A kind of piezoelectric ceramic glue filling packaging machine
Patent Information
- Application Number
- CN202522585928.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-05
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-12-05
AI Technical Summary
[0004]本实用新型的目的是提供一种压电陶瓷的灌胶封装机，用以解决现有的灌胶封装机效率较低的问题
通过设置有底座、封装模具、夹持板、升降座、气缸、灌胶头以及联动机构，联动机构包括双侧齿条、第一圆齿轮、第二圆齿轮、单侧齿条、第一锥齿轮、第二锥齿轮和第三锥齿轮，将装有压电陶瓷的封装模具放在底座上，之后气缸驱动升降座下移，带动灌胶头移动至封装模具内进行灌胶，升降座下移时带动双侧齿条下移，双侧齿条下移时使得两侧的第一圆齿轮逆时针旋转，进而驱动第一锥齿轮旋转，第一锥齿轮旋转时与之啮合的第二锥齿轮旋转，并驱动第二锥齿轮反向旋转，进而驱动第二圆齿轮顺时针旋转，第二圆齿轮底部啮合单侧齿条，进而拉动单侧齿条相互靠近，带动夹持板将封装模具夹紧，仅需启动气缸一个动作，即可同时完成灌胶头下移和夹持板夹紧，无需分步控制，灌装结束后，气缸带动双侧齿条上移，进而夹持板相互分离，方便取出封装模具，灌胶头移动与夹持板夹紧、松开动作同步启动、同步到位，避免了动作间的等待时间，缩短了单次封装的整体周期，提升了生产效率；
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Figure CN224912768U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of piezoelectric ceramic potting and encapsulation technology, and in particular to a potting and encapsulation machine for piezoelectric ceramics. Background Technology
[0002] Piezoelectric ceramics, as a functional material that can convert mechanical energy into electrical energy, have wide applications in high-tech fields such as medical imaging, acoustic sensors, and ultrasonic motors. Because piezoelectric ceramics are relatively brittle and their internal electrodes, leads, and other components are easily affected by the external environment, they need to be encapsulated to form a gel shell to isolate dust, moisture, and oil, thus preventing corrosion or physical damage to the components.
[0003] For example, a potting and encapsulation device for piezoelectric ceramics disclosed in patent number CN218925135U involves placing the piezoelectric ceramic in a potting box, adjusting the position of the potting box using a first electric push rod, and clamping the piezoelectric ceramic using a second electric push rod before potting. However, this solution requires first activating the second electric push rod to clamp the potting box, then activating the first electric push rod to adjust the potting box downwards, and after potting, activating the first electric push rod again to move the potting box upwards, and then activating the second electric push rod to release the potting box. In manual operation, four sets of commands need to be triggered sequentially: clamping, downward movement, upward movement, and release, which increases the probability of operational errors. Moreover, the initiation and completion of each action require separate waiting, which prolongs the overall process time and reduces potting efficiency. Utility Model Content
[0004] The purpose of this invention is to provide a potting and encapsulation machine for piezoelectric ceramics, in order to solve the problem of low efficiency in existing potting and encapsulation machines.
[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a potting and encapsulation machine for piezoelectric ceramics, including a base; A lifting seat is provided at one end of the top of the base via a frame, and a dispensing head is provided at the bottom of the lifting seat. A packaging mold is provided on the base below the dispensing head. A linkage mechanism is provided on the base at one end of the packaging mold. The linkage mechanism includes a double-sided rack provided at the bottom of the lifting seat. A first spur gear is meshed on both sides of the double-sided rack, and a first bevel gear is provided on the rear side of each of the first spur gears. A second bevel gear is meshed below each of the first bevel gears, and a third bevel gear is meshed above each of the second bevel gears. A second spur gear is provided at the end of the third bevel gear away from the first spur gear. Clamping plates are respectively provided on the bases on both sides of the packaging mold, and a single-sided rack is provided on one side of each clamping plate through a guide sleeve. The single-sided rack meshes with the second spur gear.
[0006] Preferably, a glue storage cylinder is provided at one end of the top of the base, and a pump body is provided at the bottom of the glue storage cylinder. The output end of the pump body is connected to the glue dispensing head through a glue guiding hose.
[0007] With the above structure, the pump body can stably deliver the glue in the glue storage cylinder to the glue dispensing head through the glue guide hose, providing a continuous and stable glue supply to the glue dispensing head and ensuring the smooth progress of the glue dispensing process.
[0008] Preferably, a rotating shaft is provided at the center of the inside of the glue storage cylinder, and an inner spiral component is provided on the rotating shaft. An outer spiral component is provided on the rotating shaft outside the inner spiral component. A drive motor is fixed at the center of the top of the glue storage cylinder, and the output end of the drive motor is connected to the rotating shaft.
[0009] With the above structure, the drive motor can drive the rotating shaft to rotate, so that the inner and outer spiral parts on the shaft rotate synchronously, stirring the glue in the glue storage cylinder, preventing the glue from settling and separating, and reducing air bubbles.
[0010] Preferably, a guide rod is provided on one side of the top of the base via a bracket, and the guide sleeves are all fitted onto the guide rod.
[0011] With the above structure, the guide rod can provide movement guidance for the guide sleeve, ensuring that the clamping plate moves along a fixed trajectory when the rack on one side drives it, avoiding the clamping plate from shifting and improving the clamping accuracy of the packaging mold.
[0012] Preferably, a cylinder is fixed to the top of the frame, and the output end of the cylinder is connected to the lifting seat through a telescopic column.
[0013] With the above structure, the cylinder can drive the lifting seat to rise and fall stably through the telescopic column, which not only provides power for the up and down movement of the dispensing head, but also triggers the linkage mechanism to clamp and release the clamping plate, realizing the synchronous control of dispensing and clamping actions.
[0014] Preferably, the clamping plate has buffer components evenly distributed on the side near the packaging mold, and the buffer components are all semi-circular hollow structures, and the buffer components are all made of rubber.
[0015] With the above structure, the buffer can replace the clamping plate and make direct rigid contact with the packaging mold, avoiding damage to the packaging mold or piezoelectric ceramic due to excessive clamping force, while improving the fit during clamping.
[0016] Preferably, a column is provided at the center of the interior of the buffer component, and a spring sleeve is fitted on the column. The end of the spring sleeve away from the column is connected to the interior of the buffer component.
[0017] With the above structure, the spring sleeve can work with the buffer to form a double buffer, absorbing the instantaneous impact of the clamping force through compression deformation during the clamping process, further preventing the packaging mold from shifting.
[0018] The advantages of the potting and encapsulation machine for piezoelectric ceramics provided by this utility model are as follows: The system comprises a base, a packaging mold, a clamping plate, a lifting seat, a cylinder, a dispensing head, and a linkage mechanism. The linkage mechanism includes double-sided racks, a first sprocket, a second sprocket, a single-sided rack, a first bevel gear, a second bevel gear, and a third bevel gear. The packaging mold containing piezoelectric ceramics is placed on the base. The cylinder then drives the lifting seat downwards, moving the dispensing head into the packaging mold for dispensing. As the lifting seat moves downwards, it causes the double-sided racks to move downwards as well. This downward movement of the racks causes the first sprockets on both sides to rotate counterclockwise, which in turn drives the first bevel gear to rotate. The rotation of the first bevel gear, in turn, causes the second bevel gear, which meshes with it, to rotate. The cylinder drives the second bevel gear to rotate in the opposite direction, which in turn drives the second sprocket to rotate clockwise. The bottom of the second sprocket meshes with a rack on one side, which pulls the racks on one side closer together, causing the clamping plate to clamp the packaging mold. Only one action of the cylinder is needed to simultaneously complete the downward movement of the dispensing head and the clamping of the clamping plate, without the need for step-by-step control. After dispensing, the cylinder drives the racks on both sides to move upward, which separates the clamping plates from each other, making it easy to remove the packaging mold. The movement of the dispensing head and the clamping and releasing actions of the clamping plate are started and completed synchronously, avoiding the waiting time between actions, shortening the overall cycle of a single packaging, and improving production efficiency. Furthermore, buffer components are evenly distributed on one side of the clamping plate. The buffer components are semi-circular hollow structures and are all made of rubber. A column is set in the center of the buffer component, and a spring sleeve is fitted on the column. One end of the spring sleeve is connected to one end of the buffer component. The rubber material itself is elastic, and together with the semi-circular hollow structure, it can replace the direct rigid contact between the clamping plate and the packaging mold. At the same time, during the clamping process, the spring sleeve can buffer the instantaneous impact of the clamping force through compression deformation, avoiding the packaging mold from shifting due to excessively rapid clamping action. Attached Figure Description
[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a three-dimensional front view structural diagram of the linkage mechanism of this utility model; Figure 3 This is a three-dimensional rear view structural diagram of the linkage mechanism of this utility model; Figure 4 This is a three-dimensional cross-sectional structural diagram of the glue storage cylinder of this utility model; Figure 5 This is a three-dimensional structural diagram of the buffer component of this utility model.
[0020] The following are the annotations in the diagram: 1. Base; 2. Packaging mold; 3. Clamping plate; 4. Lifting seat; 5. Frame; 6. Cylinder; 7. Dispensing head; 8. Linkage mechanism; 801. Double-sided rack; 802. Third bevel gear; 803. First spur gear; 804. Second spur gear; 805. Guide rod; 806. Single-sided rack; 807. Guide sleeve; 808. Second bevel gear; 809. First bevel gear; 9. Drive motor; 10. Dispensing cylinder; 11. Dispensing hose; 12. Buffer; 13. Pump body; 14. Rotating shaft; 15. Outer spiral component; 16. Inner spiral component; 17. Column; 18. Spring sleeve. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] Please see Figure 1-5 The present invention provides a potting and encapsulation machine for piezoelectric ceramics, including a base 1; Please see Figure 1-3 A lifting seat 4 is provided at one end of the top of the base 1 via the frame 5, and a dispensing head 7 is provided at the bottom of the lifting seat 4. A packaging mold 2 is provided on the base 1 below the dispensing head 7. A linkage mechanism 8 is provided on the base 1 at one end of the packaging mold 2. The linkage mechanism 8 includes a double-sided rack 801 provided at the bottom of the lifting seat 4. A first spur gear 803 is meshed on both sides of the double-sided rack 801. A first bevel gear 809 is provided on the rear side of the first spur gear 803. A second bevel gear 808 is meshed below the first bevel gear 809. A third bevel gear 802 is meshed above the second bevel gear 808. A second spur gear 804 is provided at the end of the third bevel gear 802 away from the first spur gear 803. Clamping plates 3 are respectively provided on the base 1 on both sides of the packaging mold 2, and a single-sided rack 806 is provided on one side of each clamping plate 3 through a guide sleeve 807. The single-sided rack 806 meshes with the second spur gear 804 respectively. A guide rod 805 is provided on one side of the top of the base 1 through a bracket. The guide sleeve 807 is sleeved on the guide rod 805. A cylinder 6 is fixed on the top of the frame 5, and the output end of the cylinder 6 is connected to the lifting seat 4 through a telescopic column. Place the packaging mold 2 containing piezoelectric ceramics on the base 1, start the cylinder 6 at the top of the frame 5, the cylinder 6 drives the lifting seat 4 to move downward through the telescopic column. When the lifting seat 4 moves downward, it drives the dispensing head 7 at its bottom to move downward synchronously until the dispensing head 7 moves to the top of the inside of the packaging mold 2. On the other hand, when the lifting seat 4 moves down, it drives the double-sided racks 801 at its bottom to move down synchronously. The double-sided racks 801 mesh with the first spur gears 803 on both sides, driving the first spur gears 803 to rotate counterclockwise. When the first spur gears 803 rotate, they drive the first bevel gear 809 on its rear side to rotate synchronously. The first bevel gear 809 meshes with the second bevel gear 808 below, driving the second bevel gear 808 to rotate. The second bevel gear 808 meshes with the third bevel gear 802 above, driving the third bevel gear 802 to rotate in the opposite direction. When the third bevel gear 802 rotates, it drives the second spur gear 804 at the end away from the first spur gear 803 to rotate clockwise, opposite to the rotation direction of the first spur gear 803. The second spur gear 804 meshes with the single-sided racks 806 on both sides of the packaging mold 2, driving the single-sided racks 806 on both sides to move closer to each other. The single-sided racks 806 drive the connected clamping plates 3 to move synchronously, so that the clamping plates 3 clamp and fix the packaging mold 2. Please see Figure 1 and Figure 5 The clamping plate 3 has buffers 12 evenly distributed on the side near the packaging mold 2. The buffers 12 are all semi-circular hollow structures and are all made of rubber. A column 17 is provided in the center of the buffer 12, and a spring sleeve 18 is fitted on the column 17. The end of the spring sleeve 18 away from the column 17 is connected to the inside of the buffer 12. The rubber material itself is elastic, and combined with the semi-circular hollow structure, it allows the buffer 12 to replace the clamping plate 3 in direct rigid contact with the packaging mold 2. At the same time, during the clamping process, the spring sleeve 18 can buffer the instantaneous impact of the clamping force through compression deformation, and avoid the packaging mold 2 from shifting due to excessively rapid clamping action. Please see Figure 4 A glue storage cylinder 10 is provided at one end of the top of the base 1, and a pump body 13 is provided at the bottom of the inside of the glue storage cylinder 10. The output end of the pump body 13 is connected to the glue dispensing head 7 through a glue guiding hose 11. A rotating shaft 14 is provided at the center of the inside of the glue storage cylinder 10, and an inner spiral part 16 is provided on the rotating shaft 14. An outer spiral part 15 is provided on the rotating shaft 14 outside the inner spiral part 16. A drive motor 9 is fixed at the center of the top of the glue storage cylinder 10, and the output end of the drive motor 9 is connected to the rotating shaft 14. Start the pump body 13 at the bottom of the glue storage cylinder 10. The pump body 13 delivers the glue in the glue storage cylinder 10 to the glue dispensing head 7 through the glue guiding hose 11. The glue dispensing head 7 then dispenses the glue into the packaging mold 2. During the dispensing process, the drive motor 9 at the top of the glue storage cylinder 10 can be started. The drive motor 9 drives the rotating shaft 14 to rotate. The inner spiral part 16 and the outer spiral part 15 on the rotating shaft 14 rotate synchronously to stir the glue in the glue storage cylinder 10 and prevent the glue from settling. The shearing force generated by the inner spiral part 16 and the outer spiral part 15 during rotation can cut and break up any large air bubbles that may exist in the glue, thereby improving the dispensing quality. After filling is completed, cylinder 6 drives the double-sided racks 801 to move upward, thereby separating the clamping plates 3 from each other, making it easier to remove the packaging mold 2. The movement of the dispensing head 7 and the clamping and releasing actions of the clamping plates 3 are started and put into place simultaneously, avoiding the waiting time between actions, shortening the overall cycle of a single packaging, and improving production efficiency.
[0023] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A potting and encapsulation machine for piezoelectric ceramics, comprising a base (1); Its features are: One end of the top of the base (1) is provided with a lifting seat (4) through the frame (5), and a dispensing head (7) is provided at the bottom of the lifting seat (4). A packaging mold (2) is provided on the base (1) below the dispensing head (7). A linkage mechanism (8) is provided on the base (1) at one end of the packaging mold (2). The linkage mechanism (8) includes a double-sided rack (801) provided at the bottom of the lifting seat (4). A first spur gear (803) is meshed on both sides of the double-sided rack (801). A first bevel gear (809) is provided on the rear side of the first spur gear (803). A second bevel gear (808) is meshed below the first bevel gear (809). A third bevel gear (802) is meshed above the second bevel gear (808). A second spur gear (804) is provided at the end of the third bevel gear (802) away from the first spur gear (803). Clamping plates (3) are respectively provided on the base (1) on both sides of the packaging mold (2), and a single-sided rack (806) is provided on one side of the clamping plate (3) through the guide sleeve (807), and the single-sided rack (806) meshes with the second spur gear (804).
2. The potting and encapsulation machine for piezoelectric ceramics according to claim 1, characterized in that: The base (1) has a glue storage cylinder (10) at one end of its top, and a pump body (13) is provided at the bottom of the glue storage cylinder (10). The output end of the pump body (13) is connected to the glue dispensing head (7) through a glue guiding hose (11).
3. The potting and encapsulation machine for piezoelectric ceramics according to claim 2, characterized in that: A rotating shaft (14) is provided at the center of the inside of the glue storage cylinder (10), and an inner spiral component (16) is provided on the rotating shaft (14). An outer spiral component (15) is provided on the rotating shaft (14) outside the inner spiral component (16). A drive motor (9) is fixed at the center of the top of the glue storage cylinder (10), and the output end of the drive motor (9) is connected to the rotating shaft (14).
4. The potting and encapsulation machine for piezoelectric ceramics according to claim 1, characterized in that: A guide rod (805) is provided on one side of the top of the base (1) via a bracket, and the guide sleeves (807) are all sleeved on the guide rod (805).
5. The potting and encapsulation machine for piezoelectric ceramics according to claim 1, characterized in that: A cylinder (6) is fixed to the top of the frame (5), and the output end of the cylinder (6) is connected to the lifting seat (4) through a telescopic column.
6. The potting and encapsulation machine for piezoelectric ceramics according to claim 1, characterized in that: The clamping plate (3) has buffers (12) evenly distributed on the side near the packaging mold (2), and the buffers (12) are all semi-circular hollow structures and are all made of rubber.
7. The potting and encapsulation machine for piezoelectric ceramics according to claim 6, characterized in that: Each of the buffer components (12) has a column (17) at its center, and each column (17) is fitted with a spring sleeve (18). The end of the spring sleeve (18) away from the column (17) is connected to the interior of the buffer component (12).