A mechanical arm and wafer transfer device

Abstract

The utility model discloses a kind of mechanical arm and wafer conveying device, it is related to the field of semiconductor manufacturing technology.The mechanical arm includes first support arm and second support arm, first support arm has first end and second end, second support arm is asymmetrically arranged with first support arm, extend to the side of first support arm with acute angle included angle from first end, and the end of second support arm and second end form opening. Among them, first support arm and second support arm jointly constitute the support surface for supporting workpiece.By asymmetrically arranged and the first support arm and second support arm of acute angle connection, form the stable triangular support structure with opening.The design can effectively avoid motion interference when the workpiece is transferred with symmetric structure mechanical arm.Meanwhile, triangular support structure has high rigidity and stability, provides smooth and reliable support for workpiece.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a robotic arm and wafer transfer device. Background Technology

[0002] In the semiconductor manufacturing field, ceramic robotic arms (also known as handling robots or handling fingers) are widely used for transferring workpieces such as wafers. Currently, most common robotic arm end effectors adopt a symmetrical structural design.

[0003] However, this traditional symmetrical structure has significant limitations in practical applications. When two robotic arms need to exchange workpieces at a certain angle, the symmetrical structure makes them prone to motion interference, leading to difficulties or even failures in the transfer process. To avoid this problem, an additional transfer point is usually needed between the robotic arms, but this increases the complexity and space required, resulting in redundancy. To solve the interference problem, some solutions attempt to use irregular or asymmetrical arm designs, but these designs often lack sufficient structural stability. During high-speed, precise transfer, unstable supports can easily cause wafer position shifts or jitter, significantly increasing the risk of wafer slippage and breakage, thus affecting production yield. Utility Model Content

[0004] The purpose of this invention is to propose a robotic arm and a wafer transfer device to effectively avoid interference during wafer transfer and provide stable and reliable support for the wafer.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A robotic arm, comprising:

[0007] The first support arm has a first end and a second end;

[0008] The second support arm is asymmetrically arranged with respect to the first support arm. The second support arm extends from the first end to one side of the first support arm at an acute angle, and an opening is formed between the end of the second support arm and the second end.

[0009] The first support arm and the second support arm together form a support surface for supporting the workpiece.

[0010] As an alternative to the robotic arm, the support surface is provided with an adsorption mechanism for adsorbing workpieces.

[0011] As an alternative to the robotic arm, the adsorption mechanism includes a first adsorption site, a second adsorption site, and a third adsorption site arranged in a triangular pattern.

[0012] As an alternative to the robotic arm, the first adsorption position and the second adsorption position are located on the first support arm, and the third adsorption position is located on the second support arm.

[0013] As an alternative to the robotic arm, the first support arm includes a main arm and a secondary arm that are perpendicularly connected to each other, with the end of the main arm being the first end and the end of the secondary arm being the second end;

[0014] The second support arm is connected to the main arm at an acute angle.

[0015] As an alternative to the robotic arm, a connecting arm is also included, which is located at the connection between the first support arm and the second support arm.

[0016] A wafer transfer device, comprising:

[0017] The first robotic arm has a symmetrical end-effector for placing wafers;

[0018] The second robotic arm is a robotic arm as described in any of the above schemes;

[0019] A drive mechanism, connected to the second robotic arm, is used to drive the second robotic arm to dock with the first robotic arm to transfer wafers.

[0020] As an optional embodiment of the wafer transfer device, the drive mechanism includes:

[0021] A rotating module, connected to the second robotic arm, is used to drive the second robotic arm to rotate horizontally;

[0022] A linear module, connected to the rotating module, is used to drive the rotating module to move linearly in at least one direction in three-dimensional space.

[0023] As an alternative to the wafer transfer device, the linear module is provided with a position detection element for detecting the position of the second robotic arm.

[0024] As an alternative to the wafer transfer device, a fixed arm is also included for connecting the second robotic arm and the rotating module.

[0025] The beneficial effects of this utility model are:

[0026] The robotic arm provided by this invention forms a stable triangular support structure with an opening by an asymmetrically arranged first support arm and a second support arm connected at an acute angle. This design allows the symmetrical end of the robotic arm to enter through the opening when interacting with a symmetrical robotic arm, or for the asymmetrical first and second support arms to extend into the gap between the symmetrical robotic arm, effectively avoiding motion interference. Simultaneously, the triangular support structure possesses high rigidity and stability, providing stable and reliable support for the workpiece and significantly reducing the risk of offset, slippage, and breakage during transport.

[0027] The wafer transfer device provided by this utility model has a symmetrical structure at the end of the first robotic arm for placing wafers, and a second robotic arm using the aforementioned robotic arm. The second robotic arm is driven by a drive mechanism to dock with the first robotic arm to transfer wafers, realizing direct and smooth transfer of wafers without the need for intermediate transfer stations, simplifying the equipment structure and reducing system costs. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of the robotic arm provided in Embodiment 1 of this utility model;

[0029] Figure 2 This is a schematic diagram of the wafer transfer device provided in Embodiment 2 of this utility model;

[0030] Figure 3 This is a schematic diagram of the structure of the process cavity with a supporting device for supporting wafers in the process unit provided in Embodiment 2 of this utility model;

[0031] Figure 4 This is a schematic diagram of the state of the second robotic arm in the first position when the wafer transfer device provided in Embodiment 2 of this utility model is transferring a wafer in the process cavity;

[0032] Figure 5 This is a schematic diagram of the state when the second robotic arm moves from the first position to the second position and hands over the wafer to the carrier device during the transfer of the wafer in the process cavity of the wafer transfer device provided in Embodiment 2 of this utility model;

[0033] Figure 6 This is a schematic diagram of the handover position when the second robotic arm and the carrier device hand over the wafer, provided in Embodiment 2 of this utility model;

[0034] Figure 7 This is a schematic diagram of the state when the second robotic arm in the wafer transfer device provided in Embodiment 2 of this utility model takes out the wafer from the carrier device and moves to the first position;

[0035] Figure 8 This is a schematic diagram of the second robotic arm in the wafer transfer device provided in Embodiment 2 of this utility model, showing the wafer being rotated 90° at the first position.

[0036] Figure 9 This is a schematic diagram of the state when the second robotic arm and the first robotic arm exchange wafers in the wafer transfer device provided in Embodiment 2 of this utility model.

[0037] In the picture:

[0038] 100. First robotic arm; 200. Second robotic arm;

[0039] 300. Drive mechanism; 301. Rotary module; 302. Linear module; 3021. Position detection component;

[0040] 400. Process cavity; 401. Lifting column;

[0041] 500, wafer;

[0042] 600. Fixed arm;

[0043] 1. First support arm; 11. Main arm; 111. First end; 112. First adsorption position; 12. Secondary arm; 121. Second adsorption position; 122. Second end;

[0044] 2. Second support arm; 21. Third adsorption site;

[0045] 3. Connecting arm. Detailed Implementation

[0046] To make the technical problem solved by this utility model, the technical solution adopted, and the technical effect achieved clearer, the technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0047] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0048] Example 1:

[0049] This embodiment provides a robotic arm for conveying workpieces during semiconductor manufacturing, achieving stable workpiece transfer.

[0050] like Figure 1As shown, the robotic arm provided in this embodiment includes a first support arm 1 and a second support arm 2. The first support arm 1 has a first end 111 and a second end 122. The second support arm 2 is asymmetrically arranged with respect to the first support arm 1. The second support arm 2 extends from the first end 111 towards one side of the first support arm 1 at an acute angle, and an opening is formed between the end of the second support arm 2 and the second end 122. The first support arm 1 and the second support arm 2 together constitute a support surface for supporting a workpiece.

[0051] This robotic arm utilizes an asymmetrically arranged first support arm 1 and a second support arm 2 connected at an acute angle to form a stable triangular support structure with an opening. This design allows the symmetrical end of the robotic arm to enter through the opening when handing over a workpiece to a robotic arm with a symmetrical end structure, or for the asymmetrical first support arm 1 and second support arm 2 to extend into the gap between the symmetrical end structures, effectively preventing motion interference. Simultaneously, the triangular support structure possesses high rigidity and stability, providing stable and reliable support for the workpiece and significantly reducing the risk of offset, slippage, and breakage during transport.

[0052] The robotic arm provided in this embodiment is made of ceramic material and can enter high-temperature process chambers to pick up and place workpieces, eliminating the long cooling waiting time, significantly shortening the production cycle, and increasing equipment throughput. At the same time, it avoids the decrease in positioning accuracy caused by thermal deformation, ensuring reliable transmission in hot environments.

[0053] Traditional symmetrical robotic arms often require complex trajectory planning or additional transfer stations to avoid interference when transferring workpieces. The asymmetrical acute-angle opening design of the robotic arm provided in this embodiment offers physical space for the entry of symmetrical robotic arms, enabling seamless and interference-free direct docking. This not only eliminates the risk of collisions during the handover process but also allows for the elimination of transfer stations in the equipment design, resulting in a more compact equipment layout, a simplified system structure, and reduced overall manufacturing costs.

[0054] In semiconductor manufacturing, contamination control requirements are extremely stringent. Ceramic materials are dust-free, corrosion-resistant, and have low outgassing, reducing particulate and metal ion contamination at the source. Simultaneously, the triangular support region formed by the asymmetric structure possesses excellent rigidity, effectively suppressing vibration; together, they provide an ultra-clean and ultra-stable transport environment for semiconductor workpieces. This significantly reduces the risk of defects, misalignment, or breakage of semiconductor workpieces caused by particulate contamination, mechanical vibration, or slippage, thereby directly improving product yield.

[0055] In one embodiment, an adsorption mechanism for adsorbing workpieces is provided on the support surface. The adsorption mechanism is used to adsorb and fix the workpiece after it falls onto the support surface, increasing the stability during the transfer process.

[0056] For example, the adsorption mechanism includes vacuum adsorption holes, vacuum channels communicating with the vacuum adsorption holes, and a vacuum pump. The vacuum adsorption holes are arranged on the support surface in a specific configuration that covers the center of gravity of the workpiece and forms a stable force field.

[0057] The adsorption force generated by the adsorption mechanism firmly fixes the workpiece in place the instant it falls onto the support surface, effectively overcoming the risk of workpiece slippage or being thrown away due to inertia during high-speed movement and rotation. Furthermore, by using negative pressure to tightly "pull" the workpiece onto the support surface, the slight vibrations and relative displacements between the workpiece and the support surface are eliminated, ensuring consistent positioning accuracy throughout the transfer process.

[0058] In some possible implementations, the adsorption mechanism includes a first adsorption position 112, a second adsorption position 121, and a third adsorption position 21 arranged in a triangular pattern. The three adsorption positions arranged in a triangular pattern on the support surface provide three defined, non-collinear constraint points for the workpiece. This effectively restricts all possible degrees of freedom (especially rotational degrees of freedom) of the workpiece in the horizontal plane, ensuring that the position and orientation of the workpiece are unique and fixed after adsorption.

[0059] For example, the first adsorption position 112 and the second adsorption position 121 are located on the first support arm 1, and the third adsorption position 21 is located on the second support arm 2. By placing two adsorption positions on the first support arm 1 and the third on the second support arm 2, this arrangement "binds" the two asymmetrical support arms into a cohesive whole through adsorption force. Once the workpiece is adsorbed and fixed, it becomes a "structural component" connecting the two support arms, significantly enhancing the overall torsional and bending rigidity of the robotic arm's end effector. This design not only fixes the workpiece but also strengthens the structural performance of the robotic arm itself, making it less prone to vibration during high-speed movements.

[0060] In one embodiment, the first support arm 1 includes a main arm 11 and a secondary arm 12 connected perpendicularly to each other. The end of the main arm 11 is a first end 111, and the end of the secondary arm 12 is a second end 122. The second support arm 2 is connected to the main arm 11 at an acute angle. The first support arm 1 adopts an "L-shaped" structure with the main arm 11 and the secondary arm 12 connected perpendicularly, so that the main arm 11, as the power transmission and main load-bearing beam, is responsible for accurately transmitting the force and movement from the root of the robotic arm to the front end. The secondary arm 12, as the core support beam, directly determines the width of the support surface and the load-bearing position of the workpiece, greatly enhancing the overall rigidity and torsional resistance of the end of the robotic arm. Compared with a single rod-shaped support arm, the "L-shaped" structure can more effectively resist the vibration and deformation caused by workpiece load and high-speed movement.

[0061] The second support arm 2 connects to the main arm 11 at an acute angle, forming a triangular structure with the main arm 11, the auxiliary arm 12, the second support arm 2, and the virtual connecting line. A triangle is a mechanically stable shape, effectively dispersing and transferring the load to the root of the robotic arm. When the workpiece is partially suspended outside the auxiliary arm 12, the bending moment generated by its gravity is shared by the second support arm 2 through the triangular structure, significantly reducing stress concentration at critical connections and improving the lifespan and reliability of the robotic arm.

[0062] For example, the second support arm 2 extends to a position approximately aligned with the middle of the main arm 11, with the secondary arm 12 on one side of the opening and the second support arm 2 on the other. The secondary arm 12 provides the main support boundary, while the second support arm 2, extending at an acute angle, actively "yields" space. The size and shape of this opening are directly determined by the length of the secondary arm 12, the length of the second support arm 2, and their acute angle with the main arm 11. This opening allows the end of a symmetrical robotic arm to be inserted, while the secondary arm 12 and the second support arm 2 of the robotic arm can also be inserted into the gaps of the symmetrical robotic arm, achieving "two-way avoidance" when intersecting with the symmetrical robotic arm.

[0063] In one embodiment, the robotic arm further includes a connecting arm 3, which is located at the connection between the first support arm 1 and the second support arm 2. The connecting arm 3 is a compact connecting block, with its size minimized to only retain the necessary space for stable connection and installation with the main arm 11, the second support arm 2, and the external drive unit. By designing the connecting arm 3 as a minimized connecting block, the overall mass and volume of the robotic arm are significantly reduced. The reduction in mass directly leads to a reduction in rotational inertia, enabling the external drive unit to achieve faster acceleration, deceleration, and rotational response with lower energy consumption, thus improving the robotic arm's agility. Simultaneously, the compact structure of the connecting arm 3 reduces the robotic arm's motion envelope and rotation radius in complex equipment spaces, effectively avoiding interference with surrounding equipment, making it particularly suitable for space-constrained semiconductor cluster equipment.

[0064] To further optimize mechanical balance, the first end 111 of the main arm 11 is designed to be slightly tilted and bent towards the connecting arm 3. Since the first support arm 1 integrates the main arm 11, the auxiliary arm 12, and carries two adsorption positions, its mass distribution causes the center of gravity of the entire robotic arm to naturally shift towards the first support arm 1. To actively optimize this balance, the first end 111 of the main arm 11 is designed to be slightly tilted or bent towards the side where the second support arm 2 is located. By extending the connecting end of the main arm 11 towards the lighter second support arm 2, it is equivalent to adding mass on the "lighter side," thereby generating a counter-torque. This effectively pulls the overall center of gravity back and closer to the rotation axis of the robotic arm, reducing centrifugal jitter and vibration caused by mass imbalance during high-speed rotation. This not only ensures the smoothness of the transmission process but also reduces the load on the external drive unit, improving the accuracy and lifespan of the entire motion system.

[0065] In addition, the inner wall of the first end 111 is designed as an arc-shaped surface, which connects to the second support arm 2. This smooth transition minimizes stress concentration and prevents the formation of microcracks. This ensures that the robotic arm maintains extremely high reliability at the bending point even under the high-frequency, long-cycle operation required by semiconductor equipment, significantly reducing the risk of failure due to fatigue fracture.

[0066] Example 2:

[0067] like Figure 2 As shown, this embodiment provides a wafer transfer device, including a first robotic arm 100, a second robotic arm 200, and a drive mechanism 300. The end of the first robotic arm 100 is configured with a symmetrical structure for placing a wafer 500. The second robotic arm 200 is the robotic arm provided in Embodiment 1. The drive mechanism 300 is connected to the second robotic arm 200 and is used to drive the second robotic arm 200 to dock with the first robotic arm 100 to transfer the wafer 500.

[0068] In this wafer transfer device, the end of the first robotic arm 100 is a symmetrical structure for placing wafers 500. The second robotic arm 200 adopts the robotic arm provided in Embodiment 1. The second robotic arm 200 is driven by the drive mechanism 300 to dock with the first robotic arm 100 to transfer wafers 500. This realizes the direct and smooth transfer of wafers 500 without the need to set up a transfer station, which simplifies the equipment structure and reduces the system cost.

[0069] The drive mechanism 300 can greatly expand the transmission space of the wafer 500, meeting the needs of long-distance, multi-location transmission.

[0070] In one embodiment, the drive mechanism 300 includes a rotation module 301 and a linear module 302. The rotation module 301 is connected to the second robotic arm 200 and is used to drive the second robotic arm 200 to rotate horizontally. The linear module 302 is connected to the rotation module 301 and is used to drive the rotation module 301 to move linearly in at least one direction in three-dimensional space. The linear module 302 performs coarse positioning in three-dimensional space, quickly moving the second robotic arm 200 to the approximate orientation of the target position. The rotation module 301 is responsible for fine positioning, making minor horizontal adjustments to the end of the second robotic arm 200 to accurately align with the wafer 500 for interference-free docking; thus achieving precise and efficient execution of the complex motion trajectory of the second robotic arm 200 within a compact space.

[0071] For example, the rotary module 301 includes a rotating part and a fixed part. The rotating part is rotatably disposed within the fixed part and is connected to a rotary drive component, which drives the rotating part to rotate. The rotary drive component is a motor, and an encoder is integrated within the motor. The encoder is used to provide real-time feedback on the rotation angle position of the rotating part. The rotary module 301 can drive the second robotic arm 200 to achieve 360° rotation, thereby enabling it to dock with the first robotic arm 100 at any angle to transfer the wafer 500.

[0072] In one embodiment, the wafer transfer device further includes a fixed arm 600 for connecting the second robotic arm 200 and the rotating module 301. One end of the fixed arm 600 is fixedly connected to the connecting arm 3 by bolts or the like, and the other end is fixedly connected to the rotating part by bolts or the like, so that the rotating part drives the second robotic arm 200 to rotate through the fixed arm 600.

[0073] The linear module 302 includes a linear guide rail and a linear motor. The fixed part is slidably mounted on the linear guide rail and driven by the linear motor.

[0074] The linear module 302 includes at least one of an X-axis linear module, a Y-axis linear module, and a Z-axis linear module to enable the second robotic arm 200 to move along at least one of the X-axis, Y-axis, and Z-axis directions. The specific configuration can be determined according to the transfer position requirements of the wafer 500 in the semiconductor equipment and is not limited here.

[0075] In one embodiment, the linear module 302 is provided with a position detection element 3021 for detecting the position of the second robotic arm 200. By setting the position detection element 3021 and communicating with the control system of the wafer transfer device, the real-time position of the second robotic arm 200 is monitored in real time, ensuring the accuracy of wafer 500 handover and ultimately guaranteeing the high precision of the wafer 500 transfer process.

[0076] For example, the position detection element 3021 can be an absolute encoder integrated into the linear motor, or it can be a combination of a sensing element and a sensor. The sensing element is set on the second robotic arm 200 or the rotary module 301, and the sensor is set on the linear module 302. When the rotary module 301 moves to the point where the sensing element and the sensor are opposite each other, the sensor sends a signal to the control system, and the control system determines the position of the second robotic arm 200 based on the received signal.

[0077] This embodiment specifically illustrates the process by which the wafer transfer device transfers the wafer 500 from the carrier device within the process cavity 400 to the first robotic arm 100 via the second robotic arm 200.

[0078] like Figure 3 and Figure 4 As shown, in the initial state, the second robotic arm 200 is located at the first position of the linear module 302, that is, one end of the linear module 302. The support device inside the process cavity 400 includes three lifting columns 401 for lifting the wafer 500.

[0079] like Figure 5 As shown, after the transmission command is issued, the linear module 302 first moves the second robotic arm 200 from the first position to the second position (i.e., the other end of the linear module 302) closer to the process cavity 400.

[0080] During the movement of the second robotic arm 200, the control system commands the lifting column 401 to rise in advance, raising the wafer 500 to a preset height.

[0081] like Figure 6 As shown, after the second robotic arm 200 reaches the second position, its first support arm 1 is precisely inserted into the gap between the three lifting columns 401. Subsequently, the lifting columns 401 descend, allowing the wafer 500 to land smoothly on the support surface of the second robotic arm 200.

[0082] Once wafer 500 is in place, the first adsorption site 112, the second adsorption site 121, and the third adsorption site 21, which are arranged in a triangular pattern, are immediately activated to firmly fix wafer 500 through vacuum adsorption.

[0083] like Figure 7 As shown, after the second robotic arm 200 successfully grasps the wafer 500, the linear module 302 controls it to return to the first position carrying the wafer 500. During this process, the position detection component 3021 on the linear module 302 provides real-time feedback of the precise position of the second robotic arm 200 to the control system, ensuring the accuracy of the movement trajectory and positioning.

[0084] like Figure 8 As shown, after the second robotic arm 200 safely returns to the first position, the rotating module 301 drives it to rotate horizontally by 90°, so that the wafer 500 faces the handover position of the first robotic arm 100.

[0085] like Figure 2 and Figure 9 As shown, after the second robotic arm 200 is in place, the symmetrical end of the first robotic arm 100 is inserted from the opening of the second robotic arm 200, achieving a non-interference spatial intersection.

[0086] After the docking was completed, the second robotic arm 200 released the vacuum adsorption, and the wafer 500 was smoothly transferred to the first robotic arm 100.

[0087] Finally, the first robotic arm 100 transfers the wafer 500 to the next process unit, completing the entire transfer process.

[0088] With the advantage of interference-free docking brought by its asymmetric robotic arm, this wafer transfer device can be widely used in a variety of complex scenarios in the front and back ends of semiconductor manufacturing: in cluster equipment such as etching, chemical vapor deposition, and physical vapor deposition, the second robotic arm 200 serves as a highly efficient central transfer robotic arm, scheduling wafers 500 between different process cavities 400 and load locks. Its compact structure and flexible turning capability significantly improve the space utilization and capacity of the equipment.

[0089] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A robotic arm, characterized in that, include: The first support arm (1) has a first end (111) and a second end (122); The second support arm (2) is asymmetrically arranged with respect to the first support arm (1). The second support arm (2) extends from the first end (111) toward one side of the first support arm (1) at an acute angle, and an opening is formed between the end of the second support arm (2) and the second end (122). The first support arm (1) and the second support arm (2) together form a support surface for supporting the workpiece.

2. The robotic arm according to claim 1, characterized in that, The support surface is provided with an adsorption mechanism for adsorbing workpieces.

3. The robotic arm according to claim 2, characterized in that, The adsorption mechanism includes a first adsorption site (112), a second adsorption site (121), and a third adsorption site (21) arranged in a triangular pattern.

4. The robotic arm according to claim 3, characterized in that, The first adsorption position (112) and the second adsorption position (121) are located on the first support arm (1), and the third adsorption position (21) is located on the second support arm (2).

5. The robotic arm according to claim 1, characterized in that, The first support arm (1) includes a main arm (11) and a secondary arm (12) that are perpendicularly connected to each other. The end of the main arm (11) is the first end (111), and the end of the secondary arm (12) is the second end (122). The second support arm (2) is connected to the main arm (11) at an acute angle.

6. The robotic arm according to claim 1, characterized in that, It also includes a connecting arm (3), which is located at the connection between the first support arm (1) and the second support arm (2).

7. A wafer transfer device, characterized in that, include: The first robotic arm (100) has a symmetrical end structure for placing a wafer (500); The second robotic arm (200) is the robotic arm as described in any one of claims 1-6; A drive mechanism (300) is connected to the second robotic arm (200) for driving the second robotic arm (200) to dock with the first robotic arm (100) to transfer the wafer (500).

8. The wafer transfer apparatus according to claim 7, characterized in that, The drive mechanism (300) includes: A rotating module (301) is connected to the second robotic arm (200) and is used to drive the second robotic arm (200) to rotate horizontally; A linear module (302) is connected to the rotating module (301) and is used to drive the rotating module (301) to move linearly in at least one direction in three-dimensional space.

9. The wafer transfer apparatus according to claim 8, characterized in that, The linear module (302) is provided with a position detection component (3021) for detecting the position of the second robotic arm (200).

10. The wafer transfer apparatus according to claim 8, characterized in that, It also includes a fixed arm (600) for connecting the second robotic arm (200) and the rotating module (301).

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