Electrode assembly for a semiconductor chip test socket
Patent Information
- Application Number
- CN202522626540.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-11
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-12-11
AI Technical Summary
[0005]本实用新型的目的在于克服现有技术的不足，适应现实需要，提供一种半导体芯片测试座的电分解正极导电装置，以解决当前电分解正极导电装置一般采用人工擦拭与超声清洗等方法进行清洁，从而效率低、易损伤触针、清洗剂兼容性不足的技术问题
[0015]本实用新型装置运行时，先通过支撑底板的双重定位结构固定芯片测试座，确保其与导电机构网对齐；向海绵条滴注电解液，使其渗透并覆盖导电机构网与Pin针接触区域；通过导线连接外部电源，形成正负极闭合回路；操作人员握持把手稳定装置，用清洗头治具按压海绵体，使清洗头与Pin针良好接触，触发电分解反应：正极侧Pin针氧化物被氧化溶解，负极侧析出气体剥离脏污；老化测试板与海绵体的缓冲适配，保障反应均匀且不损伤Pin针，整个过程实现定位、导电、化学反应和清洁的一体化运行，高效去除Pin针表面的氧化绝缘层与油污，恢复Pin针的导电性能，适配半导体芯片测试座的清洁维护需求。
Smart Images
Figure CN224913017U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of cleaning semiconductor chip test sockets, specifically to an electrolytic decomposition device for positive electrode conduction of a semiconductor chip test socket. Background Technology
[0002] After chip packaging, it needs to undergo aging tests. The chip is mounted in a dedicated socket on the aging test board to achieve electrical connection with the test equipment. Under long-term high-frequency use, the socket is prone to accumulating contaminants such as flux residue, dust, and metal oxides, which leads to increased contact resistance, signal distortion, increased test misjudgment rate, and decreased yield. In severe cases, it can damage both the socket and the chip.
[0003] However, existing technologies have the following problems when used:
[0004] Traditional methods for cleaning the positive electrode conductive device of semiconductor chip test sockets typically involve manual wiping and ultrasonic cleaning, which suffer from drawbacks such as low efficiency, potential damage to the probes, and insufficient compatibility of cleaning agents. Therefore, there is an urgent need to develop efficient, safe, and compatible professional cleaning solutions to improve testing accuracy and reliability and extend equipment lifespan. This requires the design of new technical solutions. Utility Model Content
[0005] The purpose of this utility model is to overcome the shortcomings of the existing technology, adapt to the needs of reality, and provide an electrolytic positive electrode conductive device for semiconductor chip test sockets. This solves the technical problems of low efficiency, easy damage to the probes, and insufficient compatibility of cleaning agents in current electrolytic positive electrode conductive devices, which are generally cleaned by manual wiping and ultrasonic cleaning.
[0006] To achieve the purpose of this utility model, the technical solution adopted by this utility model is as follows: design a positive electrode conductive device for electrolysis of a semiconductor chip test socket, including a fixed base, the fixed base including a support base plate, two handle mechanisms are fixedly connected to both sides of the upper surface of the support base plate, four L-shaped positioning columns are symmetrically installed on both sides of the two handle mechanisms, and four positioning columns are respectively installed on one side of the positioning surface of the four L-shaped positioning columns.
[0007] A conductive base plate is fixedly connected to the upper surface of the supporting base plate. Multiple sponge strips are evenly distributed on the upper surface of the conductive base plate, and the upper surface of the sponge strips is covered with a conductive mesh structure.
[0008] Preferably, the two handle mechanisms include a first handle and a second handle, the first handle being fixedly connected to the left side of the upper surface of the support base plate, and the second handle being fixedly connected to the right side of the upper surface of the support base plate.
[0009] Preferably, the four L-shaped positioning posts include a first L-shaped positioning post, a second L-shaped positioning post, a third L-shaped positioning post, and a fourth L-shaped positioning post. The first L-shaped positioning post is fixedly connected to the upper left corner of the support base plate, the second L-shaped positioning post is fixedly connected to the upper right corner of the support base plate, the third L-shaped positioning post is fixedly connected to the lower left corner of the support base plate, and the fourth L-shaped positioning post is fixedly connected to the lower right corner of the support base plate.
[0010] Preferably, the four positioning posts include a first positioning post, a second positioning post, a third positioning post, and a fourth positioning post. The first positioning post is fixedly connected to the upper left corner of the support base plate, the second positioning post is fixedly connected to the upper right corner of the support base plate, the third positioning post is fixedly connected to the lower left corner of the support base plate, and the fourth positioning post is fixedly connected to the lower right corner of the support base plate.
[0011] Preferably, a plurality of the sponge strips are bonded to the upper surface of the conductive base plate, the size of the conductive structure mesh is consistent with the size of the conductive base plate, and covers the upper surface of the sponge strips.
[0012] Preferably, an aging test plate is placed on the upper surface of the conductive structure mesh in contact with it, and a sponge is placed on the upper surface of the aging test plate. The other end of the sponge is fixedly connected to one end of the cleaning head fixture.
[0013] Preferably, the cleaning head fixture is connected to the negative terminal of an external power source via a wire, and the positive terminal of the external power source is connected to the conductive base plate via a wire.
[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0015] When this device is in operation, the chip test socket is first fixed by the double positioning structure of the supporting base plate to ensure its alignment with the conductive mesh; electrolyte is dripped into the sponge strip to penetrate and cover the contact area between the conductive mesh and the pin; an external power supply is connected through wires to form a closed circuit of positive and negative electrodes; the operator holds the handle to stabilize the device and presses the sponge with the cleaning head fixture to ensure good contact between the cleaning head and the pin, triggering an electrolysis reaction: the oxide on the positive side of the pin is oxidized and dissolved, and the gas released on the negative side removes dirt; the aging test plate and the sponge are buffered and adapted to ensure uniform reaction without damaging the pin. The whole process realizes the integrated operation of positioning, conductivity, chemical reaction and cleaning, efficiently removing the oxide insulating layer and oil on the surface of the pin, restoring the conductivity of the pin, and adapting to the cleaning and maintenance needs of semiconductor chip test sockets. Attached Figure Description
[0016] Figure 1 This is an overall view of the conductive plate of this utility model;
[0017] Figure 2 This is an anatomical diagram of the conductive plate of this utility model;
[0018] Figure 3 This is a schematic diagram illustrating the working principle of this utility model.
[0019] In the diagram: 1. First L-shaped positioning post; 2. Second L-shaped positioning post; 3. Third L-shaped positioning post; 4. Fourth L-shaped positioning post; 5. First handle; 6. Second handle; 7. Support base plate; 8. Conductive base plate; 9. Sponge strip; 10. First positioning post; 11. Second positioning post; 12. Third positioning post; 13. Fourth positioning post; 14. Conductive structure mesh; 15. Cleaning head fixture; 16. Aging test plate; 17. External power supply; 18. Sponge body. Detailed Implementation
[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0021] Example 1: An electrolytic decomposition device for the positive electrode of a semiconductor chip test socket, see [link to example]. Figures 1 to 3 It includes a fixed base, which includes a support base plate. Two handle mechanisms are fixedly connected to both sides of the upper surface of the support base plate. The two handle mechanisms include a first handle and a second handle. The first handle is fixedly connected to the left side of the upper surface of the support base plate, and the second handle is fixedly connected to the right side of the upper surface of the support base plate.
[0022] Four L-shaped positioning posts are symmetrically installed on both sides of the two handle mechanisms. The four L-shaped positioning posts include a first L-shaped positioning post, a second L-shaped positioning post, a third L-shaped positioning post, and a fourth L-shaped positioning post. The first L-shaped positioning post is fixedly connected to the upper left corner of the support base plate, the second L-shaped positioning post is fixedly connected to the upper right corner of the support base plate, the third L-shaped positioning post is fixedly connected to the lower left corner of the support base plate, and the fourth L-shaped positioning post is fixedly connected to the lower right corner of the support base plate.
[0023] Four positioning posts are installed on one side of the positioning surface of the four L-shaped positioning posts. The four positioning posts include a first positioning post, a second positioning post, a third positioning post, and a fourth positioning post. The first positioning post is fixedly connected to the upper left corner of the support base plate, the second positioning post is fixedly connected to the upper right corner of the support base plate, the third positioning post is fixedly connected to the lower left corner of the support base plate, and the fourth positioning post is fixedly connected to the lower right corner of the support base plate.
[0024] The base plate of the fixed base provides stable support for the overall structure. The handle mechanism and the L-shaped positioning posts form a dual positioning system: two handles (first and second handles) are symmetrically installed on both sides of the base plate, which not only facilitates the operator to move and transfer the device, but also helps to fix the position of the device during cleaning operations and prevent displacement; the four L-shaped positioning posts and the four positioning posts correspond to the four corners of the base plate, forming circumferential limit and positioning, ensuring that the chip test socket, conductive base plate, conductive mechanism mesh and other components are coaxially aligned, avoiding poor conductive contact due to component misalignment, and ensuring the uniformity of the electrolysis reaction.
[0025] A conductive base plate is fixedly connected to the upper surface of the supporting base plate. Multiple sponge strips are evenly distributed on the upper surface of the conductive base plate. A conductive structural mesh is covered on the upper surface of the sponge strips. Multiple sponge strips are adhered to the upper surface of the conductive base plate. The size of the conductive structural mesh matches the size of the conductive base plate and covers the upper surface of the sponge strips.
[0026] As the core carrier of positive current, the conductive base plate, after being connected to the positive terminal of the external power supply, evenly transmits the current to multiple sponge strips on its surface. The sponge strips serve both as elastic support and electrolyte carriers. Their elasticity allows the conductive mesh to adapt to the height differences of the pins when in contact with the chip test pins, ensuring that each pin is in close contact with the conductive mesh (without gaps) and preventing interruption of current conduction. At the same time, the sponge strips absorb the electrolyte through a dripping process, forming a dual medium of conductivity and electrolyte penetration. This ensures both current conduction efficiency and provides a continuous reaction environment for the electrolysis reaction. The conductive mesh is the same size as the conductive base plate and fully covers the sponge strips, further achieving uniform current distribution and preventing local current concentration that could damage the pins.
[0027] For details, see Figure 3 An aging test plate is placed on the upper surface of the conductive structure mesh in contact with it. A sponge is placed on the upper surface of the aging test plate. The other end of the sponge is fixedly connected to one end of the cleaning head fixture.
[0028] The aging test board serves as an intermediate carrier between the conductive mesh and the chip test pins. Its flat surface ensures that the current from the conductive mesh is evenly distributed to each pin, preventing poor contact and uneven cleaning caused by inconsistent pin heights. The sponge is fixedly connected to one end of the cleaning head fixture. On one hand, it has an elastic buffering function; when the cleaning head fixture is pressed, the sponge absorbs the pressure through deformation, preventing damage to the pins from rigid contact. On the other hand, the sponge can absorb electrolyte, forming a uniform electrolyte film between the cleaning head and the pins, ensuring uniform reduction reaction and consistent bubble removal. It also assists in conducting negative current, ensuring circuit stability.
[0029] Further, see Figure 3The cleaning head fixture is connected to the negative terminal of an external power source via a wire, and the positive terminal of the external power source is connected to a conductive base plate via a wire.
[0030] The cleaning head fixture is connected to the negative terminal of an external power supply via wires, and the conductive base plate is connected to the positive terminal of the external power supply via wires, forming a complete closed loop: "Positive power supply → Conductive base plate → Conductive mesh → Electrolyte → Pin → Sponge → Cleaning head fixture → Negative power supply". This connection method ensures a clear and stable current conduction path, eliminating the risk of leakage or current loss. The positive current can evenly cover the conductive mesh, and the negative current is precisely transmitted to the pin contact area through the cleaning head fixture, allowing each pin to participate in the oxidation-reduction reaction. This avoids cleaning failure of some pins due to poor circuit contact, ensuring consistent overall cleaning results for the chip test socket pins.
[0031] Working principle: The electrolyte flows into the chip test socket through the sponge in a drip manner. The cleaning head is connected to the negative terminal of the external power supply, and the conductive structure mesh on the conductive plate is connected to the positive terminal of the power supply. After forming a closed circuit, the cleaning head is pressed for several seconds to cause an oxidation reaction on the aging test board. The metal ions are oxidized to form ions, which enter the solution and destroy the oxide insulating layer, thereby removing the oxide. At the same time, a reduction reaction occurs on the test head, releasing gas and mechanically impacting the dirt.
[0032] Circuit closure: The conductive base plate (connected to the positive terminal of the external power supply) → conductive mesh → electrolyte → chip test socket pin → cleaning head (connected to the negative terminal of the external power supply) form a closed loop, providing the current basis for the electrolysis reaction;
[0033] Oxidation reaction (positive electrode side): The metal oxides on the surface of the pin undergo an oxidation reaction under the action of the positive electrode current. The elemental metal ions are oxidized into metal ions, which dissolve into the electrolyte, thereby destroying the structural integrity of the oxide insulating layer and achieving the chemical removal of oxides.
[0034] Reduction reaction (negative electrode side): The cleaning head acts as the negative electrode. When it comes into contact with the pin, a reduction reaction occurs. Hydrogen ions in the electrolyte gain electrons to generate hydrogen or oxygen and are released. The released gas forms tiny bubbles, which exert mechanical impact on the oil and residual dirt on the surface of the pin, peeling off the attached dirt and achieving dual cleaning of oil and physical impurities.
[0035] Synergistic effect of electrolyte: The electrolyte permeates through the sponge strip, acting as an ion conduction medium to ensure circuit continuity, dissolving metal ions generated by oxidation reaction to prevent ions from redepositing on the pin surface, and providing a flow environment for bubbles to remove dirt, thus improving the thoroughness of cleaning.
[0036] In addition, all components designed in this utility model are general standard parts or components known to those skilled in the art. Their structure and principle can be known to those skilled in the art through technical manuals or conventional experimental methods. Those skilled in the art can fully implement them, so there is no need to elaborate. The content protected by this utility model does not involve improvements to the internal structure and method.
[0037] The embodiments disclosed herein are preferred embodiments, but are not limited thereto. Those skilled in the art can readily grasp the spirit of this utility model based on the above embodiments and make different extensions and variations. However, as long as they do not depart from the spirit of this utility model, they are all within the protection scope of this utility model.
Claims
1. A device for electrolytic decomposition of the positive electrode of a semiconductor chip test socket, comprising a fixed base, characterized in that, The fixed base includes a support base plate (7), and two handle mechanisms are fixedly connected to both sides of the upper surface of the support base plate (7). Four L-shaped positioning columns are symmetrically installed on both sides of the two handle mechanisms, and four positioning columns are respectively installed on one side of the positioning surface of the four L-shaped positioning columns. A conductive base plate (8) is fixedly connected to the upper surface of the supporting base plate (7). Multiple sponge strips (9) are evenly distributed on the upper surface of the conductive base plate (8). The upper surface of the sponge strips (9) is covered with a conductive structure mesh (14).
2. The electrolytic positive electrode conductive device for a semiconductor chip test socket as described in claim 1, characterized in that, The two handle mechanisms include a first handle and a second handle (6), the first handle being fixedly connected to the left side of the upper surface of the support base plate (7), and the second handle (6) being fixedly connected to the right side of the upper surface of the support base plate (7).
3. The electrolytic decomposition positive electrode conductive device for a semiconductor chip test socket as described in claim 1, characterized in that, The four L-shaped positioning posts include a first L-shaped positioning post (1), a second L-shaped positioning post (2), a third L-shaped positioning post (3), and a fourth L-shaped positioning post (4). The first L-shaped positioning post (1) is fixedly connected to the upper left corner of the support base plate (7), the second L-shaped positioning post (2) is fixedly connected to the upper right corner of the support base plate (7), the third L-shaped positioning post (3) is fixedly connected to the lower left corner of the support base plate (7), and the fourth L-shaped positioning post (4) is fixedly connected to the lower right corner of the support base plate (7).
4. The electrolytic positive electrode conductive device for a semiconductor chip test socket as described in claim 1, characterized in that, The four positioning posts include a first positioning post (10), a second positioning post (11), a third positioning post (12), and a fourth positioning post (13). The first positioning post (10) is fixedly connected to the upper left corner of the support base plate (7), the second positioning post (11) is fixedly connected to the upper right corner of the support base plate (7), the third positioning post (12) is fixedly connected to the lower left corner of the support base plate (7), and the fourth positioning post (13) is fixedly connected to the lower right corner of the support base plate (7).
5. The electrolytic decomposition positive electrode conductive device for a semiconductor chip test socket as described in claim 1, characterized in that, Multiple sponge strips (9) are bonded to the upper surface of the conductive base plate (8). The size of the conductive structure mesh (14) matches the size of the conductive base plate (8) and covers the upper surface of the sponge strips (9).
6. The electrolytic positive electrode conductive device for a semiconductor chip test socket as described in claim 1, characterized in that, An aging test plate (16) is placed on the upper surface of the conductive structure mesh (14) in contact with it. A sponge (18) is in contact with the upper surface of the aging test plate (16). The other end of the sponge (18) is fixedly connected to one end of the cleaning head fixture (15).
7. The electrolytic positive electrode conductive device for a semiconductor chip test socket as described in claim 6, characterized in that, The cleaning head fixture (15) is connected to the negative terminal of an external power supply (17) via a wire, and the positive terminal of the external power supply (17) is connected to the conductive base plate (8) via a wire.