A polycrystalline silicon surface impurity removal polishing apparatus

CN224914379UActive Publication Date: 2026-10-30四川永祥能源科技有限公司
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Patent Information

Application Number
CN202522475867.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-21
Publication Date
2026-10-30
Estimated Expiration
2035-11-21

AI Technical Summary

Technical Problem

[0003]以上为粒状硅杂质的形成过程,不但会影响粒状硅的质量,而且会导致其在下游使用过程影响单晶硅质量及寿命

Benefits of technology

[0023]本实用新型采用高频振动的形式,使硅料在槽体内产生高频的相互摩擦,将硅料表面的毛刺及硅粉磨掉,实现硅料的抛光,抛光过程中主要依靠硅料的相互摩擦撞击,不会引入新的杂质,并且物料运动随着底部隔板的倾斜而不断被抛洒,与此同时氮气泵入并且对槽体进行吸尘,物料抛洒进一步提升抛光效果,且提高氮气冲走硅粉的效果,硅粉随氮气被抽吸,避免硅粉散入环境中以及再次吸附在硅料上。

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Abstract

The utility model provides a kind of polycrystal silicon surface impurity removal polishing equipment, it is related to polycrystal silicon production technical field.The utility model includes base, polishing box is located above base, spring is located between base and polishing box, polishing groove is located in polishing box, vibration source is connected with polishing box, wherein, dust removal opening that is communicated with polishing groove is equipped on the polishing box, the sweep tube that is inlaid into polishing groove is equipped on the polishing box, dust removal opening is communicated with dust collection system, the sweep tube is communicated with gas source.The utility model carries out polishing to silicon material, removes silicon powder and silicon material surface burr.
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Description

Technical Field

[0001] This utility model relates to the field of polycrystalline silicon production technology, specifically to a polycrystalline silicon surface impurity removal and polishing device. Background Technology

[0002] After the granular silicon passes through the front-end reaction, a certain thickness of silicon powder adheres to its surface. This silicon powder is formed by the adsorption of non-dense silicon at the end of the reaction. During the packaging and transportation of the granular silicon obtained from the reaction to the next process, it is exposed to air and the environment, and will adsorb non-silicon and metal particles in the environment.

[0003] The above describes the formation process of granular silicon impurities, which not only affect the quality of granular silicon but also impact the quality and lifespan of monocrystalline silicon during downstream applications. Utility Model Content

[0004] The purpose of this invention is to develop a polishing device for removing burrs and impurities from the surface of polycrystalline silicon by polishing silicon materials.

[0005] This utility model is achieved through the following technical solution:

[0006] A polycrystalline silicon surface impurity removal and polishing device, comprising:

[0007] Base;

[0008] Polishing box, located above the base;

[0009] A spring is located between the base and the polishing box;

[0010] Polishing tank, located inside the polishing box;

[0011] The vibration source is connected to the polishing box;

[0012] The polishing box is equipped with a dust removal port that communicates with the polishing tank, and a blow pipe that extends into the polishing tank. The dust removal port is connected to the dust collection system, and the blow pipe is connected to the air source.

[0013] Optionally, the polishing tank is annular, and the bottom of the polishing tank is provided with multiple inclined baffles, and the vibration source drives the polishing box to rotate and oscillate.

[0014] Optionally, the polishing tank is cylindrical, and multiple partitions are arranged sequentially end to end along the circular trajectory of the polishing tank. The tail of the partition gradually rises towards the head, and the material moves from the tail to the head of the partition within the polishing tank.

[0015] Optionally, the polishing box is provided with multiple dust removal ports, which are arranged at equal intervals along the circular trajectory of the polishing tank.

[0016] Optionally, the polishing box is provided with a top cover that covers the top of the polishing tank, and the dust removal port and the blowing pipe are located on the top cover.

[0017] Optionally, the polishing box has a base at the bottom, and multiple stiffeners connect the base and the polishing box. The spring is located between the base and the base plate, and the vibration source includes a vibration motor installed at the bottom of the base.

[0018] Optionally, the polishing tank is rectangular, and the vibration source includes a vibration motor mounted on a polishing box at both ends of the polishing tank.

[0019] Optionally, the polishing box at the top of the polishing tank is provided with multiple dust removal ports, which are arranged at equal intervals along the length of the polishing tank.

[0020] Optionally, multiple blow pipes are evenly arranged on the polishing box outside the dust removal port.

[0021] Optionally, the polishing box on the outer side of the bottom of the polishing tank is provided with an openable material door, and the purging pipe extends into the bottom of the polishing tank.

[0022] The beneficial effects of this utility model are:

[0023] This invention employs high-frequency vibration to generate high-frequency mutual friction between the silicon material within the tank, grinding away burrs and silicon powder on the surface of the silicon material to achieve polishing. The polishing process mainly relies on the mutual friction and impact of the silicon material, without introducing new impurities. Furthermore, the material is continuously thrown as the bottom baffle tilts, while nitrogen is pumped in and vacuums the tank. The throwing of material further enhances the polishing effect and improves the effect of nitrogen flushing away silicon powder. The silicon powder is drawn in with the nitrogen, preventing it from being dispersed into the environment or re-adsorbed onto the silicon material. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a structural diagram of Example 1;

[0026] Figure 2 This is a diagram of the internal structure of Example 1;

[0027] Figure 3 This is a structural diagram of Example 2.

[0028] Reference numerals in the attached diagram: 1a, base; 2a, polishing box; 3a, vibrating motor; 4a, dust removal port; 5a, blow pipe; 6a, spring; 7, base; 8, stiffening plate; 9, top cover; 10, partition; 1b, base; 2b, polishing box; 3b, vibrating motor; 4b, dust removal port; 5b, blow pipe; 6b, spring. Detailed Implementation

[0029] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0030] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0031] The following disclosure provides many different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0032] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0033] Example 1

[0034] like Figure 1 and Figure 2 As shown, this embodiment discloses a polycrystalline silicon surface impurity removal and polishing device, including a base 1a, a polishing box 2a above the base 1a, the polishing box 2a is circular, the polishing box 2a is provided with an annular polishing groove inside the polishing box 2a, the polishing groove is cylindrical, and the top of the polishing box 2a is provided with a top cover 9 covering the top of the polishing groove.

[0035] The polishing box 2a has a base 7 at its bottom, and multiple ribs 8 connect the base 7 to the polishing box 2a. Multiple springs 6a are provided between the base 7 and the base 1a. A vibration motor 3a is installed at the bottom of the base 7. The operation of the vibration motor 3a drives the base 7 and the polishing box 2a to rotate and swing.

[0036] The polishing box 2a on the outer side of the bottom of the polishing tank is equipped with a material door that can be opened and closed (not shown in the figure). Closing the material door can seal the polishing tank from the outside.

[0037] The bottom of the polishing tank is provided with multiple baffles 10, which are arranged sequentially end to end along the circular trajectory of the polishing tank. The baffles 10 are inclined and gradually rise from the tail to the head. The material moves from the tail to the head of the baffle 10 in the polishing tank. Through the continuous movement of the material from the tail to the head on the multiple baffles 10 in the polishing tank, and the continuous process of the material falling from the head of the previous baffle 10 to the tail of the next baffle 10, the material is thrown, which enhances the friction and impact force between the material and the polishing tank and between the materials.

[0038] The top cover 9 has three dust removal ports 4a located at the top of the polishing tank, and the three dust removal ports 4a are evenly spaced along the circular trajectory of the polishing tank. The top cover 9 also has four blow pipes 5a, which extend into the bottom of the polishing tank. The dust removal ports 4a are connected to a dust collection system (not shown in the figure), and the blow pipes 5a are connected to a nitrogen source. The dust collection system sucks up dust from the polishing tank, and the nitrogen source provides wet nitrogen and pumps it into the blow pipes 5a.

[0039] The material is placed in the polishing tank. The vibration motor 3a operates to make the polishing box 2a rotate and swing. The material in the polishing tank gradually moves along a circular trajectory. During this process, it passes through multiple baffles 10 in sequence, realizing the continuous spraying of the material and improving the polishing effect. The impurities (silicon powder) generated during the polishing process are pumped into the dust collection system through the dust removal port 4a by the nitrogen gas flow pumped in by the blow pipe 5a and are treated. Furthermore, the spraying of the material can further enhance the blowing effect of nitrogen on the material, making it easier for impurities to be carried out by the nitrogen gas flow.

[0040] Example 2

[0041] like Figure 3 As shown, this embodiment discloses a polycrystalline silicon surface impurity removal and polishing device, including a base 1b, a cuboid polishing box 2b on the base 1b, a plurality of springs 6b between the bottom of the polishing box 2b and the base 1b, a polishing groove inside the polishing box 2b, and vibration motors 3b at both ends of the polishing box 2b.

[0042] The polishing box 2b has three dust removal ports 4b located at the top of the polishing tank. The three dust removal ports 4b are arranged at equal intervals along the length of the polishing box 2b. Four blow pipes 5b extending into the bottom of the polishing tank are evenly provided on the top of the polishing box 2b outside each dust removal port 4b. The polishing box 2b at the bottom of the polishing tank is provided with a material door that can be opened and closed (not shown in the figure).

[0043] The material is placed in the polishing tank of the polishing box 2b. The vibration motor 3b operates to vibrate the material in the polishing tank. The blow pipe 5b is connected to the nitrogen source and pumps wet nitrogen into the bottom of the polishing tank. The dust removal port 4b is connected to the dust collection system pipeline for suction. The material is polished, and impurities on the surface of the material are treated by the dust collection system through the dust removal port 4b along with the nitrogen flow.

[0044] The above embodiments are merely preferred embodiments of this utility model and are not intended to limit the technical solutions of this utility model. Any technical solution that can be implemented based on the above embodiments without creative effort should be considered to fall within the scope of protection of this utility model patent.

Claims

1. A polycrystalline silicon surface impurity removal and polishing device, characterized in that, include: Base; Polishing box, located above the base; A spring is located between the base and the polishing box; Polishing tank, located inside the polishing box; The vibration source is connected to the polishing box; The polishing box is equipped with a dust removal port that communicates with the polishing tank, and a blow pipe that extends into the polishing tank. The dust removal port is connected to the dust collection system, and the blow pipe is connected to the air source.

2. The polycrystalline silicon surface impurity removal and polishing equipment according to claim 1, characterized in that, The polishing tank is annular, and the bottom of the polishing tank is provided with multiple inclined baffles. The vibration source drives the polishing box to rotate and sway.

3. The polycrystalline silicon surface impurity removal and polishing equipment according to claim 2, characterized in that, The polishing tank is cylindrical, and multiple partitions are arranged sequentially end to end along the circular trajectory of the polishing tank. The tail of the partition gradually rises towards the head, and the material moves from the tail to the head of the partition within the polishing tank.

4. The polycrystalline silicon surface impurity removal and polishing equipment according to claim 3, characterized in that, The polishing box is provided with multiple dust removal ports, which are arranged at equal intervals along the circular trajectory of the polishing tank.

5. The polycrystalline silicon surface impurity removal and polishing equipment according to claim 1, characterized in that, The polishing box is provided with a top cover that covers the top of the polishing tank, and the dust removal port and the blowing pipe are located on the top cover.

6. The polycrystalline silicon surface impurity removal and polishing equipment according to claim 1, characterized in that, The polishing box has a base at the bottom, and multiple stiffeners connect the base and the polishing box. The spring is located between the base and the base plate. The vibration source includes a vibration motor installed at the bottom of the base.

7. The polycrystalline silicon surface impurity removal and polishing equipment according to claim 1, characterized in that, The polishing tank is rectangular, and the vibration source includes a vibration motor installed on the polishing boxes at both ends of the polishing tank.

8. The polycrystalline silicon surface impurity removal and polishing equipment according to claim 7, characterized in that, The polishing box at the top of the polishing tank is provided with multiple dust removal ports, which are arranged at equal intervals along the length of the polishing tank.

9. The polycrystalline silicon surface impurity removal and polishing equipment according to claim 8, characterized in that, Multiple blow pipes are evenly arranged on the polishing box outside the dust removal port.

10. The polycrystalline silicon surface impurity removal and polishing equipment according to any one of claims 1 to 9, characterized in that, The polishing box on the outer side of the bottom of the polishing tank is equipped with a material door that can be opened and closed, and the purging pipe extends into the bottom of the polishing tank.