Rack assembly and laser processing apparatus

Abstract

The application provides a rack assembly and a laser processing device. The rack assembly comprises a rack, a transmission member, a sliding block, a driving mechanism, a first connecting line, a second connecting line and a circuit board. The rack is provided with a first wire slot and a second wire slot. The transmission member is installed on the rack. The transmission member, the first wire slot and the second wire slot are arranged along the height direction of the rack. The sliding block is slidingly arranged on the transmission member and is used for being connected with a laser module. The driving mechanism is installed on the rack and is connected with the transmission member and can drive the sliding block to move along the transmission member. The first connecting line is arranged in the first wire slot and is used for being connected with the laser module. The second connecting line is arranged in the second wire slot and is used for being connected with the driving mechanism. The circuit board is connected with the first connecting line and the second connecting line. The second wire slot and the first wire slot are arranged on both sides of the transmission member. The application can realize orderly wiring of cables.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a frame assembly and laser processing equipment. Background Technology

[0002] In the field of laser processing equipment, the back panel design typically provides ample internal space. While this satisfies the basic cabling requirements from the laser module to the back panel, the lack of constraint and organization results in a messy cabling situation. This messy cabling not only hinders equipment maintenance and repair but can also affect the stability and reliability of equipment operation due to mutual interference between cables. Utility Model Content

[0003] This application embodiment provides a rack assembly, the rack assembly comprising: The frame is provided with a first cable tray and a second cable tray; A transmission component is mounted on the frame, and the transmission component, the first wire groove, and the second wire groove extend along the height direction of the frame. A slider is slidably disposed on the transmission component, and the slider is used to connect with the laser module; A drive mechanism is mounted on the frame and connected to the transmission component, and is capable of driving the slider to move along the transmission component; A first connecting line is disposed within the first groove and is used to connect the laser module; The second connecting line is disposed in the second groove and is used to connect to the drive mechanism; The circuit board is connected to the first connecting line and the second connecting line; The second groove and the first groove are disposed on both sides of the transmission component.

[0004] Optionally, the frame includes a support plate and a rear shell arranged opposite to each other, the drive mechanism is disposed on the support plate, the first groove and the second groove are disposed between the support plate and the rear shell, the rear shell and the support plate enclose a mounting cavity, and the transmission component and the slider are disposed in the mounting cavity.

[0005] Optionally, the support plate includes a body, a first side plate, and a second side plate, the first side plate and the second side plate being connected to the same side of the body and disposed opposite to each other; the two ends of the slider are slidably connected to the first side plate and the second side plate respectively; and / or, the body, the first side plate, and the rear shell enclose a first mounting sub-cavity, the body, the second side plate, and the rear shell enclose a second mounting sub-cavity, and the first side plate, the second side plate, the body, and the rear shell enclose a third mounting sub-cavity, the mounting cavity including the first mounting sub-cavity, the second mounting sub-cavity, and the third mounting sub-cavity.

[0006] Optionally, the frame further includes a first wire rack, which is mounted on the support plate; the first wire rack includes a first baffle and two first baffles, the two first baffles extending along the slider direction of the slider, both first baffles being connected to and opposite to the first baffle, and the two first baffles and the first baffle forming the first wire groove.

[0007] Optionally, the first baffle is disposed opposite to the rear shell; and / or, the length of the first baffle is less than the length of the two first baffle edges, so that the first wire frame forms a first open opening communicating with the first wire groove, and the first open opening is located above the first baffle along the slider direction of the slider; and / or, the support plate is provided with one of the first slot and the first buckle, and the first wire frame is provided with the other of the first slot and the first buckle.

[0008] Optionally, the frame includes a second wire rack, the second wire rack is mounted on the support plate, the second wire rack includes two second baffles and a second baffle, the two second baffles extend along the sliding direction of the slider, the two second baffles are connected to the second baffle and are arranged opposite to each other to form the second wire groove.

[0009] Optionally, the second baffle is disposed opposite to the rear shell; and / or, the length of one of the second baffle edges is less than the length of the other second baffle edge, so that the second wire rack forms a second open opening communicating with the second wire groove, the second open opening being close to the top of the frame; and / or, the support plate is provided with one of the second slot and the second buckle, and the second wire rack is provided with the other of the second slot and the second buckle.

[0010] Optionally, the frame assembly further includes a base plate for supporting the workpiece, the base plate being connected to the bottom end of the frame, the circuit board being disposed near the base plate and located on the side of the drive mechanism facing the base plate; and / or, the circuit board including a substrate and multiple components, the substrate being a single-layer board, the multiple components being mounted on the substrate, and the multiple components including at least multiple interfaces; and / or, the frame assembly further includes a keypad and a third connecting line, the keypad being mounted on the frame and located on the side of the first wire groove opposite to the second wire groove, and the third connecting line connecting the keypad and the circuit board.

[0011] Optionally, the rack assembly further includes a fan mounted on the rack and closer to the bottom of the rack. The circuit board has a clearance opening on the side facing the drive mechanism, and the fan is disposed within the clearance opening. The circuit board includes a first sub-board and a second sub-board located on both sides of the fan. The first sub-board is connected to the first connecting line, and the second sub-board is connected to the second connecting line. And / or, the rack includes a mounting bracket, and one end of the transmission member is connected to the mounting bracket.

[0012] This application also provides a laser processing device, including: The rack assembly described in any of the above embodiments; A bracket is connected to the rack assembly and is spaced apart from the base plate of the rack assembly; A laser module is connected to the bracket and is opposite to the base plate. The laser module is used to emit laser light to process the workpiece on the base plate. The laser module includes a laser and a galvanometer assembly. The laser is used to emit a laser beam, and the galvanometer assembly is used to deflect the laser beam.

[0013] The rack assembly of this application embodiment includes a first cable tray and a second cable tray, respectively used to hold the first and second connecting cables. For example, the first cable tray can be used to store the FPC cable and power cable of the laser module, while the second cable tray can be used to store the cable of the drive mechanism. A transmission component is mounted on the rack, with its axis extending along the height direction of the rack. A slider is disposed on the transmission component and connected to the laser module. When the drive mechanism operates, it drives the transmission component to rotate, thereby causing the slider to move the laser module up and down along the axis of the transmission component. This ensures precise control of the laser module in the height direction, providing a reliable guarantee for achieving high-precision laser processing. Moreover, by placing the second cable tray and the first cable tray on opposite sides of the transmission component, this application embodiment achieves orderly cable routing, effectively solving the problem of the first and second connecting cables tangling together, and improving the efficiency and reliability of cable management. This layout fully utilizes the space of the rack in the Z-axis direction, making the structure of the entire rack assembly more compact and reasonable. Meanwhile, the design of the first and second cable trays provides additional protection for the cables, effectively reducing the risk of damage caused by factors such as friction or pulling, thereby extending the service life of the cables. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0016] Figure 1 This is a schematic diagram of the structure of the laser processing equipment provided in the embodiments of this application.

[0017] Figure 2 This is a schematic diagram of the structure for removing the cover in a laser processing device provided in an embodiment of this application.

[0018] Figure 3 An exploded view of the laser processing equipment provided in this application embodiment after the cover has been removed.

[0019] Figure 4 This is a schematic diagram of the structure of the laser processing equipment provided in the embodiments of this application, showing the removal of the cover, back shell, and support plate.

[0020] Figure 5 This is a cross-sectional view along the XX direction of the structure of the laser processing equipment provided in the embodiments of this application, after removing the cover, back shell and support plate.

[0021] Figure 6 This is a schematic diagram of the structure of the support plate of the laser processing equipment provided in the embodiments of this application.

[0022] Figure 7 This is a schematic diagram of the structure of the first wire rack of the laser processing equipment provided in the embodiments of this application.

[0023] Figure 8 This is a schematic diagram of the structure of the second wire rack of the laser processing equipment provided in an embodiment of this application.

[0024] Figure 9 An exploded view of a portion of the structure of the laser processing equipment provided in an embodiment of this application.

[0025] Figure 10 This is an exploded view of the laser module provided in an embodiment of this application. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this application or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0027] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0028] Please refer to Figures 1 to 5 The rack assembly 10 provided in this application embodiment can be applied to, for example... Figure 1 The laser processing equipment 1 shown includes a protective cover 40. During laser processing, the protective cover 40 can block some potential hazards and prevent users from being injured when approaching the processing area. The protective cover 40 can prevent the processing laser from passing through.

[0029] like Figures 2 to 5As shown, in some embodiments, the rack assembly 10 may include a rack 100, a transmission member 200, a slider 300, a drive mechanism 400, a first connecting line 500, a second connecting line 600, and a circuit board 700. The rack 100 is provided with a first wire groove 110 and a second wire groove 120. The transmission member 200 is mounted on the rack 100, and the transmission member 200, the first wire groove 110, and the second wire groove 120 extend along the height direction of the rack 100. The slider 300 is slidably disposed on the transmission member 200, and the slider 300 is used to interact with the drive mechanism 400. The optical module 20 is connected; the drive mechanism 400 is mounted on the frame 100 and connected to the transmission component 200, and can drive the slider 300 to move along the transmission component 200; the first connecting line 500 is disposed in the first groove 110 and is used to connect the laser module 20; the second connecting line 600 is disposed in the second groove 120 and is used to connect to the drive mechanism 400; the circuit board 700 is connected to the first connecting line 500 and the second connecting line 600; wherein, the second groove 120 and the first groove 110 are disposed on both sides of the transmission component 200.

[0030] The frame 100 is provided with a first cable tray 110 and a second cable tray 120 extending along the height direction (Z-axis) of the frame 100, which are used to place the first connecting cable 500 and the second connecting cable 600, respectively. For example, the first cable tray 110 can be used to store the flexible printed circuit board (FPC) and power cables of the laser module 20, while the second cable tray 120 is used to store the cables of the drive mechanism 400, thereby realizing separate management of different cables. Among them, after the first connecting cable 500 is led out from the laser module 20, it first passes through the opening in the slider 300, allowing the first connecting cable to pass through the slider 300 from the side where the laser module 20 is located and enter the wiring space of the frame 100. Subsequently, the first connecting cable 500 is stored in the first cable tray 110 and extends along it, finally connecting to the circuit board 700 located at the bottom of the mechanism. Similarly, after the second connecting line 600 is led out from the drive mechanism 400, it is housed in the second wire groove 120 and extends along it, eventually connecting to the circuit board 700 located at the bottom of the rack 100.

[0031] The transmission component 200 is mounted on the frame 100, with its axis extending along the height direction of the frame 100. The slider 300 is disposed on the transmission component 200 and connected to the laser module 20. When the drive mechanism 400 operates, it drives the transmission component 200 to rotate, thereby causing the slider 300 to move the laser module 20 up and down along the axis of the transmission component 200. This ensures precise control of the laser module 20 in the height direction, providing a reliable guarantee for achieving high-precision laser processing. For example, the transmission component 200 can be a lead screw, and the slider 300 can include a nut that matches the lead screw, sleeved on the lead screw, and forming a threaded engagement with the lead screw. The drive mechanism 400 provides sufficient and stable power for the rotation of the transmission component 200, ensuring the stability and processing accuracy of the laser module 20 during operation.

[0032] This embodiment of the application effectively solves the problem of the first connecting wire 500 and the second connecting wire 600 becoming entangled by respectively setting the second cable tray 120 and the first cable tray 110 on both sides of the transmission component 200, thus achieving orderly cable routing and improving the efficiency and reliability of cable management. This layout makes full use of the back space of the rack 100 in the Z-axis direction, making the structure of the entire rack assembly 10 more compact and reasonable. At the same time, the design of the first cable tray 110 and the second cable tray 120 also provides additional protection for the cables, effectively reducing the risk of damage caused by friction or pulling, thereby extending the service life of the cables.

[0033] In some embodiments, the frame 100 includes a support plate 130 and a rear shell 140 disposed opposite to each other, a drive mechanism 400 is disposed on the support plate 130, a first groove 110 and a second groove 120 are disposed between the support plate 130 and the rear shell 140, the rear shell 140 and the support plate 130 enclose to form a mounting cavity, and a transmission member 200 and a slider 300 are disposed in the mounting cavity.

[0034] In this embodiment, the rear shell 140 and the support plate 130 together form an installation cavity, which constitutes a three-dimensional motion channel for accommodating the transmission component 200 and the slider 300. The first groove 110 and the second groove 120 are formed in the space between the support plate 130 and the rear shell 140, which not only improves the overall aesthetics of the equipment, but also enhances safety and provides a strong guarantee for the stable operation of the equipment.

[0035] Please refer to the reference. Figure 6 In some embodiments, the support plate 130 includes a body 131, a first side plate 132 and a second side plate 133, the first side plate 132 and the second side plate 133 are connected to the same side of the body 131 and are disposed opposite to each other; the two ends of the slider 300 are slidably connected to the first side plate 132 and the second side plate 133 respectively.

[0036] In some embodiments, the slider 300 is slidably connected to the first side plate 132 and the second side plate 133, which are disposed opposite to each other, so that the slider 300 maintains stable sliding with bidirectional constraints in the height direction. For example, the first side plate 132 and the second side plate 133 are provided with grooves, and the two ends of the slider 300 are respectively provided with guide protrusions. The guide protrusions are embedded in the grooves opened on the inner side of the first side plate 132 and the second side plate 133 so that the slider 300 can move smoothly along the trajectory defined by the grooves, effectively preventing the slider 300 from overturning, swaying or radially deviating during the movement, thereby ensuring that the laser module 20 moves accurately and stably in the height direction.

[0037] In some embodiments, the body 131, the first side plate 132, and the rear shell 140 enclose a first mounting sub-cavity, the body 131, the second side plate 133, and the rear shell 140 enclose a second mounting sub-cavity, and the first side plate 132, the second side plate 133, the body 131, and the rear shell 140 enclose a third mounting sub-cavity. The mounting cavity includes the first mounting sub-cavity, the second mounting sub-cavity, and the third mounting sub-cavity.

[0038] In this embodiment, the first mounting sub-cavity, the second mounting sub-cavity, and the third mounting sub-cavity are arranged side-by-side in space. The third mounting sub-cavity houses the first wire rack 150, the second wire rack 160, the transmission component 200, and the slider 300, and is physically isolated from other structures or components by the first side plate 132 and the second side plate 133, thereby forming an independent motion and wiring functional area inside the third mounting sub-cavity. For example, the first wire rack 150 can be connected to the first side plate 132, and the second wire rack 160 can be connected to the second side plate 133 to enhance the stability of the first wire rack 150 and the second wire rack 160.

[0039] In some embodiments, the support plate 130 has a vertically extending clearance groove 134 on its body 131. The clearance groove 134 provides a movement channel for the slider 300 and the laser module 20 connected to it, ensuring that it does not interfere with the support plate 130 during its entire vertical movement.

[0040] Please refer to the reference. Figure 7 In some embodiments, the frame 100 further includes a first wire rack 150, which is mounted on the support plate 130. The first wire rack 150 includes a first baffle 111 and two first baffles 112. The two first baffles 112 extend along the slider 300 direction of the slider 300. Both first baffles 112 are connected to and opposite to the first baffle 111. The two first baffles 112 and the first baffle 111 enclose and form a first wire groove 110.

[0041] In this embodiment, the first wire rack 150 forms a longitudinal constraint channel through two first guard edges 112 extending along the Z-axis and arranged opposite each other. This channel can confine the first connecting wire 500, such as an FPC wire and a power wire, within the space formed by the two guard edges, effectively preventing the first connecting wire 500 from shifting left or right on the rack 100. Moreover, the two first guard edges 112 and the first baffle 111 form an enclosure to form a first wire groove 110. The first baffle 111 forms a physical barrier, preventing the first connecting wire 500 from coming out of the first wire groove 110.

[0042] The design of the first cable tray 150 not only avoids potential entanglement, crossing, and interference with surrounding components between the first connecting cable 500 and other cables, ensuring neat cable arrangement and stable routing, but also provides effective mechanical protection for the first connecting cable 500, resisting potential damage such as external compression or impact, thereby helping to extend the cable's service life. Furthermore, the first connecting cable 500 is neatly arranged within the first cable tray 110 according to design requirements, facilitating quick and accurate connection and disassembly of the first connecting cable 500 during assembly, debugging, and maintenance, reducing operational difficulty and maintenance costs.

[0043] In some embodiments, the first baffle 111 is disposed opposite to the rear housing 140, forming a channel space between them for accommodating and constraining the first connecting line 500. Specifically, the two first baffles 112 restrict the lateral displacement of the cable, the first baffle 111 prevents the cable from moving forward, and the rear housing 140 prevents the cable from coming off backward. This multi-directional constraint achieves omnidirectional fixation of the cable, thereby ensuring the stability and reliability of the first connecting line 500.

[0044] In some embodiments, the length of the first baffle 111 is less than the length of the two first baffles 112, so that the first wire rack 150 forms a first opening 151 that connects to the first wire groove 110. Along the slider 300 direction of the slider 300, the first opening 151 is located above the first baffle 111.

[0045] In this embodiment, the length of the first baffle 111 is less than the length of the two first baffle edges 112. This length difference causes the first wire frame 150 to form a first open opening 151 in the region above the first baffle 111 along the movement direction (Z-axis) of the slider 300, connecting to the first wire groove 110. The first open opening 151 provides the necessary clearance space for the bending and movement of the cable when the slider 300 moves downward, ensuring that the cable is not excessively squeezed or worn during dynamic processes. Therefore, this embodiment not only considers the installation and fixation of the first connecting line 500, but also fully considers the dynamic requirements of the laser module 20 during operation.

[0046] In some embodiments, the support plate 130 is provided with one of the first slot and the first buckle, and the second wire rack 160 is provided with the other of the first slot and the first buckle. Through the cooperation of the first slot and the first buckle, the second wire rack 160 and the support plate 130 can be quickly positioned and reliably connected, simplifying the assembly process and ensuring the stability of the structure.

[0047] In some embodiments, the frame 100 includes a second wire rack 160, which is disposed on the support plate 130. The second wire rack 160 includes two second baffles 122 and a second baffle 121. The two second baffles 122 extend along the sliding direction of the slider 300 and are connected to the second baffle 121 and are arranged opposite to each other to form a second wire groove 120.

[0048] Please refer to the reference. Figure 8 In some embodiments, the frame 100 includes a second wire rack 160, which is disposed on the support plate 130. The second wire rack 160 includes two second baffles 122 and a second baffle 121. The two second baffles 122 extend along the sliding direction of the slider 300 and are connected to the second baffle 121 and are arranged opposite to each other to form a second wire groove 120.

[0049] In this embodiment, the second wire rack 160 forms a longitudinal constraint channel through two second baffles 122 extending along the Z-axis and arranged opposite each other, which can restrict the second connecting wire 600 within the space formed by the two second baffles 122, effectively preventing the second connecting wire 600 from shifting left and right on the rack 100. Moreover, the two second baffles 122 and the second baffle 121 enclose and form a second wire groove 120, and the second baffle 121 forms a physical barrier, preventing the second connecting wire 600 from coming out of the second wire groove 120.

[0050] The design of the second cable tray 160 not only avoids potential entanglement, crossing, and interference with surrounding components between the second connecting cable 600 and other cables, ensuring neat cable arrangement and stable routing, but also provides effective mechanical protection for the second connecting cable 600, resisting potential damage such as external compression or impact, thereby helping to extend the cable's service life. Furthermore, the second connecting cable 600 is neatly arranged within the second cable tray 120 according to design requirements, facilitating quick and accurate connection and disassembly of the second connecting cable 600 during assembly, debugging, and maintenance, reducing operational difficulty and maintenance costs.

[0051] In some embodiments, the second baffle 121 is disposed opposite to the rear housing 140, and a channel space is formed between them for accommodating and constraining the second connecting line 600.

[0052] In some embodiments, the length of one second guard 122 is less than the length of the other second guard 122, so that the second wire rack 160 forms a second opening 161 communicating with the second wire groove 120, the second opening 161 being close to the top of the rack 100.

[0053] In this embodiment, the two second guard edges 122 have different lengths. For example, the second guard edge 122 closer to the transmission member 200 is shorter, while the second guard edge 122 farther from the transmission member 200 is designed to be longer. The different lengths of the second guard edges 122 allow the second wire frame 160 to form a second open opening 161 communicating with the second wire groove 120 near the top of the frame 100. It can be understood that the laser module 20 in this embodiment mainly moves up and down in the relatively upper half. Therefore, the second open opening 161, being close to the top of the frame 100, provides the necessary clearance space for the bending and movement of the second connecting line 600 when the slider 300 moves downward. When the slider 300 moves downward along the transmission member 200, it provides the necessary bending space for the second connecting line 600 to move downward synchronously with the slider 300, ensuring that the dynamic movement of the second connecting line 600 is not obstructed. In addition, the longer second guard edge 122 can effectively prevent the second connecting line 600 from coming off outward, ensuring the stability of the second connecting line 600 throughout the entire use process. Therefore, in this embodiment, the structure of the second wire frame 160, while ensuring the constraint force of the second connecting wire 600, provides reasonable clearance space for the dynamic movement of the second connecting wire 600, effectively solving the problems of interference between the second connecting wire 600 and the slider 300 and the second connecting wire 600 coming off, thus improving the stability and reliability of the equipment operation.

[0054] In some embodiments, the support plate 130 is provided with one of the second slot and the second buckle, and the second wire frame 160 is provided with the other of the second slot and the second buckle. Through the cooperation of the second slot and the second buckle, quick positioning and reliable connection between the second wire frame 160 and the support plate 130 can be achieved, simplifying the assembly process and ensuring the stability of the structure.

[0055] In some embodiments, the frame assembly 10 further includes a base plate 170 for supporting workpieces. The base plate 170 is connected to the bottom end of the frame 100. The circuit board 700 is disposed near the base plate 170 and located on the side of the drive mechanism 400 facing the base plate 170. The layout design of the circuit board 700 makes full use of the space at the bottom of the frame 100, so that the first connecting line 500 and the second connecting line 600 pass through the first wire groove 110 and the second wire groove 120 respectively, converge downwards, and connect to the circuit board 700. Distributing the circuit board 700 close to the base plate 170 also avoids interference with the transmission component 200 and the slider 300, further optimizing the compactness of the frame assembly 10. This position also facilitates operation of the circuit board 700 and its interfaces during assembly and maintenance.

[0056] In some embodiments, the circuit board 700 includes a substrate and a plurality of components. The substrate is a single-layer board, and the plurality of components are mounted on the substrate. The plurality of components include at least a variety of interfaces.

[0057] In this embodiment, the substrate completes all electrical connections through single-sided wiring. The first connecting line 500 is led out from the laser module 20, passes through the opening of the slider 300, and descends along the first wire groove 110 to the interface of the circuit board 700. The second connecting line 600 is led out from the drive mechanism 400 and also descends along the second wire groove 120 to the interface of the circuit board 700. The first connecting line 500 and the second connecting line 600 are connected on the same plane of the circuit board 700, eliminating the need for multi-layer transitions, saving the interlayer alignment and soldering steps of traditional multi-layer boards, reducing the complexity of manual operation, and reducing costs. Multiple components include at least multiple interfaces, such as connectors for connecting the laser module 20 wiring harness, terminals for connecting motor wires, and interfaces for communication with other external modules. The interface layout on a single circuit board 700 also facilitates the neat management of cables, avoiding the wiring harness crossover problem common when multiple circuit boards 700 are distributed, enhancing reliability and maintenance convenience.

[0058] Please refer to the reference. Figure 9 In some implementations, the rack assembly 10 also includes a keypad 800 and a third connecting cable 810. The keypad 800 is mounted on the rack 100 and located on the side of the first cable tray 110 opposite to the second cable tray 120. The third connecting cable 810 connects the keypad 800 and the circuit board 700. By placing the keypad 800 outside the first cable tray 110 and maintaining a certain distance from it, user operation is facilitated, and mutual interference between the keypad 800 and the wiring harness inside the first cable tray 110 is avoided. The keypad 800 can integrate components such as a power switch, emergency stop button, and mode selection key. The third connecting cable 810 transmits the control signals from the keypad 800 to the circuit board 700, realizing signal transmission. The layout of the keypad 800 not only optimizes the overall space utilization but also improves the convenience of operation and the neatness of internal wiring.

[0059] In some embodiments, the rack assembly 10 further includes a fan 900, which is mounted on the rack 100 and closer to the bottom of the rack 100. The circuit board 700 has a clearance opening on the side facing the drive mechanism 400, and the fan 900 is disposed in the clearance opening. The circuit board 700 includes a first sub-board 710 and a second sub-board 720 located on both sides of the fan. The first sub-board 710 is connected to a first connecting line 500, and the second sub-board 720 is connected to a second connecting line 600.

[0060] In this embodiment, the circuit board 700 has a clearance opening on the side facing the drive mechanism 400, and the fan 900 is cleverly positioned within this clearance opening, saving space and providing efficient smoke dissipation for the support unit 30. The circuit board 700 includes a first sub-board 710 and a second sub-board 720 located on either side of the fan 900. The first sub-board 710 is connected to a first connecting line 500, responsible for signal transmission and power supply between the laser module 20 and the circuit board 700; the second sub-board 720 is connected to a second connecting line 600, responsible for signal transmission and power supply between the drive mechanism 400 and the circuit board 700. The mounting position of the fan 900 and the layout of the circuit board 700 work together to form a compact and efficient heat dissipation and smoke dissipation system, ensuring that the equipment maintains good heat dissipation and smoke dissipation during long-term operation.

[0061] In some embodiments, the frame 100 includes a mounting bracket 180, and one end of the transmission member 200 is connected to the mounting bracket 180.

[0062] Mounting bracket 180 serves as a support structure for transmission component 200, providing a stable and reliable mounting reference for it. By mounting one end of transmission component 200 to mounting bracket 180, its coaxiality and rotational stability are ensured, thereby guaranteeing smooth up-and-down movement of slider 300 and laser module 20 along a preset trajectory, reducing vibration and noise, and improving transmission accuracy. For example, mounting bracket 180 may also be part of support plate 130.

[0063] Please see Figure 1 and Figure 2 This application also provides a laser processing device 1, including a frame assembly 10, a support 30, and a laser module 20 as described in any of the above embodiments. The support 30 is connected to the frame assembly 10 and is spaced apart from the base plate 170 of the frame assembly 10. The laser module 20 is connected to the support 30 and is opposite to the base plate 170. The laser module 20 is used to emit laser light to process the workpiece on the base plate 170. The laser module 20 includes a laser 21 and a galvanometer assembly 22. The laser 21 is used to emit a laser beam, and the galvanometer assembly 22 is used to deflect the laser beam so that the light spot projected on the workpiece can move along the X direction and / or the Y direction.

[0064] The bracket 30 is fixedly connected to the frame assembly 10 and is positioned at a certain distance from the base plate 170 of the frame assembly 10. The laser module 20 is mounted on the bracket 30, with its light output port facing the workpiece processing area on the base plate 170. The laser module 20 is used to generate and emit a laser beam to precisely process the workpiece placed on the base plate 170.

[0065] Please see Figure 1 , Figure 2 and Figure 10 There may be one or more lasers 21. In some embodiments, there may be multiple lasers 21 with different wavelengths, and the multiple lasers 21 may be combined by optical devices and reach the galvanometer assembly 22.

[0066] In some embodiments, the galvanometer assembly 22 may include an X-axis galvanometer and a Y-axis galvanometer, which cooperate to move the light spot projected onto the base plate assembly 10 along the X and Y directions.

[0067] In some embodiments, the laser module 20 further includes a housing 23, within which the laser 21 and the galvanometer assembly 22 can be installed. The housing 23 can be connected to the slider 300. The housing 23 may include a main housing 231 and a base 232. The base 232 is installed at the bottom of the main housing 231, and the main housing 231 and the base 232 can enclose an installation space. The main housing 231 or the base 232 is connected to the slider 300. The laser 21 and the galvanometer assembly 22 are housed within the installation space. The galvanometer assembly 22 can be installed on the base 232. In other embodiments, the housing 23 is not limited to the structure of the main housing 232 and the base 232. It can also be a structure combining the main housing with a top cover, or a structure combining the main housing with a side cover, etc., which are not listed here and are not specifically limited.

[0068] In some embodiments, the laser module 20 further includes a heat sink 24, which can be installed inside the housing 23. The laser 21 can be installed on the heat sink 24. The heat sink 24 can be used to dissipate heat from the laser 21 so that the laser 21 can operate relatively stably.

[0069] In some embodiments, the laser module 20 further includes optical devices such as reflectors that change the optical path and / or beam combiners that merge the optical path. Along the optical path of the laser 21, these optical devices are disposed between the laser 21 and the galvanometer assembly 22. In some embodiments, the laser module 20 further includes a mounting base 25, on which reflectors, beam combiners, etc., may be disposed. The mounting base 25 may be mounted on the housing 23 or the heat sink 24.

[0070] In some embodiments, such as Figure 5As shown, the laser module 20 may also include a motherboard assembly 26, which is connected to the laser 21. The motherboard assembly 26 may include a motherboard and electronic components and corresponding drive circuits, control circuits, etc., mounted on the motherboard. The motherboard assembly 26 may be mounted on the housing 23 or the heat sink 24.

[0071] The laser processing equipment 1, by integrating the aforementioned frame assembly 10, fully utilizes its stable motion structure and efficient cable management capabilities. The bracket 30 provides a stable mounting base for the laser module 20. The laser beam emitted by the laser module 20 can precisely act on the workpiece surface. Combined with the movement of the laser module 20 driven by the frame assembly 10, efficient and high-precision laser processing of the workpiece is achieved. The laser processing equipment 1 has a compact overall structure, reliable operation, and is suitable for various laser processing applications such as engraving and cutting. The laser processing equipment 1 includes, but is not limited to, laser engraving machines, laser cutting machines, laser welding machines, and other equipment that uses lasers to process materials.

[0072] In the above embodiments, the descriptions of each embodiment have their own emphasis. Parts not described in detail in a particular embodiment can be referred to in the relevant descriptions of other embodiments. The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0073] The rack assembly 10 and laser processing equipment 1 provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A rack assembly, characterized in that, The rack assembly includes: The frame is provided with a first cable tray and a second cable tray; A transmission component is mounted on the frame, and the transmission component, the first wire groove, and the second wire groove extend along the height direction of the frame. A slider is slidably disposed on the transmission component, and the slider is used to connect with the laser module; A drive mechanism is mounted on the frame and connected to the transmission component, and is capable of driving the slider to move along the transmission component; A first connecting line is disposed within the first groove and is used to connect the laser module; The second connecting line is disposed in the second groove and is used to connect to the drive mechanism; The circuit board is connected to the first connecting line and the second connecting line; The second groove and the first groove are disposed on both sides of the transmission component.

2. The rack assembly according to claim 1, characterized in that, The frame includes a support plate and a rear shell arranged opposite to each other. The drive mechanism is disposed on the support plate. The first groove and the second groove are disposed between the support plate and the rear shell. The rear shell and the support plate enclose a mounting cavity. The transmission component and the slider are disposed in the mounting cavity.

3. The rack assembly according to claim 2, characterized in that, The support plate includes a body, a first side plate and a second side plate, wherein the first side plate and the second side plate are connected to the same side of the body and are arranged opposite to each other; The two ends of the slider are slidably connected to the first side plate and the second side plate, respectively; and / or, The main body, the first side plate, and the rear shell enclose a first mounting sub-cavity; the main body, the second side plate, and the rear shell enclose a second mounting sub-cavity; and the first side plate, the second side plate, the main body, and the rear shell enclose a third mounting sub-cavity. The mounting cavity includes the first mounting sub-cavity, the second mounting sub-cavity, and the third mounting sub-cavity.

4. The rack assembly according to claim 2, characterized in that, The frame also includes a first wire rack, which is mounted on the support plate; The first wire frame includes a first baffle and two first baffles. The two first baffles extend along the slider direction of the slider. Both first baffles are connected to the first baffle and are arranged opposite to each other. The two first baffles and the first baffle together form the first wire groove.

5. The rack assembly according to claim 4, characterized in that, The first baffle is disposed opposite to the rear shell; and / or, The length of the first baffle is less than the length of the two first baffle edges, so that the first wire rack forms a first open opening communicating with the first wire groove, and along the slider direction of the slider, the first open opening is located above the first baffle; and / or, The support plate is provided with one of the first slot and the first buckle, and the first wire frame is provided with the other of the first slot and the first buckle.

6. The rack assembly according to claim 2, characterized in that, The frame includes a second wire rack, which is mounted on the support plate. The second wire rack includes two second baffles and a second baffle. The two second baffles extend along the sliding direction of the slider and are connected to the second baffle and arranged opposite to each other to form the second wire groove.

7. The rack assembly according to claim 6, characterized in that, The second baffle is disposed opposite to the rear shell; and / or, One of the second guard edges is shorter than the other, so that the second wire rack forms a second opening communicating with the second wire channel, the second opening being near the top of the rack; and / or, The support plate is provided with one of the second slot and the second buckle, and the second wire frame is provided with the other of the second slot and the second buckle.

8. The rack assembly according to claim 1, characterized in that, The frame assembly also includes a base plate for supporting the workpiece. The base plate is connected to the bottom end of the frame. The circuit board is disposed close to the base plate and is located on the side of the drive mechanism facing the base plate. And / or, The circuit board includes a substrate and multiple components. The substrate is a single-layer board, and the multiple components are mounted on the substrate. Each of the multiple components includes at least several interfaces; and / or... The rack assembly also includes a keypad and a third connecting line. The keypad is mounted on the rack and is located on the side of the first cable tray away from the second cable tray. The third connecting line connects the keypad and the circuit board.

9. The rack assembly according to claim 1, characterized in that, The rack assembly also includes a fan, which is mounted on the rack and closer to the bottom of the rack. The circuit board has a clearance opening on the side facing the drive mechanism, and the fan is disposed in the clearance opening. The circuit board includes a first sub-board and a second sub-board located on both sides of the fan. The first sub-board is connected to the first connecting line, and the second sub-board is connected to the second connecting line. And / or, The frame includes a mounting bracket, and one end of the transmission component is connected to the mounting bracket.

10. A laser processing device, characterized in that, include: The rack assembly as described in any one of claims 1 to 9; A bracket is connected to the rack assembly and is spaced apart from the base plate of the rack assembly; A laser module is connected to the bracket and is opposite to the base plate. The laser module is used to emit laser light to process the workpiece on the base plate. The laser module includes a laser and a galvanometer assembly. The laser is used to emit a laser beam, and the galvanometer assembly is used to deflect the laser beam.

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