A wafer encapsulation glue spraying device

Abstract

The utility model provides a kind of glue spraying device for wafer packaging welding, it is related to wafer packaging welding technical field, the glue spraying device for wafer packaging welding, including operation table body, the operation table body top side is provided with glue spraying equipment, the operation table body top is equipped with two adsorption discs, two the adsorption disc between fixed communication has U-shaped pipe, the U-shaped pipe both ends outside are all installed with valve, the U-shaped pipe is equipped with suction structure between operation table body;The glue spraying device for wafer packaging welding, the output end of driving motor is driven U-shaped plate on sponge brush rotation, realize the wiping of wafer surface, and transparent cover can effectively prevent dust flying during wiping process, simultaneously, connecting pipe is connected with external dust collection equipment, dust generated by wiping is sucked by multiple dust collection pipes, the structure design realizes the demand of wiping another wafer while spraying glue in one wafer, significantly improves processing progress.

Description

Technical Field

[0001] This utility model relates to a glue spraying device, specifically a glue spraying device for wafer packaging welding, belonging to the field of wafer packaging welding technology. Background Technology

[0002] In wafer packaging and soldering processes, adhesive spraying is a crucial step.

[0003] In the existing technology, dust on the wafer must be wiped off with a wiping sponge before adhesive can be applied. This does not meet the requirement of wiping one wafer while another is being coated with adhesive, thus affecting the process of coating the wafers with adhesive.

[0004] For example, the aforementioned problem exists in patent (CN221046500U); it describes "a coating machine for wafer production, including an operating table and longitudinal guide rails fixedly connected to both sides of the operating table, a fixed box fixedly connected to the top of the operating table, and a cleaning mechanism provided on the top of the operating table; the cleaning mechanism includes a second motor fixedly connected to the top of the operating table, and one end of the output shaft of the second motor is fixedly connected to a rotating rod through a coupling". The above patent cannot meet the requirement of wiping one wafer while another is being coated.

[0005] To address the aforementioned problem of not being able to satisfy the need to wipe one wafer while another is being coated with adhesive, a coating adhesive spraying device for wafer packaging and soldering is proposed. Utility Model Content

[0006] (a) Technical problems to be solved The purpose of this invention is to provide a spray adhesive device for wafer packaging and welding to solve the problems mentioned above, thereby addressing the issues in the prior art.

[0007] (II) Technical Solution This utility model is achieved through the following technical solution: a spray adhesive device for wafer packaging and welding, comprising an operating table, a spray adhesive device provided on one side of the top of the operating table, two adsorption plates provided on the top of the operating table, a U-shaped tube fixedly connected between the two adsorption plates, valves installed on the outer sides of both ends of the U-shaped tube, an air extraction structure provided between the U-shaped tube and the operating table, a mounting frame provided on the top of the U-shaped tube, a servo motor installed inside the mounting frame, the output end of the servo motor fixedly connected to the U-shaped tube, an L-shaped support rod fixedly connected to the top of the mounting frame, a fixing plate fixedly connected to one end of the L-shaped support rod, and a support member and a wiping structure provided at the bottom of the fixing plate.

[0008] Preferably, the air extraction structure includes a connecting pipe, which is fixedly connected to the bottom of the U-shaped pipe. A fixed box is fixedly connected to the bottom end of the connecting pipe. The fixed box is fixedly connected to the top of the operating platform. An annular plate is provided on the outside of the U-shaped pipe. The annular plate is fixedly connected to the bottom of the U-shaped pipe and rotatably connected to the inside of the fixed box. An air inlet pipe is installed on the front side of the fixed box, and a one-way valve is installed on the air inlet pipe.

[0009] Preferably, the air extraction structure further includes a vacuum pump, which is disposed on one side of the fixed box, is fixedly connected to the operating platform, and the air extraction end of the vacuum pump is fixedly connected to the fixed box.

[0010] Preferably, the support includes two support columns, both of which are fixedly connected to the bottom of the fixed plate, and the bottom ends of both support columns are fixedly connected to the operating table body.

[0011] Preferably, the wiping structure includes a cross plate, which is disposed between two support columns. Both support columns pass through the cross plate and are slidably connected to it. A hydraulic cylinder is fixedly connected to the bottom of the cross plate, and the hydraulic cylinder passes through the operating platform and is fixedly connected to it.

[0012] Preferably, a transparent cover is fixedly connected to one end of the cross plate, a drive motor is fixedly connected to the top of the transparent cover, the output end of the drive motor passes through the top of the transparent cover and extends into the interior of the transparent cover, and the output end of the drive motor is rotatably connected to the transparent cover.

[0013] Preferably, a U-shaped plate is fixedly connected to the output end of the drive motor, and a sponge brush is provided inside the U-shaped plate. The U-shaped plate and the sponge brush are connected by bolts.

[0014] Preferably, the top of the transparent cover is provided with an annular tube, the outer side of the annular tube is fixedly connected to a connecting tube, and the bottom of the annular tube is fixedly connected to a plurality of vacuum tubes. The vacuum tubes pass through the top of the transparent cover and extend into the interior of the transparent cover, and the vacuum tubes are fixedly connected to the transparent cover.

[0015] This utility model provides a glue spraying device for wafer packaging and welding, which has the following beneficial effects: 1. This wafer packaging and welding adhesive spraying device drives the sponge brush on the U-shaped plate to rotate through the output of the drive motor, thereby wiping the wafer surface. The transparent cover can effectively prevent dust from flying during the wiping process. At the same time, the connecting tube is connected to an external dust collection device, and the dust generated during wiping is sucked out through multiple dust collection tubes. This structural design realizes the requirement of wiping another wafer while spraying adhesive on one wafer, which significantly improves the processing progress.

[0016] 2. The adhesive spraying device for wafer packaging and welding drives the U-shaped tube and the two adsorption plates connected to it to rotate 180 degrees through the output of the servo motor, thereby realizing the exchange of wafer positions between the two stations: the cleaned wafer is moved to the adhesive spraying station to prepare for adhesive spraying, while the wafer that has been sprayed with adhesive is moved to the wiping station. Then, the valve on the corresponding adsorption plate pipeline is closed to release the adsorption of the wafer, making it easy to remove the processed wafer and replace it with a new wafer to be processed. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the U-shaped tube structure of this utility model; Figure 3 This is a cross-sectional view of the transparent cover of this utility model; Figure 4 This is a schematic diagram of the disassembled structure of the sponge brush and U-shaped plate of this utility model.

[0018] [Explanation of Key Component Symbols] 1. Operating platform; 100. Glue spraying equipment; 2. Adsorption plate; 3. U-shaped tube; 4. Valve; 5. Connecting pipe; 6. Annular plate; 7. Fixing box; 8. Vacuum pump; 9. Air inlet pipe; 10. Mounting bracket; 11. Servo motor; 12. L-shaped support rod; 13. Fixing plate; 14. Support column; 15. Cross plate; 16. Transparent cover; 17. Hydraulic cylinder; 18. Drive motor; 19. U-shaped plate; 20. Sponge brush; 21. Annular tube; 22. Dust suction pipe; 23. Connecting pipe. Detailed Implementation

[0019] This utility model provides a glue spraying device for wafer packaging and welding.

[0020] Example 1, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4The system includes an operating platform 1, with a glue spraying device 100 installed on one side of the top of the operating platform 1. Two adsorption plates 2 are located on the top of the operating platform 1, and a U-shaped tube 3 is fixedly connected between the two adsorption plates 2. Valves 4 are installed on the outer sides of both ends of the U-shaped tube 3. An air extraction structure is provided between the U-shaped tube 3 and the operating platform 1. The air extraction structure includes a connecting pipe 5, which is fixedly connected to the bottom of the U-shaped tube 3. A fixed box 7 is fixedly connected to the bottom of the connecting pipe 5, and the fixed box 7 is fixedly connected to the top of the operating platform 1. An annular plate 6 is located on the outer side of the U-shaped tube 3, and the annular plate 6 is fixedly connected to the bottom of the U-shaped tube 3. The annular plate 6 is rotatably connected to the inside of the fixed box 7. An air inlet pipe 9 is installed on the front side of the fixed box 7, and an air inlet pipe 9 is installed on the air inlet pipe 9. It has a one-way valve, and the air extraction structure also includes a vacuum pump 8. The vacuum pump 8 is set on one side of the fixed box 7 and is fixedly connected to the operating table body 1. The air extraction end of the vacuum pump 8 is fixedly connected to the fixed box 7. The top of the U-shaped tube 3 is provided with a mounting bracket 10. A servo motor 11 is installed inside the mounting bracket 10. The output end of the servo motor 11 is fixedly connected to the U-shaped tube 3. An L-shaped support rod 12 is fixedly connected to the top of the mounting bracket 10. A fixed plate 13 is fixedly connected to one end of the L-shaped support rod 12. The bottom of the fixed plate 13 is provided with a support member and a wiping structure. The support member includes two support columns 14. Both support columns 14 are fixedly connected to the bottom of the fixed plate 13. The bottom ends of both support columns 14 are fixedly connected to the operating table body 1.

[0021] The wiping structure includes a cross plate 15, which is positioned between two support columns 14. Both support columns 14 penetrate the cross plate 15 and are slidably connected to it. A hydraulic cylinder 17 is fixedly connected to the bottom of the cross plate 15, penetrating the operating platform 1 and also fixedly connected to it. A transparent cover 16 is fixedly connected to one end of the cross plate 15, and a drive motor 18 is fixedly connected to the top of the transparent cover 16. The output end of the drive motor 18 passes through the top of the transparent cover 16 and extends into the interior of the transparent cover 16, driving... The output end of the motor 18 is rotatably connected to the transparent cover 16. The output end of the drive motor 18 is fixedly connected to a U-shaped plate 19. A sponge brush 20 is provided inside the U-shaped plate 19. The U-shaped plate 19 and the sponge brush 20 are connected by bolts. The top of the transparent cover 16 is provided with an annular tube 21. A connecting tube 23 is fixedly connected to the outside of the annular tube 21. Multiple suction tubes 22 are fixedly connected to the bottom of the annular tube 21. The suction tubes 22 pass through the top of the transparent cover 16 and extend into the interior of the transparent cover 16. The suction tubes 22 are fixedly connected to the transparent cover 16.

[0022] Specifically, in the initial state, both valves 4 are open. The vacuum pump 8 is started, and the vacuum pump 8 evacuates the inside of the fixed box 7. The negative pressure is transmitted to the two adsorption plates 2 through the connecting pipe 5 and the U-shaped pipe 3 in sequence, thereby completing the stable adsorption of the wafers placed on the two adsorption plates 2 respectively.

[0023] While the wafer on the right-side adsorption plate 2 is being glued by the glue spraying equipment 100, the wafer on the left-side adsorption plate 2 can be wiped clean. The specific process is as follows: The hydraulic cylinder 17 is activated, and its piston rod pushes the cross plate 15 downwards along the two support columns 14. The cross plate 15 moves the transparent cover 16 downwards and covers the wafer on the left-side adsorption plate 2 until the sponge brush 20 contacts the wafer surface. Then, the drive motor 18 is activated (the specific model of the drive motor 18 is not limited, but depends on the equipment requirements). The output of the drive motor 18 drives the sponge brush 20 on the U-shaped plate 19 to rotate, wiping the wafer surface. The transparent cover 16 effectively prevents dust from scattering during wiping. Simultaneously, the connecting pipe 23 is connected to an external dust collection device, and the dust generated during wiping is sucked up through multiple suction pipes 22. This structural design allows for wiping one wafer while simultaneously glue-spraying another, significantly improving processing speed.

[0024] Once one wafer has been coated with adhesive and the other has been wiped clean, the servo motor 11 is started. The specific model of the servo motor 11 is not limited, but is adapted to the equipment requirements. The output of the servo motor 11 drives the U-shaped tube 3 and the two adsorption plates 2 connected to it to rotate 180 degrees, thereby realizing the exchange of wafer positions between the two stations: the cleaned wafer is moved to the adhesive coating station to prepare for adhesive coating, while the wafer that has been coated with adhesive is moved to the wiping station. Then, the valve 4 on the corresponding adsorption plate 2 pipeline is closed to release the adsorption of the wafer, making it easy to remove the processed wafer and replace it with a new wafer to be processed.

[0025] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A spray adhesive device for wafer packaging and soldering, comprising an operating table (1), characterized in that: The top side of the operating table (1) is provided with a glue spraying device (100). The top of the operating table (1) is provided with two adsorption plates (2). A U-shaped tube (3) is fixedly connected between the two adsorption plates (2). Valves (4) are installed on the outer sides of both ends of the U-shaped tube (3). An air extraction structure is provided between the U-shaped tube (3) and the operating table (1). A mounting bracket (10) is provided on the top of the U-shaped tube (3). A servo motor (11) is installed inside the mounting bracket (10). The output end of the servo motor (11) is fixedly connected to the U-shaped tube (3). An L-shaped support rod (12) is fixedly connected to the top of the mounting bracket (10). A fixing plate (13) is fixedly connected to one end of the L-shaped support rod (12). A support member and a wiping structure are provided at the bottom of the fixing plate (13).

2. The adhesive spraying device for wafer packaging welding according to claim 1, characterized in that: The air extraction structure includes a connecting pipe (5), which is fixedly connected to the bottom of the U-shaped pipe (3). The bottom end of the connecting pipe (5) is fixedly connected to a fixed box (7), which is fixedly connected to the top of the operating table (1). An annular plate (6) is provided on the outside of the U-shaped pipe (3), which is fixedly connected to the bottom of the U-shaped pipe (3). The annular plate (6) is rotatably connected to the inside of the fixed box (7). An air inlet pipe (9) is installed on the front side of the fixed box (7), and a one-way valve is installed on the air inlet pipe (9).

3. The adhesive spraying device for wafer packaging welding according to claim 2, characterized in that: The air extraction structure also includes a vacuum pump (8), which is located on one side of the fixed box (7). The vacuum pump (8) is fixedly connected to the operating table body (1), and the air extraction end of the vacuum pump (8) is fixedly connected to the fixed box (7).

4. The adhesive spraying device for wafer packaging welding according to claim 1, characterized in that: The support includes two support columns (14), both of which are fixedly connected to the bottom of the fixed plate (13), and the bottom ends of both support columns (14) are fixedly connected to the operating table body (1).

5. The adhesive spraying device for wafer packaging welding according to claim 4, characterized in that: The wiping structure includes a cross plate (15), which is disposed between two support columns (14). Both support columns (14) pass through the cross plate (15) and are slidably connected to the cross plate (15). A hydraulic cylinder (17) is fixedly connected to the bottom of the cross plate (15). The hydraulic cylinder (17) passes through the operating table body (1) and is fixedly connected to the operating table body (1).

6. The adhesive spraying device for wafer packaging welding according to claim 5, characterized in that: One end of the cross plate (15) is fixedly connected to a transparent cover (16), and a drive motor (18) is fixedly connected to the top of the transparent cover (16). The output end of the drive motor (18) passes through the top of the transparent cover (16) and extends into the interior of the transparent cover (16). The output end of the drive motor (18) is rotatably connected to the transparent cover (16).

7. The adhesive spraying device for wafer packaging welding according to claim 6, characterized in that: The output end of the drive motor (18) is fixedly connected to a U-shaped plate (19), and a sponge brush (20) is provided inside the U-shaped plate (19). The U-shaped plate (19) and the sponge brush (20) are connected by bolts.

8. The adhesive spraying device for wafer packaging welding according to claim 6, characterized in that: The top of the transparent cover (16) is provided with an annular tube (21), and a connecting tube (23) is fixedly connected to the outside of the annular tube (21). Multiple suction tubes (22) are fixedly connected to the bottom of the annular tube (21). The suction tubes (22) pass through the top of the transparent cover (16) and extend into the interior of the transparent cover (16). The suction tubes (22) are fixedly connected to the transparent cover (16).

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