An automatic solder paste dispensing device

Abstract

The utility model discloses a kind of automatic spot welding tin paste devices, it is related to spot welding equipment and its accessory technical field.The utility model includes pedestal;The upper side wall of pedestal is connected with roof rack by stand, and sliding plate is slidably arranged in roof rack, and the both ends of sliding plate are equipped with horizontal drive assembly, and the inside of sliding plate is equipped with longitudinal drive assembly, and horizontal drive assembly includes servo motor one fixed on the end of roof rack, and longitudinal drive assembly includes servo motor two fixed on the inside one side of sliding plate,And sliding block is also slidably arranged in sliding plate, and the bottom side wall of sliding block is also equipped with function assembly, and function assembly includes mounting plate connected with sliding block, and motion camera, spot tin paste piece and tin paste suction piece are installed on mounting plate.The utility model is cooperated by horizontal drive assembly and longitudinal drive assembly, can promote function assembly to carry out position adjustment, and through function assembly, not only can spot tin paste work to circuit board, but also can suck excessive tin paste body.

Description

Technical Field

[0001] This utility model belongs to the technical field of spot welding equipment and accessories, and in particular relates to an automatic spot welding paste device. Background Technology

[0002] The automatic solder paste applicator is an automated device that integrates high-precision applicator, intelligent temperature control and adaptive adjustment. It is designed for precision soldering scenarios of printed circuit boards. Through the collaborative operation of a robotic arm and a vision positioning system, it achieves precise, efficient and uniform applicator of solder paste, significantly improving production efficiency and product yield.

[0003] Chinese patent application CN217253488U discloses an automatic solder paste application device, including a base with a longitudinal transmission mechanism on it. The longitudinal transmission mechanism has a tray for placing a connecting piece arrangement plate. A transverse transmission mechanism is located above the longitudinal transmission mechanism, and a vertical transmission mechanism is located on one side of the transverse transmission mechanism. A solder paste syringe is fixedly mounted on the vertical transmission mechanism. This invention solves the problems of low efficiency and inconsistent solder paste uniformity when manually applying solder paste to connecting pieces, which affects product production progress.

[0004] The aforementioned automatic solder paste dispensing device includes a tray with a longitudinal lead screw and a first motor. The first motor provides power to the longitudinal lead screw, driving the tray to move longitudinally. The tray also serves to clamp and mount circuit boards. However, after solder paste is applied to the circuit board, the solder paste cannot immediately solidify due to its own temperature. The movement of the circuit board by the tray can cause the solder paste to collapse and shift laterally. Furthermore, a solder paste syringe capable of vertical and horizontal movement is mounted above the tray. The solder paste syringe is connected to a dispensing machine via an air tube. With the support of the dispensing machine, the solder paste can be pushed out of the syringe, thus completing the solder paste dispensing process. However, solder paste is solid at room temperature, and the syringe only serves to hold it. Therefore, the solder paste easily solidifies, causing dispensing failure. To address these problems, we provide an automatic solder paste dispensing device. Utility Model Content

[0005] The purpose of this invention is to provide an automatic solder paste dispensing device. Through the cooperation of the horizontal drive component and the vertical drive component, the functional component can be driven to adjust its position. The functional component can not only dispense solder paste onto the circuit board, but also pick up excess solder paste, thus solving the problems of the existing automatic solder paste dispensing device.

[0006] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model relates to an automatic solder paste applicator, comprising a base; the upper sidewall of the base is connected to a top frame via a column, and a slide plate is slidably disposed within the top frame. Horizontal drive assemblies are installed at both ends of the slide plate, and a vertical drive assembly is installed inside the slide plate. The horizontal drive assembly includes a servo motor fixed to the end of the top frame and a lead screw mounted on the output shaft of the servo motor. The vertical drive assembly includes a servo motor fixed to one side inside the slide plate and a lead screw mounted on the output shaft of the servo motor. A slider is also slidably disposed within the slide plate, and the bottom sidewall of the slider is further... The device is equipped with functional components, including a mounting plate connected to a slider. A motion camera, a solder paste applicator, and a solder paste suction device are mounted on the mounting plate. The solder paste applicator includes an electric push rod fixed to the mounting plate and a material cylinder mounted on the bottom side wall of the electric push rod. A piston plate is slidably disposed inside the material cylinder, and an electric push rod is also mounted on the piston plate. The solder paste suction device includes an electric push rod fixed to the mounting plate, and a material cylinder is mounted on the bottom side wall of the electric push rod. A piston plate is slidably disposed inside the material cylinder, and an electric push rod is also mounted on the piston plate.

[0007] The present invention is further configured such that a plate groove is provided at the center of the upper side wall of the base, and baffles are installed at both ends of the plate groove; a total of four columns are provided, and the four columns are respectively located at the four corners of the upper side wall of the base; and a controller is also installed on the base.

[0008] The present invention is further configured such that the top frame is arranged parallel to the top of the base, and a sliding groove is provided in the top frame. The top frame is slidably connected to both ends of the sliding plate through the sliding groove. A drive screw sleeve is installed at the end of the sliding plate, and the sliding plate is connected to a lead screw through the drive screw sleeve.

[0009] The present invention is further configured such that a second sliding groove is provided inside the sliding plate, the longitudinal drive component is disposed inside the second sliding groove, the slider is slidably connected to the second sliding groove, and the slider is connected to the second servo motor through a second lead screw.

[0010] The present invention is further configured such that a frame one is fixedly mounted on the outside of the action camera, and the action camera is connected to the mounting plate through the frame one; a frame two is fixedly mounted on the outside of the electric push rod one; and a frame three is fixedly mounted on the outside of the electric push rod three.

[0011] The present invention is further configured such that the first electric push rod is connected to the mounting plate through the second frame, the third electric push rod is connected to the mounting plate through the third frame, and the solder paste dispensing component and the solder paste suction component are arranged opposite to each other.

[0012] The present invention is further configured such that a fixing block is installed at the bottom of the electric push rod one, and the material cylinder one is fixedly installed at the bottom of the fixing block one. A dripping head one is also installed on the bottom side wall of the material cylinder one. The upper end of the electric push rod two is fixedly connected to the upper end of the material cylinder one. A connecting plate is fixedly installed on the bottom side wall of the piston plate one, and an electric heating column is fixedly installed at the bottom of the connecting plate. Springs are installed at both ends of the electric heating column.

[0013] The present invention is further configured such that a fixing block 2 is installed at the bottom of the electric push rod 3, and the material cylinder 2 is fixedly installed at the bottom of the fixing block 2. A dripping head 2 is also installed on the bottom side wall of the material cylinder 2, and the upper end of the electric push rod 4 is fixedly connected to the upper end of the material cylinder 2.

[0014] This utility model has the following beneficial effects: This invention features a horizontal drive assembly, a sliding plate, and a vertical drive assembly. A top frame is mounted above the base, and a sliding plate slides within the top frame. Horizontal drive assemblies are installed at both ends of the sliding plate, and a vertical drive assembly is installed inside the sliding plate. The horizontal drive assembly includes a lead screw mounted at both ends of the sliding plate, with the end of the lead screw connected to the output shaft of a servo motor. The vertical drive assembly includes a slider slidably mounted within the sliding plate, with a lead screw mounted at the center of the slider, the end of which is also connected to the output shaft of a servo motor. The functional components are fixedly mounted on the bottom sidewall of the slider. In use, a motion camera first photographs the circuit board to locate the position where solder paste needs to be applied. After position calibration, servo motor one first operates, pushing the sliding plate laterally within the top frame until the sliding plate reaches the calibrated position. Then, servo motor two operates, pushing the slider within the sliding plate via the lead screw until the sliding plate is directly above the calibrated position, thus achieving the effect of adjusting the position of the functional components.

[0015] This invention incorporates functional components, including a mounting plate and a motion camera, a solder paste dispensing component, and a solder paste suction component mounted on the mounting plate. The solder paste dispensing component and the solder paste suction component are positioned opposite each other, while the motion camera is positioned to the side. The motion camera is used to photograph and record the solder paste dispensing process and the resulting solder paste form, as well as the solder paste suction process and the resulting solder paste form. By comparing the captured images with standard images, it is determined whether the solder paste meets the requirements, thus preventing the solder paste from being too large or too small. The solder paste application component includes an electric push rod and a solder cylinder fixed to the end of the electric push rod. The electric push rod can move the solder cylinder up and down. A dropper is installed at the bottom of the solder cylinder, which outputs the fluid solder paste in the solder cylinder and drips it onto the target location on the circuit board. A piston plate is also slidably installed inside the solder cylinder. An electric push rod is installed above the piston plate. A heating column is installed on the bottom side wall of the piston plate. Springs are installed at both ends of the heating column to prevent excessive collision between the heating column and hard objects. At the same time, the heating column can control the solder paste in the solder cylinder. The solder paste inside is heated to keep it in a fluid state and prevent low-temperature solidification. The solder paste suction device includes an electric push rod three and a material cylinder two fixed to the end of the electric push rod three. A piston plate two is slidably installed inside the material cylinder two, and an electric push rod four is installed at the upper end of the piston plate two. In use, the solder paste is injected into the material cylinder one, and then the equipment is started. The heating column works, which generates heat to heat the solder paste, keeping it in a fluid state. Then, when applying the solder paste, the electric push rod one works first, which moves the solder paste application device downward until the dropper one is aligned with the solder paste application position on the circuit board. The circuit stops at the designated time, and then the electric pusher two operates, pushing the piston plate one downward inside the material cylinder one. This forces the solder paste fluid inside the material cylinder one to flow out from the dropper one and drip onto the circuit board. When a large amount of solder paste has dripped, the solder paste suction unit operates, and the material cylinder two on it moves to the position of the solder paste. At the same time, the electric pusher three operates, pushing the solder paste suction unit downward until the dropper two contacts the solder paste on the circuit board and stops. Then, the electric pusher four operates, driving the piston plate two upward inside the material cylinder two. Since the dropper two is inserted into the solder paste, it can form a suction effect on the solder paste, thereby removing excess solder paste. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0017] Figure 1 This is a schematic diagram of an automatic solder paste application device.

[0018] Figure 2 This is a structural disassembly diagram of an automatic solder paste applicator.

[0019] Figure 3 This is a structural disassembly diagram of the lateral drive assembly, the slide plate, and the longitudinal drive assembly.

[0020] Figure 4 This is a structural breakdown diagram of the functional components.

[0021] Figure 5 This is a structural disassembly diagram of a component for applying solder paste.

[0022] Figure 6 This is a structural disassembly diagram of a component that absorbs solder paste.

[0023] The attached diagram lists the components represented by each number as follows: 1-Base, 101-Board Slot, 2-Controller, 3-Baffle, 4-Column, 5-Top Frame, 501-Slide Rail One, 6-Horizontal Drive Assembly, 601-Servo Motor One, 602-Lead Screw One, 7-Slide Plate, 701-Slide Rail Two, 702-Drive Screw Sleeve, 8-Vertical Drive Assembly, 801-Servo Motor Two, 802-Lead Screw Two, 803-Slider, 9-Functional Component, 901-Mounting Plate, 902-Motion Camera, 902a-Frame One, 903-Solder Paste Application Component, 903a-Electric Actuator One, 903 a-1-Fixing Block 1, 903b-Frame 2, 903c-Barrel 1, 903c-1-Drip Head 1, 903c-2-Piston Plate 1, 903c-3-Electric Push Rod 2, 903c-4-Connecting Plate, 903c-5-Heating Column, 903c-6-Spring, 904-Soldering Paste Suction Part, 904a-Electric Push Rod 3, 904a-1-Fixing Block 2, 904b-Frame 3, 904c-Barrel 2, 904c-1-Drip Head 2, 904c-2-Piston Plate 2, 904c-3-Electric Push Rod 4. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Example 1

[0025] Please see Figure 1-3 This utility model is an automatic solder paste dispensing device, including a base 1, a horizontal drive component 6 and a vertical drive component 8. Through the cooperation of the horizontal drive component 6 and the vertical drive component 8, the functional component 9 can be moved to any position inside the top frame 5, keeping the circuit board stationary during the solder paste dispensing process and preventing the dripping solder paste from collapsing laterally.

[0026] Specifically, a slot 101 is provided at the center of the upper side wall of the base 1. The slot 101 is used to place the circuit board. Baffles 3 are also installed at both ends of the slot 101. The circuit board placed in the slot 101 is positioned by the baffles 3. A column 4 is also provided at the corner of the upper side wall of the base 1. The base 1 is connected to the top frame 5 through the column 4, thereby enabling the top frame 5 to be erected directly above the base 1. A controller 2 is also installed on the base 1.

[0027] Furthermore, a sliding groove 501 is provided in the side wall of the top frame 5, and the top frame 5 is slidably connected to the end of the slide plate 7 through the sliding groove 501. A drive screw sleeve 702 is installed at the end of the slide plate 7 located in the sliding groove 501, and a second sliding groove 701 is also provided inside the slide plate 7. There are two lateral drive components 6, which are respectively located inside the slide groove 501 corresponding to the end of the slide plate 7. The lateral drive component 6 includes a lead screw 602 that is threadedly connected to the drive sleeve 702, and the end of the lead screw 602 is also connected to the output shaft of the servo motor 601. The longitudinal drive assembly 8 is disposed inside the slide groove 701. The longitudinal drive assembly 8 includes a slider 803 that is slidably disposed in the slide groove 701. A lead screw 802 is also mounted on the slider 803, and the end of the lead screw 802 is connected to the output shaft of the servo motor 801.

[0028] The operation process of this embodiment is as follows: When in use, the motion camera 902 first works to take pictures of the circuit board to find the position where solder paste needs to be applied. After the position is calibrated, the servo motor 601 first works, which pushes the slide plate 7 to move laterally in the top frame 5 through the lead screw 602 until the slide plate 7 moves to the calibrated position. Then the servo motor 801 works, which pushes the slider 803 to move in the slide plate 7 through the lead screw 802 until the slide plate 7 moves directly above the calibrated position and stops. Example 2

[0029] Please see Figure 4-5 Based on Embodiment 1, a motion camera 902 and a solder paste applicator 903 are also provided. The motion camera 902 can record and photograph the solder paste applicating and solder paste suction processes, as well as photograph the solder paste, and compare the captured images with data comparison standard images. The solder paste applicator 903 can realize the solder paste applicating work on the circuit board.

[0030] Specifically, the functional component 9 includes a mounting plate 901 fixed on the bottom side wall of the slider 803. The mounting plate 901 is also suspended and mounted with an action camera 902 and a solder paste application component 903. The action camera 902 is externally fixedly mounted with a frame 902a, and the action camera 902 is fixedly connected to the mounting plate 901 through the frame 902a.

[0031] Furthermore, the solder paste application component 903 includes a frame 903b fixed on the mounting plate 901, and the mounting plate 901 is fixedly connected to the electric push rod 903a through the frame 903b. The bottom end of the electric push rod 903a is also fixedly provided with a fixing block 903a-1, and a material cylinder 903c is installed on the fixing block 903a-1. A dropper 903c-1 is fixedly installed at the bottom of the material cylinder 903c. A piston plate 903c-2 is slidably installed inside the material cylinder 903c, and an electric push rod 903c-3 is installed above the piston plate 903c-2. The upper end of the electric push rod 903c-3 is fixedly connected to the upper end of the material cylinder 903c. A connecting plate 903c-4 is fixedly installed on the bottom side wall of the piston plate 903c-2, and an electric heating column 903c-5 is also fixedly installed at the bottom of the connecting plate 903c-4. The electric heating column 903c-5 is directly inserted into the inside of the barrel 903c to heat the solder paste placed inside and keep it in a fluid state. Springs 903c-6 are installed at both ends of the electric heating column 903c-5 to prevent the electric heating column 903c-5 from excessively colliding with hard objects.

[0032] The operation process of this embodiment is as follows: During use, solder paste is injected into the inside of the first barrel 903c. Then, the equipment is started, and the electric heating column 903c-5 works, which generates heat to heat the solder paste, keeping it in a fluid state. Then, when applying solder paste, the electric push rod 903a works first, which moves the solder paste application component 903 downward until the dropper 903c-1 is aligned with the solder paste application position on the circuit board and stops. Then, the electric push rod 903c-3 works, which pushes the piston plate 903c-2 downward in the first barrel 903c, forcing the fluid solder paste in the first barrel 903c to flow out from the dropper 903c-1 and drip onto the circuit board. At the same time, the motion camera 902 is used to take pictures and record videos of the solder paste application process of the solder paste application component 903 and the solder paste after application. The images captured by the motion camera 902 are compared with the data comparison standard image to determine whether the solder paste meets the requirements. Example 3

[0033] Please see Figure 6 Based on Examples 1 and 2, a solder paste absorber 904 is also provided, which can absorb excess solder paste that has dripped down.

[0034] Specifically, a solder paste absorber 904 is also suspended on the mounting plate 901, and the solder paste absorber 904 is located on the opposite side of the solder paste application component 903. The solder paste absorber 904 includes an electric push rod 904a, and a frame 904b is fixedly installed on the outside of the electric push rod 904a. The electric push rod 904a is connected to the mounting plate 901 through the frame 904b.

[0035] Furthermore, a fixing block 2 904a-1 is fixedly installed at the bottom end of the electric push rod 3 904a, and a material cylinder 2 904c is installed on the fixing block 2 904a-1, and a dripping head 2 904c-1 is fixedly installed at the bottom of the material cylinder 2 904c. Piston plate 2 904c-2 is slidably installed inside the material cylinder 2 904c, and electric push rod 4 904c-3 is installed on the upper side wall of piston plate 2 904c-2. The upper end of electric push rod 4 904c-3 is fixedly connected to the upper end of material cylinder 2 904c.

[0036] The operation process of this embodiment is as follows: When there is a large amount of solder paste dripping, the solder paste suction component 904 is activated, and the second material cylinder 904c on it moves to the position where the solder paste is located. At the same time, the third electric push rod 904a is activated, pushing the solder paste suction component 904 downward until the second dropper 904c-1 contacts the solder paste on the circuit board and stops. Then, the fourth electric push rod 904c-3 is activated, which drives the second piston plate 904c-2 to move upward inside the second material cylinder 904c. Since the second dropper 904c-1 is inserted into the solder paste, it can form a suction effect on the solder paste, thereby removing excess solder paste.

[0037] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. An automatic solder paste applicator, comprising a base (1); characterized in that: The upper sidewall of the base (1) is connected to the top frame (5) via a column (4), and a sliding plate (7) is slidably installed inside the top frame (5). A transverse drive assembly (6) is installed at both ends of the sliding plate (7), and a longitudinal drive assembly (8) is installed inside the sliding plate (7). The transverse drive assembly (6) includes a servo motor (601) fixed to the end of the top frame (5) and a lead screw (602) installed on the output shaft of the servo motor (601). The longitudinal drive assembly (8) includes a servo motor (801) fixed to one side inside the sliding plate (7) and a lead screw (802) installed on the output shaft of the servo motor (801). A slider (803) is also slidably installed inside the sliding plate (7). A functional component (9) is installed on the bottom sidewall of the slider (803). The functional component (9) includes a mounting plate (901) connected to the slider (803). A motion camera (902), a solder paste applicator (903), and a solder paste suction device (904) are mounted on a board (901). The solder paste applicator (903) includes an electric push rod (903a) fixed on the mounting board (901) and a material cylinder (903c) mounted on the bottom side wall of the electric push rod (903a). A piston plate (903c-2) is slidably disposed inside the material cylinder (903c). 2) An electric push rod two (903c-3) is also installed on it. The solder paste absorber (904) includes an electric push rod three (904a) fixed on the mounting plate (901). A material cylinder two (904c) is installed on the bottom side wall of the electric push rod three (904a). A piston plate two (904c-2) is slidably arranged inside the material cylinder two (904c). An electric push rod four (904c-3) is also installed on the piston plate two (904c-2).

2. The automatic solder paste applicator according to claim 1, characterized in that, The base (1) has a plate groove (101) at the center of the upper side wall, and baffles (3) are installed at both ends of the plate groove (101). There are four columns (4), and the four columns (4) are respectively located at the four corners of the upper side wall of the base (1). A controller (2) is also installed on the base (1).

3. The automatic solder paste applicator according to claim 1, characterized in that, The top frame (5) is arranged parallel to the base (1) directly above it, and a sliding groove (501) is provided in the top frame (5). The top frame (5) is slidably connected to both ends of the slide plate (7) through the sliding groove (501). A drive screw sleeve (702) is installed at the end of the slide plate (7), and the slide plate (7) is connected to the lead screw (602) through the drive screw sleeve (702).

4. The automatic solder paste applicator according to claim 1, characterized in that, The slide plate (7) is further provided with a second slide groove (701), the longitudinal drive component (8) is provided inside the second slide groove (701), the slider (803) is slidably connected to the second slide groove (701), and the slider (803) is connected to the second servo motor (801) through the second lead screw (802).

5. An automatic solder paste applicator according to claim 1, characterized in that, The action camera (902) is externally fixedly mounted with a frame one (902a), and the action camera (902) is connected to the mounting plate (901) through the frame one (902a). The electric push rod one (903a) is externally fixedly mounted with a frame two (903b), and the electric push rod three (904a) is externally fixedly mounted with a frame three (904b).

6. An automatic solder paste applicator according to claim 5, characterized in that, The electric push rod one (903a) is connected to the mounting plate (901) through the frame two (903b), the electric push rod three (904a) is connected to the mounting plate (901) through the frame three (904b), and the solder paste dispensing component (903) and the solder paste suction component (904) are arranged opposite to each other.

7. An automatic solder paste applicator according to claim 1, characterized in that, The bottom of the electric push rod 1 (903a) is equipped with a fixing block 1 (903a-1), and the material cylinder 1 (903c) is fixedly installed at the bottom of the fixing block 1 (903a-1). The bottom side wall of the material cylinder 1 (903c) is also equipped with a dripping head 1 (903c-1). The upper end of the electric push rod 2 (903c-3) is fixedly connected to the upper end of the material cylinder 1 (903c). The bottom side wall of the piston plate 1 (903c-2) is fixedly installed with a connecting plate (903c-4), and the bottom of the connecting plate (903c-4) is also fixedly installed with an electric heating column (903c-5). The two ends of the electric heating column (903c-5) are equipped with springs (903c-6).

8. An automatic solder paste applicator according to claim 1, characterized in that, The bottom of the electric push rod three (904a) is equipped with a fixing block two (904a-1), and the material cylinder two (904c) is fixedly installed at the bottom of the fixing block two (904a-1). The dripping head two (904c-1) is also installed on the bottom side wall of the material cylinder two (904c). The upper end of the electric push rod four (904c-3) is fixedly connected to the upper end of the material cylinder two (904c).

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