Wafer surface slag removing device

Abstract

The utility model provides a kind of wafer surface slag removal device, including rotating table, scraper, dust suction component, rotating table is equipped with positioning assembly, for positioning wafer, and can drive wafer rotation, rotating table outside is equipped with two oppositely arranged scrapers, two scrapers can be with rotating table as center and move towards each other, and two scrapers are flexibly pressed in wafer back when slag removal;Every scraper below is also equipped with a dust suction component.The utility model realizes automatic slag removal, simple structure, scraper is flexibly pressed in wafer surface when slag removal, and slag removal strength is stable, can avoid damaging wafer when slag removal;And dust suction simultaneously when slag removal, can avoid waste slag and scrap adsorption on scraper and wafer, improve slag removal efficiency and slag removal quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a wafer surface slag removal device. Background Technology

[0002] During wafer manufacturing, foreign matter such as crystals or particles can easily accumulate on the back side of the wafer (especially within about 10mm of the wafer edge), such as silicon dross particles. These foreign matter adheres to the back side of the wafer, affecting its flatness and subsequent photolithography, etching, and other processes, thereby reducing wafer yield. Therefore, it is necessary to remove foreign matter from the wafer surface.

[0003] Currently, the process is generally done manually. Manual scraping is inefficient, and it's difficult to control the scraping force, leading to inconsistent scraping quality and potentially damaging the wafer. Utility Model Content

[0004] The present invention aims to provide a wafer surface slag removal device to overcome the shortcomings of the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model is: a wafer surface descaling device, including a rotating table, a scraper, and a dust collection assembly. The rotating table is provided with a positioning assembly for positioning the wafer and driving the wafer to rotate. Two oppositely arranged scrapers are provided on the outer side of the rotating table. The two scrapers can move towards each other with the rotating table as the center, and the two scrapers are flexibly pressed against the back of the wafer during descaling. A dust collection assembly is also provided below each scraper.

[0006] Furthermore, in the aforementioned wafer surface descaling device, the positioning component includes a vacuum stage, which is positioned above a rotating stage and has a vacuum groove on its top for adsorbing wafers. The vacuum groove is evenly distributed within the wafer adsorption range.

[0007] Furthermore, in the aforementioned wafer surface descaling device, the positioning component further includes a positioning seat, which is sleeved on the outside of the vacuum stage. Above the positioning seat are multiple sets of support blocks arranged around the vacuum stage. Each set of support blocks includes two oppositely arranged fixed support blocks and a movable support block. The fixed support blocks are fixed to the positioning seat by the fixed seat, and the movable support blocks are connected to the output end of a movable cylinder installed on the positioning seat, and can move radially along the vacuum stage by the movable cylinder.

[0008] Furthermore, in the aforementioned wafer surface descaling device, both the fixed support block and the movable support block are provided with multiple support parts. The multiple support parts are arranged in a multi-level step along the radial direction of the vacuum stage, and each support part includes a horizontal support part and a vertical limiting part. The horizontal support part can support the wafer, and the vertical limiting part is arranged perpendicular to the horizontal support part. The vertical limiting part cooperates with the outer surface of the wafer to limit the wafer position.

[0009] Furthermore, the aforementioned wafer surface descaling device also includes a lifting assembly, which includes a lifting motor and guide rods. The lifting motor is fixed on a rotating base, and its output end is connected to a positioning seat through a connector. Multiple guide rods are provided below the positioning seat, and the lower ends of the guide rods are inserted into the rotating base and slidably connected to the rotating base.

[0010] Furthermore, in the aforementioned wafer surface descaling device, the two scrapers move towards each other via a moving assembly. The moving assembly includes a base plate, a lead screw, a support base, and a moving base. The lead screw is a double-ended lead screw located above the base plate, with support bases rotatably connected to both ends of the lead screw. One end of the lead screw is also connected to the output end of a drive motor via a coupling. Two moving bases are provided, symmetrically located at both ends of the lead screw and fixedly connected to the lead screw nut on the lead screw. The lower end of each moving base is also slidably connected to a guide rail fixed on the base plate. The two scrapers are each mounted on one moving base.

[0011] Furthermore, in the aforementioned wafer surface descaling device, the scraper is flexibly held on the back of the wafer by a self-adjusting component. The self-adjusting component is mounted on a movable base and includes a scraper holder, a connecting base, a guide wheel, a counterweight, and a steel wire rope. The scraper is mounted on the scraper holder with its blade angled upwards. The scraper holder is mounted on the connecting base. The connecting base and the counterweight are positioned opposite each other on both sides of the movable base and are slidably connected to slide rails on corresponding sides of the movable base. The top of the movable base is provided with a guide wheel that is rotatably connected to it. The tops of the connecting base and the counterweight are each provided with a steel wire rope connector. One end of the steel wire rope is connected to the connecting base, and the other end is wound upwards around the guide wheel and then extends downwards to connect with the counterweight.

[0012] Furthermore, in the aforementioned wafer surface descaling device, an adjuster is provided between the blade holder and the connecting seat, and the adjuster is used to adjust the tilt angle of the scraper.

[0013] Furthermore, in the aforementioned wafer surface descaling device, the dust collection assembly includes a dust collection pipe and a slag collection box. The slag collection box is arranged along the outer side of the vacuum stage, located below the scraper, and is fixedly connected to the rotary table via a support plate. The dust collection pipe is fixedly connected to the base plate via a support column, with one end connected to the slag outlet at the bottom of the slag collection box and the other end connected to an external air suction device. The slag collection box has an opening slot on the side away from the vacuum stage that matches the shape of the tool holder, and the tool holder is inserted into the opening slot.

[0014] Compared with the prior art, the beneficial effects of this utility model are: this utility model realizes automatic slag removal, has a simple structure, and the scraper is flexibly pressed on the wafer surface during slag removal, with stable slag removal force, which not only ensures the cleaning quality, but also avoids damage to the wafer during slag removal; and it can also vacuum up dust while removing slag, which can prevent waste residue and debris from adhering to the scraper and wafer, thus improving the slag removal efficiency and slag removal quality. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the wafer surface slag removal device of this utility model; Figure 2 This is a partial structural schematic diagram of the wafer surface slag removal device of this utility model; Figure 3 This is a schematic diagram of the self-adjusting component of the wafer surface slag removal device of this utility model. Figure 1 ; Figure 4 This is a schematic diagram of the self-adjusting component of the wafer surface slag removal device of this utility model. Figure 2 ; In the diagram: 1. Rotary table; 2. Scraper; 3. Positioning assembly; 31. Vacuum stage; 311. Vacuum chamber; 32. Positioning seat; 33. Fixed support block; 331. Support part; 34. Moving support block; 35. Fixed seat; 36. Moving cylinder; 37. Lifting motor; 38. Guide rod; 39. Rotating base; 4. Dust collection assembly; 41. Dust collection hose; 42. Dust collection box; 421. Opening groove; 43. Support plate; 44. Support column; 5. Moving component; 51. Base plate; 52. Lead screw; 53. Support base; 54. Moving base; 55. Guide rail; 6. Self-adjusting component; 61. Tool holder; 62. Connecting seat; 63. Guide wheel; 64. Counterweight; 65. Slide rail; 66. Adjuster. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Example 1 like Figure 1-4 As shown, a wafer surface descaling device includes a rotary table 1, a scraper 2, and a dust collection assembly 4. The rotary table 1 is equipped with a positioning assembly 3 for positioning the wafer and driving the wafer to rotate. Two oppositely arranged scrapers 2 are provided on the outer side of the rotary table 1. The two scrapers 2 can move towards each other with the rotary table 1 as the center, and during descaling, the two scrapers 2 are flexibly pressed against the back of the wafer. A dust collection assembly 4 is also provided below each scraper 2.

[0019] This invention achieves automatic slag removal with a simple structure. During slag removal, the scraper is flexibly pressed against the wafer surface, ensuring stable slag removal force. This not only guarantees cleaning quality but also prevents damage to the wafer during slag removal. Furthermore, dust is sucked up simultaneously during slag removal, preventing waste residue from adhering to the scraper and wafer, thus improving slag removal efficiency and quality.

[0020] In addition, an ion fan bar (not shown in the figure) can be installed above the scraper 2 to remove static electricity and prevent dust from adhering to the scraper 42 and affecting the scraping effect.

[0021] like Figure 1-2 As shown, the two scrapers 2 move towards each other via a moving assembly 5. The moving assembly 5 includes a base plate 51, a lead screw 52, ​​a support base 53, and a moving base 54. The lead screw 52 is a double-ended lead screw, located above the base plate 51. Support bases 53 are rotatably connected to both ends of the lead screw 52. One end of the lead screw 52 is also connected to the output end of a drive motor via a coupling. Two moving bases 54 are provided, symmetrically located at both ends of the lead screw 52, ​​and fixedly connected to the lead screw nut on the lead screw 52. The lower end of the moving base 54 is also slidably connected to a guide rail 55 fixed on the base plate 51. The two scrapers 2 are each mounted on one moving base 54. A rotating base 39 is installed above the base plate 51 and spans the middle of the lead screw 52. A rotating table 1 is fixed on the rotating base 39. The distance between the two scrapers 2 can be adjusted by the moving assembly, adapting to the slag removal of wafers of different sizes, offering a wide range of applications and good flexibility. In this embodiment, the rotating table 1 is a motor, with a simple and compact structure.

[0022] like Figure 3-4As shown, the scraper 2 is flexibly held on the back of the wafer by the self-adjusting component 6. The self-adjusting component 6 is located on the moving base 54 and includes a blade holder 61, a connecting base 62, a guide wheel 63, a counterweight 64, and a steel wire rope. The scraper 2 is located on the blade holder 61 with its blade tip tilted upward. The blade holder 61 is located on the connecting base 62. The connecting base 62 and the counterweight 64 are located opposite each other on both sides of the moving base 54 and are slidably connected to the slide rails 65 located on the corresponding sides of the moving base 54. The top of the moving base 54 is provided with a guide wheel 63 that is rotatably connected to it. The top of the connecting base 62 and the counterweight 64 are both provided with steel wire rope joints. One end of the steel wire rope (not shown in the figure) is connected to the connecting base 62, and the other end is wound upward around the guide wheel 63 and then extends downward to connect with the counterweight 64.

[0023] In addition, an adjuster 66 is provided between the blade holder 61 and the connecting seat 62, which is used to adjust the tilt angle of the scraper 2.

[0024] The weight of the counterweight 64 was determined through multiple trials to achieve the optimal weight, and the scraping force can also be adjusted by replacing the counterweight. Furthermore, the moving base 54 has a limiting component on its side that cooperates with the connecting base 62. This limiting component can limit the upper limit position of the scraper when there is no wafer on the vacuum stage, allowing the scraper to have upward floating space. In this embodiment, the upward floating distance is small and can be adjusted according to the wafer situation. When the wafer is adsorbed, it overcomes the resistance brought by the upward movement of the scraper and is adsorbed and fixed on the vacuum stage. During scraping, the scraper 2 is kept in contact with the back of the wafer by the gravity of the counterweight 64, flexibly pressing against the back of the wafer, resulting in stable scraping force. Compared with devices that control scraping force such as torque motors, the self-adjusting component of this invention can self-adjust the force, has a simple structure, low cost, and is not easily affected by interference.

[0025] Example 2 Based on the structure of Example 1, such as Figure 1-2 As shown, the positioning component 3 includes a vacuum stage 31 and a positioning seat 32. The vacuum stage 31 is located above the rotary table 1, and its top is provided with a vacuum groove 311 for adsorbing wafers. The vacuum groove 311 is arranged in annular grid and is evenly distributed within the adsorption range of the wafers. The positioning seat 32 is sleeved on the outside of the vacuum stage 31. Above the positioning seat 31, there are multiple sets of support blocks arranged around the vacuum stage 31. Each set of support blocks includes two fixed support blocks 33 and a movable support block 34 arranged opposite to each other. The fixed support blocks 33 are fixed to the positioning seat 32 by a fixed seat 35. The movable support blocks 34 are connected to the output end of a movable cylinder 36 installed on the positioning seat 32 and can move radially along the vacuum stage 31 by the movable cylinder 36.

[0026] Specifically, both the fixed support block 33 and the movable support block 34 are provided with multiple support parts 331. These support parts 331 are arranged in a multi-step manner along the radial direction of the vacuum stage 31. Each support part 331 includes a horizontal support part and a vertical limiting part. The horizontal support part supports the wafer, and the vertical limiting part is perpendicular to the horizontal support part, cooperating with the outer surface of the wafer to limit its position. Each support part 331 corresponds to a wafer of a specific size. In this embodiment, it mainly corresponds to the descaling of 5-inch, 6-inch, and 8-inch wafers; therefore, there are three support parts arranged in a multi-step manner according to the wafer size.

[0027] During slag removal, after the wafer is placed on the vacuum stage 31, the positioning seat 32 rises, and the bottom surface of the support part 331 corresponding to the wafer size abuts against the wafer. Then, the moving cylinder 36 drives the moving support block 34 to move, positioning the wafer. The wafer is then adsorbed and fixed by the vacuum stage 31, completing the positioning and fixing of the wafer. By setting multiple sets of support blocks to position the wafer center, it is possible to ensure that the wafer rotates coaxially with the rotary table 1, ensuring positioning accuracy and thus ensuring accurate slag removal range.

[0028] like Figure 1-2 As shown, the positioning component 3 also includes a lifting component, which includes a lifting motor 37 and guide rods 38. The lifting motor 37 is fixed on the rotating base 39, and its output end is connected to the positioning seat 32 through a connector. Multiple guide rods 38 are provided below the positioning seat 32, and the lower ends of the guide rods 38 are inserted into the rotating base 39 and slidably connected to the rotating base 39. The lifting component can be used to drive the fixed support block 33 and the movable support block 34 on the positioning seat 32 to move up and down, so that the support part 331 corresponding to the wafer size rises and aligns with the wafer on the vacuum stage 31 to position its center. In addition, it can also lift the wafer on the vacuum stage 31 after the vacuum adsorption is released during unloading, so that the wafer is detached from the vacuum stage 31, which is convenient for unloading and unloading.

[0029] like Figure 1-2 As shown, the dust collection assembly 4 includes a dust collection box 42. The dust collection box 42 is arranged along the outer side of the vacuum stage 31 and is located below the scraper 2. It is fixedly connected to the rotating table 1 through a support plate 43. The dust collection pipe 41 is fixedly connected to the base plate 51 through a support column 44. One end of the dust collection pipe 41 is connected to the dust outlet at the bottom of the dust collection box 42, and the other end is connected to an external air suction device. The dust collection pipe 41 is also provided with a telescopic section for good flexibility. The side of the dust collection box 42 away from the vacuum stage 31 has an opening groove 421 that matches the shape of the blade holder 61. The blade holder 61 is inserted into the opening groove 421, and the blade holder 61 is at least partially located inside the dust collection box 42. The opening groove serves to support the scraper and improve operational safety. When the scraper is working, the dust collection pipe 41 is activated, which, together with the dust collection box 42, can collect the waste residue scraped by the scraper 2, preventing the waste residue from adhering to the scraper and the wafer, and further improving the cleaning effect.

[0030] The working principle of this utility model is as follows: The control system starts the corresponding descaling program according to the size of the wafer to be descaled. The two scrapers 2 move to the descaling range corresponding to the wafer size according to the set program. The wafer to be descaled is placed on the rotating table 1. After the wafer is positioned by the positioning component 3, the rotating table 1 rotates and the wafer rotates accordingly. The two scrapers 2 flexibly press against the surface of the wafer to scrape away foreign objects on the back of the wafer. At the same time, the dust collection component 4 starts to collect dust. The wafer is descaled while rotating, which has high cleaning efficiency and good cleaning quality. When the descaling is completed, the rotating table 1 stops rotating, the positioning component 3 releases the positioning of the wafer, and the lifting component drives the wafer to detach from the vacuum stage 31 and unload the wafer.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0032] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer surface slag removal device, characterized in that: The device includes a rotating table, scrapers, and a dust collection assembly. The rotating table is equipped with a positioning assembly for positioning the wafer and driving the wafer to rotate. Two oppositely arranged scrapers are provided on the outer side of the rotating table. The two scrapers can move towards each other with the rotating table as the center, and during descaling, the two scrapers are flexibly pressed against the back of the wafer. A dust collection assembly is also provided below each scraper.

2. The wafer surface slag removal device according to claim 1, characterized in that: The positioning component includes a vacuum stage, which is located above a rotary table and has a vacuum groove on its top for adsorbing wafers. The vacuum groove is evenly distributed within the adsorption range of the wafers.

3. The wafer surface slag removal device according to claim 2, characterized in that: The positioning assembly also includes a positioning seat, which is sleeved on the outside of the vacuum stage. Above the positioning seat are multiple sets of support blocks arranged around the vacuum stage. Each set of support blocks includes two fixed support blocks and a movable support block arranged opposite to each other. The fixed support blocks are fixed to the positioning seat by the fixed seat. The movable support blocks are connected to the output end of a movable cylinder installed on the positioning seat and can move radially along the vacuum stage by the movable cylinder.

4. The wafer surface slag removal device according to claim 3, characterized in that: Both the fixed support block and the movable support block are provided with multiple support parts. The multiple support parts are arranged in a multi-level step along the radial direction of the vacuum stage. Each support part includes a horizontal support part and a vertical limiting part. The horizontal support part can support the wafer. The vertical limiting part is arranged perpendicular to the horizontal support part and cooperates with the outer surface of the wafer to limit the wafer position.

5. The wafer surface slag removal device according to claim 3, characterized in that: It also includes a lifting assembly, which includes a lifting motor and guide rods. The lifting motor is fixed on the rotating base, and its output end is connected to the positioning seat through a connector. Multiple guide rods are provided below the positioning seat, and the lower ends of the guide rods are inserted into the rotating base and slidably connected to the rotating base.

6. The wafer surface slag removal device according to claim 1, characterized in that: The two scrapers move toward each other via a moving assembly, which includes a base plate, a lead screw, a support base, and a moving base. The lead screw is a double-ended lead screw located above the base plate, with support bases rotatably connected to both ends of the lead screw. One end of the lead screw is also connected to the output end of a drive motor via a coupling. Two moving bases are provided, symmetrically located at both ends of the lead screw and fixedly connected to the lead screw nut on the lead screw. The lower end of each moving base is also slidably connected to a guide rail fixed on the base plate. The two scrapers are each mounted on one moving base.

7. The wafer surface slag removal device according to claim 1 or 6, characterized in that: The scraper is flexibly held on the back of the wafer by a self-adjusting component. The self-adjusting component is located on a movable base and includes a scraper holder, a connecting seat, a guide wheel, a counterweight, and a steel wire rope. The scraper is located on the scraper holder with its blade angled upward. The scraper holder is located on the connecting seat. The connecting seat and the counterweight are located opposite each other on both sides of the movable base and are slidably connected to slide rails located on the corresponding sides of the movable base. The top of the movable base is provided with a guide wheel that is rotatably connected to it. One end of the steel wire rope is connected to the connecting seat, and the other end is wound upward around the guide wheel and then extends downward to connect with the counterweight.

8. The wafer surface slag removal device according to claim 7, characterized in that: An adjuster is provided between the blade holder and the connecting seat, and the adjuster is used to adjust the tilt angle of the scraper.

9. The wafer surface slag removal device according to claim 1, characterized in that: The dust collection assembly includes a dust collection pipe and a slag collection box. The slag collection box is arranged along the outer side of the vacuum stage and is located below the scraper. It is fixedly connected to the rotating table via a support plate. The dust collection pipe is fixedly connected to the base plate via a support column. One end of the dust collection pipe is connected to the slag outlet at the bottom of the slag collection box, and the other end is connected to an external air suction device. The side of the slag collection box away from the vacuum stage has an opening groove that matches the shape of the blade holder. The blade holder is inserted into the opening groove.

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