Wafer marking machine

Abstract

The utility model relates to a marking machine technical field especially is a kind of wafer marking machine, including machine table, XY axis drive module, mobile platform, lifting drive mechanism, the lifting end of lifting drive mechanism is equipped with lifting platform, the wafer pick-and-place mechanism movably arranged in the upper of mobile platform, the mobile drive mechanism of driving wafer pick-and-place mechanism movement and the marking device located above the mobile area of mobile platform, lifting platform includes lifting platform, the front positioning plate of being equipped with in the side of lifting platform close to mobile platform and the multiple positioning structures of being arranged in the top surface of lifting platform in straight line, each positioning structure and front positioning plate form a positioning area, multiple positioning areas gradually increase from inside to outside, a positioning area can position the wafer carrier of one specification. The present application can position the wafer carrier of multiple specifications, to be able to mark the wafer of multiple specifications, good compatibility, strong practicality, reduce production cost.

Description

Technical Field

[0001] This utility model relates to the field of marking machine technology, and in particular to a wafer marking machine. Background Technology

[0002] A wafer, also known as a silicon wafer, is a crucial raw material for silicon semiconductor circuits. With the widespread application and development of wafers, wafer manufacturers typically use markings on the wafers to enable quality tracking and traceability of their products.

[0003] Among existing patents, Chinese patent application number 202311718106.0 discloses a fully automatic wafer laser marking device, relating to the field of intelligent manufacturing equipment technology. This fully automatic wafer laser marking device includes a worktable, a storage mechanism, a material picking mechanism, an edge-finding mechanism, a fixing mechanism, and a laser marking mechanism. The storage mechanism, edge-finding mechanism, material picking mechanism, fixing mechanism, and laser marking mechanism are all disposed on the worktable. The storage mechanism is used to store wafers to be processed and processed wafers. The material picking mechanism is used to pick up and transport the wafers to be processed. The edge-finding mechanism is used to locate and position the wafers to be processed. The fixing mechanism is used to fix the wafers to be processed. The laser marking mechanism is used to laser mark the wafers fixed on the fixing mechanism. While this patent document enables automated marking of wafers, it can generally only position wafer carriers of a specific size and cannot position wafer carriers of different sizes. Different sizes of wafer carriers require different sizes of stage, resulting in poor compatibility and increased production and usage costs.

[0004] Therefore, the defects are very obvious, and a solution is urgently needed. Utility Model Content

[0005] In order to solve the above-mentioned technical problems, the purpose of this utility model is to provide a wafer marking machine.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A wafer marking machine includes a machine base, an XY-axis drive module mounted on the machine base, a movable platform mounted on the movable end of the XY-axis drive module, a lifting drive mechanism mounted on the machine base and located on one side of the XY-axis drive module, a lifting platform mounted on the lifting end of the lifting drive mechanism, a wafer pick-and-place mechanism movably disposed above the movable platform, a movable drive mechanism mounted on the machine base for driving the wafer pick-and-place mechanism to move, and a marking device located above the movable area of ​​the movable platform. The lifting platform includes a lifting plate mounted on the lifting end of the lifting drive mechanism, a front positioning plate mounted on the side of the lifting plate near the movable platform, and multiple positioning structures arranged in a straight line on the top surface of the lifting plate. Each positioning structure and the front positioning plate form a positioning area. The multiple positioning areas gradually increase in size from the inside to the outside. One positioning area can position a wafer carrier of a certain specification.

[0007] Furthermore, the lifting platform also includes multiple specification sensors installed on the bottom surface of the lifting platform. Each specification sensor is respectively set to correspond one-to-one with multiple positioning structures. The sensing end of the specification sensor can extend into or be exposed in the corresponding positioning area. When the wafer carrier is placed in a positioning area, the wafer carrier can trigger the corresponding specification sensor.

[0008] Furthermore, the positioning structure includes two L-shaped positioning blocks mounted back-to-back on the lifting platform, with the front positioning plate and the two L-shaped positioning blocks forming a positioning area; the L-shaped positioning blocks of the multiple positioning structures are distributed in a stepped manner.

[0009] Furthermore, the movable stage includes a vent plate mounted on the movable end of the XY axis drive module and a movable carrier plate mounted on the vent plate. A through slot is provided in the middle of the top surface of the movable carrier plate, and a suction slot is provided on the top surface of the movable carrier plate. The suction slot is located on both sides of the through slot. A vent hole is provided inside the vent plate, and a connecting hole is provided on the movable carrier plate. One end of the connecting hole is connected to the vent hole, and the other end of the connecting hole is connected to the suction slot. The through slot allows the wafer pick-and-place end of the wafer pick-and-place mechanism to extend into it.

[0010] Furthermore, the wafer pick-and-place mechanism includes a connecting plate mounted on the moving end of the moving drive mechanism, a pick-and-place plate mounted on the connecting plate, and a wafer sensor mounted on the connecting plate. The sensing end of the wafer sensor faces the lifting platform, and the top surface of the pick-and-place plate is recessed with a suction groove. The pick-and-place plate can extend into the through groove. The top surface of the pick-and-place plate can be flush with the top surface of the moving platform.

[0011] Furthermore, the wafer marking machine also includes a dust extraction mechanism and an anti-static mechanism respectively installed on the machine base. The dust extraction end of the dust extraction mechanism faces the marking position of the marking device, and the anti-static mechanism is used to remove static electricity.

[0012] Furthermore, the marking device includes a mounting platform installed on the machine tool, an optical path system installed on the mounting platform, a lifting drive module installed on the mounting platform or machine tool and located on one side of the optical path system, a laser injection marking mechanism installed on the lifting end of the lifting drive module, a telescopic tube connected between the output end of the optical path system and the input end of the laser injection marking mechanism, and a vision positioning mechanism installed on the lifting end of the lifting drive module and located on one side of the laser injection marking mechanism.

[0013] Furthermore, the visual positioning mechanism includes a mounting plate installed on the lifting end of the lifting drive module, a first CCD camera and a second CCD camera installed parallel to the mounting plate, and a supplementary light source installed on the mounting plate and located below the first CCD camera.

[0014] Furthermore, the optical path system includes a laser mounted on a mounting platform, a housing mounted on the mounting platform, and a first reflector, a second reflector, a beam expander, a third reflector, and a fourth reflector respectively mounted on the housing. The angle between the light emitted by the laser and the first reflector is 45°. The first and second reflectors are positioned opposite each other with an angle of 90° between them. The second and third reflectors are positioned opposite each other and are parallel to each other. The beam expander is located between the second and third reflectors. A mounting box is provided on one side of the housing. The fourth reflector is mounted on the mounting box. The third and fourth reflectors are positioned opposite each other. The top end of the telescopic tube is mounted on the bottom port of the mounting box. The angle between the central axis of the telescopic tube and the fourth reflector is 45°.

[0015] Furthermore, the laser emission marking mechanism includes a housing installed at the lifting end of the lifting drive module, a fifth reflecting mirror installed in the inner cavity of the housing, a galvanometer installed in the inner cavity of the housing and positioned opposite to the fifth reflecting mirror, and a field mirror installed in the housing and located below the galvanometer. The fifth reflecting mirror and the fourth reflecting mirror are positioned opposite to each other and are parallel to each other. The angle between the central axis of the telescopic tube and the fifth reflecting mirror is 45°.

[0016] The beneficial effects of this utility model are as follows: In practical applications, a wafer carrier of a certain specification and filled with stacked wafers is placed in the corresponding positioning area of ​​the lifting platform, so that the front positioning plate and the corresponding positioning structure position the wafer carrier. The pick-and-place port of the wafer carrier is correspondingly set with the pick-and-place part of the wafer pick-and-place mechanism. The moving drive mechanism drives the pick-and-place part of the wafer pick-and-place mechanism to extend into the wafer carrier and be located below one of the wafers, so that the pick-and-place part of the wafer pick-and-place mechanism picks up the wafer and removes the wafer from the wafer carrier. The wafer pick-and-place mechanism places the wafer... On the moving platform, the XY-axis drive module then moves the moving platform, along with the wafer, to the marking position of the marking device. The marking device marks the wafer. After marking, the XY-axis drive mechanism moves the moving platform, along with the marked wafer, to the pick-and-place position. The moving drive mechanism then moves the wafer pick-and-place mechanism, allowing its pick-and-place section to pick up the marked wafer from the moving platform and return it to its original position on the wafer carrier. This process is repeated until all wafers in the wafer carrier have been marked. The lifting drive mechanism raises and lowers the lifting platform, adjusting the starting height of the wafer carrier and facilitating placement. Furthermore, each positioning area can hold one type of wafer carrier, and multiple positioning areas can hold multiple types of wafer carriers. This invention can position wafer carriers of various sizes for marking, offering good compatibility, strong practicality, and reduced production costs. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the hidden machine platform of this utility model.

[0018] Figure 2 This is a three-dimensional structural diagram of the hidden machine platform of this utility model from another perspective.

[0019] Figure 3 This is a three-dimensional structural diagram of the lifting platform of this utility model that supports a wafer carrier.

[0020] Figure 4 This is a three-dimensional structural diagram of the lifting platform of this utility model carrying a wafer carrier from another perspective.

[0021] Figure 5 This is a three-dimensional structural diagram of the XY-axis drive module and the moving platform of this utility model.

[0022] Figure 6 This is a cross-sectional view of the mobile platform of this utility model.

[0023] Figure 7 This is a three-dimensional structural diagram of the moving drive mechanism and the wafer pick-and-place mechanism of this utility model.

[0024] Figure 8 This is a three-dimensional structural diagram of the marking device of this utility model.

[0025] Figure 9 This is a cross-sectional view of the laser emission marking mechanism of this utility model.

[0026] Explanation of reference numerals in the attached figures: 1. XY axis drive module; 2. Moving stage; 3. Lifting drive mechanism; 4. Lifting stage; 5. Wafer pick-and-place mechanism; 6. Moving drive mechanism; 7. Marking device; 8. Lifting carrier plate; 9. Front positioning plate; 10. Positioning structure; 11. Carrier sensor; 12. Sensing hole; 13. Specification sensor; 14. L-shaped positioning block; 15. Ventilation plate; 16. Moving carrier plate; 17. Through slot; 18. Suction slot; 19. Ventilation hole; 20. Connecting plate; 21. Pick-and-place plate; 22. Wafer sensor; 23. Suction slot; 24. Dust collection mechanism; 25. Static elimination mechanism; 26. Mounting platform; 27. Optical path System; 28. Lifting drive module; 29. ​​Laser injection marking mechanism; 30. Telescopic tube; 31. Vision positioning mechanism; 32. Mounting plate; 33. First CCD camera; 34. Second CCD camera; 35. Supplementary light source; 36. Laser; 37. Box; 38. First reflector; 39. Second reflector; 40. Beam expander; 41. Third reflector; 42. Fourth reflector; 43. Housing; 44. Fifth reflector; 45. Galvanometer; 46. Field lens; 47. Wafer carrier; 48. Pressing mechanism; 49. Rotary pressing cylinder; 50. Pressing plate; 51. Through hole; 52. Mounting box. Detailed Implementation

[0027] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention.

[0028] like Figures 1 to 9As shown, the present invention provides a wafer marking machine, which includes a machine base, an XY-axis drive module 1 mounted on the machine base, a movable platform 2 mounted on the movable end of the XY-axis drive module 1, a lifting drive mechanism 3 mounted on the machine base and located on one side of the XY-axis drive module 1, a lifting platform 4 mounted on the lifting end of the lifting drive mechanism 3, a wafer pick-and-place mechanism 5 movably disposed above the movable platform 2, a movable drive mechanism 6 mounted on the machine base for driving the wafer pick-and-place mechanism 5 to move, and a marking device located above the moving area of ​​the movable platform 2. 7. The lifting platform 4 includes a lifting plate 8 installed at the lifting end of the lifting drive mechanism 3, a front positioning plate 9 installed on the side of the lifting plate 8 near the moving platform 2, and multiple positioning structures 10 arranged in a straight line on the top surface of the lifting plate 8. Each positioning structure 10 and the front positioning plate 9 form a positioning area. The multiple positioning areas gradually increase in size from the inside to the outside. That is, in the multiple positioning areas from the inside to the outside, the previous positioning area is located in the next positioning area. One positioning area can position a wafer carrier 47 of a certain specification.

[0029] In practical applications, a wafer carrier 47 of a certain specification, filled with stacked wafers, is placed in the corresponding positioning area of ​​the lifting platform 4, so that the front positioning plate 9 and the corresponding positioning structure 10 position the wafer carrier 47. The pick-and-place port of the wafer carrier 47 is correspondingly set with the pick-and-place part of the wafer pick-and-place mechanism 5. The moving drive mechanism 6 drives the pick-and-place part of the wafer pick-and-place mechanism 5 to extend into the wafer carrier 47 and be positioned below one of the wafers, so that the pick-and-place part of the wafer pick-and-place mechanism 5 picks up the wafer and removes the wafer from the wafer carrier 47. The wafer pick-and-place mechanism 5 places the wafer on the moving platform 47. On stage 2, the XY-axis drive module 1 drives the moving stage 2, along with the wafer, to the marking position of the marking device 7. The marking device 7 marks the wafer. After marking, the XY-axis drive mechanism drives the moving stage 2, along with the marked wafer, to the pick-and-place position. The moving drive mechanism 6 drives the wafer pick-and-place mechanism 5 to move, so that the pick-and-place part of the wafer pick-and-place mechanism 5 picks up the marked wafer carried by the moving stage 2 and puts the marked wafer back to the original position of the wafer carrier 47. The above operation steps are repeated until all wafers in the wafer carrier 47 have been marked. Among them, the lifting drive mechanism 3 drives the lifting stage 4 to rise and fall, which can not only adjust the starting height of the wafer carrier 47, but also facilitate the placement of the wafer carrier 47 on the lifting stage 4. In addition, each positioning area can hold one type of wafer carrier 47, and multiple positioning areas can hold multiple types of wafer carriers 47. This invention can position wafer carriers 47 of various specifications, enabling marking of wafers of various specifications. It has good compatibility, strong practicality, and reduces production costs.

[0030] Preferably, there are three positioning structures 10. The front positioning plate 9 and the three positioning structures 10 form three positioning areas. The first positioning area can hold a six-inch wafer carrier 47, the second positioning area can hold a seven-inch wafer carrier 47, and the third positioning area can hold an eight-inch wafer carrier 47.

[0031] Specifically, a carrier sensor 11 is installed on the bottom surface of the lifting carrier plate 8, and a sensing hole 12 is opened on the lifting carrier plate 8. The sensing hole 12 is located within the positioning area, and the carrier sensor 11 is located inside or below the sensing hole 12. In practical applications, when the carrier sensor 11 detects the presence of a wafer carrier 47, it indicates that a wafer carrier 47 is placed on the lifting carrier plate 8; when the carrier sensor 11 does not detect the wafer carrier 47, it indicates that no wafer carrier 47 is placed on the lifting carrier plate 8.

[0032] In this embodiment, the lifting platform 4 also includes a plurality of specification sensors 13 installed on the bottom surface of the lifting plate 8. The plurality of specification sensors 13 are respectively configured in correspondence with a plurality of positioning structures 10. The sensing end of the specification sensor 13 can extend into or be exposed in the corresponding positioning area. When the wafer carrier 47 is placed in a positioning area, the wafer carrier 47 can trigger the corresponding specification sensor 13.

[0033] In practical applications, when a wafer carrier 47 of a specific specification is placed in the corresponding positioning area, the wafer carrier 47 will trigger the corresponding specification sensor 13 to determine the specification of the wafer carrier 47, thereby determining the size of the wafer to be marked, which is beneficial for the accurate handling of wafers and the quality of wafer marking.

[0034] Specifically, the lifting platform 4 also includes a pressing mechanism 48 mounted on the lifting plate 8. The pressing mechanism 48 is used to press the wafer carrier 47 onto the lifting plate 8 to improve the positional accuracy and stability of the wafer carrier 47 on the lifting plate 8.

[0035] Specifically, the pressing mechanism 48 includes a rotary pressing cylinder 49 mounted on the lifting carrier plate 8 and a pressing plate 50 mounted on the piston rod of the rotary pressing cylinder 49. The rotary pressing cylinder 49 is used to drive the pressing plate 50 to lift and rotate. In practical applications, after the wafer carrier 47 is placed in the corresponding positioning area, the rotary pressing cylinder 49 first drives the pressing plate 50 to rotate above the wafer carrier 47, and then drives the pressing plate 50 to descend to press the wafer carrier 47 onto the lifting carrier plate 8.

[0036] In this embodiment, the positioning structure 10 includes two L-shaped positioning blocks 14 mounted back-to-back on the lifting carrier plate 8, and the front positioning plate 9 and the two L-shaped positioning blocks 14 form a positioning area; the L-shaped positioning blocks 14 of the multiple positioning structures 10 are distributed in a stepped manner. In practical applications, a wafer carrier 47 of a specific size is placed on the lifting carrier plate 8, and the front side of the wafer carrier 47 abuts against the front positioning plate 9, so that the two positioning shoulders on the rear side of the wafer carrier 47 abut against the two L-shaped positioning blocks 14 respectively. The two L-shaped positioning blocks 14 position the two positioning shoulders on the rear side of the wafer carrier 47 to position the wafer carrier 47 in the corresponding positioning area.

[0037] In this embodiment, the movable stage 2 includes a vent plate 15 mounted on the movable end of the XY axis drive module 1 and a movable carrier plate 16 mounted on the vent plate 15. A through groove 17 is formed in the middle of the top surface of the movable carrier plate 16, and a suction groove 18 is provided on the top surface of the movable carrier plate 16. The suction groove 18 is located on both sides of the through groove 17. A vent hole 19 is provided inside the vent plate 15, and a connecting hole 51 is provided on the movable carrier plate 16. One end of the connecting hole 51 communicates with the vent hole 19, and the other end of the connecting hole 51 communicates with the suction groove 18. The through groove 17 allows the wafer pick-and-place end of the wafer pick-and-place mechanism 5 to extend into it. Specifically, the movable carrier plate 16 is T-shaped.

[0038] In practical applications, the vent plate 15 is connected to an external vacuum device. After the wafer pick-up and drop-down section of the wafer pick-up and drop-down mechanism 5 picks up the wafer, the pick-up and drop-down section of the wafer pick-up and drop-down mechanism 5 inserts laterally or enters the through slot 17 from top to bottom, so that the wafer is located on the top surface of the movable carrier 16. At this time, the suction groove 18 holds the wafer tightly on the movable carrier 16. After the wafer pick-up and drop-down section of the wafer pick-up and drop-down mechanism 5 releases the wafer, the pick-up and drop-down section of the wafer pick-up and drop-down mechanism 5 moves laterally out of the through slot 17. When the wafer on the movable carrier 16 is marked, the pick-up and drop-down section of the wafer pick-up and drop-down mechanism 5 extends into the through slot 17 and holds the wafer tightly. At this time, the movable carrier 16 releases the wafer, and the pick-up and drop-down section of the wafer pick-up and drop-down mechanism 5 holds the wafer tightly and moves laterally out of the through slot 17 or moves out of the through slot 17 from top to bottom.

[0039] In this embodiment, the wafer pick-and-place mechanism 5 includes a connecting plate 20 mounted on the moving end of the moving drive mechanism 6, a pick-and-place plate 21 mounted on the connecting plate 20, and a wafer sensor 22 mounted on the connecting plate 20. The sensing end of the wafer sensor 22 faces the lifting platform 4. The top surface of the pick-and-place plate 21 is recessed with a suction groove 23. The pick-and-place plate 21 can extend into the through groove 17. The top surface of the pick-and-place plate 21 can be flush with the top surface of the moving platform 16. The suction groove 23 is connected to a vacuum device. Specifically, the moving drive mechanism 6 can be a robotic arm or a YZ axis drive mechanism.

[0040] In practical applications, after the wafer carrier 47 filled with stacked wafers is placed on the lifting platform 4, the moving drive mechanism 6 first drives the wafer pick-and-place mechanism 5 to move from top to bottom or from bottom to top, aligned with the pick-and-place port of the wafer carrier 47. This allows the wafer sensor 22 to detect the number of wafers in the wafer carrier 47, whether there are missing wafers, whether there are stacked wafers, and / or whether there are tilted wafers. After the detection is completed, the moving drive mechanism 6 drives the suction groove 23 of the pick-and-place plate 21 of the wafer pick-and-place mechanism 5 to move into the wafer carrier 47 and position it below the wafer to be picked up. After the suction groove 23 of the suction plate clamps the wafer, the moving drive mechanism 6 drives the wafer pick-and-place mechanism 5 to move the wafer out of the wafer carrier 47 and place it on the moving platform 16. The suction groove 18 of the moving platform 16 clamps the wafer.

[0041] In this embodiment, the wafer marking machine further includes a dust extraction mechanism 24 and an antistatic mechanism 25 respectively installed on the machine base. The dust extraction end of the dust extraction mechanism 24 faces the marking position of the marking device 7, and the antistatic mechanism 25 is used to remove static electricity. Specifically, the antistatic mechanism 25 can be an ion fan. When the marking device 7 marks the wafer carried by the moving platform 2, the dust extraction mechanism 24 extracts the dust and / or smoke generated during marking, while the antistatic mechanism 25 removes static electricity from the environment and the wafer to prevent dust from adhering to the wafer under the action of static electricity.

[0042] In this embodiment, the marking device 7 includes a mounting platform 26 installed on the machine tool, an optical path system 27 installed on the mounting platform 26, a lifting drive module 28 installed on the mounting platform 26 or the machine tool and located on one side of the optical path system 27, a laser emission marking mechanism 29 installed on the lifting end of the lifting drive module 28, a telescopic tube 30 connecting the output end of the optical path system 27 and the input end of the laser emission marking mechanism 29, and a visual positioning mechanism 31 installed on the lifting end of the lifting drive module 28 and located on one side of the laser emission marking mechanism 29.

[0043] In practical applications, the visual positioning mechanism 31 first performs visual inspection and positioning on the wafer carried by the moving stage 2. Then, the optical path system 27 emits light, which is emitted by the laser marking mechanism 29 to mark the wafer. During laser marking of the wafer, the XY axis drive module 1 drives the moving stage 2 to move along the marking trajectory. In addition, when it is necessary to adjust the size of the light spot, the lifting drive module 28 drives the laser marking mechanism 29 to rise and fall. During this process, the telescopic tube 30 extends and retracts to ensure that the light spot after laser focusing is at the center of the galvanometer 45 of the laser marking mechanism 29, so as to ensure the marking quality.

[0044] In this embodiment, the visual positioning mechanism 31 includes a mounting plate 32 installed on the lifting end of the lifting drive module 28, a first CCD camera 33 and a second CCD camera 34 installed parallel to the mounting plate 32, and a supplementary light source 35 installed on the mounting plate 32 and located below the first CCD camera 33; preferably, the visual detection accuracy of the first CCD camera 33 is less than the visual detection accuracy of the second CCD camera 34; the supplementary light source 35 is a supplementary aperture.

[0045] In practical applications, the moving stage 2 first moves the wafer to below the first CCD camera 33, where the first CCD camera 33 takes a picture of the wafer. During this process, the supplementary light source 35 provides supplementary lighting to visually locate the marking points on the wafer. Then, the moving stage 2 moves the wafer to below the second CCD camera 34, where the second CCD camera 34 precisely positions the wafer carried by the moving stage 2 to improve the quality of marking the wafer by the marking device 7.

[0046] In this embodiment, the optical path system 27 includes a laser 36 mounted on a mounting platform 26, a housing 37 mounted on the mounting platform 26, and a first reflector 38, a second reflector 39, a beam expander 40, a third reflector 41, and a fourth reflector 42 respectively mounted on the housing 37. The angle between the light emitted by the laser 36 and the first reflector 38 is 45°. The first reflector 38 and the second reflector 39 are arranged opposite each other with an angle of 90° between them. The second reflector 39 and the third reflector 41 are arranged opposite each other and are parallel to each other. The beam expander 40 is located between the second reflector 39 and the third reflector 41. A mounting box 52 is provided on one side of the housing 37. The fourth reflector 42 is mounted on the mounting box 52. The third reflector 41 and the fourth reflector 42 are arranged opposite each other. The top end of the telescopic tube 30 is mounted on the bottom port of the mounting box 52. The angle between the central axis of the telescopic tube 30 and the fourth reflector 42 is 45°.

[0047] In practical applications, the laser 36 emits light that shines on the first reflector 38, the first reflector 38 reflects the light onto the second reflector 39, the second reflector 39 reflects the light through the beam expander 40 and then shines on the third reflector 41, the third reflector 41 reflects the light onto the fourth reflector 42, the fourth reflector 42 reflects the light to the laser emission marking mechanism 29, and the laser emission marking mechanism 29 emits the laser to mark the wafer.

[0048] In this embodiment, the laser emission marking mechanism 29 includes a housing 43 installed at the lifting end of the lifting drive module 28, a fifth reflecting mirror 44 installed in the inner cavity of the housing 43, a galvanometer 45 installed in the inner cavity of the housing 43 and disposed opposite to the fifth reflecting mirror 44, and a field mirror 46 installed in the housing 43 and located below the galvanometer 45. The fifth reflecting mirror 44 and the fourth reflecting mirror 42 are disposed opposite to each other and are parallel. The angle between the central axis of the telescopic tube 30 and the fifth reflecting mirror 44 is 45°.

[0049] In practical applications, the fourth reflector 42 reflects the light onto the fifth reflector 44, which in turn reflects the light onto the galvanometer 45, which then passes through the field mirror 46 and emits the laser beam outward.

[0050] All technical features in this embodiment can be freely combined according to actual needs.

[0051] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A wafer marking machine, characterized in that: The system includes a machine tool, an XY-axis drive module (1) mounted on the machine tool, a moving platform (2) mounted on the moving end of the XY-axis drive module (1), a lifting drive mechanism (3) mounted on the machine tool and located on one side of the XY-axis drive module (1), a lifting platform (4) mounted on the lifting end of the lifting drive mechanism (3), a wafer pick-and-place mechanism (5) movably disposed above the moving platform (2), a moving drive mechanism (6) mounted on the machine tool and used to drive the wafer pick-and-place mechanism (5) to move, and a moving area located on the moving platform (2). The marking device (7) above the field, the lifting platform (4) includes a lifting plate (8) installed at the lifting end of the lifting drive mechanism (3), a front positioning plate (9) installed on the side of the lifting plate (8) near the moving platform (2) and multiple positioning structures (10) arranged in a straight line on the top surface of the lifting plate (8). Each positioning structure (10) and the front positioning plate (9) form a positioning area. The multiple positioning areas gradually increase in size from the inside to the outside. One positioning area can position a wafer carrier (47) of a certain specification.

2. The wafer marking machine according to claim 1, characterized in that: The lifting platform (4) also includes multiple specification sensors (13) installed on the bottom surface of the lifting plate (8). The multiple specification sensors (13) are respectively set in correspondence with multiple positioning structures (10). The sensing end of the specification sensor (13) can extend into or be exposed in the corresponding positioning area. When the wafer carrier (47) is placed in a positioning area, the wafer carrier (47) can trigger the corresponding specification sensor (13).

3. A wafer marking machine according to claim 1, characterized in that: The positioning structure (10) includes two L-shaped positioning blocks (14) mounted back-to-back on the lifting platform (8), and the front positioning plate (9) and the two L-shaped positioning blocks (14) form a positioning area; the L-shaped positioning blocks (14) of the multiple positioning structures (10) are distributed in a stepped manner.

4. A wafer marking machine according to claim 1, characterized in that: The mobile stage (2) includes a vent plate (15) installed on the moving end of the XY axis drive module (1) and a mobile carrier plate (16) installed on the vent plate (15). A through groove (17) is provided in the middle of the top surface of the mobile carrier plate (16). A suction groove (18) is provided on the top surface of the mobile carrier plate (16). The suction groove (18) is located on both sides of the through groove (17). A vent hole (19) is provided inside the vent plate (15). A connecting hole (51) is provided on the mobile carrier plate (16). One end of the connecting hole (51) is connected to the vent hole (19), and the other end of the connecting hole (51) is connected to the suction groove (18). The through groove (17) allows the wafer pick-and-place mechanism (5) to extend into it.

5. A wafer marking machine according to claim 4, characterized in that: The wafer pick-and-place mechanism (5) includes a connecting plate (20) mounted on the moving end of the moving drive mechanism (6), a pick-and-place plate (21) mounted on the connecting plate (20), and a wafer sensor (22) mounted on the connecting plate (20). The sensing end of the wafer sensor (22) faces the lifting platform (4). The top surface of the pick-and-place plate (21) is recessed with a suction groove (23). The pick-and-place plate (21) can extend into the through groove (17). The top surface of the pick-and-place plate (21) can be flush with the top surface of the moving platform (16).

6. A wafer marking machine according to claim 1, characterized in that: The wafer marking machine also includes a dust suction mechanism (24) and an anti-static mechanism (25) respectively installed on the machine. The dust suction end of the dust suction mechanism (24) faces the marking position of the marking device (7), and the anti-static mechanism (25) is used to remove static electricity.

7. A wafer marking machine according to claim 1, characterized in that: The marking device (7) includes a mounting platform (26) installed on the machine, an optical path system (27) installed on the mounting platform (26), a lifting drive module (28) installed on the mounting platform (26) or the machine and located on one side of the optical path system (27), a laser emission marking mechanism (29) installed on the lifting end of the lifting drive module (28), a telescopic tube (30) connected between the output end of the optical path system (27) and the input end of the laser emission marking mechanism (29), and a vision positioning mechanism (31) installed on the lifting end of the lifting drive module (28) and located on one side of the laser emission marking mechanism (29).

8. A wafer marking machine according to claim 7, characterized in that: The visual positioning mechanism (31) includes a mounting plate (32) installed on the lifting end of the lifting drive module (28), a first CCD camera (33) and a second CCD camera (34) installed parallel to the mounting plate (32), and a supplementary light source (35) installed on the mounting plate (32) and located below the first CCD camera (33).

9. A wafer marking machine according to claim 7, characterized in that: The optical path system (27) includes a laser (36) mounted on a mounting platform (26), a housing (37) mounted on the mounting platform (26), and a first reflector (38), a second reflector (39), a beam expander (40), a third reflector (41), and a fourth reflector (42) respectively mounted on the housing (37). The angle between the light emitted by the laser (36) and the first reflector (38) is 45°. The first reflector (38) and the second reflector (39) are arranged opposite each other with an angle of 90° between them. The mirror (39) and the third mirror (41) are arranged opposite each other and parallel to each other. The beam expander (40) is located between the second mirror (39) and the third mirror (41). A mounting box (52) is provided on one side of the box (37). The fourth mirror (42) is installed in the mounting box (52). The third mirror (41) and the fourth mirror (42) are arranged opposite each other. The top end of the telescopic tube (30) is installed at the bottom port of the mounting box (52). The angle between the central axis of the telescopic tube (30) and the fourth mirror (42) is 45°.

10. A wafer marking machine according to claim 9, characterized in that: The laser marking mechanism (29) includes a housing (43) installed at the lifting end of the lifting drive module (28), a fifth reflector (44) installed in the inner cavity of the housing (43), a galvanometer (45) installed in the inner cavity of the housing (43) and positioned opposite to the fifth reflector (44), and a field mirror (46) installed in the housing (43) and located below the galvanometer (45). The fifth reflector (44) and the fourth reflector (42) are positioned opposite to each other and are parallel. The central axis of the telescopic tube (30) and the fifth reflector (44) are at an angle of 45°.

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