Semiconductor device lead bending mechanism

Abstract

The utility model belongs to the technical field of semiconductor device manufacturing, specifically relates to a semiconductor device lead bending mechanism. Its including bending device and feeding device, the discharge port of feeding device is aligned with the feed port of bending device, the bending device includes: mounting seat, the lower blanking channel of inclined setting is established in the middle part of mounting seat, the first end of lower blanking channel is the feed port, and the second end of lower blanking channel is the discharge port, the lower die head is set below the first end of lower blanking channel, the upper die head is set above the first end of lower blanking channel, the drive cylinder is installed on the top of mounting seat, and its output end is connected with the upper die head, is used for driving the upper die head to be close to and away from the lower die head. The utility model is used to solve the problem of low efficiency. By setting the inclined lower blanking channel in the mounting seat, after the drive cylinder controls the upper die head and the lower die head to be close to and bend the workpiece between them, the workpiece can automatically move towards the lower second end through the inclined lower blanking channel to form automatic discharge, and the efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor device manufacturing technology, and specifically relates to a semiconductor device lead bending mechanism. Background Technology

[0002] In semiconductor devices, the leads of a diode are metal wires that connect the diode chip to external circuitry. Their main functions are to conduct current and provide mechanical support. The shape and length of the leads vary depending on the diode's package type.

[0003] When a diode lead needs to be flattened or bent at one end and then bent at the other end, the traditional process usually involves manual bending with pliers or simple tools. However, this method has significant limitations, such as low efficiency and difficulty in controlling the force, which can easily lead to lead breakage or inconsistent bending lengths, failing to meet the needs of large-scale production. Currently, automated processing is mainly achieved through specialized bending devices. For example, the utility model patent with publication number CN219378775U describes a diode lead bending device. This device has an adjustable distance between the moving block and the frame wall, making it suitable for different diode lead models. After the diode is manually placed, the lower clamping plate presses it down, and then the device is pressed down to bend the suspended lead, allowing multiple diode leads to be formed at once.

[0004] However, the diode lead bending device still requires manual feeding during bending, and the diodes are placed in the fixed slots one by one. It still requires continuous manual intervention, resulting in low automation and low efficiency. Utility Model Content

[0005] To address the shortcomings of existing technologies, a semiconductor device lead bending mechanism is provided to solve the problem of low efficiency.

[0006] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A semiconductor device lead bending mechanism, comprising: a bending device and a feeding device, wherein the outlet of the feeding device is aligned with the inlet of the bending device; The bending device includes: The mounting base has an inclined feeding channel in the middle, the higher first end of the feeding channel is the feeding port, and the lower second end is the feeding port. The lower die head is located below the first end of the feeding channel; The upper die head is positioned above the first end of the unloading channel; A drive cylinder is installed on the top of the mounting base, and its output end is connected to the upper die head, used to drive the upper die head to move closer to and away from the lower die head.

[0007] Compared with existing technologies, the above technical solutions have the following beneficial effects: By setting an inclined feeding channel in the mounting base, and with the feeding port of the feeding channel corresponding to the feeding device, a continuous stream of workpieces enters the feeding port in sequence. After the drive cylinder controls the upper and lower die heads to approach and bend the workpiece located between them, the workpiece can automatically move towards the lower second end through the inclined feeding channel, forming automatic feeding and discharge through the feeding channel. This forms automated bending, eliminating the need for frequent manual feeding and placement, improving efficiency, and saving labor.

[0008] Based on the above technical solution, the embodiments of this application can be further improved as follows: In one embodiment, a stop is provided between the lower die head and the mounting base. The stop is located on the side of the lower die head away from the feeding device. The end of the stop extends into the feeding channel to block the first end of the workpiece from bending, thereby limiting the workpiece between the lower die head and the upper die head.

[0009] By using a stopper located downstream of the lower die head, and in conjunction with the opening and closing lower and upper dies, each workpiece can be bent and shaped.

[0010] In one embodiment, the lower die head has a bending groove corresponding to the upper die head so that the upper die head can be inserted, for bending the second end of the workpiece. The lower die head is also provided with a limiting notch, which is used to match and correspond to the first end of the workpiece that is not bent.

[0011] The bending is completed by using the bending groove in conjunction with the upper die head. The limiting notch on the lower die head is used to limit the expansion section formed by the first end of the workpiece being bent or bent, which makes it easier to bend the second end of the workpiece.

[0012] In one embodiment, the side of the limiting notch away from the bending groove is in an open state that is connected to the outside. A flexible limiting member is provided on the mounting base, and the limiting member cooperates with the limiting notch to restrict the first end of the workpiece.

[0013] The workpiece is limited from both sides by a flexible limiting component in conjunction with a limiting notch. The flexible limiting component can also deform to adapt to workpieces with different end sizes.

[0014] In one embodiment, the feeding channel is located on one side of the middle part of the mounting base, and a guide groove is provided at the bottom of the feeding channel to guide the discharge of materials.

[0015] The feeding channel is set on one side of the mounting base, so that the feeding channel forms a semi-enclosed structure with the side open. When the feeding channel is blocked, the workpieces blocked in the feeding channel can be manually discharged. At the same time, the guide groove can control the feeding direction, so that the workpieces are discharged towards the lower second end of the discharge port, which is convenient for subsequent collection.

[0016] In one embodiment, the device further includes a base, the top of which forms a mounting surface inclined toward the direction away from the feeding device, and the mounting seat is disposed on the mounting surface to form an inclined feeding channel in the mounting seat.

[0017] In one embodiment, the mounting base includes: The lower mold base is mounted on the mounting surface of the base, and the lower mold head is disposed on the lower mold base; An upper mold base is disposed on the upper mold base, the upper mold head is slidably disposed on the upper mold base, and the material feeding channel is formed between the upper mold base and the lower mold.

[0018] In one embodiment, the upper die head is further provided with a separator, the functional end of which gradually narrows and extends downward to be located upstream of the functional end of the upper die head, for separating the workpieces entering the lower die head when the upper die head approaches the lower die head, so as to limit the target number of workpieces in the feeding device to the lower die head.

[0019] In one embodiment, the lower die head is provided with a positioning protrusion, and the upper die head is provided with a positioning groove corresponding to the positioning protrusion.

[0020] In one embodiment, the feeding device includes: a vibratory feeder; The feeding guide rail has one end connected to the outlet of the vibratory feeder, and the other end inclined downward and connected to the inlet of the bending device. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0023] Figure 2 for Figure 1 A schematic diagram of the bending device.

[0024] Figure 3 for Figure 2 A schematic diagram of a bending device with a workpiece.

[0025] Figure label: 100. Bending device; 200. Feeding device; 300. Material stop; 400. Flexible limiting component; 500. Guide groove; 600. Base; 700. Workpiece; 110. Mounting base; 120. Material unloading channel; 130. Material inlet; 140. Material outlet; 150. Upper die head; 160. Lower die head; 170. Drive cylinder; 111. Lower mold base; 112. Upper mold base; 113. Divider; 114. Positioning protrusion; 115. Positioning groove; 161. Bending groove; 162. Limiting notch; 210. Vibratory feeder; 220. Feeding guide rail. Detailed Implementation

[0026] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention. It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.

[0027] In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly defined.

[0029] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] like Figure 1-3 As shown, the present invention provides a semiconductor device lead bending mechanism, which includes a bending device 100 and a feeding device 200, wherein the outlet of the feeding device 200 is aligned with the inlet of the bending device 100.

[0031] The bending device 100 includes: a mounting base 110, a lower die head 160, an upper die head 150, and a drive cylinder 170.

[0032] The mounting base 110 has an inclined feeding channel 120 in the middle. The higher first end of the feeding channel 120 is the feeding port 130, and the lower second end is the feeding port 140. The lower die head 160 is located below the first end of the feeding channel 120. The upper die head 150 is located above the first end of the feeding channel 120. The drive cylinder 170 is mounted on the top of the mounting base 110, and its output end is connected to the upper die head 150. It is used to drive the upper die head 150 to move closer to and away from the lower die head 160. The drive cylinder 170 can be implemented by a drive cylinder.

[0033] The upper and lower dies 160 are used to bend the workpiece 700. After bending, the workpiece 700 passes through the inclined unloading channel 120 to complete the unloading.

[0034] To ensure more accurate positioning of the workpiece 700 when the upper and lower dies 160 bend it, a stopper 300 is provided between the lower die 160 and the mounting base 110. The stopper 300 is located on the side of the lower die 160 away from the feeding device 200, and its end extends into the unloading channel 120 to block the first end of the workpiece 700 from bending, thereby limiting the workpiece 700 between the lower die 160 and the upper die 150.

[0035] When the workpiece 700 (the unbent pin) enters the space between the upper and lower dies 160 from the feeding channel, the stop 300 can block it, facilitating bending. After bending, because the stop 300 blocks the first unbent end, the workpiece 700 is pressed from a horizontal position to a vertical position. At this time, the stop 300 does not play a blocking role. When the upper and lower dies 160 are separated, the workpiece 700 can easily enter the unloading channel 120. Then, through the stop 300 set downstream of the lower die 160, in conjunction with the opening and closing of the lower die 160 and the upper die 150, each workpiece 700 can be bent and formed.

[0036] To ensure that the required shape is achieved by bending, the lower die head 160 is provided with a bending groove 161 corresponding to the upper die head 150 so that the upper die head 150 can be inserted, for bending the second end of the workpiece 700. The lower die head 160 is also provided with a limiting notch 162, which is used to match and correspond to the first end of the workpiece 700 that is not bent.

[0037] The bending is completed by using the bending slot 161 in conjunction with the upper die head 150. The expansion section formed by the first end of the workpiece 700 being bent or bent is contained in the lower die head 160, which facilitates the bending of the second end of the workpiece 700. In view of the expansion shape of the first end of the workpiece 700, the lower die head 160 has a better limit to the first end of the workpiece 700 at this position. The limit notch 162 can work with the stop 300 to limit the first end of the workpiece 700 from the rear and the side.

[0038] To improve the flexibility of the limiting position, the side of the limiting notch 162 away from the bending groove 161 is in an open state that connects to the outside. A flexible limiting member 400 is provided on the mounting base 110. The limiting member cooperates with the limiting notch 162 to limit the first end of the workpiece 700. That is, the flexible limiting member 400 can directly contact the other side of the workpiece 700 located in the limiting notch 162. The flexible limiting member 400 cooperates with the limiting notch 162 to limit the bulging end of the first end of the workpiece 700 from both sides. The flexible limiting member 400 can also deform to adapt to workpieces 700 with different end sizes.

[0039] The flexible limiting component 400 can be made of flexible iron wire or the like, and the flexible limiting component 400 is fastened to the mounting base 110 by bolts or the like.

[0040] In this embodiment, the feeding channel 120 is located on one side of the middle part of the mounting base 110, and a guide groove 500 is provided at the bottom of the feeding channel 120 to guide the discharge of materials.

[0041] The feeding channel 120 is set on one side of the mounting base 110, so that the feeding channel 120 forms a semi-enclosed structure with the side open. When the feeding is blocked, the workpiece 700 blocked in the feeding channel 120 can be manually discharged. At the same time, the guide groove 500 can control the feeding direction, so that the workpiece 700 is discharged towards the lower second end of the discharge port, which is convenient for subsequent collection.

[0042] Specifically, the end of the guide groove 500 corresponds to the bending slot 161 in the lower die head 160, so that the workpiece 700 can fall directly into the inclined guide groove 500 after being bent in the bending slot 161 and slide down along the guide groove 500.

[0043] To facilitate tilting the feeding channel 120 in the mounting base 110, specifically, a base 600 is also provided. The top of the base 600 forms a mounting surface that is tilted away from the feeding device 200. The mounting base 110 is disposed on the mounting surface to form the feeding channel 120 in the mounting base 110 as an inclined feeding channel 120. The material feeding channel 120 in the mounting base 110 does not need to be opened at an angle. It can be opened horizontally. Then, the mounting base 110 is installed on the inclined base 600, so that the material feeding channel 120 is inclined. At the same time, the base 600 can also raise the overall height, which is convenient for cooperation with the feeding device 200 and raises the height of the discharge port of the material feeding channel 120, which is convenient for subsequent collection operations.

[0044] Specifically, the mounting base 110 includes an upper mold base 112 and a lower mold base 111.

[0045] The lower mold base 111 is mounted on the mounting surface of the base 600, and the lower mold head 160 is disposed on the lower mold base 111; the upper mold base 112 is disposed on the upper mold base 112, and the upper mold head 150 is slidably disposed on the upper mold base 112; the material feeding channel 120 is formed between the upper mold base 112 and the lower mold. Through the cooperation of the upper and lower mold bases 111, the material feeding channel 120 is formed more conveniently; in conjunction with the setting of the base 600, the inclined material feeding channel 120 is formed more conveniently.

[0046] In one embodiment, the upper die head 150 is further provided with a separator 113. The separator 113 is a sheet-like separator 113, which is fixed to the upper die head 150 by fasteners such as bolts and moves up and down with the upper die head 150. The functional end of the separator 113, i.e. the bottom end, gradually narrows and extends downward to be located upstream of the functional end of the upper die head 150. It is used to separate the workpieces 700 entering the lower die head 160 when the upper die head 150 approaches the lower die head 160, so as to limit the target number of workpieces 700 in the feeding device 200 to the lower die head 160.

[0047] The function of the separator 113 is to be inserted between two adjacent workpieces 700 as the upper die head 150 moves down, so as to ensure that the number of workpieces 700 entering between the lower die head 160 and the upper die head 150 is within a controllable range, and to avoid the workpieces 700 from accumulating between the upper and lower dies head 160, resulting in poor bending effect.

[0048] To ensure alignment and stability when the upper and lower dies 160 are close together, the lower die 160 is provided with a positioning protrusion 114, and the upper die 150 is provided with a positioning groove 115 corresponding to the positioning protrusion 114. When the upper and lower dies 160 are close to the bending workpiece 700, the positioning protrusion 114 is embedded in the positioning groove 115, ensuring that the upper and lower dies 160 do not wobble and that the bending effect is good.

[0049] In this embodiment, the feeding device 200 includes a vibratory feeder 210 and a feeding guide rail 220. The vibratory feeder 210 is a workpiece 700 that transports materials by vibration in the prior art. One end of the feeding guide rail 220 is connected to the discharge port of the vibratory feeder 210, and the other end is inclined downward and connected to the inlet of the bending device 100. Specifically, the groove in the feeding guide rail 220 needs to form a feeding groove that matches the shape of the workpiece 700, so that the workpieces 700 can enter the bending device 100 one by one from the feeding guide rail 220.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A semiconductor device lead bending mechanism, characterized in that, include: A bending device and a feeding device, wherein the outlet of the feeding device is aligned with the inlet of the bending device; The bending device includes: The mounting base has an inclined feeding channel in the middle, the higher first end of the feeding channel is the feeding port, and the lower second end is the feeding port. The lower die head is located below the first end of the feeding channel; The upper die head is positioned above the first end of the unloading channel; A drive cylinder is installed on the top of the mounting base, and its output end is connected to the upper die head, used to drive the upper die head to move closer to and away from the lower die head; A baffle is provided between the lower die head and the mounting base. The baffle is located on the side of the lower die head away from the feeding device. The end of the baffle extends into the feeding channel to block the first end of the workpiece that does not bend, so as to limit the workpiece between the lower die head and the upper die head. After bending, the workpiece is pressed from a horizontal position to a vertical position. The stop part can no longer stop the material. When the upper and lower dies separate, the workpiece enters the unloading channel.

2. The semiconductor device lead bending mechanism according to claim 1, characterized in that, The lower die head has a bending groove corresponding to the upper die head so that the upper die head can be inserted, for bending the second end of the workpiece. The lower die head is also provided with a limiting notch, which is used to match and correspond to the first end of the workpiece that is not bent.

3. The semiconductor device lead bending mechanism according to claim 2, characterized in that, The side of the limiting notch away from the bending groove is in an open state that connects to the outside. The mounting base is provided with a flexible limiting member, which cooperates with the limiting notch to restrict the first end of the workpiece.

4. The semiconductor device lead bending mechanism according to claim 1, characterized in that, The material discharge channel is located on one side of the middle part of the mounting base, and a guide groove is provided at the bottom of the material discharge channel to guide the discharge of materials.

5. The semiconductor device lead bending mechanism according to claim 1, characterized in that, It also includes a base, the top of which forms a mounting surface that is inclined away from the feeding device, and the mounting seat is disposed on the mounting surface to form an inclined feeding channel in the mounting seat.

6. The semiconductor device lead bending mechanism according to claim 5, characterized in that, The mounting base includes: A lower mold base is mounted on the mounting surface of the base, and the lower mold head is disposed on the lower mold base; An upper mold base is disposed on the upper mold base, the upper mold head is slidably disposed on the upper mold base, and the material feeding channel is formed between the upper mold base and the lower mold.

7. The semiconductor device lead bending mechanism according to claim 6, characterized in that, The upper die head is also provided with a separator, the functional end of which gradually narrows and extends downward to be located upstream of the functional end of the upper die head. It is used to separate the workpieces entering the lower die head when the upper die head approaches the lower die head, so as to limit the target number of workpieces in the feeding device to the lower die head.

8. The semiconductor device lead bending mechanism according to claim 1, characterized in that, The lower die head is provided with a positioning protrusion, and the upper die head is provided with a positioning groove corresponding to the positioning protrusion.

9. The semiconductor device lead bending mechanism according to claim 1, characterized in that, The feeding device includes: a vibratory feeder; The feeding guide rail has one end connected to the outlet of the vibratory feeder, and the other end inclined downward and connected to the inlet of the bending device.

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