Wafer fixing ring sorting device

Abstract

The application relates to a sorting device of a wafer fixing ring, which comprises a support, a sorting channel plate extending in a first direction, the sorting channel plate being installed on the support, a height sorting assembly comprising a height sorting plate arranged above the sorting channel plate, the height sorting plate being capable of moving up and down to adapt to wafer fixing rings of different specifications, a first sensor located in front of the height sorting plate in the first direction to determine a first time when sorting starts, a second sensor located behind the height sorting plate in the first direction to determine a second time when the wafer fixing ring passes through the height sorting plate, a sorting guide selecting a sorting guide direction according to a time difference between the second time and the first time, and a controller in communication connection with the height sorting plate, the first sensor, the second sensor and the sorting guide to control the actions of the height sorting plate and the sorting guide. The technical scheme of the application has high sorting efficiency and low cost.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and in particular to a sorting device for a wafer retaining ring. Background Technology

[0002] Wafer retaining rings, such as dicing rings, film attaching rings, or chip attaching rings, need to be sorted according to the degree of warpage during use. For example, in one type of chip, the warpage requirement is ≤0.3mm.

[0003] The existing sorting method involves placing the wafer retainer ring on a marble measuring table and using a 0.3mm feeler gauge to test its fit into the gap between the wafer retainer ring and the measuring table surface. If the feeler gauge can be inserted, the warpage is considered ≥0.3mm, which is considered unacceptable; otherwise, the warpage is considered ≤0.3mm, which is considered acceptable. However, this method has the following problems: 1) Relying on manual measurement is inefficient and costly; 2) After measurement, good and bad products need to be manually stacked, which can easily lead to confusion.

[0004] 3) Because the wafer retaining ring is flat, it is not easy to pick up on the marble flat measuring table. It is easy to rub against the surface of the measuring table during the picking process, which can damage the wafer retaining ring.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this application and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0006] In view of this, this application provides a wafer fixing ring sorting device to solve at least one problem existing in the background art.

[0007] To achieve the above objectives, the technical solution of this application is implemented as follows: In a first aspect, embodiments of this application provide a sorting device for wafer retaining rings, comprising: support; A sorting channel plate extends along a first direction, allowing the wafer retaining ring to slide along the first direction or to move the wafer retaining ring along the first direction; the sorting channel plate is mounted on the bracket. The height sorting assembly includes a height sorting plate mounted above the sorting channel plate. The height sorting plate is movable up and down to adjust the gap with the sorting channel plate in the height direction to accommodate wafer retaining rings of different specifications. A first sensor, located in front of the height sorting plate in the first direction, is configured to sense the wafer retaining ring to determine the first time when sorting begins; A second sensor, located behind the height sorting plate in the first direction, is configured to sense the wafer retaining ring to determine a second time when the wafer retaining ring passes through the height sorting plate; The sorting guide selects a sorting direction based on the time difference between the second time and the first time, so as to sort the flatness of the wafer fixing ring. The controller is communicatively connected to the height sorting plate, the first sensor, the second sensor, and the sorting guide to control the operation of the height sorting plate and the sorting guide.

[0008] In one alternative embodiment, the sorting channel plate is tilted so that the wafer retaining ring slides under the influence of gravity.

[0009] In one optional embodiment, a height-adjustable support mechanism is provided at the bottom of one end of the sorting channel plate to adjust the tilt angle of the sorting channel plate.

[0010] In an alternative embodiment, the height sorting assembly further includes a first power mechanism for driving the height sorting plate to move up and down. The first power mechanism includes a motor and a motion conversion component, the motion conversion component being configured to convert the rotation of the motor into linear movement.

[0011] In one optional embodiment, the height sorting assembly further includes a plurality of guide posts and a base plate above the guide posts. One end of each guide post is fixed to the bracket, and the other end is fixed to the base plate. The height sorting plate has a plurality of guide post holes that match the guide posts, so that the height sorting plate can move up and down along the direction of the guide posts. The fixing part of the first power mechanism is fixed to the base plate, and the driving part is connected to the height sorting plate.

[0012] In one optional embodiment, the sorting guide includes a guide rod and a second power mechanism; the rear end of the guide rod is fixed at the middle of the width direction of the sorting channel plate, and the front end can swing in the width direction of the sorting channel plate under the drive of the second power mechanism to guide the wafer fixing ring to move towards a preset sorting area.

[0013] In one optional embodiment, both the first sensor and the second sensor are proximity sensors installed in the middle of the sorting channel plate and protrude from the sorting channel plate. After sensing the wafer retaining ring, they can retract downwards to the bottom of the sorting channel plate. The sorting channel plate has through holes to allow the first sensor and the second sensor to protrude and retract.

[0014] In an optional embodiment, the device further includes a width sorting component, which includes width sorting blocks disposed on both sides of the sorting channel plate; the spacing between the width sorting blocks on both sides can be adjusted according to the specifications of the wafer retaining ring.

[0015] In one alternative embodiment, the sorting channel plate is a cyclically moving transmission plate that drives the wafer retaining ring to move.

[0016] In one alternative embodiment, both the first sensor and the second sensor are optical sensors mounted on both sides of the sorting channel plate.

[0017] The wafer retaining ring sorting device provided in this application includes: a bracket; a sorting channel plate extending along a first direction and mounted on the bracket; a height sorting assembly including a height sorting plate mounted above the sorting channel plate, the height sorting plate being movable up and down to accommodate wafer retaining rings of different sizes; a first sensor located in front of the height sorting plate in the first direction to determine a first time when sorting begins; a second sensor located behind the height sorting plate in the first direction to determine a second time when the wafer retaining ring passes through the height sorting plate; a sorting guide that selects a sorting guiding direction based on the time difference between the second time and the first time; and a controller communicatively connected to the height sorting plate, the first sensor, the second sensor, and the sorting guide to control the operation of the height sorting plate and the sorting guide. As can be seen, the wafer retaining ring sorting device of this application embodiment is provided with a sorting channel plate and a height sorting component, so that the wafer retaining rings pass through the height sorting component in sequence. The wafer retaining rings with different warpages are sorted by the gap in the height direction between the sorting channel plate and the height sorting plate. The sorting efficiency is high, the cost is low, and the automatic placement makes it less likely to be confused and will not damage the wafer retaining rings due to friction with the marble countertop.

[0018] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 A perspective view of the sorting device for the wafer retaining ring provided in Embodiment 1 of this application; Figure 2 for Figure 1 A schematic diagram of the side projection; Figure 3 This is a perspective view of the wafer retaining ring sorting device provided in Embodiment 2 of this application; Figure 4 This is a schematic flowchart of the process of the wafer retaining ring sorting device provided in the embodiments of this application.

[0020] Explanation of reference numerals in the attached figures: 10. Support; 11. Worktable; 21. Sorting channel plate; 22. Support mechanism; 221. First motor; 30. Height sorting assembly; 31. Height sorting plate; 32. First power mechanism; 33. Guide post; 34. Substrate; 41. First sensor; 42. Second sensor; 51. Sorting guide; 52. Qualified area; 53. Unqualified area; 54. Partition; 60. Width sorting assembly; 90. Wafer retaining ring. Detailed Implementation

[0021] To make the technical solutions and beneficial effects of this application more obvious and understandable, the technical solutions in the embodiments of this application are clearly and completely described below by listing specific embodiments. Obviously, the embodiments of this application are not exhaustive, and the described embodiments are only some embodiments of this application, not all embodiments.

[0022] The exemplary embodiments disclosed in this application will now be described in more detail with reference to the accompanying drawings, providing detailed structures and steps to illustrate the technical solution of this application. Note that the drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used herein is for the purpose of describing particular embodiments only and should not be construed as limiting the technical solutions of this application.

[0024] The following description provides numerous specific details to offer a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. To clearly define the inventive concept of this application and avoid confusion with its content, technical features well-known in the art and conventionally understood by those skilled in the art are not elaborated upon. Specifically, this document does not fully list all features of actual embodiments, nor does it provide a detailed description of well-known functions and structures.

[0025] Example 1

[0026] To address the technical problems in related technologies, embodiments of this application provide a sorting device for wafer retaining rings. (Reference) Figure 1 and Figure 2 The wafer retaining ring sorting device includes: 10 brackets; The sorting channel plate 21 extends along a first direction, allowing the wafer retaining ring 90 to slide along the first direction or to move the wafer retaining ring 90 along the first direction; the sorting channel plate 21 is mounted on the bracket 10. The height sorting assembly 30 includes a height sorting plate 31 mounted above the sorting channel plate 21. The height sorting plate 31 can move up and down to adjust the gap with the sorting channel plate 21 in the height direction to accommodate wafer retaining rings 90 of different specifications. The first sensor 41, located in front of the height sorting plate 31 in the first direction, is configured to sense the wafer retaining ring 90 to determine the first time when sorting begins. The second sensor 42, located behind the height sorting plate 31 in the first direction, is configured to sense the wafer retaining ring 90 to determine the second time at which the wafer retaining ring 90 passes through the height sorting plate 31. The sorting guide 51 selects a sorting guide direction based on the time difference between the second time and the first time, so as to achieve the sorting of the flatness of the wafer fixing ring 90. A controller (not shown in the figure) is communicatively connected to the height sorting plate 31, the first sensor 41, the second sensor 42 and the sorting guide 51 to control the operation of the height sorting plate 31 and the sorting guide 51.

[0027] Understandably, the support 10 is the basic structure of the entire device, used to support and stabilize other components.

[0028] Specifically, the bracket 10 can be made of aluminum alloy or stainless steel, using a high-strength material grade to give it good rigidity and vibration resistance, ensuring the stability of the components during long-term operation. A work surface 11 can be provided on the bracket 10 to facilitate the installation of other components.

[0029] Understandably, the sorting channel plate 21 is designed to provide a defined path for the wafer retaining ring 90, enabling it to move in a predetermined direction. Specifically, the surface of the sorting channel plate 21 needs to have a low coefficient of friction, such as by using a Teflon coating.

[0030] Understandably, the height sorting assembly 30 is designed to accommodate wafer retaining rings 90 of varying thicknesses or warpages. By adjusting the position of the height sorting plate 31, the specifications of the passing wafer retaining rings 90 can be precisely controlled, ensuring that only wafer retaining rings 90 meeting the warpage requirements can pass through.

[0031] Understandably, if the wafer retaining ring 90 has significant warpage (such as a central arch or edge deformation), meaning its warpage is unacceptable, its overall thickness will exceed the standard value. By setting a precise gap (e.g., ±0.05mm tolerance), only wafer retaining rings 90 with acceptable warpage are allowed to pass smoothly, while those exceeding the tolerance are blocked or have their movement slowed down to trigger subsequent sorting actions. In the shape tolerance evaluation of the wafer retaining ring 90, warpage is similar to flatness, and therefore can also be called flatness (understandably, the two concepts are not entirely equivalent in other products).

[0032] The height sorting plate 31 can be made of high-hardness, wear-resistant materials (such as ceramics or hardened steel), and the flatness of its lower surface must be better than the tolerance of the measured part. The dynamic adjustability of the gap allows the same equipment to be compatible with multiple models (such as the wafer retaining ring 90 corresponding to 200mm and 300mm wafers), improving the equipment's versatility. The sorting device in this embodiment replaces the traditional manual plug gauge inspection, realizing online, continuous, and non-destructive sorting.

[0033] Understandably, the function of the first sensor 41 is to sense the arrival of the wafer retaining ring 90 in front of the height sorting plate 31 to determine the initial time of sorting commencement. The first sensor 41 only needs to be located in front of the height sorting plate 31, and its position can be fixed in subsequent measurements.

[0034] Understandably, the second sensor 42 records the second time at which the wafer retaining ring 90 passes through the height sorting plate 31. Combined with the aforementioned first time, a time difference can be obtained. This time difference can be used to calculate the moving speed of the wafer retaining ring 90 as it passes through the height sorting plate 31, thereby assessing its flatness. Alternatively, after collecting multiple data points, the time difference can be directly used as a reference for assessing flatness, eliminating the need to calculate the movement again.

[0035] Understandably, the sorting guide 51 determines which area the wafer retaining ring 90 should be guided to based on the time difference between the two sensors. This method not only improves efficiency but also reduces labor costs. The sensors are a collective term for the first sensor 41 and the second sensor 42, hereinafter the same. The guided areas include a qualified area 52 and a rejected area 52, separated by a partition 54.

[0036] If the wafer retaining ring 90 is slightly blocked or slowed down by the height sorting plate 31 due to warping, the time difference will increase significantly; conversely, qualified products glide smoothly with a shorter time difference. This time difference serves as an indirect basis for judging whether the flatness exceeds the standard, eliminating the need for direct deformation measurement and simplifying the sensing system.

[0037] Specifically, the controller can be a programmable logic controller (PLC) or an embedded microprocessor system, running a dedicated sorting algorithm. In addition to basic input / output (I / O) control, it can also integrate a human-machine interface (HMI) to support parameter setting, data logging (sorting quantity, yield statistics), fault alarms, and other functions.

[0038] Specifically, parameter settings, such as gap threshold and time difference threshold, can be manually input. The controller can control the operation of the height sorting component 30 and the sorting guide 51 based on the input parameter settings. This is prior art known to those skilled in the art and will not be described in detail here. The gap threshold and time difference threshold are preset thresholds for the gap value and time difference.

[0039] The wafer retaining ring sorting device of this application embodiment is provided with a sorting channel plate 21 and a height sorting component 30, so that the wafer retaining rings 90 pass through the height sorting component 30 in sequence. The wafer retaining rings 90 with different warpages are sorted by the gap in the height direction between the sorting channel plate 21 and the height sorting plate 31. The sorting efficiency is high, the cost is low, and the placement is automatic, which makes it less likely to be confused and will not damage the wafer retaining rings 90 due to friction with the marble countertop.

[0040] In some embodiments of this application, the sorting channel plate 21 is inclined so that the wafer retaining ring 90 slides under the action of gravity.

[0041] The tilted sorting channel plate 21 utilizes natural gravity, reducing the need for an additional power source, simplifying the design, and lowering energy consumption. Using gravity to assist the movement of the wafer retaining ring 90 is both energy-efficient and simplifies the mechanical design.

[0042] Understandably, tilting is a low-cost, low-energy transmission solution. Specifically, the tilt angle can be 15°–70°. The tilt angle needs to be calibrated based on the wafer retaining ring material (metal / ceramic), surface roughness, and ambient temperature and humidity. This method is particularly suitable for small-batch, multi-variety scenarios, avoiding the maintenance costs of complex transmission systems such as motors and belts. Simultaneously, the gravity-assisted sliding process is smooth, reducing the impact of vibration on subsequent sensing accuracy.

[0043] In some embodiments of this application, a height-adjustable support mechanism 22 is provided at the bottom of one end of the sorting channel plate 21 to adjust the tilt angle of the sorting channel plate 21.

[0044] Understandably, the height-adjustable support mechanism 22 allows users to flexibly adjust the tilt of the sorting channel plate 21 according to specific needs, thereby optimizing the movement speed and sorting effect of the wafer retaining ring 90. Understandably, this design allows the equipment to accommodate wafer retaining rings 90 of different weights or sizes—heavier ones require a larger tilt angle to ensure movement speed, while lightweight ceramic rings require a smaller tilt angle to prevent excessive impact on the sensors. This flexibility significantly expands the equipment's application range.

[0045] By adjusting the tilt angle of the sorting channel plate 21, precise control of the moving speed of the wafer fixing ring 90 was achieved, further improving the sorting accuracy.

[0046] Specifically, the support mechanism 22 can be adjusted in height using a threaded lifting column, a pneumatic lifting cylinder, an electric push rod, or a scissor lift mechanism. In this embodiment, the support mechanism 22 can be a scissor lift mechanism, powered by an electric motor, providing fast and reliable adjustment. For distinction, the motor here is referred to as the first motor 221.

[0047] Specifically, users can set the target tilt angle via handwheel or touchscreen, and the system will automatically adjust and lock it, which is quick and reliable.

[0048] In some embodiments of this application, the height sorting assembly 30 further includes a first power mechanism 32 for driving the height sorting plate 31 to move up and down. The first power mechanism 32 includes a motor and a motion conversion component, the motion conversion component being configured to convert the rotation of the motor into linear movement.

[0049] Understandably, the design of the first power mechanism 32 enables the height sorting plate 31 to be precisely adjusted as needed. The combination of a motor and motion conversion components (such as a lead screw or cam mechanism) allows for efficient and accurate position control, which is crucial for adapting to wafer retaining rings 90 of different specifications.

[0050] Specifically, the motion conversion component can be a ball screw. Understandably, ball screw solutions offer high precision (up to ±0.01mm) and good rigidity, making them suitable for high repeatability positioning requirements. Specifically, the motor can be equipped with an encoder to achieve closed-loop control, ensuring that the height setpoint matches the actual value. This mechanism supports programmed automatic model changeover; for example, when switching product models, the controller automatically calls the corresponding height parameters and drives the device into position. This allows for rapid switching in applications with many 90-type wafer fixing rings, significantly improving production efficiency.

[0051] Specifically, the motor can be a servo motor. In addition to enabling closed-loop control, servo motors also feature high precision, high sensitivity, and high reliability, which can significantly increase the accuracy of detection.

[0052] In some embodiments of this application, the height sorting assembly 30 further includes a plurality of guide posts 33 and a base plate 34 above the guide posts 33. One end of the guide post 33 is fixed to the bracket 10, and the other end is fixed to the base plate 34. The height sorting plate 31 has a plurality of guide post holes that match the guide posts 33, so that the height sorting plate 31 can move up and down along the direction of the guide posts 33. The fixing part of the first power mechanism 32 is fixed to the base plate 34, and the driving part is connected to the height sorting plate 31.

[0053] Understandably, the design of the guide post 33 ensures that the height sorting plate 31 remains stable and straight during vertical movement, avoiding deviation or tilting and improving sorting accuracy. Furthermore, this design enhances the durability and reliability of the equipment.

[0054] The guide post 33 system constitutes a high-rigidity guide pair, which effectively suppresses the shaking or deflection of the height sorting plate 31 during the lifting process and ensures the uniformity of the gap.

[0055] Specifically, the height sorting component 30 can employ four symmetrically arranged precision linear bearing guide pillars 33, coupled with self-lubricating bushings, to achieve smooth and low-noise movement. The base plate 34, serving as the mounting platform for the power mechanism, must have sufficient thickness to resist the reaction force of the motor. This structure clearly separates the load paths: the guide pillars 33 bear the guiding force, and the lead screw bears the driving force, avoiding wear or jamming caused by cross-coupling.

[0056] In some embodiments of this application, the sorting guide 51 includes a guide rod and a second power mechanism; the rear end of the guide rod is fixed at the middle of the width direction of the sorting channel plate 21, and the front end can swing in the width direction of the sorting channel plate 21 under the drive of the second power mechanism to guide the wafer fixing ring 90 to move towards a preset sorting area.

[0057] Understandably, the sorting guide 51 drives the guide rod to swing via a second power mechanism, thereby effectively guiding the wafer retaining ring 90 to the correct sorting area. This method not only improves sorting efficiency but also reduces the possibility of misclassification.

[0058] Specifically, the second power mechanism can be a cylinder or an electromagnetic actuator. Cylinders offer fast response and low cost, making them suitable for two-position three-way sorting. Electromagnetic actuators are characterized by their small size, environmental friendliness, and low maintenance costs. This embodiment uses a cylinder, specifically a small cylinder with a diameter of less than 10mm, to reduce size.

[0059] Specifically, the swing trajectory of the guide rod needs to be verified by motion simulation to ensure that the turning is completed within the shortest path and that it does not scratch the wafer retaining ring 90.

[0060] More specifically, the end of the guide rod can be equipped with a flexible paddle or roller to further reduce contact stress.

[0061] In some embodiments of this application, the first sensor 41 and the second sensor 42 are both proximity sensors installed in the middle of the sorting channel plate 21 and protrude from the sorting channel plate 21. After sensing the wafer retaining ring 90, they can retract downward to the bottom of the sorting channel plate 21. The sorting channel plate 21 has through holes to allow the first sensor 41 and the second sensor 42 to protrude and retract.

[0062] Understandably, to improve detection sensitivity and reduce false detections, both the first sensor 41 and the second sensor 42 are installed in the middle of the sorting channel plate 21, i.e., in the path of the wafer retaining ring 90. However, to reduce the risk of damage from contact between the first sensor 41 and the second sensor 42 and the wafer retaining ring 90, the proximity sensor is configured to automatically retract when it detects the wafer retaining ring 90. Understandably, this design not only reduces damage to the wafer retaining ring 90 but also improves the reliability and lifespan of the sensor.

[0063] Specifically, this "floating" proximity sensor design cleverly resolves the conflict between sensing and avoidance. The sensor normally protrudes slightly (e.g., 0.5mm) to ensure reliable triggering; when the wafer retaining ring 90 presses past, an internal spring or pneumatic mechanism instantly retracts it, preventing it from lifting or jamming the workpiece. A sealing ring can be added around the through-hole for dust prevention. This structure is particularly suitable for thin-walled or easily deformable wafer retaining rings 90, avoiding contact damage caused by traditional fixed sensors. The sensor type can be inductive (metal ring) or capacitive (ceramic ring), depending on the material.

[0064] In some embodiments of this application, the device further includes a width sorting component 60, which includes width sorting blocks disposed on both sides of the sorting channel plate 21; the spacing between the width sorting blocks on both sides can be adjusted according to the specifications of the wafer retaining ring 90.

[0065] Understandably, the width sorting component 60 increases the system's flexibility, accommodating not only wafer retaining rings 90 of various heights as described above, but also wafer retaining rings 90 of various widths. By adjusting the distance between the width sorting blocks, wafer retaining rings 90 that meet specific width requirements can be precisely selected.

[0066] Understandably, the width sorting component 60 is used to exclude wafer retaining rings 90 with out-of-tolerance outer diameters or elliptical deformation. Wear-resistant strips can be embedded on the inner side of the width sorting block, and fine-tuning bolts or servo slides are provided to achieve precise spacing adjustment (e.g., ±0.1mm steps). When a wafer retaining ring 90 cannot pass through the set width, it will be blocked and fall into the waste bin, or be diverted by an additional guiding mechanism. This function, together with height sorting, forms a "two-dimensional screening" (height + width), significantly improving the sorting dimensionality.

[0067] Understandably, when there are not many width specifications or the switching frequency is not high, the width sorting component 60 can be adjusted manually with a plug gauge. This makes the structure simpler, the cost lower, and the maintenance easier.

[0068] Example 2

[0069] This embodiment is based on Embodiment 1, but adjusts the power source for the movement of the wafer fixing ring 90. Except for the description below, everything else is the same as in Embodiment 1. This embodiment can be referred to. Figure 3 .

[0070] In some embodiments of this application, the sorting channel plate 21 is a cyclically moving transmission plate to drive the wafer fixing ring 90 to move.

[0071] Understandably, the transmission plate can achieve cyclic movement through rollers, belts, or chain drive mechanisms; the specific structure will not be detailed here. The advantage of the transmission plate is that it can achieve constant speed transmission, eliminating the fluctuations in movement speed caused by friction differences during gravity sliding, thus making the time difference criterion more stable.

[0072] Specifically, the cyclically moving transmission plate can include two types: the first is an up-and-down cycle, where the transmission plate can move to the bottom, then rotate once and return to the top. The second is a horizontal cycle, where the transmission plate can move to one side, rotate once, and then return.

[0073] The second approach increases the length of the sorting channel plate 21 in front of the height sorting plate 31, allowing for the pre-arrangement of numerous wafer retaining rings 90 awaiting inspection, thus improving overall production efficiency and making it suitable for high-speed, high-volume production scenarios. This embodiment can employ the first approach, resulting in a more compact structure and a smaller footprint.

[0074] Specifically, positioning grooves or V-shaped guides can be provided on the surface of the transmission plate to ensure that the wafer retaining ring 90 operates in the center. In this mode, the sensor and sorting guide 51 need to be synchronized with the transmission cycle, and the encoder can provide position feedback to realize "flying" sorting (i.e., non-stop sorting).

[0075] In some embodiments of this application, the first sensor 41 and the second sensor 42 are both optical sensors mounted on both sides of the sorting channel plate 21.

[0076] Mounting sensors on both sides of the sorting channel plate 21 further reduces the potential risk of damage to the wafer retaining ring 90 and improves detection accuracy. Optical sensors, with their fast response and high resolution, are well-suited for high-precision sorting tasks.

[0077] Optical sensors (such as through-beam or diffuse-reflection photoelectric switches) provide non-contact detection, completely eliminating the risk of mechanical contact. Through-beam switches offer high accuracy and are suitable for transparent or reflective materials; diffuse-reflection switches are easy to install and suitable for compact spaces. Furthermore, dual-sided arrangement can detect whether the wafer retaining ring 90 is misaligned—if the signals on both sides are not synchronized, it indicates an abnormal orientation and can trigger rejection. This solution improves the system's adaptability to complex operating conditions.

[0078] To more clearly illustrate the wafer retaining ring sorting device of this application embodiment, the operation process of the wafer retaining ring sorting device is briefly described below. This process applies to Embodiments 1 and 2. Figure 4 : S100: Set parameters. For example, set the gap threshold and time difference threshold according to the specifications of the wafer retaining ring 90; S200: Adjust the gap value. Based on the set parameters, control the movement of the height sorting component 30, for example, drive the sorting plate to move up and down to form the set gap threshold.

[0079] S300: Acquire first time. When the wafer retaining ring 90 begins screening, the first sensor 41 detects the wafer retaining ring 90 and records the time.

[0080] S400: Acquire the second time. The second sensor 42 detects and records the time when the wafer retaining ring 90 passes through the height sorting assembly 30.

[0081] S500: Controls the operation of the sorting guide 51. Based on the time difference, or the moving speed of the wafer retaining ring 90 calculated based on the time difference, the sorting guide 51 is controlled to guide the wafer to the qualified area 52 or the unqualified area 53.

[0082] Furthermore, an adjustment step for the width sorting component 60 can be added between S100 and S200, that is, adjusting the spacing between the width sorting blocks on both sides according to the specifications of the wafer retaining ring 90. The adjustment can be manual or automatic (e.g., by a motor, hydraulic or other power component).

[0083] It should be noted that the various embodiments or implementation methods in this document can be described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to mutually. It should be understood that in the various embodiments of this application, the embodiment numbers are merely for descriptive purposes and do not represent the superiority or inferiority of the embodiments.

[0084] Understandably, without conflict, the technical features in the technical solutions described in each embodiment can be arbitrarily combined to form new embodiments. For example, each structure in each embodiment can be implemented as an independent embodiment, and the structures can be arbitrarily combined; some or all of the structures in different embodiments can be arbitrarily combined. Each step in each embodiment can be implemented as an independent embodiment, and the steps can be arbitrarily combined; the order of the steps can be arbitrarily interchanged; some or all of the steps in different embodiments can be arbitrarily combined. Furthermore, regarding the table in the embodiments, each element, each row, or each column in the table can be implemented as an independent embodiment.

[0085] In this document, when the terms "embodiment," "implementation," or "example" are used, it means that the specific features described in connection with these implementations or examples are included in at least one implementation, embodiment, or example of this application. It should be noted that the illustrative expressions of the above terms do not necessarily refer to the same implementation, embodiment, or example. Furthermore, the specific features described, such as structures or steps, can be appropriately combined in any one or more implementations, embodiments, or examples.

[0086] In some embodiments, prefixes such as "first" and "second" are used merely to distinguish different descriptive objects and do not impose restrictions on the position, order, priority, or value of the descriptive objects. The description of the descriptive objects is based on the context of the claims or embodiments, and the use of prefixes does not constitute unnecessary limitations. For example, the numerical value of the descriptive object is not limited by ordinal numbers and can be one or more. For instance, in "first device," the numerical value of "device" can be one or more. Furthermore, objects modified by different prefixes can be the same or different. For example, if the descriptive object is "device," then "first device" and "second device" can be the same device or different devices, and their types can be the same or different. Describing "first" does not necessarily imply the existence of "second," and discussing "second" does not necessarily imply the existence of "first."

[0087] In some embodiments, unless otherwise stated, elements expressed in the singular form, such as "a," "the," "the," "the," "the," "the," etc., can mean "one and only one," or "one or more," "at least one," etc. For example, when using articles such as "a," "an," "the," etc. in translation, the noun following the article can be understood as either a singular or a plural expression. In some embodiments, "multiple" refers to two or more.

[0088] In some embodiments, the terms “at least one of”, “one or more”, “a plurality of”, “multiple”, etc., may be used interchangeably.

[0089] In some embodiments, the notation "at least one of A and B", "A and / or B", "A in one case, B in another", "A in one case, B in another", etc., may include the following technical solutions depending on the situation: in some embodiments, A (A is executed regardless of B); in some embodiments, B (B is executed regardless of A); in some embodiments, execution is selected from A and B (A and B are selectively executed); in some embodiments, both A and B are executed. The same applies when there are more branches such as A, B, C, etc.

[0090] In some embodiments, the notation "A or B" may include the following technical solutions, depending on the situation: in some embodiments, A (execution of A regardless of B); in some embodiments, B (execution of B regardless of A); in some embodiments, selective execution from A and B (A and B are selectively executed). The same applies when there are more branches such as A, B, and C.

[0091] In some embodiments, unless otherwise expressly defined, the terms "installation," "connection," "linking," "fixing," "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment according to the specific circumstances.

[0092] In some embodiments, the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “height,” “up,” “down,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” and “counterclockwise” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. That is, they should not be construed as limitations on this application.

[0093] In some embodiments, unless otherwise expressly defined, "above" or "below" the second feature can mean that the first and second features are in direct contact, or indirect contact via an intermediate medium, or that they are not in contact, but simply indicate that the horizontal level of the first feature is higher than that of the second feature. Furthermore, "above" or "below" the second feature can mean that the first feature is directly above or diagonally above, directly below, or diagonally below the second feature.

[0094] In some embodiments, spatial relation terms such as “upper” and “lower” may be used for convenience of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, the description of an element or feature “below” other elements or features will change it to “upper” other elements or features. Therefore, the exemplary terms “upper” and “lower” can include both upper and lower orientations. The device may also be otherwise oriented (rotated 90 degrees or otherwise), and the spatial descriptive terms used herein will be interpreted accordingly.

[0095] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations of the technical solutions of this application. Various modifications and changes can be made to the above embodiments without departing from the scope of this application. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

Claims

1. A sorting device for wafer retaining rings, characterized in that, include: support; A sorting channel plate extends along a first direction, allowing the wafer retaining ring to slide along the first direction or to move the wafer retaining ring along the first direction; the sorting channel plate is mounted on the bracket. The height sorting assembly includes a height sorting plate mounted above the sorting channel plate. The height sorting plate is movable up and down to adjust the gap with the sorting channel plate in the height direction to accommodate wafer retaining rings of different specifications. A first sensor, located in front of the height sorting plate in the first direction, is configured to sense the wafer retaining ring to determine the first time when sorting begins; A second sensor, located behind the height sorting plate in the first direction, is configured to sense the wafer retaining ring to determine a second time when the wafer retaining ring passes through the height sorting plate; The sorting guide selects a sorting direction based on the time difference between the second time and the first time, so as to sort the flatness of the wafer fixing ring. The controller is communicatively connected to the height sorting plate, the first sensor, the second sensor, and the sorting guide to control the operation of the height sorting plate and the sorting guide.

2. The wafer fixing ring sorting device according to claim 1, characterized in that, The sorting channel plate is tilted so that the wafer retaining ring slides under the action of gravity.

3. The wafer retaining ring sorting device according to claim 2, characterized in that, The bottom of one end of the sorting channel plate is provided with a height-adjustable support mechanism to adjust the tilt angle of the sorting channel plate.

4. The wafer fixing ring sorting device according to claim 1, characterized in that, The height sorting assembly further includes a first power mechanism for driving the height sorting plate to move up and down. The first power mechanism includes a motor and a motion conversion component, the motion conversion component being configured to convert the rotation of the motor into linear movement.

5. The wafer retaining ring sorting device according to claim 4, characterized in that, The height sorting assembly further includes multiple guide posts and a base plate above the guide posts. One end of each guide post is fixed to the bracket, and the other end is fixed to the base plate. The height sorting plate has multiple guide post holes that match the guide posts, so that the height sorting plate can move up and down along the direction of the guide posts. The fixing part of the first power mechanism is fixed to the base plate, and the driving part is connected to the height sorting plate.

6. The wafer fixing ring sorting device according to claim 1, characterized in that, The sorting guide includes a guide rod and a second power mechanism; the rear end of the guide rod is fixed in the middle of the width direction of the sorting channel plate, and the front end can swing in the width direction of the sorting channel plate under the drive of the second power mechanism to guide the wafer fixing ring to move towards a preset sorting area.

7. The wafer retaining ring sorting device according to claim 4, characterized in that, Both the first sensor and the second sensor are proximity sensors installed in the middle of the sorting channel plate and protrude from the sorting channel plate. After sensing the wafer retaining ring, they can retract downwards to the bottom of the sorting channel plate. The sorting channel plate has through holes to allow the first sensor and the second sensor to protrude and retract.

8. The wafer retaining ring sorting device according to any one of claims 1-7, characterized in that, The device further includes a width sorting component, which includes width sorting blocks disposed on both sides of the sorting channel plate; the spacing between the width sorting blocks on both sides can be adjusted according to the specifications of the wafer retaining ring.

9. The wafer fixing ring sorting device according to claim 1, characterized in that, The sorting channel plate is a cyclically moving transmission plate that drives the wafer fixing ring to move.

10. The wafer retaining ring sorting device according to claim 9, characterized in that, Both the first sensor and the second sensor are optical sensors installed on both sides of the sorting channel plate.

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