Wafer polishing apparatus upper polishing plate pressure device

Abstract

The application relates to an upper grinding disc pressure device of a wafer grinding and polishing device, which comprises an upper grinding disc, a tension electric cylinder connected to the upper grinding disc, and a pressure piece arranged on the side of the upper grinding disc away from a lower grinding disc. The application has the effect of improving the wafer grinding and polishing precision.

Description

Technical Field

[0001] This application relates to the field of wafer grinding and polishing equipment, and more particularly to an upper grinding disc pressure device of a wafer grinding and polishing apparatus. Background Technology

[0002] A double-sided grinding machine is a mechanical device used for high-precision surface processing. It can grind or polish two parallel surfaces of a workpiece simultaneously and is widely used in industries such as precision machinery, semiconductors, optical components, ceramics, and glass.

[0003] Existing double-sided grinding machines require an air pump and air hose to apply pressure to the wafer during the grinding and polishing process to ensure that the wafer adheres tightly to the polishing table and thus ensures the grinding and polishing effect. However, the air pump is prone to intermittent air output during use. When the air output is intermittent, the pressure on the wafer disappears momentarily, thus affecting the precision of wafer grinding and polishing. Utility Model Content

[0004] To improve the precision of wafer grinding and polishing, this application provides an upper grinding disc pressure device for a wafer grinding and polishing apparatus.

[0005] The upper grinding disc pressure device structure of the wafer grinding and polishing apparatus provided in this application adopts the following technical solution:

[0006] A wafer grinding and polishing apparatus includes an upper grinding disc pressure device, wherein an upper grinding disc is connected to a tension cylinder, the upper grinding disc slides toward or away from a lower grinding disc via the tension cylinder, and the upper grinding disc is pressed onto the wafer by sliding, and a pressure element is provided on the side of the upper grinding disc away from the lower grinding disc.

[0007] By adopting the above technical solution, a stable pressure is applied to the wafer by replacing the cylinder with a pressure component, thereby avoiding the situation where the pressure on the wafer disappears momentarily due to the intermittent air output from the cylinder, and improving the accuracy of wafer grinding and polishing.

[0008] Optionally, a tension sensor is provided between the tension electric cylinder and the upper grinding disc, and the tension sensor is used to detect the tension of the tension electric cylinder on the pressure component.

[0009] By adopting the above technical solution, the tension sensor can detect the tension on the pressure component in real time, thus facilitating the observation of the pressure applied by the pressure component and the adjustment of the pressure on the pressure component.

[0010] Optionally, a tension damper is provided between the tension electric cylinder and the upper grinding disc.

[0011] By adopting the above technical solution, the buffer can slow down the tension adjustment process, thereby reducing the impact of the fault on the pressure component when the tension electric cylinder experiences a brief malfunction.

[0012] In summary, this application includes at least one of the following beneficial technical effects:

[0013] 1. By installing pressure components to replace the cylinder pressure application, a stable pressure is applied to the wafer, thereby avoiding the situation where the pressure on the wafer disappears momentarily due to the intermittent air output from the cylinder, and improving the accuracy of wafer grinding and polishing.

[0014] 2. The tension sensor can detect the tension on the pressure component in real time, making it easy to observe the pressure applied to the pressure component and adjust the pressure on the pressure component.

[0015] 3. The buffer can slow down the tension adjustment process, thereby reducing the impact of the fault on the pressure components when the tension electric cylinder experiences a brief malfunction. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of existing technology.

[0017] Figure 2 This is a schematic diagram of the overall structure of an embodiment of this application.

[0018] Figure 3 This is a schematic diagram of the overall structure of the embodiment of this application in use.

[0019] Explanation of reference numerals in the attached drawings: 0, wafer; 1, machine body; 101, stage body; 102, gantry frame; 2, lower grinding disc; 3, upper grinding disc; 4, lifting cylinder; 5, placement tray; 6, pressure component; 7, tension electric cylinder; 8, tension sensor; 9, tension buffer; 10, air pipe. Detailed Implementation

[0020] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.

[0021] First, it should be noted that in the description of this application, the use of directional terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" indicates the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used solely for descriptive purposes and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the use of numerical quantifiers such as "first," "second," and "third" is for descriptive purposes only and should not be construed as indicating or implying relative importance. Additionally, in this application, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, interference fits, transition fits, or integral connections; they can refer to direct connections or indirect connections through an intermediate medium. Therefore, those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] Existing wafer grinding and polishing equipment, referring to Figure 1 and Figure 2 The device includes a body 1, which includes a platform 101 placed in the working area and a gantry frame 102 fixedly mounted on the platform 101. A lower grinding disc 2 and an upper grinding disc 3 slidably mounted on the gantry frame 102 are fixedly mounted on the upper surface of the platform 101. The lower grinding disc 2 is used to place the wafer 0. Several placement discs 5 are rotatably mounted on the lower grinding disc 2. The wafer 0 is placed in the placement discs 5 and then placed on the lower grinding disc 2 through the placement discs 5. A lifting cylinder 4 is installed on the gantry frame 102. The lifting cylinder 4 drives the upper grinding disc 3 to slide towards or away from the lower grinding disc 2. The upper grinding disc 3 is pressed onto the side of the wafer 0 away from the lower grinding disc 2 by sliding. An air pipe 10 is led out from the lifting cylinder 4. The end of the air pipe 10 away from the lifting cylinder 4 is connected to the upper grinding disc 3. When the grinding and polishing device grinds and polishes the wafer 0, the lifting cylinder 4 applies pressure to the wafer 0 through the air pipe 10.

[0023] This application discloses an upper grinding disc pressure device in a wafer grinding and polishing apparatus, referring to... Figure 1 and Figure 2A tension cylinder 7 is connected to the upper grinding disc 3. The upper grinding disc 3 slides towards or away from the lower grinding disc 2 via the tension cylinder 7. The upper grinding disc 3 is pressed onto the wafer by sliding. A pressure member 6 is pressed on the side of the upper grinding disc 3 away from the lower grinding disc 2. The pressure member 6 is a component fixed on the upper grinding disc 3 to increase its weight. In this embodiment, the overall mass of the upper grinding disc 3 is increased by thickening the upper grinding disc 3. The thickened part of the upper grinding disc 3 is used as the pressure member 6 to increase the total weight of the upper grinding disc 3, thereby improving the overall stability. By installing the pressure member 6, the cylinder is replaced to apply stable pressure to the wafer 0, thereby avoiding the situation where the pressure on the wafer 0 disappears momentarily due to the discontinuous air output of the cylinder, and improving the precision of the grinding and polishing of the wafer 0.

[0024] Reference Figure 1 , Figure 2 and Figure 3 A tension sensor 8 is provided between the tension cylinder 7 and the upper grinding disk 3. The tension sensor 8 is used to detect the tension of the tension cylinder 7 on the upper grinding disk 3. The tension sensor 8 can detect the tension on the upper grinding disk 3 in real time, so as to facilitate the observation of the pressure applied by the upper grinding disk 3 to the wafer 0 and facilitate the adjustment of the pressure on the upper grinding disk 3. A tension buffer 9 is provided between the tension cylinder 7 and the upper grinding disk 3. The tension buffer 9 is located on the side of the tension sensor 8 away from the upper grinding disk 3. The tension buffer 9 can slow down the tension adjustment process, so as to reduce the impact of the tension cylinder 7 on the upper grinding disk 3 when the tension cylinder 7 has a brief failure. In this embodiment, the pressure applied to the wafer 0 is the total weight of the upper grinding disk 3 minus the tension applied by the tension cylinder 7 to the upper grinding disk 3.

[0025] The implementation principle of this application embodiment is as follows: the wafer 0 is fixedly placed in the placement tray 5, and the upper grinding tray 3 is slidably pressed onto the wafer 0 by the lifting cylinder 4. Then, the pressure applied to the upper surface of the wafer 0 on the upper grinding tray 3 is adjusted by the tension cylinder 7. Then, the grinding and polishing equipment is started to grind and polish the wafer 0. During the grinding and polishing process, the tension cylinder 7 gradually reduces the tension to gradually increase the pressure of the upper grinding tray 3 on the wafer 0. After the grinding and polishing is completed, the wafer 0 is taken out to complete the grinding and polishing of the wafer 0.

[0026] It should be noted that the above embodiments are only used to illustrate this application and are not intended to limit the technical solutions described in this application. Although this specification has described this application in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to this application. All technical solutions and improvements that do not depart from the spirit and scope of this application should be covered within the scope of the claims of this application.

Claims

1. A pressure device for an upper grinding disc in a wafer grinding and polishing apparatus, comprising an upper grinding disc (3), wherein a tension cylinder (7) is connected to the upper grinding disc (3), the upper grinding disc (3) slides toward or away from the lower grinding disc (2) via the tension cylinder (7), and the upper grinding disc (3) is pressed onto the wafer (0) by sliding, characterized in that: A pressure component (6) is provided on the side of the upper grinding disc (3) away from the lower grinding disc (2). The pressure component (6) is a component fixed on the upper grinding disc (3) to lift the weight. A tension sensor (8) is provided between the tension cylinder (7) and the upper grinding disc (3). The tension sensor (8) is used to detect the tension of the tension cylinder (7) on the pressure component (6). A tension buffer (9) is provided between the tension cylinder (7) and the pressure component (6).

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