Wafer chamfering and grinding apparatus

Abstract

The utility model discloses a wafer chamfering and grinding equipment, including the carrying assembly on the frame, its both ends are equipped with measurement subassembly and cleaning component respectively, and both sides are equipped with grinding assembly respectively, the other end of measurement subassembly is equipped with the material taking subassembly, and both sides of measurement subassembly are equipped with the wafer magazine respectively, one side of cleaning component is equipped with grinding detection assembly, the wafer magazine is used for placing wafer, and the material taking subassembly is used for the transfer between wafer magazine, measurement subassembly, the first parameter of measurement subassembly is used for detecting wafer, the carrying assembly is used for the transfer between measurement subassembly, grinding assembly, cleaning component, grinding detection assembly, and the second parameter of grinding detection assembly is used for detecting the wafer after grinding. Through the four station grinding of both sides both ends, improve the processing efficiency, the state detection of old grinding wheel and the adaptation problem of new grinding wheel are solved when the grinding wheel is exchanged, and it solves the detection record and feedback problem of wafer parameter after grinding, solves the management and tracing problem of wafer.

Description

Technical Field

[0001] This utility model relates to a grinding equipment, specifically a wafer chamfering grinding equipment, belonging to the field of wafer manufacturing technology. Background Technology

[0002] After a wafer is cut and polished from a crystal, the un-beveling wafer is prone to edge chipping and damage. This problem can lead to fragments or become the core of dislocation lines, which can then propagate to the chip near the edge of the wafer.

[0003] The existing grinding equipment has insufficient workstations, low grinding efficiency, and lacks feedback on grinding results and inspection of grinding wheel quality.

[0004] Therefore, it is necessary to improve the existing grinding equipment. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this utility model is to provide a wafer chamfering and grinding equipment.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A wafer chamfering and grinding equipment includes a conveying assembly mounted on a rack; The conveying assembly is equipped with a measuring component and a cleaning component at both ends; Grinding components are provided on both sides of the conveying assembly; The material handling component is located at the other end of the measuring component, and sheet boxes are provided on both sides of the measuring component; A grinding detection component is provided on one side of the cleaning component; The wafer cassette is used to hold wafers. The material handling assembly is used to transfer wafers between the wafer cassette and the measurement assembly; The measurement component is used to detect a first parameter of the wafer; The transport assembly is used to transfer wafers between the measurement assembly, grinding assembly, cleaning assembly, and grinding inspection assembly; The grinding detection component is used to detect the second parameter of the wafer after grinding.

[0007] On the other side of the aforementioned cleaning assembly is a grinding wheel detection assembly, including a second vision camera; The grinding wheel detection component is used to detect the wear condition of the grinding wheel.

[0008] The aforementioned grinding wheel detection component also identifies and records information about replaced grinding wheels.

[0009] The wafers transferred by the aforementioned material handling components include both unprocessed and processed wafers.

[0010] The aforementioned grinding station is equipped with a spray head.

[0011] The wafers transferred by the aforementioned transport components include both unprocessed and processed wafers.

[0012] The aforementioned grinding assembly includes a grinding wheel driven by a rotating spindle, and grinding stations located at both ends of the grinding wheel. The grinding station is equipped with a three-axis moving fixture, including a base. The base is provided with an X-axis moving module, the X-axis moving module is provided with a Y-axis moving module, and the Y-axis moving module is provided with a Z-axis moving module; the Z-axis moving module is used to drive the grinding table to move along the Z-axis, and the grinding table is provided with a ceramic disk with a negative pressure suction hole; the ceramic disk is used to place the wafer to be ground, and the negative pressure suction hole is used to adsorb the wafer.

[0013] The aforementioned handling assembly includes a handling table that moves laterally via a lead screw, the handling table having a rotating arm, the end of which has a negative pressure suction hole for adsorbing wafers.

[0014] The aforementioned measurement components include a thickness sensor and a visual centering device. The thickness sensor is used to measure the thickness of the wafer. The visual centering device includes a high-precision digital micrometer for detecting the position of the wafer transferred by the pick-up assembly on the measurement assembly.

[0015] The advantages of this utility model are: This utility model discloses a wafer chamfering and grinding equipment. By changing the grinding assembly from one-sided grinding to four-station grinding at both ends, and adding grinding inspection after grinding, the processing efficiency is greatly improved. The grinding inspection can also be used to correct grinding parameters in a timely manner, reducing the cumulative error of the machine, and facilitating debugging and operation during model changeover. This ensures the machine's grinding pass rate and production efficiency, guaranteeing the timely and qualified completion of production targets. The grinding wheel inspection assembly solves the problem of old grinding wheel status detection and new grinding wheel compatibility during grinding wheel exchange, clarifying whether the grinding wheel can meet the processing accuracy requirements.

[0016] This utility model discloses a wafer chamfering and grinding equipment, which solves the problems of detecting, recording and feedback wafer parameters after grinding, managing and tracing wafers, and addressing the issues of insufficient grinding wheel utilization and production efficiency. It has strong practicality and wide applicability. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a wafer chamfering and grinding equipment.

[0018] Figure 2 This is a top view of the structural schematic diagram of the grinding component.

[0019] Figure 3 This is a side view of a structural schematic diagram of a grinding assembly.

[0020] Figure 4 This is a schematic diagram of the structure of a three-axis moving tool.

[0021] The meanings of the markings in the attached diagram are as follows: 1. Plate box, 2. Material handling assembly, 3. Measuring assembly, 4. Platform, 5. Handling assembly, 6. Grinding assembly, 7. Grinding wheel, 8. Ceramic disc, 9. Spray head, 10. Cleaning assembly, 11. Grinding and measuring assembly, 12. Grinding wheel inspection assembly. 13. Three-axis moving fixture; 14. Spindle; 15. 0-axis rotation module; 16. Z-axis movement module; 17. Y-axis movement module; 18. X-axis movement module. Detailed Implementation

[0022] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0023] A wafer chamfering and grinding equipment comprises a wafer cassette 1, a material handling assembly 2, a measuring assembly 3, a conveying assembly 5, a grinding assembly 6, a cleaning assembly 10, a grinding inspection assembly, and a grinding wheel inspection assembly 12, all mounted on a frame and connected to a control device.

[0024] The material handling component 2 is a robotic arm located at one end of the measuring component 3, and the other end of the measuring component 3 is the conveying component 5. A sheet box 1 is located on each side of the measuring component 3, and a grinding component 6 is located on each side of the conveying component 5.

[0025] The cleaning component 10 is located at the other end of the conveying component 5, and the two sides of the cleaning component 10 are respectively provided with a grinding detection component and a grinding wheel detection component 12.

[0026] The wafer tray 1 is used to hold wafers to be ground and wafers that have already been ground.

[0027] The material handling assembly 2 is used to transfer wafers between the wafer cassette 1 and the measurement assembly 3.

[0028] The measuring component 3 includes a rotatable measuring stage and a thickness sensor and a visual centering device arranged around the stage 4; wherein, the visual centering device is preferably a Keyence LS7000 series high-precision digital micrometer, used to detect the coaxiality and reference angle of the wafer and the stage 4; on the one hand, it facilitates detection, and on the other hand, it facilitates the handling of the component 5 for picking up parts.

[0029] The wafer, placed on stage 4, rotates with stage 4. A high-precision digital micrometer identifies and scans the outer peripheral parameters of the silicon wafer, fitting and determining its specific eccentric coordinates to achieve precise positioning. If there is a misalignment or angular deviation, the control device drives a robotic arm to correct the wafer's position based on feedback from the high-precision digital micrometer.

[0030] The first parameter includes the thickness and the eccentricity coordinate.

[0031] The transport assembly 5 is used to transfer the wafer between the measurement assembly 3, the grinding assembly 6, the cleaning assembly 10, and the grinding and inspection assembly.

[0032] The transport assembly 5 includes a horizontally arranged main groove, with a lead screw located within the main groove and driven by a motor shaft at its end. A transport table is placed within the main groove and connected to the lead screw; the rotating lead screw pushes the transport table to slide laterally along the main groove. The transport table is equipped with a rotating arm, the end of which has a negative pressure suction port for adsorbing wafers.

[0033] The grinding assembly 6 includes a grinding wheel 7 driven by a rotating spindle 14 and grinding stations at both ends of the grinding wheel 7. The grinding station is equipped with a three-axis moving fixture 13, including a base, an X-axis moving module on the base, a Y-axis moving module on the X-axis moving module 18, and a Z-axis moving module on the Y-axis moving module 17. The Z-axis moving module 16 is used to drive the grinding table to move along the Z-axis. A ceramic disk 8 with a negative pressure suction hole is set on the grinding table through the O-axis rotating module 15. The ceramic disk 8 is used to place the wafer to be ground, and the negative pressure suction hole is used to adsorb the wafer.

[0034] The grinding assembly 6 is also equipped with a spray head 9.

[0035] The grinding inspection component includes a first vision camera, preferably a Keyence CV-X series camera, for detecting second parameters of the ground wafer, including the surface profile of the wafer circumferential direction and the surface profile of the V-shaped cut of the wafer.

[0036] The grinding wheel inspection assembly 12 includes a second vision camera, preferably a Keyence CV-X series camera, for detecting the surface profile of the grinding wheel 7, and then detecting the wear condition of the grinding wheel 7 through the surface profile. Preferably, the grinding wheel inspection assembly 12 also includes a scanning unit for identifying and recording information about replaced grinding wheels 7.

[0037] The main working process is as follows: The picking component 2 (robotic arm) takes the workpiece (wafer) out of the wafer cassette 1 and places it on the stage 4 of the measuring component 3 for positioning and measurement of thickness, etc. If it is not qualified, the picking component 2 puts it back into the wafer cassette 1; if it is qualified, the conveying component 5 takes the workpiece (wafer) away and puts it into the grinding station for grinding. The processed wafer is taken out by the conveying component 5 and placed into the cleaning component 10.

[0038] After cleaning, the wafer is transferred by the transport component 5 to the grinding and measuring component 11 for measurement, recording and feedback.

[0039] After measurement, the wafer is transferred from the transfer assembly 5 to the stage 4 of the measurement assembly 3, and then placed back into the wafer cassette 1 by the pick-up assembly 2 (robotic arm). When replacing the grinding wheel 7, the grinding wheel 7 to be replaced can be placed at the grinding wheel detection component 12 for identification and detection, and the current status data (wear condition) of the grinding wheel 7 can be recorded to determine whether replacement is necessary. If replacement is necessary, the new grinding wheel 7 is also placed at the grinding wheel detection component 12 for identification, matching it with the machining conditions, and checking whether it is suitable for the current target machining.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that the above embodiments do not limit this utility model in any way, and all technical solutions obtained by equivalent substitution or equivalent transformation fall within the protection scope of this utility model.

Claims

1. A wafer chamfering and grinding equipment, characterized in that, Including transport components mounted on the rack; The conveying assembly is equipped with a measuring component and a cleaning component at both ends; Grinding components are provided on both sides of the conveying component; The material handling component is located at the other end of the measuring component, and sheet boxes are provided on both sides of the measuring component; A grinding detection component is provided on one side of the cleaning component; The wafer cassette is used to hold wafers. The material handling assembly is used to transfer wafers between the wafer cassette and the measurement assembly; The measurement component is used to detect a first parameter of the wafer; The transport assembly is used to transfer wafers between the measurement assembly, grinding assembly, cleaning assembly, and grinding inspection assembly; The grinding detection component is used to detect the second parameter of the wafer after grinding.

2. The wafer chamfering and grinding equipment according to claim 1, characterized in that, On the other side of the cleaning assembly is a grinding wheel detection assembly, including a second vision camera; The grinding wheel detection component is used to detect the wear condition of the grinding wheel.

3. The wafer chamfering and grinding equipment according to claim 2, characterized in that, The grinding wheel detection component also identifies and records information about replaced grinding wheels.

4. The wafer chamfering and grinding equipment according to claim 1, characterized in that, The wafers transferred by the material handling component include both unprocessed and processed wafers.

5. The wafer chamfering and grinding equipment according to claim 1, characterized in that, The wafers transferred by the transport assembly include both unprocessed and processed wafers.

6. The wafer chamfering and grinding equipment according to claim 1, characterized in that, The grinding assembly includes a grinding wheel driven by a rotating spindle, and grinding stations located at both ends of the grinding wheel. The grinding station is equipped with a three-axis moving fixture, including a base. The base is provided with an X-axis moving module, the X-axis moving module is provided with a Y-axis moving module, and the Y-axis moving module is provided with a Z-axis moving module; the Z-axis moving module is used to drive the grinding table to move along the Z-axis, and the grinding table is provided with a ceramic disk with a negative pressure suction hole; the ceramic disk is used to place the wafer to be ground, and the negative pressure suction hole is used to adsorb the wafer.

7. The wafer chamfering and grinding equipment according to claim 6, characterized in that, The grinding station is equipped with a spray head.

8. The wafer chamfering and grinding equipment according to claim 1, characterized in that, The transport assembly includes a transport table that moves laterally via a lead screw, and the transport table is provided with a rotating arm, the end of which is provided with a negative pressure suction hole for adsorbing wafers.

9. The wafer chamfering and grinding equipment according to claim 1, characterized in that, The measurement components include a thickness sensor and a visual centering device. The thickness sensor is used to measure the thickness of the wafer. The visual centering device includes a high-precision digital micrometer for detecting the position of the wafer transferred by the pick-up assembly on the measurement assembly.

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