A circuit board processing device

Abstract

The application discloses a circuit board processing device and belongs to the field of circuit board processing. The device comprises a base pedestal, displacement mechanisms are arranged on both sides and above the base pedestal, the displacement mechanisms comprise guide mounting racks, pre-cleaning mechanisms are arranged on one side of the guide mounting racks, and the pre-cleaning mechanisms comprise side mounting racks and middle part mounting slides. The device has the beneficial effect that when the pre-cleaning mechanism moves to above the initial end of the circuit board along the first displacement assembly, the staff can start the third motor to rotate the third transmission lead screw, at this time, the third lead screw sleeve matched with the third transmission lead screw will take the mounting slide to descend with the help of the second guide rod, and since the anti-static brush roller is mounted in the middle below the mounting slide, when the working layer of the anti-static brush roller contacts the surface of the circuit board, the fourth motor can be started to rotate the anti-static brush roller to the side mounting rack direction, so that impurity cleaning is realized.

Description

Technical Field

[0001] This application relates to the field of circuit board processing, and more specifically, to a circuit board processing apparatus. Background Technology

[0002] Printed circuit boards (PCBs) are the core basic components of the modern electronics industry. They bear the dual core functions of "mechanical support" and "signal transmission" for electronic devices and are widely used in fields such as communications, medical, aerospace, and military. Laser cutting equipment is used to cut and process PCBs during the manufacturing process.

[0003] In current circuit board laser cutting equipment, if impurities adhere to the surface of the circuit board and are not treated beforehand, these impurities, debris, and other contaminants will directly interfere with the focusing and transmission of the laser beam, causing deviations in the cutting path. This results in problems such as rough cuts and substandard dimensional accuracy, failing to meet the processing requirements of high-precision circuit boards. At the same time, the presence of impurities will also cause uneven heat distribution during laser cutting. This heat difference will further lead to carbonization, discoloration, and other defects at the cut edges, not only damaging the appearance integrity of the circuit board but also potentially negatively affecting its internal electrical performance. Utility Model Content

[0004] The summary section of this application is intended to provide a brief overview of the concepts, which will be described in detail in the detailed description section below. This summary section is not intended to identify key or essential features of the claimed technical solutions, nor is it intended to limit the scope of the claimed technical solutions.

[0005] The purpose of this application is to address the shortcomings of existing technologies by providing a circuit board processing apparatus. This apparatus solves the problem that if impurities adhere to the surface of the circuit board and are not pre-treated, these impurities, debris, and other contaminants will directly interfere with the focusing and transmission of the laser beam, causing deviations in the cutting path. This results in problems such as rough cuts and substandard dimensional accuracy, failing to meet the processing requirements of high-precision circuit boards. Furthermore, the presence of impurities will cause uneven heat distribution during laser cutting. This heat difference will further lead to carbonization, discoloration, and other defects at the cutting edges, not only damaging the appearance integrity of the circuit board but also potentially negatively impacting its internal electrical performance.

[0006] To achieve the above objectives, this application provides the following technical solution: A circuit board processing apparatus includes: a base, on both sides and above the base, a displacement mechanism is provided, the displacement mechanism includes a guide frame, and a pre-cleaning mechanism is provided on one side of the guide frame, the pre-cleaning mechanism includes a side mounting frame and a component assembly slide, the side mounting frame is fixed to one side of the guide frame, a first cleaning component is installed in the middle of the side mounting frame, and a second cleaning component is provided on one side of the assembly slide.

[0007] Furthermore, the first cleaning component includes an inner frame, which is disposed on both sides of the middle of the side frame. A third motor is installed in the upper part of the inner frame of one of the inner frames, and the output end of the third motor is connected to a third transmission screw. A third screw sleeve is screwed around one side of the third transmission screw, and an assembly slide is fixed inside the third screw sleeve. A second guide rod is fixed inside the other inner frame, and a fourth motor is installed on one side of the assembly slide. An antistatic brush roller is connected to the output end of the fourth motor.

[0008] Furthermore, the assembly carriage and its second guide rod are connected by a lifting guide connection.

[0009] Furthermore, the second cleaning component includes a side mounting frame, which is fixed to one side of the assembly carriage. An upper frame is fixed above the side mounting frame, and a negative pressure main pipe is installed in the middle section of the upper frame. A diversion pipe rack is connected to the end of the negative pressure main pipe, and branch pipes are provided below the diversion pipe rack. Dust suction ports are provided on the inner working surface of the side mounting frame.

[0010] Furthermore, the displacement mechanism includes a first displacement component, which is installed on both sides and above the base. The first displacement component includes a guide frame, and a second displacement component is installed in the middle of the guide frame. The second displacement component includes a mounting guide, and a cylinder is fixedly installed at the front end of the mounting guide. The extended end of the cylinder is connected to a sliding frame. A guide edge for guiding the sliding frame is opened at the front end of the mounting guide. A laser cutting component is installed in the middle of the sliding frame.

[0011] Furthermore, the first displacement component includes a first transmission screw, which is installed in the middle of one side of the base. A first motor is installed at one end of the first transmission screw, and a first screw sleeve is screwed around one side of the first transmission screw. A guide frame is fixed around the first screw sleeve, and a first guide rod for guiding the displacement of the guide frame is fixed in the middle of the other side of the base.

[0012] Furthermore, the second displacement component includes a second motor, which is mounted on one side of the guide frame. The output end of the second motor is connected to a second transmission screw, and a second screw sleeve is screwed around one side of the second transmission screw. A mounting guide is fixed around the second screw sleeve, and a guide groove is provided on the top of the guide frame for guiding the displacement of the mounting guide.

[0013] The beneficial effects of this application are as follows: When the pre-cleaning mechanism moves to above the initial end of the circuit board along with the first displacement component, the operator can start the third motor to rotate the third transmission screw. At this time, the third screw sleeve, which is connected to the screw, will carry the assembly carriage down with the help of the second guide rod. Since an anti-static brush roller is installed in the middle of the lower part of the assembly carriage, when the working layer of the anti-static brush roller contacts the surface of the circuit board, the fourth motor can be started to rotate it towards the side mounting bracket, thereby cleaning the impurities. At the same time, the negative pressure air source (which can be a negative pressure fan) connected to the negative pressure main pipe is started. The negative pressure suction will be evenly distributed to each branch pipe and the dust suction port connected to the end along the negative pressure main pipe and the diversion pipe frame connected to its end, thereby sucking out the cleaned impurities through negative pressure, providing a good working environment for subsequent laser cutting.

[0014] The operator first places the circuit board on the base, then starts the first motor to rotate the first transmission screw. At this time, the first screw sleeve, which is connected to the screw, moves the guide frame with the help of the first guide rod. During this movement, the pre-cleaning mechanism installed on one side of the guide frame pre-cleans the circuit board using its own structure. After cleaning, the laser cutting component installed at the front end of the guide frame moves to the area of ​​the circuit board to be processed. Then, the cylinder is activated, and under the limiting guidance of the sliding frame and the guide edge, the laser cutting component descends and performs laser cutting on the circuit board. If displacement in another direction is required during the process, the second motor can be started to rotate the second transmission screw. At this time, the second screw sleeve, which is connected to the screw, moves the mounting guide and the laser cutting component in the corresponding direction, thereby expanding the cutting range. Attached Figure Description

[0015] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application.

[0016] Furthermore, throughout the accompanying drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the elements are not necessarily drawn to scale.

[0017] In the attached diagram: Figure 1This is a three-dimensional structural diagram of the present application; Figure 2 For the purposes of this application Figure 1 Schematic diagram of the structure at point A in the middle; Figure 3 This is a three-dimensional structural diagram of the pre-cleaning mechanism in this application; Figure 4 This is a three-dimensional detailed structural diagram of the second cleaning component of this application.

[0018] Figure label: 1. Base; 2. Displacement mechanism; 21. First displacement assembly; 211. First transmission lead screw; 212. First motor; 213. First lead screw sleeve; 214. Guide frame; 215. First guide rod; 22. Second displacement assembly; 221. Second motor; 222. Second transmission lead screw; 223. Second lead screw sleeve; 224. Mounting guide; 225. Guide groove; 23. Cylinder; 24. Sliding frame; 25. Guide edge; 26. Laser cutting assembly; 3 31. Pre-cleaning mechanism; 32. Side mounting frame; 33. First cleaning assembly; 34. Inner mounting frame; 35. Third motor; 36. Third transmission screw; 37. Third screw sleeve; 38. Assembly slide; 39. Second guide rod; 30. Fourth motor; 31. Antistatic brush roller; 32. Second cleaning assembly; 33. Side mounting frame; 34. Upper frame; 35. Negative pressure main pipe; 36. Diversion pipe frame; 37. Branch pipe; 38. Dust suction port. Detailed Implementation

[0019] The circuit board processing apparatus provided in this application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should also be noted that, in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can also use other alternative methods to implement some well-known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit this application.

[0020] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0021] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0022] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] Reference Figure 1-4As shown, this utility model provides a circuit board processing device, including: a base 1, a displacement mechanism 2 jointly arranged on both sides and above the base 1, the displacement mechanism 2 including a guide frame 214, and a pre-cleaning mechanism 3 arranged on one side of the guide frame 214, the displacement mechanism 2 including a first displacement component 21, the first displacement component 21 being installed on both sides and above the base 1, the first displacement component 21 including a first transmission screw 211, the first transmission screw 211 being installed in the middle of one side of the base 1, a first motor 212 being installed at one end of the first transmission screw 211, and a first screw slide being screwed around one side of the first transmission screw 211. The first lead screw sleeve 213 is fixedly provided with a guide frame 214 around its periphery. A first guide rod 215 for guiding the displacement of the guide frame 214 is fixedly provided at the center of the other side of the base 1. A second displacement assembly 22 is installed at the center of the guide frame 214. The second displacement assembly 22 includes a second motor 221, which is mounted on one side of the guide frame 214. The output end of the second motor 221 is connected to a second transmission lead screw 222. A second lead screw sleeve 223 is screwed onto the periphery of one side of the second transmission lead screw 222. A mounting guide 224 is fixedly provided around the periphery of the second lead screw sleeve 223. A mounting guide 224 is provided on the top of the guide frame 214 for mounting... The guide rail 224 has a guide groove 225 for guiding displacement, and a cylinder 23 is fixedly installed at the front end of the guide rail 224. The extended end of the cylinder 23 is connected to a sliding frame 24. The front end of the guide rail 224 has a guide edge 25 for guiding the sliding frame 24. A laser cutting component 26 is installed in the middle of the sliding frame 24. The operator first places the circuit board on the base 1, and then starts the first motor 212 to rotate the first transmission screw 211. At this time, the first screw sleeve 213, which cooperates with the screw, will carry the guide frame 214 to move with the guidance of the first guide rod 215. During this displacement, the pre-loaded part installed on one side of the guide frame 214 will move. The cleaning mechanism 3 will pre-clean the circuit board using its own structure. After cleaning, the laser cutting component 26 installed at the front end of the guide frame 214 will move to the area above the circuit board to be processed. Then, the cylinder 23 will be activated. Under the limiting guidance of the sliding frame 24 and the guide edge 25, the laser cutting component 26 will descend and perform laser cutting on the circuit board. If displacement in another direction is required during the process, the second motor 221 can be activated to rotate the second transmission screw 222. At this time, the second screw sleeve 223, which is in cooperation with the screw, will carry the mounting guide frame 224 and the laser cutting component 26 to move in the corresponding direction, thereby expanding the cutting range.

[0024] The pre-cleaning mechanism 3 includes a side mounting frame 31 and a component assembly slide 325. The side mounting frame 31 is fixed to one side of the guide frame 214. A first cleaning component 32 is installed in the middle of the side mounting frame 31. The first cleaning component 32 includes an inner mounting frame 321, which is located on both sides of the middle of the side mounting frame 31. A third motor 322 is installed in the upper part of the interior of one of the inner mounting frames 321. The output end of the third motor 322 is connected to a third transmission screw 323. A third screw sleeve 324 is screwed around one side of the third transmission screw 323. An assembly slide 325 is fixedly mounted on the inner side of 324. A second guide rod 326 is fixedly mounted inside another inner mounting frame 321. A fourth motor 327 is mounted on one side of the assembly slide 325, and the output end of the fourth motor 327 is connected to an anti-static brush roller 328. The assembly slide 325 and the second guide rod 326 are connected by a lifting guide connection. A second cleaning assembly 33 is provided on one side of the assembly slide 325. The second cleaning assembly 33 includes a side mounting frame 331, which is fixedly mounted on one side of the assembly slide 325. An upper frame 332 is fixedly mounted above the side mounting frame 331. Furthermore, a negative pressure main pipe 333 is installed in the middle section of the upper frame 332, and a diversion pipe rack 334 is connected to the end of the negative pressure main pipe 333. Branch pipes 335 are distributed below the diversion pipe rack 334. Dust suction ports 336 are distributed on the inner working surface of the side frame 331. When the pre-cleaning mechanism 3 moves above the initial end of the circuit board with the first displacement component 21, the operator can start the third motor 322 to rotate the third transmission screw 323. At this time, the third screw sleeve 324, which is in cooperation with the screw, will carry the assembly slide 325 down with the help of the second guide rod 326. An antistatic brush roller 328 is installed in the middle. When the working layer of the antistatic brush roller 328 comes into contact with the surface of the circuit board, the fourth motor 327 can be started to rotate it in the direction of the side mounting frame 331, thereby cleaning the impurities. At the same time, the negative pressure air source (which can be a negative pressure fan) connected to the negative pressure main pipe 333 is started. The negative pressure suction will be evenly distributed along the negative pressure main pipe 333 and the diversion pipe frame 334 connected to its end to each branch pipe 335 and the dust suction port 336 connected to the end, thereby sucking out the cleaned impurities through negative pressure, providing a good working environment for subsequent laser cutting.

[0025] It should be noted in this section that dust removal requires the use of dust removal filter media (such as cloth bags or filter cartridges) at the inlet of the fan to prevent dust from entering the fan and causing impeller wear, which would affect its lifespan.

[0026] Working Principle: In use, the circuit board processing device begins by placing the circuit board on the base 1. Then, the first motor 212 is started, causing the first transmission screw 211 to rotate. At this time, the first screw sleeve 213, which works with the screw, carries the guide frame 214, which is guided by the first guide rod 215. During this displacement, the pre-cleaning mechanism 3 mounted on one side of the guide frame 214 pre-cleans the circuit board using its own structure. After cleaning, the laser cutting component 26 mounted at the front end of the guide frame 214 moves to above the area to be processed on the circuit board. Then, the cylinder 23 is activated, and under the limiting guidance of the sliding frame 24 and the guide edge 25, the laser cutting component 26 descends and performs laser cutting on the circuit board. If displacement in another direction is required during the process, the second motor 221 is started, causing the second transmission screw 222 to rotate. At this time, the second screw sleeve 223, which works with the screw, carries the mounting guide frame 224 and the mounted laser cutting component. 26. The corresponding direction displacement is performed to expand the cutting range. When the pre-cleaning mechanism 3 moves above the initial end of the circuit board with the first displacement component 21, the operator can start the third motor 322 to rotate the third transmission screw 323. At this time, the third screw sleeve 324, which cooperates with the screw, will carry the assembly slide 325 down with the help of the second guide rod 326. Since the anti-static brush roller 328 is installed in the middle of the lower part of the assembly slide 325, when the working layer of the anti-static brush roller 328 contacts the surface of the circuit board, the fourth motor 327 can be started to rotate it towards the side mounting frame 331 to achieve impurity cleaning. At the same time, the negative pressure air source (which can be a negative pressure fan) connected to the negative pressure main pipe 333 is started. The negative pressure suction will be evenly distributed to each branch pipe 335 and the dust suction port 336 connected at the end along the negative pressure main pipe 333 and its end-connected diversion pipe frame 334, thereby sucking out the cleaned impurities through negative pressure, providing a good working environment for subsequent laser cutting.

[0027] It should be noted that the cylinders mentioned in this solution are existing technologies on the market. A cylinder is an actuator that works by utilizing the pressure difference of compressed gas. Its core function is to convert gas pressure energy into mechanical energy by driving a piston within the cylinder in a reciprocating linear motion, thus driving external mechanisms (such as clamping or lifting) to complete the action. The workflow consists of two steps: first, compressed gas enters one chamber of the cylinder, pushing the piston and piston rod to extend, thus actuating the load, while gas is simultaneously discharged from the other chamber; after switching the gas intake direction, gas enters the other chamber, pushing the piston back to its original position, and the piston rod retracts, completing one cycle. In practical applications, solenoid valves are used to control the airflow direction, speed control valves to adjust the movement speed, and some systems also incorporate magnetic switches to detect the piston position, ensuring precise and stable operation.

[0028] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

[0029] It should be noted that this application covers any alternatives, modifications, equivalent methods, and solutions made within the spirit and scope of this application. To provide the public with a thorough understanding of this application, specific details are described in detail in the preferred embodiments, while those skilled in the art can fully understand this application without these details. Furthermore, to avoid unnecessary confusion regarding the substance of this application, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0030] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A circuit board processing apparatus, comprising: The base (1) is characterized in that: a displacement mechanism (2) is provided on both sides and above the base (1), the displacement mechanism (2) includes a guide frame (214), and a pre-cleaning mechanism (3) is provided on one side of the guide frame (214), the pre-cleaning mechanism (3) includes a side frame (31) and a component assembly slide (325), the side frame (31) is fixed on one side of the guide frame (214), a first cleaning component (32) is installed in the middle of the side frame (31), and a second cleaning component (33) is provided on one side of the assembly slide (325).

2. The circuit board processing apparatus according to claim 1, characterized in that: The first cleaning component (32) includes an inner frame (321), which is located on both sides of the middle part of the side frame (31). A third motor (322) is installed in the upper part of the inner frame (321), and the output end of the third motor (322) is connected to a third transmission screw (323). A third screw sleeve (324) is screwed around one side of the third transmission screw (323), and an assembly slide (325) is fixed inside the third screw sleeve (324). A second guide rod (326) is fixed inside the other inner frame (321), and a fourth motor (327) is installed on one side of the assembly slide (325). An antistatic brush roller (328) is connected to the output end of the fourth motor (327).

3. The circuit board processing apparatus according to claim 2, characterized in that: The assembly slide (325) and its second guide rod (326) are connected by a lifting guide.

4. The circuit board processing apparatus according to claim 1, characterized in that: The second cleaning component (33) includes a side mounting frame (331), which is fixed to one side of the mounting carriage (325). An upper frame (332) is fixed above the side mounting frame (331), and a negative pressure main pipe (333) is installed in the middle section of the upper frame (332). A diversion pipe rack (334) is connected to the end of the negative pressure main pipe (333), and branch pipes (335) are provided below the diversion pipe rack (334). A dust suction port (336) is provided on the inner working surface of the side mounting frame (331).

5. The circuit board processing apparatus according to claim 1, characterized in that: The displacement mechanism (2) includes a first displacement component (21), which is installed on both sides and above the base (1). The first displacement component (21) includes a guide frame (214), and a second displacement component (22) is installed in the middle of the guide frame (214). The second displacement component (22) includes a mounting guide (224), and a cylinder (23) is fixedly installed at the front end of the mounting guide (224). The extended end of the cylinder (23) is connected to a sliding frame (24). A guide edge (25) for guiding the sliding frame (24) is opened at the front end of the mounting guide (224). A laser cutting component (26) is installed in the middle of the sliding frame (24).

6. The circuit board processing apparatus according to claim 5, characterized in that: The first displacement component (21) includes a first transmission screw (211), and the first transmission screw (211) is installed in the middle of one side of the base (1). A first motor (212) is installed at one end of the first transmission screw (211), and a first screw sleeve (213) is screwed around one side of the first transmission screw (211). A guide frame (214) is fixed around the first screw sleeve (213), and a first guide rod (215) for guiding displacement of the guide frame (214) is fixed in the middle of the other side of the base (1).

7. The circuit board processing apparatus according to claim 5, characterized in that: The second displacement component (22) includes a second motor (221), and the second motor (221) is mounted on one side of the guide frame (214). The output end of the second motor (221) is connected to a second transmission screw (222), and a second screw sleeve (223) is screwed around one side of the second transmission screw (222). A mounting guide (224) is fixed around the second screw sleeve (223). A guide groove (225) is provided above the guide frame (214) for guiding the displacement of the mounting guide (224).

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