Wafer carrier gripping device

Abstract

The utility model relates to a kind of wafer carrier grabbing device, including the installation arm connected with robot, the support plate being set in installation arm grabbing front end, the moving block being slidably connected along the support plate and the cylinder that the moving block is reciprocated along the direction of grabbing is pushed;A pair of detachable first clamping posts is equipped in the support plate near the side of grabbing end;Also a pair of detachable first clamping posts is equipped in the side of moving block towards grabbing end;2 pairs of the first clamping post correspond to the outer contour of carrier;A pair of detachable second clamping posts is also equipped in the side of moving block towards grabbing end;Wherein, the first clamping post on the support plate can be replaced by second clamping post, then 2 pairs of the second clamping post correspond to the outer contour of carrier;Sensor for detecting grabbed article is also equipped on the support plate, improved grabbing device uses four corresponding clamping posts that can be replaced according to carrier size to fix carrier, realize the stable grabbing of two kinds of carriers, realize the purpose of the compatible operation of two kinds of carriers in single machine.

Description

Technical Field

[0001] This utility model relates to a wafer carrier gripping device. Background Technology

[0002] Existing wafers employ two different mounting methods during visual inspection due to variations in product characteristics; Method 1: Refer to the image Figure 1 The carrier 2 includes a wafer 21, a blue film 22 and an iron ring 23. The top of the blue film 22 is provided with adhesive, and the wafer 21 and the iron ring 23 are both adhered to the top. The wafer 21 is placed at the center of the upper surface of the blue film 22. The center of the iron ring 23 is empty. The outer diameter of the iron ring 23 is 227 mm and the thickness is 1.2 mm. Method 2: Refer to the image Figure 2 The carrier 2' includes a wafer 21', a blue film 22', and a mother-daughter ring 23'. The surface of the blue film 22' is coated with adhesive. The wafer 21' is placed at the center of the upper surface of the blue film 22'. The mother-daughter ring 23' is a pair of interlocking rings consisting of a daughter ring and a mother ring. The blue film 22' is sandwiched between the daughter ring and the mother ring. The outer diameter of the mother-daughter ring 23' is 186 mm, the thickness is 6 mm, and the material width on one side of the mother-daughter ring 23' is 7 mm. The currently used clamp-type fixture 1 (reference) Figures 3 to 4 As can be seen from the attached drawings, the fixture includes a mounting arm 11 connected to the robot, a gripping plate 12 set at the front end of the mounting arm 11, a gripping area 14 at the front end of the gripping plate 12, a gripping block 15 set at the top of the gripping area 14, and the gripping block 15 moves up and down through a drive mechanism 13. The body of the iron ring 23 is gripped by the action of the gripping block 15 and the gripping area 14. Structural reference of drive mechanism 13 Figure 4 It includes a rear cylinder 131, a push block 132 connected to the push rod of the cylinder 131, and a lifting block 136 connected to the rear of the clamping block 15. The contact surface of the push block 132 and the lifting block 136 is a lifting inclined surface. A cover 133 is provided outside the lifting block 136. The top of the lifting block 136 is a plane. A guide rod 134 is erected on the plane. The guide rod 134 penetrates the cover 133 upward and slides with it. A return spring 135 is sleeved on the outside of the guide rod 134. The top of the spring 135 abuts against the top of the inner wall of the cover 133. The cylinder 131 pushes the push block 132 to open and close the clamping block 15 and the clamping area 14 to achieve grasping and placement; The clamping fixture 1 grips the carrier 2 smoothly because the iron ring 23 is thin (1.2mm) and has good flatness, making the gripping stable. However, it has shortcomings when gripping the carrier 2'. The main reason is that the mother and daughter rings 23' are 6mm thick, 7mm wide, and arc-shaped, resulting in a small clamping area and instability of the silicon wafer when clamping the mother and daughter rings 23'. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a wafer carrier gripping device.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a wafer carrier gripping device, comprising a mounting arm connected to a robot, a support plate disposed at the gripping front end of the mounting arm, a movable block slidably connected along the support plate, and a cylinder for pushing the movable block to reciprocate along the gripping direction; A pair of detachable first clamping posts are provided on the side of the support plate near the gripping end; A pair of detachable first clamping posts are provided on the side of the moving block facing the gripping end; 2. The outer contour of the carrier corresponding to the first clamping post; A pair of detachable second clamping posts are also provided on the side of the moving block facing the gripping end; Wherein, the first clamping post on the support plate can be replaced with the second clamping post, then 2 pairs of the second clamping posts correspond to the outer contour of the carrier; The support plate is also equipped with sensors for detecting the objects being grasped.

[0005] Furthermore, the support plate is provided with a sliding groove for the moving block to move.

[0006] Furthermore, the support plate has a notch on the side near the gripping end, and the first clamping post and the second clamping post are respectively disposed on both sides of the notch.

[0007] Furthermore, the movable block includes a base, and the push rod of the cylinder is connected to the rear of the base; The top of the base is provided with a first extension rod for mounting a pair of the first clamping posts and a second extension rod for mounting a pair of the second clamping posts.

[0008] Furthermore, both the first clamping post and the second clamping post are located below the support plate.

[0009] Furthermore, the first clamping column includes a column body and screws, and the column body is connected to the support plate / the moving block respectively by the screws.

[0010] Furthermore, a retaining ring is provided on the outside of the column to respectively hold the upper and lower surfaces of the object being gripped.

[0011] Compared with the prior art, the advantages and positive effects of this utility model are as follows: The improved gripping device uses four interchangeable clamping posts to fix the carrier, achieving relatively stable gripping of two types of carriers and enabling compatible operation of two types of carriers on a single machine. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of carrier 2; Figure 2 This is a schematic diagram of carrier 2'; Figure 3 This is a schematic diagram of a clamp-type fixture. Figure 4 This is a schematic diagram of the drive mechanism for a clamp-type fixture; Figure 5 This is a schematic diagram of the improved fixture; Figure 6 This is a schematic diagram of the improved fixture from another perspective; Figure 7 This is a schematic diagram of the clamping plate of the improved fixture; Figure 8 This is a structural diagram of the moving block of the improved fixture; Figure 9 This is a structural diagram of the clamping column of the improved fixture.

[0013] Legend: 1-Grip-type clamp, 2-Carrier, 2'-Carrier, 3-Gripping device; 11-Mounting arm, 12-Clamping plate, 13-Drive mechanism, 14-Gripper area, 15-Clamping block 15; 131-Cylinder, 132-Push block, 133-Cover, 134-Guide rod, 135-Spring, 136-Lifting block; 21-Wafer, 22-Blue film, 23-Iron ring; 21' - Wafer, 22' - Blue film, 23' - Mother-daughter ring; 31-Mounting arm, 32-Support plate, 33-Moving block, 34-First clamping post, 35-Cylinder, 36-Second clamping post, 37-Sensor; 321 - Slide groove, 322 - Notch; 331-Base, 332-First extension rod, 333-Second extension rod; 341 - Screw, 342 - Pillar; 3421 - Material retaining ring. Detailed Implementation

[0014] Please see Figures 5 to 6 This utility model provides a technical solution: a wafer carrier gripping device, including a mounting arm 31 connected to a robot, a support plate 32 disposed at the gripping front end of the mounting arm 31, a moving block 33 slidably connected along the support plate 32, and a cylinder 35 that pushes the moving block 33 to reciprocate along the gripping direction. A pair of detachable first clamping posts 34 are provided on the side of the support plate 32 near the gripping end; A pair of detachable first clamping posts 34 are provided on the side of the moving block 33 facing the gripping end; 2 pairs of first clamping posts 34 correspond to the outer contour of carrier 2; A pair of detachable second clamping posts 36 are also provided on the side of the moving block 33 facing the gripping end; Wherein, the first clamping post 34 on the support plate 32 can be replaced by the second clamping post 36, and the two pairs of second clamping posts 36 correspond to the outer contour of the carrier 2'. The first clamping post 34 and the second clamping post 36 are both located below the support plate 32; The support plate 32 is also equipped with a sensor 37 for detecting the grasped object.

[0015] The principle is as follows: The improved gripping device uses four corresponding clamping posts 34 / 36 that can be replaced according to the size of the carrier to fix the carrier, so as to achieve relatively stable gripping of two types of carriers 2 / 2' and realize the purpose of compatible operation of two types of carriers 2 / 2' on a single machine.

[0016] During the grasping process, the robot carries the device and moves it to the side of the inspection machine. The robot drives the device to fall from top to bottom into the grasping range of the carrier 2 / 2'. The sensor 37 detects the presence of the carrier 2 / 2', and then the cylinder 35 pushes the moving block 33 forward to clamp the carrier 2 / 2' between the four first clamping posts 34 or the second clamping posts 36. Then, the robot carries the device up and moves it to the centralized area.

[0017] Please see Figure 7 The support plate 32 is provided with a sliding groove 321 for the moving block 33 to move, and the support plate 32 is provided with a notch 322 on the side near the gripping end. The first clamping post 34 and the second clamping post 36 are respectively provided on both sides of the notch 322. The slide 321 is provided to facilitate the guidance of the moving block 33; The notch 322 is provided to reduce the weight of the support plate 32 and alleviate the sagging problem at the tail caused by the weight.

[0018] Please see Figure 8 For example, in one embodiment of the movable block 33, the movable block 33 includes a base 331, and the push rod of the cylinder 35 is connected to the rear of the base 331. The top of the base 331 is provided with a first extension rod 332 for mounting a pair of first clamping posts 34 and a second extension rod 333 for mounting a pair of second clamping posts 36. Combination Figures 5 to 6 The second extension rod 333 and the slide groove 321 are in sliding fit; It should be noted that the length of the second extension rod 333 needs to be calculated so that the carrier 2' can be grabbed within the original stroke range without adjusting the stroke of the cylinder 35.

[0019] Please see Figure 9 This is an embodiment of the first clamping post 34. The structure of the first clamping post 36 is the same as that of the first clamping post 34. The first clamping post 34 includes a post body 342 and a screw 341. The post body 342 is connected to the support plate 32 / moving block 33 respectively by the screw 341. On the outside of the column 342, there are also retaining rings 3421 that respectively clamp the upper and lower surfaces of the gripping item. The dimension A between the two retaining rings 3421 corresponds to the thickness dimension of the carrier 2 / 2'. That is, the dimension A between the two retaining rings 3421 of the first clamping column 34 should be the thickness dimension of the carrier 2. The dimension A between the two retaining rings 3421 of the second clamping column 36 should be the thickness dimension of the carrier 2'.

[0020] When in use, choose to install either the first clamping post 34 or the second clamping post 36 to avoid affecting the gripping.

[0021] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Variations and modifications made without departing from the spirit and scope of this utility model fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer carrier gripping device, characterized in that: It includes a mounting arm (31) connected to the robot, a support plate (32) set at the gripping front end of the mounting arm (31), a moving block (33) slidably connected along the support plate (32), and a cylinder (35) that pushes the moving block (33) to reciprocate along the gripping direction. A pair of detachable first clamping posts (34) are provided on the side of the support plate (32) near the gripping end; A pair of detachable first clamping posts (34) are provided on the side of the moving block (33) facing the gripping end; 2. The outer contour of the carrier corresponding to the first clamping post (34); A pair of detachable second clamping posts (36) are also provided on the side of the moving block (33) facing the gripping end; Wherein, the first clamping post (34) on the support plate (32) can be replaced with the second clamping post (36), then 2 pairs The second clamping post (36) corresponds to the outer contour of the carrier; The support plate (32) is also provided with a sensor (37) for detecting the grasped object.

2. The wafer carrier gripping device according to claim 1, characterized in that: The support plate (32) is provided with a groove (321) for the moving block (33) to move.

3. The wafer carrier gripping device according to claim 2, characterized in that: The support plate (32) has a notch (322) on the side near the gripping end, and the first clamping post (34) and the second clamping post (36) are respectively disposed on both sides of the notch (322).

4. The wafer carrier gripping device according to claim 3, characterized in that: The moving block (33) includes a base (331), and the push rod of the cylinder (35) is connected to the rear of the base (331); The top of the base (331) is provided with a first extension rod (332) for mounting a pair of the first clamping posts (34) and a second extension rod (333) for mounting a pair of the second clamping posts (36).

5. A wafer carrier gripping device according to claim 1, characterized in that: The first clamping post (34) and the second clamping post (36) are both located below the support plate (32).

6. A wafer carrier gripping device according to any one of claims 1-5, characterized in that: The first clamping column (34) includes a column body (342) and a screw (341), wherein the column body (342) is connected to the support plate (32) and the moving block (33) respectively by the screw (341).

7. A wafer carrier gripping device according to claim 6, characterized in that: A retaining ring (3421) is also provided on the outside of the column (342) to respectively hold the upper and lower surfaces of the gripping item.

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