Silicon photonic chip cleaning device

Abstract

The utility model discloses a kind of silicon optical chip cleaning devices, it is related to chip cleaning technical field, including cleaning storehouse, control box is equipped in cleaning storehouse one side, multiple observation windows are equidistantly opened in cleaning storehouse one end face, entrance and exit are respectively opened in cleaning storehouse one end face two sides, first screw rod module is installed in cleaning storehouse at entrance and exit, the sliding block of first screw rod module is fixed with tray, double-shaft moving screw rod module is installed in cleaning storehouse inner top surface;The utility model is cooperated by the slot of placing strip and arc-shaped groove, it is convenient to respectively adapt square and round silicon optical chip, improve the adaptability of device to different shape chip, and then the precise placement of multiple types of chips can be realized;Finally solve the problem that water film is caused by chip stacking placement gap in existing device, resulting in pollutant residue, affecting chip cleanliness, while improving the adaptability to different shape silicon optical chip, improve the cleanliness after silicon optical chip cleaning, cleaning operation reliability and the versatility of device.

Description

Technical Field

[0001] This utility model relates to the field of chip cleaning technology, and in particular to a silicon photonics chip cleaning device. Background Technology

[0002] As a core component in optical communication and optical computing, the surface cleanliness of silicon photonics chips directly affects photoelectric conversion efficiency, signal transmission stability, and device lifespan.

[0003] Existing devices typically place silicon photonics chips directly in a cleaning basket, and in some scenarios, multiple chips are stacked. Water films easily form between the chips, making it difficult to thoroughly clean and dry them. The residual water film carries contaminants, seriously affecting the cleanliness of the chips. Therefore, improvements are needed to address these issues. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a silicon photonics chip cleaning device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a silicon photonics chip cleaning device, comprising a cleaning chamber, a control box on one side of the cleaning chamber, multiple observation windows equidistantly opened on one end face of the cleaning chamber, an inlet and an outlet on both sides of one end face of the cleaning chamber, a first lead screw module installed at both the inlet and outlet of the cleaning chamber, a tray fixedly connected to the slider of the first lead screw module, a dual-axis moving lead screw module installed on the top surface of the cleaning chamber, the dual-axis moving lead screw module comprising two sets of lead screw modules controlling X-axis movement and Y-axis movement, an installation platform fixedly connected to the bottom surface of the lead screw slider of the Y-axis of the dual-axis moving lead screw module, four first electric push rods installed at the four corners of the bottom surface of the installation platform, hook assemblies fixedly connected to the bottom surfaces of the multiple first electric push rods, a cleaning basket hooked onto the hook assembly, multiple placement assemblies for placing silicon photonics chips equidistantly installed on the bottom surface of the cleaning basket, a cleaning assembly located in the middle of the bottom surface of the cleaning chamber, and a drying chamber located on one side of the cleaning assembly.

[0006] Preferably, a second electric actuator is installed on both sides of the top surface of the drying chamber, and a closing plate is fixedly connected to the telescopic end of the second electric actuator. A T-shaped groove for guiding the closing plate is opened on the bottom surface of the drying chamber. A T-shaped strip fixedly connected to the top surface of the closing plate is slidably arranged in the T-shaped groove. A water vapor outlet is provided on the inner wall of one end of the drying chamber. Steam pipes arranged in a serpentine pattern are fixedly connected to the inner walls of both sides of the drying chamber. A plurality of first flange pipes are provided on the outer wall of the cleaning chamber, which are respectively connected to both ends of the steam pipes and one end of the water vapor outlet.

[0007] Preferably, the hook assembly includes a mounting plate, on the top surface of which two electric push cylinders are symmetrically mounted. The telescopic ends of the electric push cylinders are fixed with inverted U-shaped hooks. The hook heads abut against the handles of the cleaning basket, and the handles of the cleaning basket are n-shaped at the hooks.

[0008] Preferably, the placement assembly includes a placement strip with a slot on its top surface and an arc-shaped groove adapted to a circular silicon photonic chip in the center of the bottom surface of the slot. Two fixing bolts are inserted at both ends of the bottom surface of the cleaning basket located on the bottom surface of the placement strip. Screw holes adapted to the fixing bolts are opened at both ends of the bottom surface of the placement strip. Inverted U-shaped limiting rods are fixed to both sides of the placement strip by bolts. A threaded hole is opened in the center of the upper part of one side surface of the limiting rod. An abutment screw is screwed into the threaded hole. A washer is fixed to the inward end of the abutment screw. Multiple through holes are equidistantly opened on the bottom surface of the slot.

[0009] Preferably, the cleaning assembly includes two ultrasonic cleaning tanks and a rapid rinsing tank. A spray rinsing tank is provided on one side of the rapid rinsing tank. Two second flange pipes for injecting and discharging cleaning fluid from the two ultrasonic cleaning tanks are symmetrically provided on one side of the outer wall of the cleaning chamber. A constant temperature circulation box is provided on one side of the cleaning chamber. The inlet and outlet of the constant temperature circulation box are connected to the rapid rinsing tank and the spray rinsing tank through connecting pipes. A filter pipe is connected to one end of the connecting pipe through a flange. A filter element is provided inside the filter pipe. Solenoid valves are provided at the connection points between the connecting pipe and the rapid rinsing tank and the spray rinsing tank.

[0010] Preferably, the upper ends of the inner walls on both sides of the spray rinsing tank are provided with T-shaped storage grooves, and the spray frame is hinged in the T-shaped storage grooves. A waterproof groove is provided on one side of the inner wall of the spray rinsing tank located in the T-shaped storage grooves. A self-locking motor is provided in the waterproof groove. The output shaft of the self-locking motor is coaxially fixed to the hinge shaft of the spray frame.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model, through the cooperation of the slot and arc-shaped groove of the placement strip, facilitates the adaptation of both square and round silicon photonic chips, improving the device's adaptability to chips of different shapes, thus enabling precise placement of multiple types of chips; furthermore, through the cooperation of the placement strip and the limiting rod, it facilitates independent positioning of individual silicon photonic chips, improving the stability of chip placement and enabling orderly chip placement to avoid stacking; furthermore, through the through-holes on the placement strip and the cooperation of the cleaning components, it facilitates smooth flow of cleaning fluid and airflow, improving the thoroughness of water film removal, thus enabling efficient cleaning and drying of the chip surface; ultimately, it solves the problem of water film formation in the gaps between stacked chips in existing devices, leading to contaminant residue and affecting chip cleanliness, while simultaneously improving the adaptability to silicon photonic chips of different shapes, enhancing the cleanliness of silicon photonic chips after cleaning, the reliability of the cleaning operation, and the versatility of the device. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0013] Figure 1 This is a first-view schematic diagram of the overall structure proposed in this utility model;

[0014] Figure 2 This is a schematic diagram of the overall cross-sectional structure proposed in this utility model;

[0015] Figure 3 This is a first-view schematic diagram of some of the component structures proposed in this utility model;

[0016] Figure 4 This is a second-view schematic diagram of some of the component structures proposed in this utility model;

[0017] Figure 5 This is a schematic diagram of the overall structure of the placement strip proposed in this utility model.

[0018] The following are the components listed in the diagram: 1. Cleaning chamber; 2. Tray; 3. Dual-axis moving screw module; 4. Cleaning basket; 5. Drying chamber; 6. Electric push cylinder; 7. Hook; 8. Placement bar; 9. Limiting rod; 10. Ultrasonic cleaning tank; 11. Quick-drain rinsing tank; 12. Spray rinsing tank; 13. Constant temperature circulation box; 14. Spray rack; 15. Filter tube. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Example: See Figures 1 to 5This utility model discloses a silicon photonics chip cleaning device, comprising a cleaning chamber 1, a control box on one side, multiple observation windows equidistantly opened on one end face, and an inlet and an outlet on both sides of the one end face. A first lead screw module is installed at both the inlet and outlet. A tray 2 is fixedly connected to the slider of the first lead screw module. A dual-axis moving lead screw module 3 is installed on the inner top surface. The dual-axis moving lead screw module 3 includes two sets of lead screw modules controlling X-axis and Y-axis movement. An installation platform is fixedly connected to the bottom surface of the Y-axis lead screw slider of the dual-axis moving lead screw module 3. Four first electric push rods are installed at the four corners of the bottom surface of the installation platform. Hook assemblies are fixedly connected to the bottom surfaces of the multiple first electric push rods. A cleaning basket 4 is hooked onto the hook assembly. Multiple viewing windows are equidistantly installed on the inner bottom surface of the cleaning basket 4. The silicon photonics chip placement assembly has a cleaning component in the center of its inner bottom surface, and a drying chamber 5 on one side of the cleaning component. The first lead screw module is a linear lead screw module, which, in conjunction with the tray 2, enables automatic loading and unloading of the cleaning basket 4, improving automation and avoiding secondary contamination caused by manual handling. The dual-axis moving lead screw module 3 uses an XY-axis cross-screw slide, and the first electric actuator uses an RDJ series servo electric cylinder. Through the cooperation of the dual-axis moving lead screw module 3 and the first electric actuator, precise lifting and moving of the cleaning basket 4 is achieved, ensuring accurate switching between workstations. The cleaning chamber 1, drying chamber 5, and cleaning basket 4 are all made of 304 stainless steel. The cleaning component and drying chamber 5 are integrated, improving the overall integration of the device and reducing... Space-saving design, while the 304 stainless steel material improves the device's corrosion resistance and service life; these elements combine to form the basic framework of the device, providing structural support for subsequent precise cleaning, stable drying, and automated operation; The drying chamber 5 has two opposing second electric actuators mounted on its top surface, with a closing plate fixed to the telescopic end of each actuator. The inner bottom surface of the second actuator has a T-shaped groove for guiding the closing plate, and a T-shaped strip sliding within the groove and fixed to the top surface of the closing plate. One end of the inner wall has a steam outlet, and the inner walls on both sides have serpentine steam pipes fixed to it. The outer wall of the cleaning chamber 1 has multiple first flanges connecting to both ends of the steam pipes and one end of the steam outlet; the second electric actuators use RDJ series servo electric cylinders, and the steam pipes are made of 304 stainless steel. 4. Stainless steel, through the cooperation of the second electric push rod with the closing plate, T-slot and T-strip, improves the sealing of the drying chamber 5, avoiding heat loss and water vapor leakage; the serpentine steam pipe increases the heating area, improves drying efficiency and uniformity, and the 304 stainless steel material can enhance the temperature resistance and corrosion resistance of the steam pipe; the first flange pipe facilitates pipe connection and disassembly, reducing maintenance difficulty; the above contents ensure the stability of the drying process, improve the drying effect, and reduce water stains on the chip surface; the hook assembly includes a mounting plate, on the top surface of the mounting plate are two electric push cylinders 6 symmetrically mounted, the telescopic end of the electric push cylinder 6 is fixed with an inverted U-shaped hook 7, the hook head of the hook 7 abuts against the handle of the cleaning basket 4, the handle of the cleaning basket 4 is located at the hook 7 in an n-shape;The electric push cylinder 6 adopts the RDJ series servo electric cylinder. Through the cooperation of the electric push cylinder 6 and the hook 7, the automatic gripping and release of the cleaning basket 4 is achieved, improving the degree of automation. The n-shaped handle and the inverted U-shaped hook 7 are compatible, improving the stability of the gripping and preventing the cleaning basket 4 from falling off during movement. The RDJ series servo electric cylinder ensures the accuracy and stability of the gripping and release actions. These features ensure the reliability of the cleaning basket 4 transfer process, providing a guarantee for smooth switching between workstations.

[0021] In this utility model, the placement component includes a placement strip 8. The top surface of the placement strip 8 has a slot adapted for a square silicon photonic chip, and the bottom surface of the slot has an arc-shaped groove adapted for a round silicon photonic chip. Two fixing bolts are inserted through the bottom surface of the cleaning basket 4 at both ends of the bottom surface of the placement strip 8. Screw holes adapted to the fixing bolts are opened at both ends of the bottom surface of the placement strip 8. U-shaped limiting rods 9 are fixed to both sides of the placement strip 8 by bolts. A threaded hole is opened at the middle of the upper part of one side surface of the limiting rod 9, and an abutment screw is screwed into the threaded hole. A washer is fixed to the inward-facing end of the abutment screw. Multiple through holes are equidistantly opened on the bottom surface of the slot. The placement strip 8 and the limiting rod 9 are made of aluminum alloy. Through the cooperation of the slot and the arc-shaped groove, both square and round silicon photonic chips can be placed, improving the versatility of the device. The limiting rod 9 and the abutment screw... The combination of rods and gaskets enables independent chip positioning, preventing offset and collision during stacking and cleaning. The lightweight aluminum alloy material provides structural strength, facilitating installation and transport. Through-holes facilitate the flow of cleaning fluid and airflow, reducing water film residue and improving cleaning and drying efficiency. These features address the core issues of water film formation and unstable positioning in existing chip stacking devices, ensuring chip cleaning quality. The cleaning assembly includes two ultrasonic cleaning tanks 10 and a rapid rinsing tank 11. A spray rinsing tank 12 is located on one side of the rapid rinsing tank 11. Two second flange pipes are symmetrically located on one side of the outer wall of the cleaning chamber 1 for injecting and discharging cleaning fluid from the two ultrasonic cleaning tanks 10. A constant temperature circulation chamber 13 is located on one side of the cleaning chamber 1. The inlet and outlet of the constant temperature circulation chamber 13 are connected via... The connecting pipe is connected to the rapid rinsing tank 11 and the spray rinsing tank 12. A filter pipe 15 is connected to one end of the connecting pipe via a flange. The filter pipe 15 contains a filter element. Solenoid valves are installed at the connections between the connecting pipe and the rapid rinsing tank 11 and the spray rinsing tank 12; the solenoid valves are three-way solenoid valves. The connecting pipe is made of 304 stainless steel, and the filter element is a PP melt-blown filter element. The ultrasonic cleaning tank 10 achieves efficient removal of contaminants. The rapid rinsing tank 11 and the spray rinsing tank 12 use ultrapure water to achieve multi-stage rinsing, improving cleaning cleanliness. The constant temperature circulation box 13 ensures stable ultrapure water temperature and improves cleaning consistency. The filter pipe 15 and the filter element work together to achieve ultrapure water filtration and circulation, saving water resources. The 304 stainless steel connecting pipe has strong corrosion resistance, and the PP... Meltblown filter cartridges offer excellent filtration performance at a low cost. The above features enhance cleaning efficiency and resource utilization, meeting the demands of high-precision chip cleaning. T-shaped storage slots are located on the upper ends of the inner walls on both sides of the spray rinsing tank 12. A spray frame 14 is hinged within these slots. A waterproof groove is located on one side of the T-shaped storage slot on the inner wall of the spray rinsing tank 12. A self-locking motor is installed within this groove, and its output shaft is coaxially and fixedly connected to the hinge shaft of the spray frame 14. The self-locking motor is a 28BYJ48 stepper self-locking motor. The spray frame 14 is made of engineering plastic. The cooperation between the self-locking motor and the spray frame 14 allows for flexible adjustment of the spray angle, eliminating blind spots and improving the rinsing effect. The precise positioning of the 28BYJ48 series stepper self-locking motor ensures accurate spray angle adjustment.The T-shaped storage slot facilitates the storage of the spray rack 14 when not in use, preventing it from occupying cleaning space and becoming contaminated. The engineering plastic material is corrosion-resistant and lightweight, suitable for use in humid environments. The waterproof slot ensures the safe operation of the self-locking motor and extends the equipment's lifespan. These features further optimize the cleaning effect and improve the reliability of the device.

[0022] Working Principle: When using this invention, the silicon photonics chip to be cleaned is first placed according to its shape: a square silicon photonics chip is placed in the slot on the top surface of the placement strip 8, and a round silicon photonics chip is placed in the arc-shaped groove in the middle of the bottom surface of the slot. Then, by rotating the abutment screw in the threaded hole at the upper end of one side of the limiting rod 9, the chip is firmly fixed in place by the washer fixed to the inward end of the abutment screw, preventing the chip from shifting in subsequent processes. At the same time, the inverted U-shaped limiting rods 9 on both sides of the placement strip 8 are fixed to the placement strip 8 by bolts to achieve independent positioning of the chip and prevent stacking. Next, the first lead screw module at the entrance drives the tray 2 fixed on its slider to move, transporting the cleaning basket 4 loaded with chips to the entrance position of the cleaning chamber 1. At this time, the dual-axis moving lead screw... Module 3 drives the mounting platform, which is fixed to the bottom of its Y-axis lead screw slider, to move above the cleaning basket 4. The first electric push rods at the four corners of the bottom of the mounting platform extend, and the two symmetrically installed electric push cylinders 6 in the hook assembly move, so that the inverted U-shaped hook 7 hooks the n-shaped handle of the cleaning basket 4, completing the automatic gripping of the cleaning basket 4. Then, the dual-axis moving lead screw module 3 moves the gripped cleaning basket 4 to the top of the cleaning assembly through the coordinated movement of the X-axis and Y-axis. The first electric push rod extends and retracts to adjust the height of the cleaning basket 4, and first puts it into two ultrasonic cleaning tanks 10 for ultrasonic cleaning in sequence, efficiently removing contaminants from the chip surface. During the cleaning process, the two second flange pipes on one side of the outer wall of the cleaning chamber 1 realize the injection and discharge of cleaning liquid in the ultrasonic cleaning tank 10 respectively.

[0023] After ultrasonic cleaning, the dual-axis moving screw module 3 moves the cleaning basket 4 to the rapid rinsing tank 11. The constant temperature circulation box 13 introduces constant temperature ultrapure water filtered by the PP melt-blown filter element in the filter tube 15 into the rapid rinsing tank 11 through the connecting pipe. The solenoid valve (three-way solenoid valve) on the connecting pipe controls the water flow to achieve precise rinsing. The cleaning solution in the rapid rinsing tank 11 can also be returned to the constant temperature circulation box 13 through the connecting pipe to form a circulation, saving water resources. Subsequently, the cleaning basket 4 is moved to the spray rinsing tank 12. The 28BYJ48 stepper self-locking motor in the waterproof tank drives the spray rack 14 to rotate out of the T-shaped storage slot. After adjusting to a suitable spray angle, the chip is sprayed and rinsed in all directions. The through holes equidistantly opened on the bottom surface of the slot 8 facilitate the flow of cleaning solution. To improve the rinsing effect, after the spray rinsing is completed, the dual-axis moving screw module 3 moves the cleaning basket 4 to the drying chamber 5. The second electric push rods on both sides of the top surface of the drying chamber 5 drive the closing plate to slide along the T-shaped groove on the inner bottom surface. The T-shaped strip and the T-shaped groove cooperate to achieve the sealing and closure of the drying chamber 5, preventing heat loss and water vapor leakage. Then, steam is introduced into the steam pipes arranged in a serpentine pattern on both sides of the inner wall for heating. The water vapor on the surface of the chip is discharged through the water vapor outlet on one end of the inner wall of the drying chamber 5. The through hole also facilitates airflow circulation and accelerates chip drying. After drying, the dual-axis moving screw module 3 moves the cleaning basket 4 to the tray 2 at the outlet. Finally, the first screw module at the outlet drives the tray 2 to move, completing the chip discharge. At this point, the entire cleaning and drying process of the device is completed.

[0024] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A silicon photonics chip cleaning device, comprising a cleaning chamber (1), characterized in that: A control box is provided on one side of the cleaning chamber (1). Multiple observation windows are equidistantly opened on one end face of the cleaning chamber (1). An inlet and an outlet are opened on both sides of one end face of the cleaning chamber (1). A first lead screw module is installed at both the inlet and outlet of the cleaning chamber (1). A tray (2) is fixedly connected to the slider of the first lead screw module. A dual-axis moving lead screw module (3) is installed on the top surface of the cleaning chamber (1). The dual-axis moving lead screw module (3) includes two sets of lead screw modules that control the movement of the X-axis and the Y-axis. An installation platform is fixedly connected to the bottom surface of the lead screw slider of the Y-axis of the dual-axis moving lead screw module (3). Four first electric push rods are installed at the four corners of the bottom surface of the installation platform. A hook assembly is fixedly connected to the bottom surface of the multiple first electric push rods. A cleaning basket (4) is hooked and fitted on the hook assembly. Multiple placement components for placing silicon photonic chips are equidistantly installed on the bottom surface of the cleaning basket (4). A cleaning component is provided in the middle of the bottom surface of the cleaning chamber (1). A drying chamber (5) is provided on one side of the cleaning component.

2. The silicon photonics chip cleaning apparatus according to claim 1, characterized in that: The drying chamber (5) has two opposing electric push rods installed on the top surface. The extension end of the second electric push rod is fixedly connected to a closing plate. The bottom surface of the drying chamber (5) has a T-shaped groove for guiding the closing plate. A T-shaped strip fixedly connected to the top surface of the closing plate is slidably provided in the T-shaped groove. A water vapor outlet is provided on the inner wall of one end of the drying chamber (5). Steam pipes arranged in a serpentine pattern are fixedly connected to the inner walls of both sides of the drying chamber (5). The outer wall of the cleaning chamber (1) has multiple first flange pipes that are respectively connected to both ends of the steam pipes and one end of the water vapor outlet.

3. The silicon photonics chip cleaning device according to claim 1, characterized in that: The hook assembly includes a mounting plate, on which two electric push cylinders (6) are symmetrically mounted. The telescopic ends of the electric push cylinders (6) are fixed with hooks (7) in the shape of an inverted U. The hook head of the hook (7) abuts against the handle of the cleaning basket (4). The handle of the cleaning basket (4) is located at the hook (7) in an n-shape.

4. The silicon photonics chip cleaning device according to claim 1, characterized in that: The placement assembly includes a placement strip (8), the top surface of which has a slot, and the bottom surface of which has an arc-shaped groove adapted to a circular silicon photonic chip. The bottom surface of the cleaning basket (4) is provided with two fixing bolts at both ends of the bottom surface of the placement strip (8). The bottom surface of the placement strip (8) has screw holes adapted to the fixing bolts at both ends. The two sides of the placement strip (8) are fixed with inverted U-shaped limiting rods (9) by bolts.

5. The silicon photonics chip cleaning apparatus according to claim 4, characterized in that: The limiting rod (9) has a threaded hole at the middle of the upper part of one side surface. An abutment screw is screwed into the threaded hole. A washer is fixed to the inward end of the abutment screw. Multiple through holes are equidistantly opened on the bottom surface of the slot.

6. The silicon photonics chip cleaning apparatus according to claim 1, characterized in that: The cleaning assembly includes two ultrasonic cleaning tanks (10) and a quick-drain rinsing tank (11). A spray rinsing tank (12) is provided on one side of the quick-drain rinsing tank (11). Two second flange pipes for injecting and discharging cleaning fluid into the two ultrasonic cleaning tanks (10) are symmetrically provided on one side of the outer wall of the cleaning chamber (1).

7. The silicon photonics chip cleaning apparatus according to claim 6, characterized in that: The cleaning chamber (1) is provided with a constant temperature circulation box (13) on one side. The inlet and outlet of the constant temperature circulation box (13) are connected to the quick-drain rinsing tank (11) and the spray rinsing tank (12) through connecting pipes. A filter pipe (15) is connected to one end of the connecting pipe through a flange. A filter element is provided inside the filter pipe (15). Solenoid valves are provided at the connection points between the connecting pipe and the quick-drain rinsing tank (11) and the spray rinsing tank (12).

8. The silicon photonics chip cleaning apparatus according to claim 6, characterized in that: The spray rinsing tank (12) has T-shaped storage grooves on the upper ends of the inner walls on both sides. A spray frame (14) is hinged in the T-shaped storage groove. A waterproof groove is opened on one side of the inner wall of the spray rinsing tank (12). A self-locking motor is installed in the waterproof groove. The output shaft of the self-locking motor is coaxially fixed to the hinge shaft of the spray frame (14).

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