Wafer surface wiping device

Abstract

The utility model provides a kind of wafer surface wiping device, including rotating table, wiping mechanism, rotating table is equipped with positioning mechanism, for positioning wafer, and can drive wafer rotation, wiping mechanism includes wiping plate, wiping cloth, wiping plate is located rotating table outside, wiping cloth is around arranged on wiping plate, wiping cloth is attached with wafer back when cleaning, and the wiping cloth around arranged in wiping plate below is connected with unwinding reel, the wiping cloth around arranged in wiping plate above is connected with winding reel, unwinding reel is used to discharge wiping cloth, winding reel is used to wind after wiping cloth use.The utility model can automatically wipe wafer, wiping force is even, wiping efficiency is high, wiping cloth is continuously wiped by winding reel according to section, can accurately control the wiping time of each section wiping cloth, ensure the effective use of wiping cloth, also avoid the waste of wiping cloth, save resources.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a wafer surface wiping device. Background Technology

[0002] During the wafer manufacturing process, dust and other foreign matter easily adhere to the surface of the wafer. The surface cleanliness of the wafer directly affects the yield rate of the process and the product. Therefore, it is necessary to continuously inspect and clean it during the process to maintain its cleanliness.

[0003] Currently, the traditional method for wiping wafers is manual cleaning. Manual cleaning typically involves holding a sheet of cleanroom cloth and wiping the wafer manually. This method results in uneven wiping pressure, low efficiency, and the tendency to reuse or waste the cleanroom cloth, which not only wastes the cloth but also affects the cleaning effect. Utility Model Content

[0004] The present invention aims to provide a wafer surface wiping device to overcome the shortcomings of the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model is: a wafer surface wiping device, including a rotating table and a wiping mechanism. The rotating table is provided with a positioning mechanism for positioning the wafer and driving the wafer to rotate. The wiping mechanism includes a wiping plate and a wiping cloth. The wiping plate is located outside the rotating table, and the wiping cloth is wrapped around the wiping plate. During cleaning, the wiping cloth is in contact with the back of the wafer. The wiping cloth wrapped below the wiping plate is connected to an unwinding reel, and the wiping cloth wrapped above the wiping plate is connected to a rewinding reel. The unwinding reel is used to unwind the wiping cloth, and the rewinding reel is used to rewind the used wiping cloth.

[0006] Furthermore, in the aforementioned wafer surface wiping device, the positioning mechanism includes a vacuum stage and a positioning seat. The vacuum stage is positioned above a rotating platform and has a vacuum groove on its top for adsorbing wafers. The vacuum groove is arranged in a ring grid and is evenly distributed within the wafer adsorption range. The positioning seat is sleeved on the outside of the vacuum stage. Above the positioning seat are multiple sets of support blocks arranged around the vacuum stage. Each set of support blocks includes two oppositely arranged fixed support blocks and a movable support block. The fixed support blocks are fixed to the positioning seat by a fixed seat. The movable support blocks are connected to the output end of a movable cylinder mounted on the positioning seat and can move radially along the vacuum stage by the movable cylinder. Preferably, it also includes a lifting assembly, which includes a lifting motor and guide rods. The lifting motor is fixed to the rotating base, and its output end is connected to the positioning seat through a connector. Multiple guide rods are provided below the positioning seat, and the lower ends of the guide rods are inserted into the rotating base and slidably connected to the rotating base.

[0007] Furthermore, in the aforementioned wafer surface wiping device, both the fixed support block and the movable support block are provided with multiple support parts. The multiple support parts are arranged in a multi-level step along the radial direction of the vacuum stage, and each support part includes a horizontal support part and a vertical limiting part. The horizontal support part is used to support the wafer, and the vertical limiting part is arranged perpendicular to the horizontal support part. The vertical limiting part cooperates with the outer surface of the wafer to limit the wafer position.

[0008] Furthermore, in the aforementioned wafer surface wiping device, the wiping mechanism further includes a wiping box and a wiping support. One end of the wiping support is connected to the rotary table, and the other end extends into the wiping box and is connected to the wiping box. The unwinding tray and the rewinding tray are both located inside the wiping box and are rotatably connected to the wiping mounting plate. The wiping mounting plate is fixedly connected to the wiping box, and the wiping plate is also connected to a lifting cylinder located below it. The lifting cylinder is fixed to the outside of the wiping box.

[0009] Furthermore, in the aforementioned wafer surface wiping device, the unwinding tray is located at the front end of the tray shaft one. The tray shaft one is rotatably connected to the wiping mounting plate via a bearing mounted on the wiping mounting plate. A spring one is sleeved on the rear end of the tray shaft one through the wiping mounting plate. One end of the spring one abuts against the wiping mounting plate, and the other end is provided with a nut that is threadedly connected to the tray shaft one.

[0010] Furthermore, in the aforementioned wafer surface wiping device, the take-up reel is mounted on the reel shaft two. The rear end of the reel shaft two passes through the wiping mounting plate and is connected to the drive assembly mounted on the wiping mounting plate. The drive assembly is used to drive the reel shaft two to rotate. The front end of the reel shaft two is provided with a seated bearing, a take-up reel, a pressure plate, and a spring two in sequence from back to front. The end of the spring two away from the pressure plate is provided with a nut that is threadedly connected to the reel shaft two.

[0011] Furthermore, in the aforementioned wafer surface wiping device, the driving assembly includes a main synchronous pulley, a driven synchronous pulley, and a tensioning pulley located on the rear side of the wiping mounting plate. The main synchronous pulley is connected to a motor located on the front side of the wiping mounting plate. The driven synchronous pulley is connected to the material tray shaft and is belt-driven to the main synchronous pulley via an annular belt. The tensioning pulley is located on the outer side of the annular belt and is used to tension the annular belt.

[0012] Furthermore, in the aforementioned wafer surface wiping device, the wiping mechanism further includes a guide assembly for guiding the movement of the wiping cloth. This guide assembly includes guide roller one and guide roller two. Multiple guide roller one are provided between the unwinding reel and the wiping plate, and multiple guide roller two are provided between the rewinding reel and the wiping plate. Preferably, at least one limiting block is provided between the guide roller one, and the limiting block has a limiting groove for the wiping cloth to pass through.

[0013] Furthermore, in the aforementioned wafer surface wiping device, the guiding assembly further includes a guide wheel three and a guide shaft. The guide shaft is rotatably connected to the wiping mounting plate via a bearing with a seat, and the front end of the guide shaft is connected to the guide wheel three. The rear end of the guide shaft passes through the wiping mounting plate and is connected to a guide drive wheel located behind the wiping mounting plate. The guide drive wheel is connected to a drive assembly that drives the take-up reel to rotate, and can rotate synchronously with the take-up reel through the drive assembly. The guide wheel three cooperates with a guide wheel two to guide the wiping cloth.

[0014] Furthermore, the aforementioned wafer surface wiping device also includes an adjustment component. The adjustment component adjusts the wiping range by adjusting the distance the wiping plate extends into the wafer. The component includes a slide rail, which is located above the wiping support. The lower end of the wiping box is provided with a mounting plate. Below the mounting plate is a slider that is slidably connected to the slide rail. Below the mounting plate is a guide rail clamp that locks the slide rail.

[0015] Compared with the prior art, the beneficial effects of this utility model are: this utility model can automatically wipe the wafer. During wiping, the wafer rotates, and the wiping cloth is in contact with the wafer surface to automatically wipe the wafer. The wiping force is uniform and the wiping efficiency is high. The wiping cloth is continuously wiped in sections by the take-up tray, and the wiped wiping cloth is automatically taken up. The wiping time of each section of the wiping cloth is precisely controlled to ensure the effective use of the wiping cloth, avoid the waste of wiping cloth, and save resources. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the wafer surface wiping device of this utility model; Figure 2 This is a schematic diagram of the wiping mechanism of the wafer surface wiping device of this utility model; Figure 3 This is a cross-sectional schematic diagram of the wiping mechanism of the wafer surface wiping device of this utility model; Figure 4 This is a partial schematic diagram of the wiping mechanism of the wafer surface wiping device of this utility model. Figure 1 ; Figure 5 This is a partial schematic diagram of the wiping mechanism of the wafer surface wiping device of this utility model. Figure 2 ; Figure 6This is a schematic diagram of the positioning mechanism of the wafer surface wiping device of this utility model; In the diagram: 1. Rotary table; 2. Wiping Mechanism; 211. Wiping Plate; 212. Wiping Cloth; 213. Lifting Cylinder; 221. Wiping Box; 222. Wiping Support; 223. Wiping Mounting Plate; 23. Unwinding Reel; 231. Reel Shaft 1; 232. Spring 1; 24. Rewinding Reel; 241. Reel Shaft 2; 242. Pressure Plate; 243. Spring 2; 25. Guide Assembly; 251. Guide Wheel 1; 252. Guide Wheel 2; 253. Limiting Block; 254. Guide Wheel 3; 255. Guide Shaft; 256. Guide Drive Wheel; 26. Drive Assembly; 261. Main Synchronous Wheel; 262. Slave Synchronous Wheel; 263. Tensioning Wheel; 264. Belt; 27. Adjustment Assembly; 271. Slide Rail; 272. Mounting Plate; 273. Guide Rail Clamping Device; 3. Positioning mechanism; 31. Vacuum stage; 311. Vacuum tank; 32. Positioning seat; 33. Fixed support block; 331. Support part; 34. Moving support block; 35. Fixed seat; 36. Moving cylinder; 37. Lifting motor; 38. Guide rod; 39. Rotating base. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Example 1 like Figure 1-6 As shown, a wafer surface wiping device includes a rotating table 1 and a wiping mechanism 2. The rotating table 1 is provided with a positioning mechanism 3 for positioning the wafer and driving the wafer to rotate. The wiping mechanism 2 includes a wiping plate 211 and a wiping cloth 212. The wiping plate 211 is located on the outside of the rotating table 1, and the wiping cloth 212 is wrapped around the wiping plate 211. During cleaning, the wiping cloth 212 is in contact with the back of the wafer. The wiping cloth 212 wrapped below the wiping plate 211 is connected to the unwinding tray 23, and the wiping cloth 212 wrapped above the wiping plate 211 is connected to the winding tray 24. The unwinding tray 23 is used to unwind the wiping cloth, and the winding tray 24 is used to wind up the used wiping cloth. Specifically, the wiping plate 211 has grooves on both its upper and lower sides that are adapted to the wiping cloth 212 to guide the path of the wiping cloth. The wiping cloth 212 is led out through the unwinding tray 23, wound around the wiping plate 211 from below to above it, and then wound upwards to be wound onto the take-up tray 24. In this embodiment, the wiping cloth 211 is a cleanroom cloth.

[0020] The wiping device of this invention can automatically wipe wafers. During wiping, the wafer rotates, and the wiping cloth is in contact with the wafer surface to automatically wipe the wafer. The wiping force is uniform and the wiping efficiency is high. The wiping cloth is continuously wiped in sections by a take-up reel, and the wiped wiping cloth is automatically rewound. The wiping time of each section of the wiping cloth is precisely controlled to ensure the effective use of the wiping cloth, avoid waste of wiping cloth, and save resources.

[0021] like Figure 1-3 As shown, the wiping mechanism 2 also includes a wiping box 221 and a wiping support 222. One end of the wiping support 222 is connected to the rotary table 1, and the other end extends into the wiping box 221 and is connected to the wiping box 221. The unwinding tray 23 and the rewinding tray 24 are both located inside the wiping box 221 and are rotatably connected to the wiping mounting plate 223. The wiping mounting plate 223 is fixedly connected to the wiping box 221. The wiping plate 211 is also connected to the lifting cylinder 231 located below it. The lifting cylinder 231 is fixed on the outside of the wiping box 221. The lifting cylinder 213 can drive the wiping cloth to adhere to the wafer during cleaning, or drive the wiping plate 211 to descend and separate from the wafer when wiping is completed.

[0022] In addition, such as Figure 2 As shown, the wiping box 221 is equipped with an openable cover with a viewing window. Opening the cover allows for easy replacement of the unwinding tray 23 and the rewinding tray 24.

[0023] Among them, such as Figure 3-5 As shown, the unwinding tray 23 is located at the front end of the tray shaft 231. The tray shaft 231 is rotatably connected to the wiping mounting plate 223 via a bearing mounted on the wiping mounting plate 223. The rear end of the tray shaft 231 passes through the wiping mounting plate 223 and is fitted with a spring 232. One end of the spring 232 abuts against the wiping mounting plate 223, and the other end is provided with a nut that is threadedly connected to the tray shaft 231.

[0024] The take-up reel 24 is mounted on the second reel shaft 241. The rear end of the second reel shaft 241 passes through the wiping mounting plate 223 and is connected to the drive assembly 26 mounted on the wiping mounting plate 223. The drive assembly 26 is used to drive the second reel shaft 241 to rotate. The front end of the second reel shaft 241 is provided with a seated bearing, the take-up reel 24, a pressure plate 242, and a second spring 243 in sequence from back to front. The end of the second spring 243 away from the pressure plate 242 is provided with a nut that is threadedly connected to the second reel shaft 241. Through the setting of the first spring 232 and the second spring 243, the unwinding reel 23 and the take-up reel 24 can move a certain amount in the axial direction of the reel, adapting to the offset of the wiping cloth and ensuring the stable delivery of the wiping cloth.

[0025] The intermittent rotation of the winding tray 24 of this utility model can precisely control the feed amount of the cleanroom cloth each time, so that the wiping cloth moves in sections. The wiping time of each section of wiping cloth 512 can be controlled according to the number of rotations of the rotary table or the working time.

[0026] like Figure 3-5 As shown, the drive assembly 56 is a belt drive assembly, including a main synchronous pulley 561, a driven synchronous pulley 562, and a tension pulley 563 located on the rear side of the wiping mounting plate 523. The wiping mounting plate 523 and the rear side plate of the wiping box 521 are spaced apart. The main body of the drive assembly 56 is located in the spaced space. The main synchronous pulley 561 is connected to a motor located on the front side of the wiping mounting plate 523. The driven synchronous pulley 562 is connected to the material tray shaft 541 and is belt driven by the main synchronous pulley 561 through an annular belt 564. The tension pulley 563 is located on the outside of the annular belt 564 and is used to tension the annular belt 564.

[0027] like Figure 3-5 As shown, the wiping mechanism 5 also includes a guide assembly 25 for guiding the movement of the wiping cloth 212. The guide assembly 25 includes a first guide wheel 251 and a second guide wheel 252. Multiple first guide wheels 251 are provided between the unwinding reel 23 and the wiping plate 511. At least one limiting block 253 is provided between the first guide wheels 251. The limiting block 253 is provided with a limiting groove for the wiping cloth 212 to pass through. Multiple second guide wheels 252 are provided between the winding reel 24 and the wiping plate 211.

[0028] The guide assembly 25 also includes a guide wheel 254 and a guide shaft 255. The guide shaft 255 is rotatably connected to the wiping mounting plate 223 via a bearing with a seat. The front end of the guide shaft 255 is connected to the guide wheel 254, and the rear end of the guide shaft 255 passes through the wiping mounting plate 223 and is connected to the guide drive wheel 226 located on the rear side of the wiping mounting plate 223. The guide drive wheel 226 is connected to the drive assembly 26 and can rotate synchronously with the take-up reel 24 through the drive assembly 26. The guide wheel 254 cooperates with a guide wheel 252 to guide the wiping cloth 212. Specifically, the guide drive wheel 226 is connected to the annular belt 264 for belt drive. In this embodiment, the guide wheel 254 is provided with a soft layer, such as sponge, on the outside. The guide wheel 254 is located obliquely above the guide wheel 252 that cooperates with it and is tangent to the guide wheel 252. The wiping cloth 212 passes through the tangent point. The guide drive wheel 226 and the synchronous wheel 262 are the same size and rotate synchronously with the take-up reel 24. The guide wheel 254 cooperates with the guide wheel 252 to guide the wiping cloth to take up, which can reduce the downstream take-up load, so that the wiping cloth 212 is stably conveyed without breaking. Moreover, the wiping cloth 212 passing through the tangent point can make the used wiping cloth more neat and convenient for subsequent rolls.

[0029] The aforementioned wiping mechanism also includes an adjustment component 27. The adjustment component 27 adjusts the wiping range by adjusting the distance the wiping plate 211 extends into the wafer. It includes a slide rail 271, which is positioned above the wiping support 222. A mounting plate 272 is located at the lower end of the wiping box 221. The bottom surface of the cover of the wiping box 221 is flush with the mounting plate 272, resulting in a more aesthetically pleasing appearance and easier adjustment. A slider that slides along the slide rail 271 is located below the mounting plate 272. A guide rail clamp 273 for locking the slide rail 271 is also located below the mounting plate 272. The mounting plate 272 has an adjustment slot for adjusting the guide rail clamp 273. Releasing the guide rail clamp 273 allows adjustment of the position of the wiping box 221 relative to the wiping support 222, thereby adjusting the distance the wiping plate 211 extends into the wafer.

[0030] Example 2 Based on the structure of Example 1, such as Figure 1 , 6 As shown, the positioning mechanism 3 includes a vacuum stage 31 and a positioning seat 32. The vacuum stage 31 is located above the rotary table 1, and its top is provided with a vacuum groove 311 for adsorbing wafers. The vacuum groove 311 is arranged in annular grid and is evenly distributed within the adsorption range of the wafers. The positioning seat 32 is sleeved on the outside of the vacuum stage 31. Above the positioning seat 31, there are multiple sets of support blocks arranged around the vacuum stage 31. Each set of support blocks includes two fixed support blocks 33 and a movable support block 34 arranged opposite to each other. The fixed support blocks 33 are fixed to the positioning seat 32 by a fixed seat 35. The movable support blocks 34 are connected to the output end of a movable cylinder 36 installed on the positioning seat 32 and can move radially along the vacuum stage 31 by the movable cylinder 36.

[0031] Specifically, both the fixed support block 33 and the movable support block 34 are provided with multiple support parts 331. These support parts 331 are arranged in a multi-step manner along the radial direction of the vacuum stage 31. Each support part 331 includes a horizontal support part and a vertical limiting part. The horizontal support part supports the wafer, and the vertical limiting part is perpendicular to the horizontal support part, cooperating with the outer surface of the wafer to limit its position. Each support part 331 corresponds to a wafer of a specific size, allowing this invention to adapt to the wiping of wafers of different sizes. In this embodiment, it mainly corresponds to the slag removal of 5-inch, 6-inch, and 8-inch wafers; therefore, three support parts are provided, arranged in a multi-step manner according to the wafer size.

[0032] During wiping, after the wafer is placed on the vacuum stage 31, the positioning seat 32 rises, and the bottom surface of the support part 331 corresponding to the wafer size abuts against the wafer. Then, the moving cylinder 36 drives the moving support block 34 to move, positioning the wafer. The vacuum stage 31 then picks up the wafer, and multiple sets of support blocks reset, completing the positioning and fixing of the wafer. By setting multiple sets of support blocks to position the wafer center, it is possible to ensure that the wafer rotates coaxially with the rotary stage 1, ensuring positioning accuracy and thus ensuring accurate wiping range.

[0033] like Figure 6 As shown, the positioning mechanism 3 also includes a lifting assembly, which includes a lifting motor 37 and guide rods 38. The lifting motor 37 is fixed on the rotating base 39, and its output end is connected to the positioning seat 32 through a connector. Multiple guide rods 38 are provided below the positioning seat 32, and the lower ends of the guide rods 38 are inserted into and slidably connected to the rotating base 39. The lifting assembly can be used to drive the fixed support block 33 and the movable support block 34 on the positioning seat 32 to move up and down, so that the support part 331 corresponding to the wafer size rises and aligns with the wafer on the vacuum stage 31 to position its center. Furthermore, after the wafer is released from vacuum adsorption during unloading, the wafer on the vacuum stage 31 can be lifted to detach from the vacuum stage 31, facilitating unloading and unloading.

[0034] It should be noted that this utility model can be used alone for wiping the wafer surface, or it can be combined with a wafer surface scraping device to achieve cleaning treatment of the wafer surface.

[0035] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0036] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer surface wiping device, characterized in that: The device includes a rotating table and a wiping mechanism. The rotating table is equipped with a positioning mechanism for positioning the wafer and driving the wafer to rotate. The wiping mechanism includes a wiping plate and a wiping cloth. The wiping plate is located outside the rotating table, and the wiping cloth is wrapped around the wiping plate. During cleaning, the wiping cloth is in contact with the back of the wafer. The wiping cloth wrapped below the wiping plate is connected to an unwinding reel, and the wiping cloth wrapped above the wiping plate is connected to a rewinding reel. The unwinding reel is used to unwind the wiping cloth, and the rewinding reel is used to rewind the used wiping cloth.

2. The wafer surface wiping device according to claim 1, characterized in that: The positioning mechanism includes a vacuum stage and a positioning seat. The vacuum stage is located above a rotary table and has a vacuum groove on its top for adsorbing wafers. The vacuum groove is evenly distributed within the wafer adsorption range. The positioning seat is sleeved on the outside of the vacuum stage. Above the positioning seat are multiple sets of support blocks arranged around the vacuum stage. Each set of support blocks includes two oppositely arranged fixed support blocks and a movable support block. The fixed support blocks are fixed to the positioning seat by a fixed seat. The movable support blocks are connected to the output end of a movable cylinder installed on the positioning seat and can move radially along the vacuum stage by the movable cylinder.

3. The wafer surface wiping device according to claim 2, characterized in that: Both the fixed support block and the movable support block are provided with multiple support parts. The multiple support parts are arranged in a multi-level step along the radial direction of the vacuum stage. Each support part includes a horizontal support part and a vertical limiting part. The horizontal support part is used to support the wafer. The vertical limiting part is arranged perpendicular to the horizontal support part and cooperates with the outer surface of the wafer to limit the wafer position.

4. The wafer surface wiping device according to claim 1, characterized in that: The wiping mechanism also includes a wiping box and a wiping support. One end of the wiping support is connected to the rotary table, and the other end extends into the wiping box and is connected to the wiping box. The unwinding tray and the rewinding tray are both located inside the wiping box and are rotatably connected to the wiping mounting plate. The wiping mounting plate is fixedly connected to the wiping box. The wiping plate is also connected to a lifting cylinder located below it. The lifting cylinder is fixed to the outside of the wiping box.

5. The wafer surface wiping device according to claim 4, characterized in that: The unwinding tray is located at the front end of the tray shaft one. The tray shaft one is rotatably connected to the wiping mounting plate via a bearing mounted on the wiping mounting plate. The rear end of the tray shaft one passes through the wiping mounting plate and is fitted with a spring one. One end of the spring one abuts against the wiping mounting plate, and the other end is provided with a nut that is threadedly connected to the tray shaft one.

6. The wafer surface wiping device according to claim 4, characterized in that: The take-up reel is mounted on the reel shaft two. The rear end of the reel shaft two passes through the wiping mounting plate and is connected to the drive assembly mounted on the wiping mounting plate. The drive assembly is used to drive the reel shaft two to rotate. The front end of the reel shaft two is provided with a seated bearing, a take-up reel, a pressure plate, and a spring two in sequence from back to front. The end of the spring two away from the pressure plate is provided with a nut that is threadedly connected to the reel shaft two.

7. The wafer surface wiping device according to claim 6, characterized in that: The drive assembly includes a main synchronous pulley, a driven synchronous pulley, and a tension pulley located on the rear side of the wiping mounting plate. The main synchronous pulley is connected to a motor located on the front side of the wiping mounting plate. The driven synchronous pulley is connected to the material tray shaft and is belt-driven to the main synchronous pulley via an annular belt. The tension pulley is located on the outer side of the annular belt and is used to tension the annular belt.

8. The wafer surface wiping device according to claim 1, characterized in that: The wiping mechanism also includes a guide component for guiding the movement of the wiping cloth. The guide component includes a guide wheel one and a guide wheel two. Multiple guide wheels one are provided between the unwinding tray and the wiping plate, and multiple guide wheels two are provided between the winding tray and the wiping plate.

9. The wafer surface wiping device according to claim 8, characterized in that: The guiding assembly also includes a guide wheel three and a guide shaft. The guide shaft is rotatably connected to the wiping mounting plate via a bearing with a seat, and the front end of the guide shaft is connected to the guide wheel three. The rear end of the guide shaft passes through the wiping mounting plate and is connected to a guide drive wheel located on the rear side of the wiping mounting plate. The guide drive wheel is connected to a drive assembly that drives the take-up reel to rotate, and can rotate synchronously with the take-up reel through the drive assembly. The guide wheel three cooperates with a guide wheel two to guide the wiping cloth.

10. The wafer surface wiping device according to claim 4, characterized in that: It also includes an adjustment component, which includes a slide rail located above the wiping support. The lower end of the wiping box is provided with a mounting plate, and a slider that is slidably connected to the slide rail is located below the mounting plate. A guide rail clamp for locking the slide rail is also provided below the mounting plate.

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