultra-high vacuum magnetron sputtering equipment has become a common method for depositing metal thin films due to its ability to precisely control the composition and thickness of the film. The cleanliness of the vacuum chamber plays a decisive role in product quality. However, in order to maintain the high vacuum environment of the equipment, the frequency of opening the chamber must be kept at a low level, which makes the potential problems accumulated during long-term operation gradually become apparent.

[0003] When high-energy particles bombard a target material, impurities and lattice defects on the target surface become the most vulnerable areas, easily generating micron-sized particle spatter. These particles adhere and deposit on the sidewalls of the vacuum chamber, forming potential sources of contamination. Over time, vibrations from equipment operation and thermal stress caused by temperature changes can cause particles attached to the sidewalls and around the sample holder to detach and fall onto the surface of the sample being processed. These particles not only directly cause protrusion defects on the film surface, damaging the film's smoothness and uniformity, but also affect the film's electrical and optical properties. For example, in semiconductor chip manufacturing, particles may cause short circuits or unstable device performance; in optical thin film preparation, particles increase light scattering, reducing the film's transmittance and laser damage threshold. The increase in particle count directly leads to a significant decrease in sample yield. More challenging is that, due to the low frequency of chamber opening, particle contamination is difficult to detect and clean in a timely manner. As equipment operating time increases, particle contamination grows non-linearly, further exacerbating the fluctuations in sample quality between batches.

[0004] Therefore, solving the problem of particulate contamination on the sidewalls of the vacuum chamber and the sample holder in ultra-high vacuum magnetron sputtering equipment has become the key to ensuring the quality and production efficiency of micro-nano fabricated products. Utility Model Content

[0005] In view of this, the present invention provides a real-time particle removal device for a vacuum chamber based on electrostatic adsorption to solve the technical problem of particle contamination on the sidewalls of the vacuum chamber and the sample holder.

[0006] The vacuum chamber real-time particle removal device based on electrostatic adsorption includes a plasma generator, a power supply, a first electrostatic dust collection assembly arranged on the inner wall of the vacuum chamber, and a second electrostatic dust collection assembly arranged near the sample holder in the vacuum chamber.

[0007] The first electrostatic dust collection assembly includes a first electrode plate and a second electrode plate arranged vertically at intervals, and an insulating collection plate placed horizontally between the first electrode plate and the second electrode plate. The first electrode plate and the second electrode plate are respectively connected to the positive and negative terminals of the power supply to form a first electrostatic field between the first electrode plate and the second electrode plate.

[0008] The second electrostatic dust collection assembly includes a first electrode ring arranged circumferentially on the inner side of the sample holder and a second electrode ring arranged circumferentially on the outer side of the sample holder. Both the first electrode ring and the second electrode ring have circumferentially extending dust collection grooves on their upper end surfaces. The first electrode ring and the second electrode ring are respectively connected to the positive and negative terminals of the power supply to form a second electrostatic field between the first electrode ring and the second electrode ring.

[0009] In one embodiment, the insulating collecting plate has a U-shaped collecting groove at its upper end, and the first electrode plate and the second electrode plate are vertically inserted into the U-shaped collecting groove.

[0010] In one embodiment, there are two or more of the first electrode plate and the second electrode plate, which are arranged alternately in the transverse direction within the U-shaped collection groove of the insulating collection plate.

[0011] In one embodiment, the bottom surface of the U-shaped collection trough is provided with several horizontally spaced insertion holes, and the first electrode and the second electrode plate are sequentially embedded in each insertion hole.

[0012] In one embodiment, there are two or more insulating collection plates arranged at intervals along the vertical direction.

[0013] In one embodiment, the first electrostatic dust collection assembly includes two horizontally extending electrode mounting plates, with the upper and lower ends of the first and second electrode plates respectively fixed to the two electrode mounting plates. Connecting guide posts are provided on the electrode mounting plates at the connection points of the first and second electrode plates.

[0014] In one embodiment, there are multiple first electrostatic dust collection components, which are attached to and distributed on the inner walls of the vacuum chamber.

[0015] In one embodiment, the radial cross-sections of the first electrode ring and the second electrode ring are both arc-shaped structures, with the openings of the arc-shaped structures facing upwards, thus forming the dust collection groove inside.

[0016] In one embodiment, the top surface height of the first electrode ring and the second electrode ring is lower than the top surface height of the sample holder.

[0017] In one embodiment, both the bottom of the first electrode ring and the second electrode ring are connected to a lead post.

[0018] Compared with the prior art, the advantages of this invention are as follows: by designing a plasma generator, a first electrostatic dust collection component, and a second electrostatic dust collection component inside the vacuum chamber, the particulate contaminants inside the vacuum chamber are adsorbed in real time through the synergistic effect of the dual electrostatic fields. This allows for the continuous removal of particles from the side walls and around the sample holder while maintaining the vacuum level, which has the advantages of significantly improving the quality of thin film processing and the stability of equipment operation.

[0019] Furthermore, when micron-sized particles are generated within the vacuum chamber, these particles become charged through collisions with charged ions. Due to the principle of like charges repelling and unlike charges attracting, the charged particles rapidly move towards the insulating collection plate and dust collection tank under the influence of the electrostatic field and are adsorbed, thus achieving the real-time removal of micron-sized particles. Employing electrostatic adsorption in a vacuum environment, this method can precisely capture particles as small as micron-sized, offering higher removal efficiency for tiny particles compared to traditional filtration methods. The device can operate synchronously with the vacuum chamber, allowing for continuous operation without shutdown, significantly improving production efficiency and effectively ensuring the cleanliness of the chamber. This provides a stable and reliable environment for precision machining processes, which is of great significance for improving product yield and reducing production costs. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of the vacuum chamber real-time particle removal device based on electrostatic adsorption provided in Embodiment 1 of this utility model;

[0022] Figure 2 yes Figure 1 A schematic diagram of the structure of the first electrostatic dust collection component in China;

[0023] Figure 3 for Figure 1 A schematic diagram of the structure of the second electrostatic dust collection component;

[0024] Figure 4 for Figure 3 A half-section view.

[0025] The following is a table explaining the reference numerals in the attached figures:

[0026] Detailed Implementation

[0027] In the following description, specific details such as particular system structures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the present invention. However, those skilled in the art will understand that the present invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0028] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0029] It should also be understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0030] As used in this specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrases "if determined" or "if [the described condition or event] is detected" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once [the described condition or event] is detected," or "in response to detection of [the described condition or event]."

[0031] Furthermore, in the description of this utility model specification and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0032] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of the present invention include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0033] To illustrate the technical solution of this utility model, specific embodiments are described below.

[0034] This utility model provides a vacuum chamber real-time particle removal device based on electrostatic adsorption. Based on the physical property that charged particles are subjected to Coulomb force in an electrostatic field, the device attempts to use the electrostatic field to adsorb and capture particles. In order to achieve comprehensive coverage of different areas in the vacuum chamber 1, planar dust collection structures are arranged on the inner sidewall of the vacuum chamber 1, and annular dust collection structures are arranged around the sample holder 4.

[0035] Specifically, such as Figure 1 As shown, the device includes a plasma generator 22, a power supply 11, a first electrostatic dust collection assembly 9 arranged on the inner wall of the vacuum chamber 1, and a second electrostatic dust collection assembly 10 arranged near the sample holder 4 of the vacuum chamber 1.

[0036] The aforementioned vacuum chamber 1 includes an outer shell 2. The inner chamber enclosed by the outer shell 2 is a rectangular chamber with four side walls. Each side wall of the outer shell 2 is fixed with an insulating layer 3 to isolate the internal particle removal device from the outside environment, preventing the conduction of charge or damage to equipment components. The outer shell 2 is equipped with: an argon inlet / outlet 23 to provide inert argon gas for particle removal; an observation window 5 to view the internal working status of the chamber; a vacuum system for evacuating the equipment; a vacuum gauge 7 for real-time monitoring of the vacuum value; a rupture valve 8 to break the vacuum in the chamber; a door 6 that can be opened at atmospheric pressure for sample loading / unloading and particle collection; and a sample holder 4 placed in the center of the vacuum chamber 1 to hold the sample.

[0037] The plasma generator 22 is a device that generates charged particles by ionizing gas. Specifically, it can be achieved by radio frequency discharge or DC discharge, which charges the particles in the vacuum chamber 1. In this application, it mainly ionizes argon gas to generate a large number of charged ions, which collide with the particles inside the chamber and thus charge the particles.

[0038] The high-voltage power supply provides AC high-voltage power to establish a potential difference between the electrodes. In this application, it is used to provide ±10KV high voltage, which can generate a stable high voltage and provide an energy basis for electrostatic adsorption.

[0039] And the first electrostatic dust collection component 9, as Figure 2 As shown, it includes a first electrode plate 12 and a second electrode plate 13 arranged vertically at intervals, and an insulating collection plate 14 placed horizontally between the first electrode plate 12 and the second electrode plate 13. The first electrode plate 12 and the second electrode plate 13 are respectively connected to the positive and negative terminals of the power supply 11 to form a first electrostatic field between the first electrode plate 12 and the second electrode plate 13. This electrostatic field is a planar electrostatic field.

[0040] The first electrode plate 12 and the second electrode plate 13 are both conductive plate structures, which can be made of materials such as stainless steel or titanium alloy. They are arranged at intervals to form an electric field gradient. The positive and negative terminals of the power supply 11 are connected to the first and second electrodes respectively, so that a planar electrostatic field is formed between the two plate surfaces. The insulating collecting plate 14 has an insulating bearing structure, which can be made of ceramic or plastic material, and is used to capture charged particles and prevent charge leakage.

[0041] The second electrostatic dust collection component 10, as... Figure 3 As shown, the sample holder 4 includes a first electrode ring 15 arranged circumferentially on the inner side of the sample holder 4, and a second electrode ring 16 arranged circumferentially on the outer side of the sample holder 4. Both the first electrode ring 15 and the second electrode ring 16 have circumferentially extending dust collection grooves 17 on their upper end surfaces. The first electrode ring 15 and the second electrode ring 16 are respectively connected to the positive and negative terminals of the power supply 11 to form a second electrostatic field between the first electrode ring 15 and the second electrode ring 16. This electrostatic field is a ring-shaped electrostatic field.

[0042] The annular conductive structure of the first electrode ring 15 and the second electrode ring 16 can be realized using a copper alloy ring component, forming a radial electric field distribution through the inner and outer rings. The dust collection groove 17 is an annular recess structure opened at the upper end of the electrode rings, which can be formed by machining, bending, injection molding, etc., and is used to collect particles that are subjected to electric field forces between the electrode rings.

[0043] In practice, the argon inlet / outlet 23 is opened, the equipment begins to circulate gas, and the plasma generator 22 is turned on. The argon gas is ionized, generating a large number of free electrons and ions. After running for five minutes, the free electrons and ions collide with micron-sized particles and become charged (positive or negative). The charged particles move towards the dust collection assembly under the influence of the electric field. The first electrostatic dust collection assembly 9 generates Coulomb force through the strong electric field between the positive and negative electrode plates, and the charged particles are adsorbed between the first electrode plate 12 and the second electrode plate 13. After that, the power is turned off, and the particles fall onto the surface of the insulating collection plate 14. The second electrostatic dust collection assembly 10 uses the electrode ring surrounding the sample holder 4 to form a ring electric field to capture particles near the sample processing area. When the high-voltage power supply is stopped, the particles are stored in the corresponding collection plate and dust collection tank 17. The vent valve 8 is opened, and after the gas pressure reaches the required level, the hatch 6 is opened to clean the particles in the collection plate and dust collection tank 17, maintaining the adsorption efficiency. The two dust collection components work together to purify a large area of ​​the side wall of the vacuum chamber 1 and a local area of ​​the sample rack 4. They operate continuously during equipment operation and can remove particles without breaking the vacuum.

[0044] Compared to traditional periodic open-cavity cleaning, which cannot solve the problem of dynamic particle shedding, this method employs an electrostatic field active adsorption mechanism to achieve real-time particle capture within a sealed vacuum chamber, preventing contamination accumulation. The dual dust collection component design overcomes the spatial limitations of single dust collection methods, eliminates cleaning blind spots present in traditional methods, effectively prevents particle shedding and contamination of the sample surface, and ensures the uniformity and density of the film deposition.

[0045] In one embodiment, for the dust collection plate, a U-shaped collection groove 19 is provided at the upper end of the insulating collection plate 14 to achieve particle collection. The first electrode plate 12 and the second electrode plate 13 are vertically inserted into the U-shaped collection groove 19. By designing the groove structure, the electrode plates are installed and limited, while forming a continuous particle collection area. The first electrode plate 12 and the second electrode plate 13 are vertically inserted into the collection groove, forming a stable and continuous connection structure with the insulating material through physical interlocking, thereby ensuring the uniformity and stability of the electrostatic field distribution. During the operation of the vacuum chamber 1, when charged particles move to the area of ​​the first electrostatic dust collection component 9, the continuous groove structure of the U-shaped collection groove 19 can guide the particles to settle along the groove wall. At the same time, by adopting the insertion form, when the electrode plates are energized, the electrostatic field coverage extends to the bottom of the groove. Charged particles in the entire range between the electrode plates are adsorbed above the U-shaped collection groove 19 under the action of the electric field. In addition, the two side walls of the U-shaped collection groove 19 can also clamp the electrode plates to prevent the electrode plates from shifting due to equipment vibration.

[0046] In one embodiment, there are more than two first electrode plates 12 and second electrode plates 13, and the first electrode plates 12 and second electrode plates 13 are arranged alternately in the transverse direction within the U-shaped collection groove 19 of the insulating collection plate 14.

[0047] like Figure 2 As shown, three first electrode plates 12 and four second electrode plates 13 can be designed. All first electrode plates 12 are connected to the positive terminal of the power supply 11, and all second electrode plates 13 are connected to the negative terminal of the power supply 11. More plates can also be designed; there is no specific limitation. The first electrode plates 12 and second electrode plates 13 are arranged alternately along the interval direction. By increasing the number of electrode plates and the staggered layout, a denser electrostatic field distribution is further formed. The staggered electrode plates form a multi-level electric field gradient in the lateral space. Particles are adsorbed onto the surface of the insulating collection plate 14 under the action of the electric field. Due to the increased number of electrode plates and their compact layout, the electrostatic field coverage extends to a larger area of ​​the chamber sidewall, thereby improving particle adsorption efficiency. Through the staggered layout of multiple electrodes, a denser electric field network is formed in the same space, significantly enhancing the capture capability of micron-sized particles, while avoiding the problem of electric field strength attenuation caused by excessively large electrode spacing.

[0048] In one embodiment, the bottom surface of the U-shaped collection groove 19 of the insulating collection plate 14 has transversely spaced insertion holes, into which the first electrode plate 12 and the second electrode plate 13 are sequentially embedded. The first electrode plate 12 and the second electrode plate 13 are alternately inserted into adjacent insertion holes, forming an alternating positive and negative electrode arrangement. Under the action of the power supply 11, a stable electrostatic field is generated between adjacent electrode plates, attracting charged particles in the vacuum chamber 1 to accumulate on the surface of the insulating collection plate 14. The insertion hole structure physically constrains the position of the electrode plates, preventing displacement due to equipment vibration or temperature changes, thereby maintaining the uniformity of the electrostatic field and dust collection efficiency.

[0049] In one embodiment, there are two or more insulating collecting plates 14, arranged at intervals along the vertical direction. Multiple insulating collecting plates 14 are arranged at certain intervals in the vertical direction, and each layer of insulating collecting plates 14 has staggered first electrode plates 12 and second electrode plates 13 inserted into its U-shaped collecting groove 19. When the power supply 11 applies voltage, superimposed electrostatic field regions are formed between the electrode plates, covering different height ranges of the sidewall of the vacuum chamber 1. When particles are carried by the airflow through the multi-layered electrostatic field, they are adsorbed step by step into the U-shaped grooves of the insulating collecting plates 14, thereby achieving gradient capture of particles in the vertical space. The vertical multi-layered arrangement creates a continuous electrostatic field region in the vertical direction, significantly expanding the particle adsorption range, and is particularly suitable for random particle diffusion paths caused by vibration or thermal stress on the sidewall of the vacuum chamber 1.

[0050] In one embodiment, the first electrostatic dust collection assembly 9 includes two horizontally extending electrode mounting plates 18. The upper and lower ends of the first electrode plate 12 and the second electrode plate 13 are respectively fixed to the two electrode mounting plates 18. Connecting guide posts 20 are provided on the electrode mounting plates 18 at the connection points of the first electrode plate 12 and the second electrode plate 13. The electrode mounting plates 18 are used to provide a stable mounting base for the electrode plates and prevent the electrode plates from shifting due to vibration or thermal stress.

[0051] Upper and lower electrode mounting plates 18 extend laterally along the inner wall of the cavity, and the first electrode plate 12 and the second electrode plate 13 are mechanically fixed between the two plates. When the power supply 11 applies voltage, an electrostatic field is formed between the electrode plates, adsorbing particulate contaminants suspended in the vacuum cavity. The connecting guide post 20 is embedded in the contact interface between the electrode mounting plate 18 and the electrode plates to ensure the stability of the current transmission path. When the equipment vibrates or the temperature changes, the rigid support of the electrode mounting plate 18 can suppress the swaying of the electrode plates and avoid electrostatic field distortion caused by mechanical deformation, thereby maintaining the particle adsorption efficiency.

[0052] In one embodiment, there are multiple first electrostatic dust collection components 9, which are attached and distributed on the inner walls of the vacuum chamber 1. The attachment and distribution can be achieved by fixing brackets or magnetic attraction. Each unit includes staggered electrode plates and insulating collection plates 14, thereby forming an electrostatic field covering different areas.

[0053] Each component is powered independently or in parallel by power supply 11, forming an electrostatic field between the electrode plates. When adhering particles detach from the sidewall of the vacuum chamber 1 due to vibration or thermal stress, the electrostatic field at different locations can simultaneously capture the dispersed particles, preventing them from diffusing towards the sample holder 4. This significantly increases the coverage area of ​​the electrostatic field, making it particularly suitable for vacuum chambers 1 with complex geometries, such as polygonal or curved cavity structures, enabling directional adsorption to address the risk of particle detachment in different areas.

[0054] In one embodiment, for the second electrostatic dust collection assembly 10, both the first electrode ring 15 and the second electrode ring 16 have arc-shaped cross-sections, with the openings of the arc-shaped structures facing upwards, thus forming the dust collection groove 17 inside. The cross-section of the electrode ring has a curved geometric shape, specifically, it can be achieved using a circular arc segment with a radius ranging from 50 to 200 mm. This shape can enhance the electric field intensity distribution at the edge of the electrode ring. The recessed area formed on the top surface of the electrode ring constitutes the dust collection groove 17. A continuous groove with a depth of 3-8 mm can be machined on the upper end face of the electrode ring by machining or stamping. This structure can increase the contact area between particles and the electrode surface.

[0055] The arc-shaped cross-section design of the first electrode ring 15 and the second electrode ring 16 creates a localized enhancement effect of the electric field lines in the dust collection tank 17 region. When charged particles move with the airflow to the sample holder 4 region, the non-uniform electrostatic field generated by the arc-shaped electrodes can guide the particles to migrate into the dust collection tank 17. The upward-opening structure of the dust collection tank 17 forms a semi-enclosed space, which can effectively capture particles that have fallen off due to equipment vibration or thermal stress, preventing them from re-suspending. The synergistic effect of the arc-shaped electrodes and the dust collection tank 17 confines the particles to a specific area, preventing them from diffusing within the vacuum chamber 1, thereby ensuring the stability of the thin film deposition process.

[0056] In one embodiment, the top surface height of the first electrode ring 15 and the second electrode ring 16 is lower than the top surface height of the sample holder 4. By controlling the range of the electrostatic field, particles are prevented from falling directly from above the sample holder 4 without being captured.

[0057] The first electrode ring 15 and the second electrode ring 16 are respectively encircled on the inner and outer sides of the sample holder 4, forming a ring-shaped electrostatic field between them. When the top surface of the electrode ring is lower than the top surface of the sample holder 4, the effective area of ​​the electrostatic field is limited to the space to the side and below the sample holder 4. When particles move downwards under the influence of gravity or airflow, they are preferentially captured by the dust collection tank 17. For example, during magnetron sputtering, when particles detach from the surface of the sample holder 4 move downwards, they will be attracted to the dust collection tank 17 by the electrostatic field formed by the electrode rings and will not bounce back to the sample surface. The height difference between the top surface of the electrode ring and the top surface of the sample holder 4 can be 5-20 mm. This distance ensures that the electrostatic field effectively covers the falling path of the particles without interfering with the load-bearing function of the sample holder 4.

[0058] In one embodiment, both the bottom of the first electrode ring 15 and the second electrode ring 16 are connected to lead posts 21. The lead posts 21 are located at the bottom of the electrode ring and are directly connected to the power supply line. The electrode ring is subjected to more uniform force. During the operation of the equipment, the mechanical stress caused by vibration or temperature changes can be effectively dispersed through the bottom connection structure, avoiding breakage or loosening of the electrode ring and the lead contact point due to stress concentration, thereby maintaining the continuous stability of the electrostatic field.

[0059] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A vacuum chamber real-time particle removal device based on electrostatic adsorption, characterized in that, It includes a plasma generator, a power supply, a first electrostatic precipitator mounted on the inner wall of the vacuum chamber, and a second electrostatic precipitator mounted near the sample holder in the vacuum chamber. The first electrostatic dust collection assembly includes a first electrode plate and a second electrode plate arranged vertically at intervals, and an insulating collection plate placed horizontally between the first electrode plate and the second electrode plate. The first electrode plate and the second electrode plate are respectively connected to the positive and negative terminals of the power supply to form a first electrostatic field between the first electrode plate and the second electrode plate. The second electrostatic dust collection assembly includes a first electrode ring arranged circumferentially on the inner side of the sample holder and a second electrode ring arranged circumferentially on the outer side of the sample holder. Both the first electrode ring and the second electrode ring have circumferentially extending dust collection grooves on their upper end surfaces. The first electrode ring and the second electrode ring are respectively connected to the positive and negative terminals of the power supply to form a second electrostatic field between the first electrode ring and the second electrode ring.

2. The vacuum chamber real-time particle removal device based on electrostatic adsorption according to claim 1, characterized in that, The insulating collecting plate has a U-shaped collecting groove at its upper end, and the first electrode plate and the second electrode plate are vertically inserted into the U-shaped collecting groove.

3. The vacuum chamber real-time particle removal device based on electrostatic adsorption according to claim 2, characterized in that, There are two or more of the first electrode plate and the second electrode plate, which are arranged alternately in the transverse direction in the U-shaped collection groove of the insulating collection plate.

4. The vacuum chamber real-time particle removal device based on electrostatic adsorption according to claim 3, characterized in that, The bottom surface of the U-shaped collection trough has several horizontally spaced insertion holes, and the first electrode and the second electrode plate are sequentially embedded in each insertion hole.

5. The vacuum chamber real-time particle removal device based on electrostatic adsorption according to claim 3, characterized in that, There are two or more insulating collection plates, which are arranged at intervals along the vertical direction.

6. The vacuum chamber real-time particle removal device based on electrostatic adsorption according to claim 2, characterized in that, The first electrostatic dust collection assembly includes two horizontally extending electrode mounting plates, with the upper and lower ends of the first electrode plate and the second electrode plate respectively fixed on the two electrode mounting plates. Connecting guide posts are provided on the electrode mounting plates at the connection points of the first electrode plate and the second electrode plate.

7. The vacuum chamber real-time particle removal device based on electrostatic adsorption according to any one of claims 1-6, characterized in that, There are multiple first electrostatic dust collection components, which are used to attach to and distribute on the inner walls of the vacuum chamber.

8. The vacuum chamber real-time particle removal device based on electrostatic adsorption according to claim 1, characterized in that, The first electrode ring and the second electrode ring both have arc-shaped cross-sections, with the openings of the arc-shaped structures facing upwards, thus forming the dust collection groove inside.

9. The vacuum chamber real-time particle removal device based on electrostatic adsorption according to claim 8, characterized in that, The top surface height of the first electrode ring and the second electrode ring is lower than the top surface height of the sample holder.

10. The vacuum chamber real-time particle removal device based on electrostatic adsorption according to claim 9, characterized in that, Both the first electrode ring and the second electrode ring have lead posts connected to their bottoms.

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