Semiconductor glass substrate film attachment cleaning apparatus with fine dust adsorption

Abstract

The utility model discloses a semiconductor glass substrate film pasting cleaning equipment with micro dust adsorption, including cleaning platform, the front end of cleaning platform is installed with support frame, the top of inside support frame is installed with electric slide rail, and the bottom of electric slide rail is installed with telescopic cylinder no.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor glass substrate film cleaning equipment, specifically a semiconductor glass substrate film cleaning equipment with micro-dust adsorption function. Background Technology

[0002] Semiconductor glass substrates are novel materials used in chip packaging, possessing characteristics such as high flatness and low coefficient of thermal expansion. During use, a protective film needs to be applied to the surface of the semiconductor glass substrate. Before applying the protective film, appropriate cleaning equipment is required to remove dirt and dust from the surface of the semiconductor glass substrate, ensuring its cleanliness before film application. Therefore, we propose a semiconductor glass substrate film application and cleaning device with dust adsorption capabilities to improve upon these issues. Utility Model Content

[0003] The purpose of this invention is to provide a semiconductor glass substrate film cleaning device with micro-dust adsorption, so as to solve the problem mentioned in the background art that micro-dust on the surface of semiconductor glass substrates is not easy to be removed.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor glass substrate film-applying cleaning device with micro-dust adsorption, comprising a cleaning table, a support frame installed at the front end of the cleaning table, an electric slide rail installed at the top inside the support frame, a telescopic cylinder installed at the bottom end of the electric slide rail, a dust suction hood installed at the bottom end of the telescopic cylinder, a collection box installed at the rear end of the support frame, a negative pressure fan installed at the bottom inside the collection box, a mesh box installed inside the collection box, and suction hoses installed on both sides of the top of the collection box, with one end of each suction hose attached to the top of the dust suction hood.

[0005] As a further technical solution of this utility model, the cross-section of the net cage is smaller than the cross-section of the collection box, and the net cage and the collection box form a sliding structure.

[0006] As a further technical solution of this utility model, mounting brackets are installed on both sides of the cleaning table, and telescopic cylinder three is installed on one side of the mounting bracket, and clamping block is installed on one side of the telescopic cylinder three, and rubber block is installed on one side of the clamping block.

[0007] As a further technical solution of this utility model, the cross-section of the clamping block is larger than the cross-section of the cleaning table, and the clamping block and the cleaning table form a sliding structure.

[0008] As a further technical solution of this utility model, the telescopic cylinder is provided in four sets, and the four sets of telescopic cylinders are symmetrically distributed in pairs about the central axis of the rubber block.

[0009] As a further technical solution of this utility model, a connecting frame is installed at the bottom of the cleaning table, and a telescopic cylinder II is installed at the bottom of the connecting frame. A lifting plate is installed at the top of the telescopic cylinder II, and the lifting plate is movably positioned in the middle of the inside of the cleaning table.

[0010] As a further technical solution of this utility model, the cross-section of the lifting plate is smaller than the cross-section of the cleaning table, and the lifting plate and the cleaning table form an interlocking structure.

[0011] Compared with the prior art, the beneficial effects of this utility model are: by setting up components such as a support frame, a dust suction hood, a collection box and a mesh box, after the semiconductor glass substrate is placed above the cleaning table, the cooperation of the above components can adsorb the micro dust adhering to the surface of the semiconductor glass substrate, thereby realizing that the cleaning equipment has a micro dust adsorption mechanism, which allows the semiconductor glass substrate to be kept cleaner and the subsequent film application effect is better.

[0012] By incorporating components such as mounting brackets, clamping blocks, telescopic cylinders, and rubber blocks, after the semiconductor glass substrate is placed above the cleaning table, these components can push the clamping blocks to adhere to both sides of the semiconductor glass substrate to clamp it, allowing the semiconductor glass substrate to be stably placed above the cleaning table for cleaning, thus ensuring the stability of the semiconductor glass substrate during cleaning.

[0013] By incorporating components such as a connecting frame, a telescopic cylinder, and a lifting plate, after the semiconductor glass substrate is cleaned above the cleaning station, it becomes difficult to quickly remove it from the station because the substrate is thin and fully adheres to the surface. These components allow the semiconductor glass substrate to move upwards and detach from the cleaning station surface, making it easier to remove and use. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a partial cross-sectional structure of the present invention.

[0015] Figure 2 This is a partial sectional view of the structure of this utility model from the side.

[0016] Figure 3 This is a top view of the cleaning table structure of this utility model;

[0017] Figure 4 This is a front view structural diagram of the lifting plate of this utility model.

[0018] In the diagram: 1. Cleaning table; 2. Support frame; 3. Dust hood; 4. Electric slide rail; 5. Telescopic cylinder one; 6. Dust suction hose; 7. Collection box; 8. Mounting frame; 9. Clamping block; 10. Connecting frame; 11. Telescopic cylinder two; 12. Telescopic cylinder three; 13. Rubber block; 14. Wire mesh cage; 15. Negative pressure fan; 16. Lifting plate. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4 This utility model provides an embodiment of a semiconductor glass substrate film cleaning device with micro-dust adsorption, including a cleaning table 1, a support frame 2 installed at the front end of the cleaning table 1, an electric slide rail 4 installed at the top inside the support frame 2, a telescopic cylinder 5 installed at the bottom end of the electric slide rail 4, a dust suction hood 3 installed at the bottom end of the telescopic cylinder 5, a collection box 7 installed at the rear end of the support frame 2, a negative pressure fan 15 installed at the bottom inside the collection box 7, a mesh box 14 installed inside the collection box 7, and suction hoses 6 installed on both sides of the top of the collection box 7, with one end of each suction hose 6 installed at the top of the dust suction hood 3. The cross-section of the mesh box 14 is smaller than the cross-section of the collection box 7, and a sliding structure is formed between the mesh box 14 and the collection box 7. The sliding structure design allows the mesh box 14 to be pulled out of the collection box 7 after the door of the collection box 7 is opened, so as to clean the micro-dust collected in the collection box 7.

[0021] Specifically, such as Figure 1 and Figure 2 As shown, after the semiconductor glass substrate is placed above the cleaning table 1 and is limited, the negative pressure fan 15 is turned on. The telescopic cylinder 5 is activated to push the dust hood 3 downward to fit against the surface of the semiconductor glass substrate. The electric slide rail 4 is activated to move the dust hood 3 from the front end to the rear end of the semiconductor glass substrate surface, allowing the dust hood 3 to adsorb the micro dust on the surface of the semiconductor glass substrate. Then, the micro dust is guided into the mesh box 14 inside the collection box 7 through the suction hose 6 and collected, thereby completing the micro dust cleaning of the semiconductor glass substrate.

[0022] Mounting brackets 8 are installed on both sides of the cleaning table 1. A telescopic cylinder 3 12 is installed on one side of the mounting bracket 8, and a clamping block 9 is installed on one side of the telescopic cylinder 3 12. A rubber block 13 is installed on one side of the clamping block 9. The cross-section of the clamping block 9 is larger than the cross-section of the cleaning table 1. The clamping block 9 and the cleaning table 1 form a sliding structure. There are four sets of telescopic cylinders 3 12. The four sets of telescopic cylinders 3 12 are symmetrically distributed in pairs about the central axis of the rubber block 13. They can stably push the rubber block 13 to move and adhere to one side of the semiconductor glass substrate to limit its position.

[0023] Specifically, such as Figure 1 , Figure 2 and Figure 3 As shown, after the semiconductor glass substrate is taken out, it is placed above the lifting plate 16. The mounting brackets 8 on both sides of the cleaning table 1 are activated. The rubber blocks 13 are pushed to the sides of the semiconductor glass substrate by the sliding of the clamping blocks 9 on the outer wall of the cleaning table 1, so that the semiconductor glass substrate is clamped and stably placed above the lifting plate 16 in the cleaning table 1.

[0024] A connecting frame 10 is installed at the bottom of the cleaning table 1, and a telescopic cylinder 11 is installed at the bottom inside the connecting frame 10. A lifting plate 16 is installed at the top of the telescopic cylinder 11, and the lifting plate 16 is movably set in the middle position inside the cleaning table 1. The cross-section of the lifting plate 16 is smaller than the cross-section of the cleaning table 1. The lifting plate 16 and the cleaning table 1 form a locking structure. The locking structure is designed so that the lifting plate 16 can be hidden inside the cleaning table 1 when it is not in use.

[0025] Specifically, such as Figure 1 , Figure 2 and Figure 4 As shown, after the semiconductor glass substrate is placed above the cleaning station 1 and the cleaning film is applied, the telescopic cylinder 11 is activated to push the lifting plate 16 upward, allowing the lifting plate 16 to push the semiconductor glass substrate upward and detach it from the surface of the cleaning station 1, so that the semiconductor glass substrate can be easily and quickly removed. After the semiconductor glass substrate above the lifting plate 16 is removed, the telescopic cylinder 11 is activated again to pull the lifting plate 16 downward and return it to the interior of the cleaning station 1.

[0026] Working principle: In use, after the semiconductor glass substrate is taken out, it is placed above the lifting plate 16 inside the cleaning table 1. Then, the mounting brackets 8 on both sides of the cleaning table 1 are activated, and the rubber blocks 13 are pushed against the sides of the semiconductor glass substrate by the sliding of the clamping blocks 9 on the outer wall of the cleaning table 1. This clamps the semiconductor glass substrate and makes it stably placed above the lifting plate 16 in the cleaning table 1. Then, the negative pressure fan 15 is turned on, and the telescopic cylinder 5 is activated to push the dust collection hood 3 downward to fit against the surface of the semiconductor glass substrate. The electric slide rail 4 is also activated to move the dust collection hood. 3. Move from the front end to the rear end of the semiconductor glass substrate surface, allowing the dust hood 3 to adsorb the micro-dust on the surface of the semiconductor glass substrate. The micro-dust is then introduced into the mesh box 14 inside the collection box 7 through the dust suction hose 6 and collected. After the semiconductor glass substrate is cleaned, take out the corresponding protective film and apply it to the surface of the semiconductor glass substrate. After the film is applied, start the telescopic cylinder 11 to push the lifting plate 16 upward, allowing the lifting plate 16 to push the semiconductor glass substrate upward and detach it from the surface of the cleaning table 1, so that the semiconductor glass substrate can be picked up.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor glass substrate film-attaching cleaning device with micro-dust adsorption, comprising a cleaning table (1), characterized in that: The front end of the cleaning station (1) is equipped with a support frame (2), the top of the support frame (2) is equipped with an electric slide rail (4), and the bottom of the electric slide rail (4) is equipped with a telescopic cylinder (5). The bottom of the telescopic cylinder (5) is equipped with a dust suction hood (3). The rear end of the support frame (2) is equipped with a collection box (7), the bottom of the collection box (7) is equipped with a negative pressure fan (15), the inside of the collection box (7) is equipped with a mesh box (14), and both sides of the top of the collection box (7) are equipped with suction hoses (6), and one end of each suction hose (6) is installed on the top of the dust suction hood (3).

2. The semiconductor glass substrate film-applying and cleaning device with micro-dust adsorption as described in claim 1, characterized in that: The cross-section of the net cage (14) is smaller than the cross-section of the collection box (7), and the net cage (14) and the collection box (7) form a sliding structure.

3. The semiconductor glass substrate film-applying and cleaning device with micro-dust adsorption as described in claim 1, characterized in that: The cleaning table (1) is equipped with mounting brackets (8) on both sides. Each mounting bracket (8) has a telescopic cylinder three (12) installed on one side, and each telescopic cylinder three (12) has a clamping block (9) installed on one side, and each clamping block (9) has a rubber block (13) installed on one side.

4. The semiconductor glass substrate film-applying and cleaning device with micro-dust adsorption as described in claim 3, characterized in that: The cross-section of the clamping block (9) is larger than the cross-section of the cleaning table (1), and the clamping block (9) and the cleaning table (1) form a sliding structure.

5. The semiconductor glass substrate film-applying and cleaning device with micro-dust adsorption according to claim 3, characterized in that: The telescopic cylinder three (12) is provided in four sets, and the four sets of telescopic cylinder three (12) are symmetrically distributed in pairs about the central axis of the rubber block (13).

6. The semiconductor glass substrate film-applying and cleaning device with micro-dust adsorption according to claim 1, characterized in that: The bottom of the cleaning table (1) is equipped with a connecting frame (10), and the bottom of the connecting frame (10) is equipped with a telescopic cylinder (11). The top of the telescopic cylinder (11) is equipped with a lifting plate (16), and the lifting plate (16) is movably positioned in the middle of the inside of the cleaning table (1).

7. The semiconductor glass substrate film-adsorbing cleaning device with micro-dust adsorption according to claim 6, characterized in that: The cross-section of the lifting plate (16) is smaller than the cross-section of the cleaning table (1), and the lifting plate (16) and the cleaning table (1) form an interlocking structure.

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