Semiconductor thin film half-cut broach assembly

Abstract

The utility model discloses a kind of semiconductor film half-cut broach assemblies, including broach seat, broach and briquetting, broach seat is provided with broach and briquetting, and the briquetting is located the front of broach.The broach includes mounting block and tool bit, the mounting block is fixedly connected with broach seat, tool bit is set in the side of mounting block, the height of briquetting lower surface is higher than the height of tool bit lower surface, and the height of tool bit lower surface is higher than the height of mounting block lower surface.The briquetting includes installation part and press film part, the installation part is fixedly connected with broach seat, press film part is set in the side of installation part, installation part and press film part are integrated structure, and the front end of press film part is provided with round angle.In the cutting semiconductor film of broach, briquetting is flattened from above semiconductor film to be cut, prevent film from appearing undulation in cutting process, ensure the accuracy of cutting thickness direction, prevent cutting injury conductive layer below film.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor thin film processing technology, and in particular to a semiconductor thin film half-cutting broach assembly. Background Technology

[0002] Semiconductor thin films are mainly used to manufacture core electronic components such as integrated circuits, optoelectronic devices, and sensors. They are one of the basic materials for making electronic devices. There is a conductive layer under the semiconductor thin film. When using it, the film above the conductive layer needs to be cut off. Since the conductive layer is usually only 10 micrometers thick, and the semiconductor thin film is thin, soft and easily deformed, the semiconductor thin film will undulate during the cutting process. The tool can easily cut the conductive layer under the film, causing the material to be scrapped. Utility Model Content

[0003] To address the aforementioned problems, this utility model aims to provide a semiconductor thin film half-cutting broach assembly to solve the issues of low cutting precision and easy damage to the conductive layer in semiconductor thin film cutting.

[0004] The technical problem solved by this utility model can be achieved by the following technical solution: A semiconductor thin film half-cutting broach assembly includes a broach base, a broach, and a pressure block. The broach base is provided with the broach and the pressure block, and the pressure block is located at the front of the broach. The broach includes a mounting block and a cutting head. The mounting block is fixedly connected to the broach base, and the cutting head is disposed on one side of the mounting block. The mounting block and the cutting head are an integral structure. The lower surface of the pressure block is higher than the lower surface of the cutting head, and the lower surface of the cutting head is higher than the lower surface of the mounting block.

[0005] The pressing block includes a mounting part and a pressing part. The mounting part is fixedly connected to the cutter seat, and the pressing part is located on one side of the mounting part. The mounting part and the pressing part are an integral structure, and the front end of the pressing part is provided with a first rounded corner. The rear end of the pressing block 3 is provided with a slope.

[0006] The broach and pressure block are fixed to the broach holder with screws.

[0007] The front end of the cutter head is provided with an infeed cutting edge, and the side of the cutter head is provided with a side cutting edge. The front end of the cutter head is inclined.

[0008] The broach holder is provided with a through groove running vertically, and the rear end of the groove is provided with an inclined surface.

[0009] The broach holder has a fixing block on one side of the groove. The lower surface of the fixing block is flush with the lower surface of the pressure block. The front end of the fixing block has a second rounded corner. The second rounded corner of the fixing block and the first rounded corner of the pressure block have the same arc.

[0010] Compared with the prior art, this utility model has the following advantages: when cutting semiconductor thin films with a broach, the pressure block flattens the semiconductor thin film to be cut from above, preventing the film from undulating and wrinkling during the cutting process, ensuring the accuracy of the cutting thickness direction, and preventing damage to the conductive layer under the film. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the structure of the broach holder of this utility model; Figure 3 This is a schematic diagram of the structure of the broach holder of this utility model; Figure 4 This is a schematic diagram of the structure of the pressure block of this utility model; Figure 5 This is a schematic diagram of the structure of the broach of this utility model; Figure 6 This is a schematic diagram of the structure of the broach of this utility model; Figure 7 This is a schematic diagram of the structure of the broach of this utility model; Figure 8 This is a schematic diagram of the cutting edge on the side of a broach. In the figure: 1-Broach holder, 2-Broach, 3-Pressure block, 11-Fixing block, 12-Groove, 13-Inclined surface, 14-Second rounded corner, 21-Mounting block, 22-Cutter head, 23-Side cutting edge, 31-Mounting part, 32-Pressure part, 33-First rounded corner, 34-Inclined surface. Detailed Implementation

[0012] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the following description, in conjunction with specific illustrations, further elaborates on this utility model.

[0013] In the description of this utility model, it should be understood that the terms "one end", "the other end", "outer side", "upper", "inner side", "horizontal", "coaxial", "center", "end", "length", "outer end", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0014] Combined with appendix Figures 1 to 8As shown, this embodiment discloses a semiconductor thin film half-cutting broach assembly, including a broach base 1, a broach 2, and a pressure block 3. The broach base 1 is provided with the broach 2 and the pressure block 3, which are fixed to the broach base 1 by screws for easy disassembly and replacement. The pressure block 3 is located at the front of the broach 2. The broach 2 includes a mounting block 21 and a cutting head 22. The mounting block 21 is fixedly connected to the broach base 1, and the cutting head 22 is disposed on one side of the mounting block 21. The mounting block 21 and the cutting head 22 are an integral structure. The mounting block 21 is provided with two mounting holes. The lower surface of the pressure block 3 is higher than the lower surface of the cutting head 22, and the lower surface of the cutting head 22 is higher than the lower surface of the mounting block 21.

[0015] The height difference between the lower surface of the cutter head 22 and the lower surface of the mounting block 21 is half the thickness of the semiconductor thin film ± 0.005 mm, and the height difference between the lower surface of the pressure block 3 and the lower surface of the cutter head 22 is half the thickness of the semiconductor thin film ± 0.005 mm.

[0016] The cutting head 22 has an inclined front end. The front end of the cutting head 22 has an infeed cutting edge, and the side of the cutting head 22 has a side cutting edge 23. The cutting head has two cutting edges with a combined cutting angle, which is beneficial for cutting semiconductor thin films.

[0017] The pressing block 3 includes a mounting part 31 and a film pressing part 32. The mounting part 31 is fixedly connected to the cutter holder 1. The film pressing part 32 is disposed on one side of the mounting part 31. The mounting part 31 and the film pressing part 32 are an integral structure. The front end of the film pressing part 32 is provided with a first rounded corner 33. During feeding, the first rounded corner 33 can prevent the pressing block 3 from hitting the edge of the film, ensuring that the film can enter under the pressing block 3 and be flattened by the pressing block 3. The rear end of the pressing block 3 is provided with a slope 34, and the mounting part 31 is provided with two mounting holes.

[0018] The cutter holder 1 has a through groove 12, and the rear end of the groove 12 has an inclined surface 13. The cut film will pass through the inclined surface and be removed from the cutter assembly. A fixing block 11 is provided on one side of the groove 12 on the cutter holder 1. The lower surface of the fixing block 11 is flush with the lower surface of the pressure block 3. The height of the lower surface of the fixing block 11 is higher than the height of the lower surface of the cutter head 22. The front end of the fixing block 11 has a second rounded corner 14. The second rounded corner 14 of the fixing block 11 has the same arc as the first rounded corner 33 of the pressure block 3.

[0019] In use, the cutter holder 1 is installed on the semi-cutting machine, the robotic arm suction cup picks up the semiconductor film and places it on the processing platform. When cutting the semiconductor film, the pressure block 3 presses the semiconductor film to be cut flat from above to prevent the film from undulating and wrinkling during the cutting process, ensuring the accuracy of the cutting thickness direction and preventing damage to the conductive layer under the film.

[0020] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the utility model. Any simple modifications, equivalent changes, or alterations made to the above embodiments based on the technical principles of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A semiconductor thin film half-cutting broach assembly, comprising a broach holder (1), a broach (2), and a pressure block (3), characterized in that: The puller holder (1) is provided with a puller (2) and a pressure block (3). The pressure block (3) is located at the front of the puller (2). The puller (2) includes a mounting block (21) and a cutter head (22). The mounting block (21) is fixedly connected to the puller holder (1). The cutter head (22) is located on one side of the mounting block (21). The mounting block (21) and the cutter head (22) are an integral structure. The height of the lower surface of the pressure block (3) is higher than the height of the lower surface of the cutter head (22). The height of the lower surface of the cutter head (22) is higher than the height of the lower surface of the mounting block (21).

2. The semiconductor thin film half-cutting broach assembly according to claim 1, characterized in that: The pressing block (3) includes an installation part (31) and a pressing part (32). The installation part (31) is fixedly connected to the puller seat (1). The pressing part (32) is located on one side of the installation part (31). The installation part (31) and the pressing part (32) are an integral structure. The front end of the pressing part (32) is provided with a first rounded corner (33).

3. The semiconductor thin film half-cutting broach assembly according to claim 1, characterized in that: The rear end of the pressure block (3) is provided with an inclined surface (34).

4. A semiconductor thin film half-cutting broach assembly according to claim 1, characterized in that: The puller (2) and the pressure block (3) are fixed to the puller seat (1) by screws.

5. A semiconductor thin-film half-cutting broach assembly according to claim 1, characterized in that: The front end of the cutter head (22) is provided with an infeed end face cutting edge, and the side of the cutter head (22) is provided with a side cutting edge (23).

6. A semiconductor thin film half-cutting broach assembly according to claim 5, characterized in that: The front end of the cutter head (22) is set at an angle.

7. A semiconductor thin film half-cutting broach assembly according to claim 5, characterized in that: The broach holder (1) is provided with a through groove (12) that runs vertically through the bottom, and the rear end of the groove (12) is provided with an inclined surface (13).

8. A semiconductor thin film half-cutting broach assembly according to claim 7, characterized in that: The broach holder (1) is provided with a fixing block (11) on one side of the groove (12). The lower surface of the fixing block (11) is flush with the lower surface of the pressure block (3). The front end of the fixing block (11) is provided with a second rounded corner (14). The second rounded corner (14) of the fixing block (11) and the first rounded corner (33) of the pressure block (3) have the same arc.

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