Fin assembly gripper device
Patent Information
- Application Number
- CN202522590716.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-05
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-12-05
AI Technical Summary
由于散热片弹簧弹力较大,人工压装时劳动强度大、操作危险性高,容易夹伤手指或导致散热片弹跳移位,产品品质难以稳定控制
本实用新型提供了一种散热片组装夹爪装置,通过设置浮动夹爪机构与推板机构配合将散热片自动组装至主板上,同时设有组装到位检测器检测散热片是否组装到位,保证产品品质可控,提高生产效率,节省人工成本。
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Figure CN224914035U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of automation equipment technology, and in particular to a heat sink assembly gripper device. Background Technology
[0002] In electronic product motherboards, especially computer motherboards, heatsinks with spring-loaded clamping structures are typically installed in designated locations on the motherboard to ensure the chips operate stably under high power consumption conditions. Currently, heatsink assembly on most production lines still relies on manual labor: operators rely on experience to align the heatsink with the mounting area on the motherboard and press it into place. Because the heatsink springs have significant elasticity, manual pressing is labor-intensive and dangerous, easily causing finger injuries or heatsink displacement, making it difficult to maintain consistent product quality. Utility Model Content
[0003] The purpose of this utility model is to provide a heat sink assembly gripper device, which automatically assembles the heat sink onto the motherboard by setting a floating gripper mechanism and a push plate mechanism. At the same time, an assembly position detector is set to detect whether the heat sink is assembled in place, so as to ensure controllable product quality.
[0004] To achieve the above objectives, the following technical solution is adopted: A heat sink assembly gripper device includes a floating gripper mechanism, a pusher mechanism on each of the two opposite outer sides of the floating gripper mechanism, an assembly positioning detector on one side above the floating gripper mechanism, an assembly lifting drive for driving the floating gripper mechanism and the pusher mechanism to assemble the heat sink, and an assembly drive mechanism for driving the floating gripper mechanism to transfer the heat sink; the floating gripper mechanism is used to grip the heat sink, and the pusher mechanism is used to compress the heat sink spring; the assembly positioning detector is used to detect whether the heat sink is assembled in place.
[0005] Preferably, the drive end of the assembly lifting drive component is provided with a connecting frame; the floating gripper mechanism is located at the bottom middle of the connecting frame, and a push plate mechanism is connected to the bottom of each end of the connecting frame.
[0006] Preferably, the floating gripper mechanism includes two opposing assembled gripper modules and an opening / closing drive for driving the two assembled gripper modules to move closer or further apart.
[0007] Preferably, the assembled gripper module includes a clamping plate, a connecting base plate that is driven to be connected to the opening and closing drive component, and a first sliding component disposed between the connecting base plate and the clamping plate; the first sliding component is disposed in a vertical direction.
[0008] Preferably, the pusher mechanism includes a pusher plate and a pusher plate drive for driving the pusher plate to move in a horizontal direction.
[0009] Preferably, the assembly drive mechanism includes a Y-axis drive module, an X-axis drive module connected to the Y-axis drive module, and a Z-axis drive module connected to the X-axis drive module; the assembly lifting drive component is mounted on the Z-axis drive module.
[0010] Preferably, the assembled detector is a height sensor.
[0011] By adopting the above solution, the beneficial effects of this utility model are: This utility model provides a heat sink assembly gripper device, which automatically assembles the heat sink onto the motherboard by setting a floating gripper mechanism and a push plate mechanism. At the same time, an assembly position detector is set to detect whether the heat sink is assembled in place, ensuring controllable product quality, improving production efficiency, and saving labor costs. Attached Figure Description
[0012] Figure 1 This is a perspective view of the present utility model; Figure 2 This is a perspective view of the present invention omitting the assembly drive mechanism; Figure 3 This is a perspective view of the floating gripper mechanism of this utility model; Figure 4 This is a perspective view of the push plate mechanism and connecting frame of this utility model; Figure 5 A 3D view of the heat sink and retaining ring; The following are explanations of the labels in the attached diagram: 1—Floating gripper mechanism, 2—Push plate mechanism 3—Assemble the detector in place; 4—Assemble the lifting drive component. 5—Assemble the drive mechanism; 6—Connecting frame. 7—Heat sink, 8—Heat sink spring 9—Snap ring, 11—Opening and closing drive component, 12—Clamping plate, 13—Connecting base plate, 14—First sliding component, 21—Push plate, 22—Push plate drive component, 51—Y-axis drive module 52—X-axis drive module, 53—Z-axis drive module. Detailed Implementation
[0013] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0014] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0015] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0016] Reference Figures 1 to 5 As shown, this utility model provides a heat sink assembly gripper device, including a floating gripper mechanism 1, a pusher mechanism 2 on each of the two opposite outer sides of the floating gripper mechanism 1, an assembly positioning detector 3 on one side above the floating gripper mechanism 1, an assembly lifting drive 4 for driving the floating gripper mechanism 1 and the pusher mechanism 2 to assemble the heat sink 7, and an assembly drive mechanism 5 for driving the floating gripper mechanism 1 to transfer the heat sink 7; specifically, the assembly lifting drive 4 is a motor. The floating gripper mechanism 1 is used to grip the heat sink 7, and the pusher mechanism 2 is used to compress the heat sink spring 8; specifically, the assembly positioning detector 3 is a height sensor used to detect whether the heat sink 7 is assembled in place.
[0017] The assembly lifting drive 4 has a connecting frame 6 at its drive end; the floating gripper mechanism 1 is located at the bottom middle of the connecting frame 6, and a push plate mechanism 2 is connected to the bottom of each end of the connecting frame 6.
[0018] The floating gripper mechanism 1 includes two opposing gripper modules and an opening / closing drive component 11 for driving the two gripper modules to move closer or further apart. Specifically, the opening / closing drive component 11 is a cylinder.
[0019] The assembled gripper module includes a clamping plate 12, a connecting base plate 13 drivenly connected to the opening and closing drive member 11, and a first sliding assembly 14 disposed between the connecting base plate 13 and the clamping plate 12; the first sliding assembly 14 is arranged in a vertical direction. Specifically, the first sliding assembly 14 includes a slide rail arranged in a vertical direction and a slider slidably connected to the slide rail.
[0020] The push plate mechanism 2 includes a push plate 21 and a push plate drive component 22 for driving the push plate 21 to move in the horizontal direction. Specifically, the push plate drive component 22 is a cylinder.
[0021] The assembly drive mechanism 5 includes a Y-axis drive module 51, an X-axis drive module 52 connected to the Y-axis drive module 51, and a Z-axis drive module 53 connected to the X-axis drive module 52; the assembly lifting drive component 4 is mounted on the Z-axis drive module 53. Further, the Y-axis drive module 51, X-axis drive module 52, and Z-axis drive module 53 each include a lead screw and a motor.
[0022] The working process of this utility model is as follows: 1) Assemble the driving mechanism 5 to drive the floating gripper mechanism 1 to take the heat sink 7 from the outside and move it above the heat sink mounting position on the motherboard; 2) Assemble the lifting drive component 4 and drive the floating gripper mechanism 1 and the push plate mechanism 2 to descend simultaneously. The floating gripper mechanism 1 will attach the heat sink 7 to the motherboard. 3) The push plate mechanism 2 compresses the heat sink spring 8 inward. At the same time, the assembly lifting drive 4 drives the floating gripper mechanism 1 and the push plate mechanism 2 to descend for the second time until the heat sink spring 8 descends to the position and engages with the retaining ring 9 on the motherboard. Since the clamping plate 12 of the floating gripper mechanism 1 has descended to the position when the assembly lifting drive 4 is driven for the first time, the clamping plate 12 slides relative to the connecting base plate 13 via the first sliding component 14 during the second drive. That is, the clamping plate 12 does not move, and only the connecting base plate 13 descends. 4) The push plate mechanism 2 resets, so that the heat sink spring 8 hangs on the motherboard retaining ring 9; the floating gripper mechanism 1 and the assembly lifting drive component 4 reset. 5) The assembly position detector 3 checks whether the heat sink 7 is assembled in place.
[0023] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model. Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the utility model and are not intended to limit the implementation of this utility model. For those skilled in the art, various obvious changes, readjustments, and substitutions can be made without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A heat sink assembly gripper device, characterized in that, It includes a floating gripper mechanism, a pusher mechanism on each of the two opposite outer sides of the floating gripper mechanism, an assembly positioning detector on one side above the floating gripper mechanism, an assembly lifting drive for driving the floating gripper mechanism and the pusher mechanism to assemble the heat sink, and an assembly drive mechanism for driving the floating gripper mechanism to transfer the heat sink. The floating gripper mechanism is used to hold the heat sink, and the push plate mechanism is used to compress the heat sink spring; the assembly position detector is used to detect whether the heat sink is assembled in place.
2. The heat sink assembly gripper device according to claim 1, characterized in that, The drive end of the assembly lifting drive component is provided with a connecting frame; the floating gripper mechanism is located at the bottom middle of the connecting frame, and a push plate mechanism is connected to the bottom of each end of the connecting frame.
3. The heat sink assembly gripper device according to claim 1, characterized in that, The floating gripper mechanism includes two opposing gripper modules and an opening / closing drive for driving the two gripper modules to move closer or further apart.
4. The heat sink assembly gripper device according to claim 3, characterized in that, The assembled gripper module includes a clamping plate, a connecting base plate that is driven to be connected to the opening and closing drive component, and a first sliding component disposed between the connecting base plate and the clamping plate; the first sliding component is arranged in a vertical direction.
5. The heat sink assembly gripper device according to claim 1, characterized in that, The push plate mechanism includes a push plate and a push plate drive for driving the push plate to move in the horizontal direction.
6. The heat sink assembly gripper device according to claim 1, characterized in that, The assembly drive mechanism includes a Y-axis drive module, an X-axis drive module connected to the Y-axis drive module, and a Z-axis drive module connected to the X-axis drive module; the assembly lifting drive component is mounted on the Z-axis drive module.
7. The heat sink assembly gripper device according to claim 1, characterized in that, The assembled detector is a height sensor.